A high-performance silicon-based adiabatic microring design method and system

By optimizing the outer and inner contours of the microring using double Euler bending and N-order Bezier curves, the problems of mode loss, bending loss, and free spectrum range of the thermal insulation microring were solved, realizing the design of a high-performance silicon-based thermal insulation microring suitable for optical communication and optical information processing.

CN119247622BActive Publication Date: 2026-06-12SUZHOU UNIV

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SUZHOU UNIV
Filing Date
2024-10-24
Publication Date
2026-06-12

AI Technical Summary

Technical Problem

Existing thermally insulating microrings suffer from severe mode loss when using wide multimode waveguides, may suffer severe bending loss when using small bending radii, and have limited doping space and free spectrum range due to narrow waveguide widths, which restricts their applicability in complex application scenarios.

Method used

The outer contour of the microring was designed using a double Euler bending design, and the inner contour of the microring was optimized using an N-order Bézier curve. The coordinates of the control points were optimized using an ant colony algorithm to reduce transmission loss, thus designing a high-performance silicon-based thermal insulation microring.

🎯Benefits of technology

Under conditions of large waveguide width or small bending radius, it significantly reduces single-mode loss, increases the free spectrum range, improves the overall performance of microrings, facilitates the integration of heaters and doping, and meets diverse application requirements.

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Abstract

The application relates to a high-performance silicon-based adiabatic micro-ring design method and system, and belongs to the optical electronic technical field. The method comprises the following steps: according to the free spectral range of a micro-ring to be designed, a half outer contour curve of the micro-ring to be designed is drawn by using double Euler bending; a half inner contour curve of the micro-ring to be designed is drawn by using an N-order Bezier curve and according to a minimum transmission loss principle, wherein N is a positive integer greater than 1, and the transmission loss is the 0-order mode transmission loss of the transverse electric field of the half micro-ring; a half optimized micro-ring is obtained according to the half outer contour curve and the half inner contour curve; and two half optimized micro-rings are spliced into a complete micro-ring. The application avoids serious mode loss when a relatively wide multimode waveguide is used and serious bending loss when a small bending radius is designed, overcomes the problem that the space for doping the micro-ring is narrow due to the limited waveguide width, and simultaneously increases the free spectral range of the micro-ring.
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Description

Technical Field

[0001] This invention relates to the field of optoelectronics technology, and in particular to a high-performance silicon-based thermal insulation microring design method and system. Background Technology

[0002] Since Marcatili first proposed the concept of microring resonators in 1969, this field has become a hot topic in silicon photonics research after decades of technological evolution. Despite significant theoretical and experimental progress, microring resonators still face a series of challenges in practical applications. First, the performance of existing microrings is highly sensitive to manufacturing errors, limiting their potential for mass production. Even minute dimensional variations or manufacturing deviations can lead to significant shifts in the resonant wavelength, thus affecting the stability and reliability of the device.

[0003] To address this issue, the adiabatic microring (AM) has been developed as a specially designed microring resonator. The AM utilizes thermal insulation principles to reduce energy loss during waveguide mode switching, thereby improving the device's manufacturing tolerance and reducing resonant wavelength shifts caused by manufacturing errors. This characteristic makes it a promising candidate for applications in optical communication, optical information processing, and photonic integrated circuits.

[0004] However, thermally adiabatic microrings also face some challenges in practical applications. For example, when using wide multimode waveguides, thermally adiabatic microrings may experience severe mode losses or require extremely large bending radii to avoid losses, which limits their application scenarios and consumes a significant amount of on-chip resources. Furthermore, the still narrow waveguide width results in limited space for doping the microrings, hindering actual manufacturing and performance improvements. Simultaneously, the small bending radius can also lead to severe bending losses, preventing further improvements in device performance. On the other hand, although thermally adiabatic microrings have made some progress in design and implementation, their free spectrum range (FSR) remains small, failing to meet the needs of various application scenarios. This limits the applicability of thermally adiabatic microrings in more complex and broader application scenarios. Summary of the Invention

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the severe mode loss when using a wide multimode waveguide, the severe bending loss when using a small bending radius, the small micro-ring doping space due to the narrow waveguide width, and the small free spectrum range in the prior art.

[0006] In a first aspect, to solve the above-mentioned technical problems, the present invention provides a high-performance silicon-based thermal insulation microring design method, comprising:

[0007] S101. Based on the free spectrum range of the microring to be designed, half of the outer contour curve of the microring to be designed is drawn using double Euler bending; using an N-order Bezier curve and optimizing the control point coordinates of the N-order Bezier curve according to the principle of minimizing transmission loss, half of the inner contour curve of the microring to be designed is drawn; where N is a positive integer greater than 1; the transmission loss is the 0th order mode transmission loss of the transverse electric field of half the microring.

