Liquid cooling device and server

Abstract

The application relates to the technical field of servers, and provides a liquid cooling device and a server, which comprise a box body and a circulating system; the box body is formed with a containing chamber for containing insulating cooling liquid; a plurality of working components are arranged in the containing chamber and are soaked in the insulating cooling liquid; the circulating system is connected with the containing chamber and is used for driving the insulating cooling liquid to circulate; a plurality of spraying mechanisms are connected with the circulating system; the spraying ports of the spraying mechanisms are arranged in the insulating cooling liquid in the containing chamber and are arranged in correspondence with the plurality of working components, so as to selectively spray the insulating cooling liquid towards the corresponding working components. According to the application, the working components are soaked in the insulating cooling liquid, so that the heat generated by the working components can be removed in time, and the cooling effect can be improved. Through the arrangement of the spraying mechanisms, the insulating cooling liquid can be sprayed by the spraying mechanisms in a targeted manner during cooling, so that effective cooling of single components is realized, and the problem that it is difficult to carry out targeted cooling is solved.

Description

Technical Field

[0001] This invention relates to the field of server technology, and in particular to a liquid cooling device and a server. Background Technology

[0002] Servers generate a significant amount of heat during operation. Common heat dissipation methods include air cooling and liquid cooling. Liquid-cooled servers offer advantages such as superior heat dissipation, low noise, and high space utilization. In a liquid-cooled server, a heat absorption device receives heat from the components being cooled and transfers it to the coolant within the device. A pump then drives the coolant to flow, transferring the heat to the heat sink for dissipation. This cycle repeats continuously, achieving the purpose of heat dissipation.

[0003] In some typical liquid cooling solutions, coolant circulation is used to achieve overall cooling, which can effectively dissipate heat. However, different heat-generating components in a server often have different heat outputs, and excessive localized heat generation can affect the performance and lifespan of individual components, thereby limiting overall performance. Summary of the Invention

[0004] This invention provides a liquid cooling device and server to solve the shortcomings of the prior art, such as poor liquid cooling effect inside the chassis and difficulty in achieving targeted cooling for individual heat-generating components.

[0005] The first aspect of the present invention provides a liquid cooling device, comprising: The housing has a receiving chamber for containing insulating coolant, and the receiving chamber is provided with a plurality of working parts, which are immersed in the insulating coolant; A circulation system connected to the receiving chamber, the circulation system being used to drive the circulation of insulating coolant and to remove the heat generated by the working components during the circulation process; The circulation system is connected to multiple spraying mechanisms, each with its spray nozzle located in the insulating coolant within the containment chamber, and each corresponding to one of the working components to selectively spray insulating coolant onto the corresponding working component.

[0006] According to the liquid cooling device provided by the present invention, the circulation system includes a liquid conveying device and a liquid cooling device. The liquid conveying device is connected to the receiving chamber through an output pipe. The input port of the liquid cooling device is connected to the liquid conveying device through a connecting pipe. The output port of the liquid cooling device is connected to the receiving chamber through a liquid inlet pipe. The spraying mechanism is connected to the liquid inlet pipe.

[0007] According to the liquid cooling device provided by the present invention, a pre-cooling component is provided on the output pipeline, and the pre-cooling component is used to perform preliminary cooling on the insulating coolant.

[0008] According to the liquid cooling device provided by the present invention, the precooling component includes a precooling pipeline with a spiral structure.

[0009] According to the liquid cooling device provided by the present invention, the injection mechanism includes an injection pipe and an injection assembly, one end of the injection pipe is connected to the circulation system, and the injection assembly is provided at the injection port at the other end of the injection pipe; The spraying assembly includes a fixed part, a rotating shaft, and a pipe cover. The fixed part is fixedly disposed inside the spraying pipe. The rotating shaft is rotatably disposed on the fixed part. One end of the rotating shaft is provided with a vortex impeller and is located inside the spraying pipe. The other end of the rotating shaft is connected to the pipe cover and is located outside the opening of the spraying pipe. The pipe cap includes a turntable and a fixing ring. The fixing ring is fixedly disposed on the bottom surface of the turntable. The inner wall surface of the fixing ring and the outer wall surface of the spray pipe have a rotational gap. The inner wall surface of the fixing ring has a first annular groove, and the outer wall surface of the spray pipe has a second annular groove. The first annular groove and the second annular groove cooperate to form a rotating annular groove. A ball bearing is disposed in the rotating annular groove. The turntable has multiple spray holes, which are positioned directly opposite the working component.

[0010] According to the liquid cooling device provided by the present invention, a plurality of the nozzles are uniformly arranged along the circumference of the turntable to form a circular nozzle array.

[0011] According to the liquid cooling device provided by the present invention, the injection pipe includes a transmission pipe section and a flow pipe section, the transmission pipe section being connected to the circulation system and the flow pipe section being connected to the housing; The injection assembly is located at the injection port of the flow pipe section, the flow pipe section is inclined downward, and the injection port of the flow pipe section extends into the receiving cavity.