[0008] S102. Obtain a half-optimized micro-ring based on the half-outer contour curve and the half-inner contour curve;

[0009] S103. Join the two half-optimized micro-rings together to form a complete micro-ring.

[0010] In one embodiment of the present invention, optimizing the control point coordinates of the Nth-order Bézier curve according to the principle of minimizing transmission loss includes an ant colony algorithm, wherein the ant colony algorithm is as follows:

[0011] S201. Randomly initialize the coordinates of the Bessel control points for each ant;

[0012] S202. Import the coordinates of the curve corresponding to the ant into the software and calculate the transmission loss value of the 0th order mode of the transverse electric field of half a micro-ring.

[0013] S203. Calculate the transfer probability based on the transmission loss value to determine the search method;

[0014] S204. Return to S202 until the specified number of iterations is reached, and obtain the control point coordinates of the Bézier curve of the ant with the largest pheromone.

[0015] In one embodiment of the present invention, step S101 includes determining the parameters of the double Euler bending and initializing the coordinates of the control points.

[0016] In one embodiment of the present invention, step S101 further includes drawing the double Euler curve according to the Euler equation to obtain the coordinates of each point on the double Euler curve; and substituting the coordinates of the control points into the Bessel control equation to obtain the coordinates of each point on the Nth order Bessel curve.

[0017] In one embodiment of the present invention, the Euler equation is:

[0018]

[0019] Where x(s) is the curve's coordinate on the X-axis, y(s) is the curve's coordinate on the Y-axis, s is the normalized length, R0 is the freely chosen radius, and t is the sampling sequence.

[0020] In one embodiment of the present invention, when the Nth-order Bézier curve is a 5th-order Bézier curve, the expression for the coordinates of the control points is:

[0021]

[0022] Where P1, P2, P3, P4, P5, and P6 are the coordinates of different control points, w1 and w2 are the waveguide widths at the start and end points of different half-micro-rings, and b i Let r1 be the i-th scaling parameter, i∈{1,2,3,4}, and r2 be the different dimensions of the inner contour in the x and y directions, respectively.

[0023] In one embodiment of the present invention, the microring to be designed includes upper and lower bus waveguides and a microring cavity.

[0024] Secondly, to solve the above-mentioned technical problems, the present invention provides a high-performance silicon-based thermal insulation microring design system, comprising:

[0025] The microring inner and outer contour drawing module is used to draw half of the outer contour curve of the microring to be designed using double Euler bending based on the free spectrum range of the microring to be designed, and to draw half of the inner contour curve of the microring to be designed using an N-order Bezier curve and optimizing the control point coordinates of the N-order Bezier curve according to the principle of minimizing transmission loss; where N is a positive integer greater than 1; and the transmission loss is the 0th order mode transmission loss of the transverse electric field of half the microring.

[0026] The micro-ring splicing module is used to obtain half of the optimized micro-ring based on the half of the outer contour curve and the half of the inner contour curve, and to splice the two half of the optimized micro-ring into a complete micro-ring.

[0027] Thirdly, to solve the above-mentioned technical problems, the present invention provides a chip, including the high-performance silicon-based thermally insulating microring design system described above.

[0028] Fourthly, to solve the above-mentioned technical problems, the present invention provides a spectrometer, including the aforementioned chip.

[0029] Compared with the prior art, the above-described technical solution of the present invention has the following advantages:

[0030] This invention discloses a high-performance silicon-based thermally insulating microring design method and system. The method employs double Euler bending to plot half of the outer contour curve of the microring to be designed, and uses an N-order Bezier curve, optimizing the control point coordinates of the N-order Bezier curve according to the principle of minimizing transmission loss, to plot half of the inner contour curve. This method significantly improves the overall performance of the microring waveguide's outer and inner contours. Even with a large waveguide width or a small bending radius, the optimized microring maintains extremely low single-mode loss. This design not only fully utilizes the advantages of wide waveguides, such as reduced sensitivity to process errors and ease of integrating heaters and doping to improve heating and doping efficiency, but also reduces performance degradation caused by waveguide sidewall roughness and process errors. Simultaneously, it leverages the advantages of a small bending radius, such as increasing the microring's free spectrum range, to meet diverse application requirements. Attached Figure Description

[0031] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings, wherein...

[0032] Figure 1 This is a flowchart of a high-performance silicon-based thermal insulation microring design method in a preferred embodiment of the present invention;

[0033] Figure 2 This is a structural diagram of the microring to be designed in a preferred embodiment of the present invention;

[0034] Figure 3 This is a cross-sectional view of a conventional elliptical thermal insulation microring in a preferred embodiment of the present invention;

[0035] Figure 4 This is a flowchart of the micro-annular cavity inner and outer contour design algorithm in a preferred embodiment of the present invention;

[0036] Figure 5 This is a schematic diagram of two identical half-microrings being synthesized into a complete microring in a preferred embodiment of the present invention;

[0037] Figure 6 This is a schematic diagram of the simulation structure in a preferred embodiment of the present invention.

[0038] Explanation of reference numerals in the attached drawings: 100, Microring to be designed; 101, Outer contour; 102, Inner contour; 103, Upper bus waveguide; 104, Lower bus waveguide. Detailed Implementation

[0039] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0040] Example 1

[0041] Reference Figure 1 As shown, the present invention provides a high-performance silicon-based thermal insulation microring design method, comprising:

[0042] S101. Based on the free spectrum range of the microring 100 to be designed, half of the outer contour curve of the microring 100 to be designed is drawn using double Euler bending; using the N-order Bézier curve and optimizing the control point coordinates of the N-order Bézier curve according to the principle of minimizing transmission loss, half of the inner contour curve of the microring 100 to be designed is drawn; where N is a positive integer greater than 1; the transmission loss is the transmission loss of the 0th order transverse electric field mode of half the microring (the 0th order transverse electric field mode can be simply referred to as the TE0 mode).

[0043] S102. Based on half of the outer contour curve and half of the inner contour curve, obtain half of the optimized micro-ring;

[0044] S103. Join the two half-optimized micro-rings into a complete micro-ring.

[0045] This invention provides a high-performance silicon-based thermal insulation microring design method. The method employs double Euler bending to plot half the outer contour curve of the microring 100 to be designed, and uses an N-order Bezier curve, optimizing the control point coordinates of the N-order Bezier curve according to the principle of minimizing transmission loss, to plot half the inner contour curve. This method significantly improves the overall performance of the microring waveguide's outer contour 101 and inner contour 102. Even with a large waveguide width or small bending radius, the optimized microring maintains extremely low single-mode loss. This design fully utilizes the benefits of wide waveguides, such as reducing the impact of process errors and facilitating the integration of heaters and doping to improve heating and doping efficiency. Simultaneously, it leverages the advantages of a small bending radius, such as increasing the microring's free spectrum range (FSR), meeting diverse application requirements. These improvements enable a qualitative leap in the performance of the thermal insulation microring, providing a more efficient and reliable solution for fields such as optical communication and optical information processing.

[0046] Specifically, the overall structure of the microring 100 to be designed in this embodiment of the invention refers to... Figure 2 The overall structure consists of two upper and lower bus waveguides and a micro-ring cavity. The upper bus waveguide 103 is responsible for effectively coupling the input optical signal into the micro-ring, while the optical signal that meets the micro-ring resonance condition is further coupled to the lower bus waveguide 104 and finally output from the output port.

[0047] Furthermore, in the design of microring cavities, existing silicon-based thermally insulating microring designs adopt elliptical waveguide structures, referring to... Figure 3The three-dimensional model of the elliptical thermally adiabatic coupler and its cross-sectional view along the Z-axis are shown, in which the waveguide constituting the microring, both its outer and inner edges, follow the standard mathematical equations of an ellipse. However, existing design processes have not specifically optimized the inner and outer contours of the thermally adiabatic microring waveguides, only adopting basic geometric shapes. This limitation significantly exacerbates mode loss problems when pursuing higher performance (e.g., widening the curved waveguide to accommodate wider process errors, or reducing the bending radius to obtain a larger free spectral range). Current design optimization of silicon-based microrings mainly focuses on improving their free spectral range, enhancing the extinction ratio, and improving thermal tuning mechanisms, while optimizing the waveguide contour has become a key challenge that urgently needs to be addressed. In view of this, this embodiment of the invention innovatively adopts a double Euler bending design for the outer contour 101 of the microring, and simultaneously uses a higher-order Bézier curve to design the inner contour 102 of the microring, thereby designing a thermally adiabatic microring that supports multimode transmission.