[0012] According to the liquid cooling device provided by the present invention, both the transmission pipe section and the circulation system are equipped with electrically controlled valves.

[0013] The liquid cooling device provided by the present invention further includes a central controller, which is disposed on the side wall of the outer casing; Each working component is equipped with a temperature sensor, which is used to collect the temperature of the working component in real time. The temperature sensor and the solenoid valve are both electrically connected to the central controller to selectively open the solenoid valve based on the temperature sensor.

[0014] A second aspect of the present invention provides a server, the server comprising the liquid cooling device as described in any of the preceding claims.

[0015] This invention provides a liquid cooling device and server. The working component is the main heat-generating component. By immersing the working component in an insulating coolant, the heat generated by the working component can be removed in a timely manner, thereby improving the cooling effect. Furthermore, the spray mechanism allows for targeted spraying of the insulating coolant during cooling, achieving effective cooling of individual components and solving the problem of difficult targeted cooling. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is one of the internal structural schematic diagrams of the liquid cooling device provided by the present invention.

[0018] Figure 2 This is the second schematic diagram of the internal structure of the liquid cooling device provided by the present invention.

[0019] Figure 3 This is a schematic diagram of the internal structure of the spray assembly in the liquid cooling device provided by the present invention.

[0020] Figure 4 This is a three-dimensional structural diagram of the spray assembly in the liquid cooling device provided by the present invention.

[0021] Figure 5 This is a top view of the liquid cooling device provided by the present invention.

[0022] Figure 6 This is a schematic diagram of the connection structure of the central controller in the liquid cooling device provided by the present invention.

[0023] Figure label: 10. Box body; 11. Receiving chamber; 20. Working component; 21. Motherboard; 22. CPU; 23. Graphics card; 24. Hard drive; 25. First temperature sensor; 26. Second temperature sensor; 27. Third temperature sensor; 30. Insulating coolant; 40. Circulation system; 41. Output pipeline; 42. Pre-cooling component; 43. Liquid delivery device; 44. Connecting pipeline; 45. Liquid cooling device; 46. Liquid inlet pipeline; 47. Fourth solenoid valve; 50. Injection mechanism; 51. Injection pipe; 511. First injection pipe; 512. Second injection pipe; 513. Third injection pipe; 514. First electrically controlled valve; 515. Second electrically controlled valve; 516. Third electrically controlled valve; 517. Includes transmission pipe section; 518. Flow pipe section; 52. Injection assembly; 521. Vortex impeller; 522. Fixing part; 523. Rotating shaft; 524. Turntable; 5241. Spray hole; 525. Fixing ring; 526. Ball bearing; 527. First annular groove; 528. Second annular groove; 60. Central controller. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0025] In the early days of computers, when heat generation was relatively low, passive cooling technology was widely used. Passive cooling primarily achieved heat dissipation by adding metal heat sinks that contact the heat-generating components, increasing the surface area for heat transfer, with heat being directly transferred to the air. Traditional air cooling mainly involves adding fans to passive heat sinks to accelerate airflow over the heat sink surface, thereby enhancing the cooling effect; this cooling method is also known as air cooling. However, due to the poor heat transfer efficiency and low heat flux density of air, air-cooled servers suffer from inherent drawbacks such as high cooling energy consumption, high noise levels, low device density, and susceptibility to dust accumulation, becoming a bottleneck in server cooling technology development. Especially with the development of high-performance computers, server layout density is increasing, and the requirements for cooling technology are becoming more stringent, making the role of traditional air cooling technology increasingly inadequate.

[0026] In this context, liquid cooling technology emerged and has gradually become the main trend in server cooling technology. Liquid cooling is a quiet and efficient heat dissipation method, and its high efficiency has led to its widespread application in scenarios with high heat dissipation requirements.

[0027] In related technologies, numerous coolant pipes are constructed inside the chassis to rapidly dissipate heat and achieve efficient cooling. While this approach offers good overall heat dissipation, in actual cooling processes, the varying heat generation of individual components due to shifts in data processing scenarios and differences in component characteristics mean that heat transfer to the entire system takes time. This means that individual components may not dissipate heat quickly enough, impacting their performance and reducing their lifespan, ultimately affecting the overall user experience.

[0028] In the diagram, Figure 1 This is a frontal cross-sectional view of the liquid cooling device. Figure 2 This is a schematic diagram of the side cross-sectional structure of the liquid cooling device; Figure 3 A schematic diagram of the assembly of the injection components; Figure 4 This is a schematic diagram of the three-dimensional structure of the spray assembly; Figure 6 This is a top-view structural diagram of the liquid cooling device. The proportions of the components in the diagram are not fixed, and the proportions should not be interpreted as a limitation on size.