[0048] Furthermore, reverse engineering, due to its ability to automate the design of silicon photonic components, has greatly promoted the large-scale integration of silicon-based optical devices, thus gaining increasingly widespread application in the field of silicon photonics design. As the opposite of forward design, reverse engineering typically begins with a product prototype or existing product generated by forward design. It involves directly modifying, testing, and analyzing problematic models to iterate and achieve more ideal results. Finally, using the corrected model or sample, through scanning, modeling, and other processes, the final design model is derived. This method has opened new paths for the innovative design of silicon-based optoelectronic devices, making novel micro / nano devices with ultra-small size, superior performance, and multifunctionality possible. In China, many outstanding teams are actively engaged in the reverse engineering and automated design of silicon photonics. For example, the team at Shanghai Jiao Tong University has achieved significant success in areas such as the design of ring-core OAM fiber and the optimization of weak coupling in few-mode fibers using particle swarm optimization, search algorithms, and neural networks. Nevertheless, the current application focus of reverse engineering in silicon photonics remains primarily on key components such as couplers, power beam splitters, mode-division multiplexers / demultiplexers, and silicon substrate antireflection coating systems. However, the embodiments of the present invention innovatively use a reverse design method to optimize the Bézier curve control equation, and the same method can be used to realize the reverse design process of the outer contour curve.

[0049] Specifically, this embodiment of the invention proposes an algorithm that uses double Euler bending to design the outer contour 101 of the microring, and simultaneously uses an Nth-order Bézier curve to design the inner contour 102 of the microring. The shape of the Nth-order Bézier curve is determined by the coordinates of the control points in the higher-order Bézier equation. By optimizing the control parameters of the Nth-order Bézier equation using an optimization algorithm, the shape of the designed inner contour 102 of the microring is changed, maximizing the optical power of the TEO mode at the output port, which corresponds to minimizing the mode loss. (Refer to...) Figure 4The specific steps of the algorithm are as follows:

[0050] Step 1: Initial stage, that is, before step S101, a series of parameters are initialized according to the selected optimization strategy. This includes determining the relevant parameters of the double Euler bending and initializing the coordinates of the Bessel control points.

[0051] Step 2: Proceed to the curve drawing stage. In step S101, the double Euler curve is drawn according to the Euler equation and the double Euler bending parameters set during initialization, thereby obtaining the precise coordinates of each point on the double Euler curve. At the same time, using the corresponding Bézier control points in the current iteration, the coordinates of the control points are substituted into the Bézier control equation to obtain the coordinates of each point on the Nth-order Bézier curve.

[0052] Step 3: Perform simulation analysis on the structure. In the simulation software, combine the point coordinates obtained from the curve plotting in Step 2 into a half-micro-ring structure and simulate it to calculate the single-mode loss of the structure under the current algorithm loop, and feed this result back into the algorithm.

[0053] Step 4: During the Bessel parameter modification phase, the Bessel parameters are adjusted according to preset rules to prepare for the next iteration. When the entire algorithm loop ends, an optimized half-micro-loop structure is finally obtained.

[0054] This invention focuses on optimizing a half-microring structure. Through simulation analysis, it can be ensured that the designed half-microring exhibits excellent single-mode loss characteristics. Specifically, the simulation analysis allows for precise control of parameters such as the size and shape of the microring to achieve optimal single-mode loss characteristics. Based on the principle of symmetry, two identical, designed 180-degree curved structures are spliced ​​together to construct a complete microring, as can be seen from [reference needed]. Figure 5 ,in Figure 5 Both input and output are single-mode waveguides. This method achieves both design simplification and consistent performance.

[0055] To better illustrate and understand the embodiments of the present invention, a specific example is provided below for detailed explanation.

[0056] Example: On a standard silicon-on-insulator (SOI) platform, the structural features of the thermally insulating microring to be designed include: a 220 nm thick top silicon layer, a 2 μm thick buried oxide layer, and a top silicon dioxide cladding. This microring is designed to operate at wavelengths close to 1310 nm, with a waveguide width that tapers from a minimum of 0.4 μm to a maximum of 2.5 μm, and possesses a free spectral range of approximately 10 nm. The specific design steps are as follows:

[0057] Step 1: Determine the relevant parameters of the double Euler bending and initialize the coordinates of the Bessel control points.

[0058] Step 2: Based on the specific values ​​of the free spectral range, the outer contour curve of the adiabatic microring is plotted using the double Euler bending method. The construction of the double Euler bending follows the Euler equation, which is expressed as follows:

[0059]

[0060] Where x(s) is the curve's coordinate on the X-axis, y(s) is the curve's coordinate on the Y-axis, s is the normalized length, R0 is the freely chosen radius, and t is the sampling sequence.