[0029] Regarding the problems in related technologies, such as Figure 1 , Figure 2 As shown, this embodiment provides a liquid cooling device, including a housing 10 and a circulation system 40. The housing 10 has a receiving chamber 11 for containing insulating coolant 30. Multiple working components 20 are disposed within the receiving chamber 11 and are immersed in the insulating coolant 30. The circulation system 40 is connected to the receiving chamber 11 and drives the insulating coolant 30 to circulate, carrying away the heat generated by the working components 20 during the circulation process. Multiple spraying mechanisms 50 are connected to the circulation system 40. The spray nozzles of the multiple spraying mechanisms 50 are all located in the insulating coolant 30 within the receiving chamber 11 and are correspondingly arranged one-to-one with the multiple working components 20, for selectively spraying the insulating coolant 30 onto the corresponding working component 20. In the liquid cooling system, the coolant needs to flow continuously to carry away the continuously generated heat. In this embodiment, by immersing the entire working component 20 in the insulating coolant 30, heat is carried away in a timely manner. Furthermore, the spray mechanism 50 enables targeted cooling, thereby achieving cooling of a single component. This solves the problem of difficulty in efficiently cooling a single component and improves the overall performance and user experience.

[0030] Specifically, the receiving chamber 11 inside the housing 10 is a relatively closed chamber structure, and a certain amount of insulating coolant 30 is injected inside it. The working part 20 is located in the receiving chamber 11 and below the liquid level of the insulating coolant 30, so that the whole is immersed in the insulating coolant 30. This allows the coolant to directly contact the working part 20 and increases the contact area with the working part 20, thereby quickly removing heat during the circulation of the insulating coolant 30 and achieving efficient cooling.

[0031] Meanwhile, the circulation system 40 is also equipped with multiple spraying mechanisms 50, each of which is equipped with a spray nozzle. Each spray nozzle is located in the insulating coolant 30 and is directly facing a single working component 20, so that when a single component needs targeted cooling, coolant is sprayed to achieve efficient cooling of the single component.

[0032] Understandably, the working component 20 is used to implement the basic functions of the server. During operation, due to the differences in data processing and the individual functions of each component, the heat generated by each component varies. This makes traditional overall liquid cooling ineffective in achieving targeted cooling, leading to a decrease in the performance and lifespan of individual components. In this embodiment, the spray mechanism 50 provides a spray nozzle corresponding to each individual working component 20. The insulating coolant 30 sprayed from the nozzle increases the liquid flow rate at the location of the individual component, thereby removing heat more quickly. This achieves targeted cooling of the individual working component 20, providing each component with a more suitable working environment, improving its performance and lifespan, and enhancing the overall user experience.

[0033] It should be understood that when the working part 20 is immersed in some conventional coolant, the normal operation of the working part 20 may be affected by the coolant. In this embodiment, the immersion is in insulating coolant 30, so that the coolant will not affect the specific operation of the working part 20 during the circulation process.

[0034] In some embodiments, the insulating coolant 30 can be a synthetic oil or a fluorinated solution. Specifically, the synthetic oil can be a polyester oil, thereby preventing it from affecting the normal operation of the working part 20 during circulation. The fluorinated solution can be the Novec series coolant manufactured by 3M. Of course, it can also be a water-based insulating coolant 30, which is a treated water-based liquid with added insulating and corrosion inhibitors to achieve its insulating properties and ensure the insulating characteristics of the coolant.

[0035] In some embodiments, the surface of the working component 20 is coated with an insulating layer to achieve insulation of the working component 20 itself, which can further improve the insulation effect between the working component 20 and the insulating coolant 30, and ensure the normal operation of the working component 20.

[0036] In a specific configuration, the working component 20 includes a motherboard 21, and a CPU 22, a graphics card 23, and a hard disk 24 mounted on the motherboard 21. An insulating layer is coated on the motherboard 21, CPU 22, graphics card 23, and hard disk 24. This insulating layer enhances the insulation between the working component 20 and the insulating coolant 30, preventing the insulating coolant 30 from affecting the working component 20.

[0037] For example, the insulating layer can be one or more combinations of polyester coating, polyurethane coating and epoxy coating, and the insulating layer can prevent the insulating coolant 30 from affecting the normal operation of the working part 20.

[0038] like Figure 1 As shown, the working component 20 is located at the bottom of the receiving chamber 11. Specifically, the motherboard 21 is located at the bottom of the receiving chamber 11. The motherboard 21 is equipped with a CPU 22, a graphics card 23, and a hard disk 24. There are three spraying mechanisms 50. The spray nozzles on the three spraying mechanisms 50 are set one-to-one with the CPU 22, the graphics card 23, and the hard disk 24, so that when individual cooling is required, the insulating coolant 30 is sprayed through the spray nozzle to achieve efficient cooling of a single component.