[0061] Select a 5th-order Bézier curve (i.e., when N is 5) to plot half of the inner contour curve of the adiabatic micro-ring. In the 5th-order Bézier curve, there are a total of six control points. The expression for the coordinates of the control points is:

[0062]

[0063] Where P1, P2, P3, P4, P5, and P6 are the coordinates of different control points, w1 and w2 are the waveguide widths at the start and end points of different half-micro-rings, and b i Let r1 be the i-th scaling parameter, used for subsequent optimization of the coordinates of different control points, i∈{1,2,3,4}, and r1 and r2 be the dimensions of the inner contour in the x and y directions, respectively.

[0064] Step 3: Based on the principle of minimizing transmission loss in the 0th-order mode of the transverse electric field of a half-micro-ring, the control point coordinates of the 5th-order Bézier curve are optimized using an ant colony algorithm. The ant colony algorithm is as follows:

[0065] S201. Randomly initialize the coordinates of the Bessel control points for each ant;

[0066] S202. Import the coordinates of the curve corresponding to the ant into the software and calculate the transmission loss value of the 0th order mode of the transverse electric field of half a micro-ring.

[0067] S203. Calculate the transfer probability based on the transmission loss value to determine the search method;

[0068] S204. Return to step S202 until the specified number of iterations is reached, and obtain the coordinates of the control point of the Bézier curve of the ant with the largest pheromone.

[0069] In step S201, initialization includes initializing the ant colony algorithm. In step S202, the selected software is simulation software, and the simulation structure established within the software can be referenced... Figure 6When selecting such software, its modeling accuracy and efficiency, the accuracy of simulation calculations, and the comprehensiveness of its post-processing functions should be comprehensively considered. Optional simulation software includes Matlab, HFSS, and CST Microwave Studio. It should be noted that different simulation platforms may differ in data import formats, model building processes, and parameter setting details. Therefore, in actual operation, users need to flexibly adjust the specific work steps according to the characteristics of the selected software.

[0070] In step S203, the transition probability is used to determine the ant's movement direction during the search process and is a crucial basis for choosing between local and global search. When the transition probability is greater than a preset transition probability constant (usually an empirical value or a threshold set according to the specific problem), it indicates that the current ant may be close to the region where the optimal solution is located, so the algorithm will tend to let this ant perform a local search. Local search usually means performing a small-scale, fine-grained search in the vicinity of the current solution in order to find a better solution. When the transition probability is less than the transition probability constant, it indicates that the current ant may be far from the optimal solution, and it is necessary to expand the search range to explore more potential solution spaces. At this time, the algorithm will tend to let this ant perform a global search. Global search usually means performing a broad search throughout the entire solution space in order to discover new regions of better solutions. The determination of the search method includes:

[0071] Initialization Phase: During the initialization phase of the ant colony algorithm, a series of parameters are set, including the number of ants, the pheromone evaporation coefficient, and the transition probability constant. These parameter settings directly affect the balance between local and global searches in the subsequent search process.

[0072] Calculation of transition probability: In each iteration, based on the pheromone concentration at the current ant's location and other heuristic information (such as distance, direction, etc.), the transition probability of each ant moving to an adjacent location is calculated. This probability is typically directly proportional to the pheromone concentration and inversely proportional to the heuristic information (such as distance).

[0073] Search method selection: By comparing the calculated transition probability with a preset transition probability constant, it is determined whether the current ant should perform a local search or a global search. This decision-making process is performed dynamically in each iteration, thus allowing for flexible adjustment of the search strategy based on the progress of the search.

[0074] Pheromone Update: After each iteration, the pheromone concentration on the path is updated based on the quality of the solution found by the ants (such as the objective function value). The pheromone concentration on paths corresponding to higher-quality solutions will increase, thereby attracting more ants to visit these paths in future iterations.

[0075] Step 4: Combine the half-insulating microrings obtained from Step 1 to Step 3 into a complete insulating microring.

[0076] Example 2

[0077] Based on the same inventive concept, this embodiment provides a high-performance silicon-based thermal insulation microring design system. The principle of solving the problem is similar to that of the high-performance silicon-based thermal insulation microring design method provided in Embodiment 1, and the repeated parts will not be described again.