[0039] In a specific configuration, the housing 10 is a rectangular housing 10, and the receiving chamber 11 formed inside the housing 10 has a rectangular closed chamber structure. The working part 20 is located at the bottom of the receiving chamber 11, which allows the working part 20 to be immersed in a smaller amount of insulating solution, thus saving the amount of insulating coolant 30 used.

[0040] In some embodiments, the circulation system 40 includes a liquid delivery device 43 and a liquid cooling device 45. The liquid delivery device 43 is connected to the receiving chamber 11 via an output pipe 41. The inlet of the liquid cooling device 45 is connected to the liquid delivery device 43 via a connecting pipe 44, and the outlet of the liquid cooling device 45 is connected to the receiving chamber 11 via a liquid inlet pipe 46. The spraying mechanism 50 is connected to the liquid inlet pipe 46. The circulation system 40 needs to drive the coolant to circulate and achieve cooling of the coolant during the circulation process, thereby continuously achieving internal temperature exchange. In this embodiment, by providing a liquid cooling device 45 in the circulation system 40, the insulating coolant 30 within the circulation system 40 can be cooled, allowing the insulating coolant 30 to quickly remove the heat generated by the internal working components 20.

[0041] Generally, the circulation system 40 of a liquid cooling system outputs heat and dissipates or exchanges heat during circulation, thereby cooling the coolant and maintaining the continuity of the entire circulation system 40. For example, by externalizing the circulation pipes in the circulation system 40, heat in the pipes can be exchanged with the external environment, thus cooling the coolant. In this embodiment, by installing a liquid cooling device 45 in the circulation system 40, the insulating coolant 30 can be cooled more quickly, thereby increasing the flow rate of the insulating coolant 30 in the circulation system 40 and achieving efficient internal cooling.

[0042] Specifically, the liquid cooling device 45 is a condenser. The insulating coolant 30 input by the liquid conveying device 43 has a certain temperature. After passing through the condenser, the insulating coolant 30 is cooled, so that the insulating coolant 30 input through the liquid inlet pipe 46 is in a low temperature state, thereby continuously achieving internal cooling.

[0043] like Figure 1 As shown, in some embodiments, an output connection hole is provided on the side wall of the housing 10, and the output pipe 41 is connected to the receiving chamber 11 through the output connection hole. The output connection hole is located below the liquid surface of the insulating coolant 30 and close to the working component 20. An input connection hole is provided on the side wall of the housing 10 opposite to the output connection hole. The liquid inlet pipe 46 is connected to the receiving chamber 11 through the input connection hole. The input connection hole is located at the upper part of the receiving chamber 11.

[0044] Specifically, the connection point between the output pipe 41 and the housing 10 is located at the lower part of the housing 10, which is close to the working component 20. This allows the generated heat to be carried away in a timely manner, preventing heat from accumulating inside the housing chamber 11.

[0045] like Figure 1 As shown, the inlet pipe 46 is located above the liquid surface. This arrangement allows the injected coolant to have a certain degree of fluidity within the system, maintaining uniform cooling. Furthermore, this design effectively prevents air bubbles from being drawn into the system, reducing air resistance.

[0046] In a specific configuration, the liquid delivery device 43 includes a water pump, which generates negative pressure to quickly draw in the insulating coolant 30, achieving efficient circulation of the insulating coolant 30. Alternatively, a peristaltic pump, gear pump, or other similar device can be used for pumping operations.

[0047] In some embodiments, a pre-cooling component 42 is provided on the output pipe 41, which is used to initially cool the insulating coolant 30. During the cooling of the insulating coolant 30, the two-stage cooling process improves cooling efficiency and enhances the overall cooling effect.

[0048] Generally, the insulating coolant 30 can be cooled by introducing it into the liquid cooling device 45. In this embodiment, by setting a pre-cooling component 42 before the liquid cooling device 45, the insulating coolant 30 can be initially cooled, thereby improving the overall cooling efficiency and reducing the workload of the liquid cooling device 45.

[0049] In a specific implementation, the precooling component 42 includes a spiral-shaped precooling pipeline. During precooling, it primarily achieves the initial cooling of the high-temperature insulating coolant 30.

[0050] In this embodiment, the spiral pipeline structure can increase the contact area with the external environment, thereby achieving efficient heat exchange, reducing the temperature of the insulating coolant 30 in the pre-cooling pipeline, and achieving preliminary cooling. Then, the pre-cooled insulating coolant 30 is input into the liquid cooling device 45 through the liquid conveying device 43 for further cooling, which can improve the cooling efficiency and cooling effect of the system.

[0051] Understandably, by setting up a spiral pre-cooling pipeline, the unnecessary pre-cooling components 42 are cooled, achieving energy saving of the overall system and effectively reducing the temperature of the insulating coolant 30 inside the pipe, thereby improving the cooling effect and efficiency.

[0052] In specific setup, one or more sets of spiral precooling pipes can be installed. When setting one set, such as... Figure 1 As shown, the inlet end of the precooling pipeline is connected to the outlet pipeline 41, and the outlet end of the precooling pipeline is connected to the inlet of the liquid conveying device 43. When multiple sets are configured, multiple sets of precooling pipelines can be arranged side by side or connected in series to achieve a better precooling effect and further improve the cooling efficiency and cooling effect of the coolant.

[0053] According to an embodiment of the present invention, each spraying mechanism 50 includes a spray pipe 51 and a spraying assembly 52. ​​One end of the spray pipe 51 is connected to the circulation system 40, and the spraying assembly 52 is provided at the spray port at the other end of the spray pipe 51. The spraying assembly 52 includes a fixing part 522, a rotating shaft 523, and a pipe cover. The fixing part 522 is fixedly disposed inside the spray pipe 51, and the rotating shaft 523 is rotatably disposed on the fixing part 522. One end of the rotating shaft 523 is provided with a vortex impeller 521 and is located inside the spray pipe 51; the other end of the rotating shaft 523 is connected to the pipe cover and is located inside the spray pipe 51. The outer side of the nozzle of pipe 1; the pipe cover includes a turntable 524 and a fixing ring 525. The fixing ring 525 is fixedly mounted on the bottom surface of the turntable 524. The inner wall surface of the fixing ring 525 and the outer wall surface of the spray pipe 51 have a rotation gap. The inner wall surface of the fixing ring 525 has a first annular groove 527, and the outer wall surface of the spray pipe 51 has a second annular groove 528. The first annular groove 527 and the second annular groove 528 cooperate to form a rotating annular groove. A ball bearing 526 is provided in the rotating annular groove. Multiple spray holes 5241 are provided on the turntable 524. The multiple spray holes 5241 are positioned directly opposite the working part 20. The fluidity of the insulating coolant 30 inside the receiving chamber 11 affects the overall cooling effect and the uniformity of cooling. In this embodiment, the spraying assembly 52 can spray the insulating coolant 30 toward the corresponding working component 20. During the spraying process, the local flow rate can be increased, thereby achieving efficient cooling of a single component on the one hand, and increasing the flow rate of the internal insulating coolant 30 on the other hand, thus achieving uniform cooling of the entire internal component and improving cooling efficiency.

[0054] Specifically, the vortex impeller 521 is located inside the injection pipe 51. When flowing liquid is injected into the injection pipe 51, it drives the vortex impeller 521 to rotate. The rotation of the vortex impeller 521 drives the rotating shaft to rotate, which in turn drives the pipe cover to rotate. During the rotation, the multiple nozzles 5241 on the pipe cover form vortices, thereby increasing the external flow velocity of the workpiece component directly opposite the injection nozzle, improving its cooling effect, and achieving targeted cooling. In addition, this method also accelerates the flow of the insulating coolant 30 in the receiving chamber 11, improving the overall uniformity of cooling.

[0055] like Figures 2-4 As shown, the fixing part 522 includes a fixing rod, both ends of which are fixed inside the injection pipe 51. The rotating shaft 523 passes through the fixing rod and is rotatably connected to it. After the insulating coolant 30 is injected, the liquid impacts the vortex impeller 521, causing the vortex impeller 521 to rotate, which in turn drives the rotating shaft 523 to rotate relative to the fixing part 522.

[0056] In a specific configuration, a rotating hole is provided on the fixed rod, and a rotating shaft 523 is provided in the rotating hole. The rotating shaft 523 is supported on the fixed rod, thereby causing the vortex impeller 521 to rotate under the action of liquid thrust.

[0057] Understandably, the pipe cap can rotate relative to the spray pipe 51 under the drive of the rotating shaft 523. Specifically, the rotation of the pipe cap is made more stable through the cooperation of the rotating annular groove and the ball bearing 526. During the rotation of the nozzle 5241, the sprayed liquid forms a vortex, thereby increasing the flow velocity and accelerating cooling.

[0058] In some embodiments, such as Figure 3 , Figure 4 As shown, multiple nozzles 5241 are evenly arranged along the circumference of the turntable 524 to form a circular nozzle array 5241. The arrangement of the nozzle array 5241 can improve the uniformity of the sprayed liquid and facilitate the formation of vortices, thereby improving the targeted cooling effect and the overall cooling uniformity.

[0059] Specifically, the rotating shaft 523 is connected to the middle of the turntable 524, and the array of nozzles 5241 is located on the outer ring of the rotating shaft 523. This arrangement can ensure the overall structural strength of the turntable 524 and make the overall stability of the pipe cover higher.

[0060] In some embodiments, the spray pipe 51 includes a transmission pipe section 517 and a flow pipe section 518. The transmission pipe section is connected to the circulation system 40, and the flow pipe section 518 is connected to the housing 10. The spray assembly 52 is located at the spray port of the flow pipe section 518, which is inclined downwards, and the spray port of the flow pipe section 518 extends into the receiving chamber 11. The spray pipe 51 needs to be connected to the cooled insulating coolant 30. In this embodiment, the coolant is input into the spray pipe 51 through the transmission pipe section connected to the circulation system 40. The flow pipe section 518 enables rapid flow of the insulating coolant 30 and drives the spray assembly 52 to spray the insulating coolant 30 outwards.