[0078] This embodiment provides a high-performance silicon-based thermal insulation microring design system, comprising:

[0079] The microring inner and outer contour drawing module is used to draw half of the outer contour curve of the microring 100 to be designed based on the free spectrum range of the microring 100 to be designed using double Euler bending, and to draw half of the inner contour curve of the microring 100 to be designed using an N-order Bezier curve and optimizing the control point coordinates of the N-order Bezier curve according to the principle of minimizing transmission loss; where N is a positive integer greater than 1; and the transmission loss is the 0th order mode transmission loss of the transverse electric field of half the microring.

[0080] The micro-ring splicing module is used to obtain half of an optimized micro-ring based on half of the outer contour curve and half of the inner contour curve, and to splice the two half-optimized micro-rings into a complete micro-ring.

[0081] Example 3

[0082] This embodiment provides a chip, including the high-performance silicon-based thermally insulating microring design system provided in Embodiment 2.

[0083] Example 4

[0084] This embodiment provides a spectrometer, including a chip provided in Embodiment 3.

[0085] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0086] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0087] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0088] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0089] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A method for designing high-performance silicon-based thermally insulating microrings, characterized in that, include: S101. Based on the free spectrum range of the microring to be designed, draw half of the outer contour curve of the microring to be designed using double Euler bending. Using an N-order Bézier curve and optimizing the control point coordinates of the N-order Bézier curve according to the principle of minimizing transmission loss, half of the inner contour curve of the micro-ring to be designed is plotted; where N is a positive integer greater than 1; the transmission loss is the 0th-order mode transmission loss of the transverse electric field of half the micro-ring. Optimizing the control point coordinates of the Nth-order Bézier curve based on the principle of minimizing transmission loss includes an ant colony algorithm, which is as follows: S201. Randomly initialize the coordinates of the Bessel control points for each ant; S202. Import the coordinates of the curve corresponding to the ant into the software and calculate the transmission loss value of the 0th order mode of the transverse electric field of half a micro-ring. S203. Calculate the transfer probability based on the transmission loss value to determine the search method; S204. Return to S202 until the specified number of iterations is reached, and obtain the control point coordinates of the Bézier curve of the ant with the largest pheromone. S102. Obtain a half-optimized micro-ring based on the half-outer contour curve and the half-inner contour curve; S103. Join the two half-optimized micro-rings together to form a complete micro-ring; S101 further includes drawing the double Euler curve according to the Euler equation to obtain the coordinates of each point on the double Euler curve; substituting the coordinates of the control points into the Bézier control equation to obtain the coordinates of each point on the Nth-order Bézier curve; wherein the Euler equation is: ; in, Let X be the curve's coordinate on the X-axis. Let be the curve's Y-coordinate, and s be the normalized length. For a freely chosen radius, This is the sampling sequence.

2. The high-performance silicon-based thermal insulation microring design method according to claim 1, characterized in that, The step S101 includes determining the parameters of the double Euler bend and initializing the coordinates of the control points.

3. The high-performance silicon-based thermal insulation microring design method according to claim 1, characterized in that, When the Nth-order Bézier curve is a 5th-order Bézier curve, the expression for the coordinates of the control points is: ; ; ; ; ; ; in, These are the coordinates of different control points. and The waveguide widths at the start and end points of the respective half-micro-rings are as follows: For the first One proportional parameter, , and These represent the different dimensions of the inner contour in the x and y directions.

4. The high-performance silicon-based thermal insulation microring design method according to claim 1, characterized in that, The microring to be designed includes upper and lower bus waveguides and a microring cavity.

5. A high-performance silicon-based thermal insulation microring design system, used to implement the high-performance silicon-based thermal insulation microring design method according to any one of claims 1 to 4, characterized in that, include: The microring inner and outer contour drawing module is used to draw half of the outer contour curve of the microring to be designed using double Euler bending based on the free spectrum range of the microring to be designed, and to draw half of the inner contour curve of the microring to be designed using an N-order Bezier curve and optimizing the control point coordinates of the N-order Bezier curve according to the principle of minimizing transmission loss; where N is a positive integer greater than 1; and the transmission loss is the 0th order mode transmission loss of the transverse electric field of half the microring. The micro-ring splicing module is used to obtain half of the optimized micro-ring based on the half of the outer contour curve and the half of the inner contour curve, and to splice the two half of the optimized micro-ring into a complete micro-ring.

6. A chip, characterized in that, This includes the high-performance silicon-based thermal insulation microring design system described in claim 5.

7. A spectrometer, characterized in that, Includes the chip described in claim 6.