[0061] Specifically, the port of the flow pipe section 518 is the injection port, and the injection component 52 is located inside the injection port. Due to the downward tilt of the flow pipe section 518, the liquid flow velocity through the flow pipe section 518 is increased, thereby effectively driving the vortex impeller 521 to rotate and realize the spraying of the insulating coolant 30 through the spray hole 5241.

[0062] It is understood that in this embodiment, the spray nozzle is located inside the insulating coolant 30 and close to the working component 20. The spray assembly 52 is located at the spray nozzle, and the tube cap is located outside the spray nozzle. Driven by the injected liquid, the tube cap can rotate, thereby driving the insulating coolant 30 at the tube cap position to rotate, thereby accelerating the flow speed of the insulating liquid in the containment chamber 11 and improving the cooling efficiency and cooling effect.

[0063] like Figure 1 , Figure 2 As shown, each working component 20 has a spray nozzle above it, and the axis of the spray direction of the spray nozzle forms a spray angle with the working component 20. The spray assembly 52 is located at the spray nozzle, and the spray angle setting can increase the coverage area of ​​the spray with the working component 20, thereby improving the cooling effect.

[0064] Specifically, a connection hole is provided on the side wall of the housing 10, and part of the flow pipe section 518 is located in the connection hole to realize the connection between the flow pipe section 518 and the housing 10. The flow pipe section 518 is connected to the transmission pipe section, so that the insulating coolant 30 is input into the flow pipe section 518 through the transmission pipe section.

[0065] like Figure 2 As shown, an obtuse angle is formed between the flow pipe section 518 and the transmission pipe section, so that the flow pipe section 518 is arranged to be inclined downward, so as to realize the high-speed flow of the insulating coolant 30.

[0066] In some embodiments, electrically controlled valves are installed on both the transmission pipe section and the circulation system 40. The installation of electrically controlled valves facilitates the integration of an automatic control system, enabling overall automatic control and improving the level of automation.

[0067] Specifically, an electrically controlled valve is provided on the liquid inlet pipe 46 in the circulation system 40, and an electrically controlled valve is also provided on each transmission pipe section. The electrically controlled valve can be connected to the control system to realize the control of each electrically controlled valve.

[0068] In some specific implementations, the flow pipe section 518 can be made of stainless steel. The stainless steel flow pipe section 518 has corrosion resistance and high structural strength to improve overall stability and durability.

[0069] like Figure 2 , Figure 5As shown, the specific configuration includes a first injection pipe 51151, a second injection pipe 51251, and a third injection pipe 51351. The first injection pipe 51151 includes a first transmission pipe section and a first flow pipe section 518, with the first injection port of the first flow pipe section 518 facing the CPU 22 on the motherboard 21. The second injection pipe 51251 includes a second transmission pipe section and a second flow pipe section 518, with the second injection port of the second flow pipe section 518 facing the graphics card 23 on the motherboard 21. The third injection pipe 51351 includes a third transmission pipe section and a third flow pipe section 518, with the third injection port of the third flow pipe section 518 facing the hard drive 24 on the motherboard 21.

[0070] The system includes a first solenoid valve 514 on the first transmission pipe section, a second solenoid valve 515 on the second transmission pipe section, a third solenoid valve 516 on the third transmission pipe section, and a fourth solenoid valve 47 on the liquid inlet pipe 46 in the circulation system 40. The four solenoid valves can control the opening and closing of their respective pipes.

[0071] In the control system, the first solenoid valve 514, the second solenoid valve 515, the third solenoid valve 516 and the fourth solenoid valve 47 are all connected to the control system, thereby enabling the control of each solenoid valve and realizing the cooling operation of different working parts 20.

[0072] For example, when the CPU 22 is detected to be overheating, cooling measures are needed. At this time, the first solenoid valve 514 is opened, and the second, third, and fourth solenoid valves 515, 516, and 47 are closed. This allows the insulating coolant 30 to pass through the first transmission pipe section and the first flow pipe section 518, and then be sprayed onto the CPU 22 by the spray assembly 52 at the first spray nozzle, thus achieving targeted cooling of the CPU 22. Specifically, the insulating coolant 30 flows out from the first flow pipe section 518, driving the vortex impeller 521 to rotate. The rotation of the vortex impeller 521 drives the turntable 524 to rotate via the rotating shaft 523. When the coolant flows out from the spray nozzle 5241 on the rotating turntable 524, the insulating coolant 30 is sprayed onto the CPU 22 in a rotating vortex pattern, ensuring more thorough contact with the CPU 22 and accelerating the reduction of its temperature. Similarly, it can also quickly reduce the temperature of the graphics card 23 and hard drive 24. This device is reasonably designed and ingeniously conceived, effectively targeting the cooling of different components in the server, ensuring the cooling effect of all components and improving their lifespan. Furthermore, while achieving targeted cooling of the CPU 22, it can also accelerate the flow of the internal insulating liquid, thereby achieving more efficient cooling.

[0073] It should be understood that the CPU 22, graphics card 23, and hard disk 24 listed in the above embodiments are merely illustrative examples and should not be construed as limiting the working component 20. Those skilled in the art, upon learning of this solution, can arrange other components using similar methods, and therefore, exhaustive descriptions will not be provided.

[0074] According to the embodiments provided by the present invention, a central controller 60 is also included, which is disposed on the side wall outside the housing 10; each working component 20 is provided with a temperature sensor, which is used to collect the temperature of the working component 20 in real time; the temperature sensor and the electrically controlled valve are both electrically connected to the central controller 60 to selectively open the electrically controlled valve based on the temperature sensor. The central controller 60 enables data acquisition and control command output, and its configuration improves the overall level of automation, achieving automated operation.

[0075] Specifically, each working component 20 is equipped with a temperature sensor on its side or top wall. The temperature sensor is used to sense the temperature of the current working component 20. Each working component 20 is provided with a temperature threshold in the central controller 60. When the sensed temperature exceeds the threshold, a control command is output to open the corresponding electronically controlled valve, thereby realizing the automatic control of the liquid cooling system.

[0076] In the specific configuration, a first temperature sensor 25 is located on the side wall of the CPU 22, a second temperature sensor 26 is located on the graphics card 23, and a third temperature sensor 27 is located on the hard drive 24. Each temperature sensor is unidirectionally electrically connected to the central controller 60, meaning that the three temperature sensors are only used to transmit the sensed temperature data. Similarly, the first electronically controlled valve 514, the second electronically controlled valve 515, the third electronically controlled valve 516, and the fourth electronically controlled valve 47 are all unidirectionally electrically connected to the central controller 60, thereby enabling the issuance of control commands to each electronically controlled valve.

[0077] In specific operation: the first temperature sensor 25, the second temperature sensor 26 and the third temperature sensor 27 respectively detect the real-time surface temperature data of the CPU 22, the graphics card 23 and the hard disk 24 on the motherboard 21, and send the real-time surface temperature of the CPU 22, the graphics card 23 and the hard disk 24 to the central controller 60.

[0078] When cooling the motherboard 21 as a whole, the first electronic control valve 514, the second electronic control valve 515, and the third electronic control valve 516 are closed to prevent the insulating coolant 30 from being sprayed out of the spray pipe 51. The fourth electronic control valve 47 is then opened, and the liquid delivery device 43 is started, allowing the insulating coolant 30 in the housing 10 to enter the pre-cooling component 42 from the output pipe 41 for initial heat dissipation. After initial heat dissipation, it enters the liquid cooling device 45 through the connecting pipe 44 for further deep cooling of the insulating coolant 30. After deep cooling, since the fourth electronic control valve 47 is open and the other three electronic control valves are closed, the cooled insulating coolant 30 can enter the receiving chamber 11 from the liquid inlet pipe 46. The insulating coolant 30 then circulates continuously, continuously removing heat from the motherboard 21 as a whole.

[0079] When the temperature of any of the working components 20 among CPU 22, graphics card 23, and hard drive 24 rises, targeted cooling is required. For example, when the central controller 60 detects that the surface temperature of CPU 22 exceeds a preset threshold, it can open the first electrically controlled valve 514 on the first transmission pipe section above CPU 22 and close the second electrically controlled valve 515, the third electrically controlled valve 516, and the fourth electrically controlled valve 47. This allows the low-temperature insulating coolant 30 to enter the first flow pipe section 518 from the first transmission pipe section, and finally be sprayed onto CPU 22 from the spray assembly 52 through the spray nozzle of the first flow pipe section 518, thus providing targeted cooling to CPU 22. When the insulating coolant 30 flows out from the first flow pipe, the insulating coolant 30 can drive the vortex impeller 521 to rotate. The rotation of the vortex impeller 521 can drive the turntable 524 to rotate through the rotating shaft 523. At this time, when the insulating coolant 30 flows out from the spray hole 5241 on the rotating turntable 524, the insulating coolant 30 will be sprayed onto the CPU 22 in a rotating vortex shape, making more full contact with the CPU 22, which can accelerate the reduction of the CPU 22 temperature. Similarly, it can also quickly reduce the temperature of the graphics card 23 and hard drive 24.

[0080] In specific configurations, the central controller 60 includes an MSP430 microcontroller or a PLC controller of model OMRON CP1E-N20DR-D. The MSP430 microcontroller is chosen for its low power consumption, efficient 16-bit RISC architecture, fast processing speed, suitability for real-time applications, and various peripheral options such as ADCs, timers, and communication interfaces to meet diverse application needs. Furthermore, the MSP430 microcontroller is widely used, technologically mature, and relatively inexpensive, making it suitable for mass production.

[0081] The OMRON CP1E-N20DR-D PLC controller is used, offering high performance, 20 input / output points, fast response, and suitability for various automation tasks. Its compact design saves space, making it ideal for applications with limited space. It supports multiple programming languages, such as ladder diagrams and structured text, making it easy for users to learn.

[0082] The present invention also provides a server, which includes the liquid cooling device described above.

[0083] In one specific embodiment, the server includes a chassis, a motherboard 21, a central processing unit (CPU), memory, and storage devices. The chassis has a housing 10, and the housing 10 forms a receiving chamber 11. The receiving chamber 11 is filled with a large amount of insulating coolant 30. The motherboard 21, CPU, memory, and storage devices are located below the surface of the insulating coolant 30, so that the motherboard 21, CPU, memory, and storage devices are all immersed in the insulating coolant 30.

[0084] In this embodiment, the specific structure of the server is not limited. As long as the server is equipped with the above-mentioned liquid cooling device, it should fall within the scope of this embodiment. The server should have all the beneficial effects of the above-mentioned liquid cooling device, which will not be described in detail here.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A liquid cooling device, characterized in that, include: The housing has a receiving chamber for containing insulating coolant, and the receiving chamber is provided with a plurality of working parts, which are immersed in the insulating coolant; A circulation system connected to the receiving chamber, the circulation system being used to drive the circulation of insulating coolant and to remove the heat generated by the working components during the circulation process; The circulation system is connected to multiple spraying mechanisms, and the spray nozzles of the multiple spraying mechanisms are all located in the insulating coolant in the receiving chamber, and are arranged one-to-one with the multiple working parts, so as to selectively spray insulating coolant towards the corresponding working parts; The spraying mechanism includes a spray pipe and a spraying assembly. One end of the spray pipe is connected to the circulation system, and the spraying assembly is provided at the spray port at the other end of the spray pipe. The spraying assembly can spray insulating coolant towards the corresponding working part. During the spraying process, it can increase the local flow rate, achieving efficient cooling of a single part while increasing the flow rate of the internal insulating coolant. The spraying assembly includes a fixed part, a rotating shaft, and a pipe cover. The fixed part is fixedly disposed inside the spraying pipe. The rotating shaft is rotatably disposed on the fixed part. One end of the rotating shaft is provided with a vortex impeller and is located inside the spraying pipe. The other end of the rotating shaft is connected to the pipe cover and is located outside the opening of the spraying pipe. The pipe cover includes a turntable with multiple spray holes, which are positioned directly opposite the working component. The turntable is connected to the rotating shaft.

2. The liquid cooling device according to claim 1, characterized in that, The circulation system includes a liquid delivery device and a liquid cooling device. The liquid delivery device is connected to the receiving chamber through an output pipe. The inlet of the liquid cooling device is connected to the liquid delivery device through a connecting pipe. The outlet of the liquid cooling device is connected to the receiving chamber through an inlet pipe. The injection mechanism is connected to the liquid inlet pipe.

3. The liquid cooling device according to claim 2, characterized in that, The output pipeline is equipped with a pre-cooling component, which is used to initially cool the insulating coolant.

4. The liquid cooling device according to claim 3, characterized in that, The precooling component includes a spiral precooling pipeline.

5. The liquid cooling device according to claim 1, characterized in that, The pipe cap also includes a fixing ring, which is fixedly disposed on the bottom surface of the turntable. The inner wall surface of the fixing ring and the outer wall surface of the spray pipe are provided with a rotation gap. The inner wall surface of the fixing ring is provided with a first annular groove, and the outer wall surface of the spray pipe is provided with a second annular groove. The first annular groove and the second annular groove cooperate to form a rotating annular groove. A ball bearing is provided in the rotating annular groove.

6. The liquid cooling device according to claim 5, characterized in that, The multiple nozzles are evenly arranged along the circumference of the turntable to form a circular nozzle array.

7. The liquid cooling device according to claim 5, characterized in that, The injection pipe includes a transmission pipe section and a flow pipe section. The transmission pipe section is connected to the circulation system, and the flow pipe section is connected to the housing. The injection assembly is located at the injection port of the flow pipe section, the flow pipe section is inclined downward, and the injection port of the flow pipe section extends into the receiving cavity.

8. The liquid cooling device according to claim 7, characterized in that, Both the transmission pipe section and the circulation system are equipped with electrically controlled valves.

9. The liquid cooling device according to claim 8, characterized in that, It also includes a central controller, which is located on the side wall of the outer casing; Each working component is equipped with a temperature sensor, which is used to collect the temperature of the working component in real time. The temperature sensor and the solenoid valve are both electrically connected to the central controller to selectively open the solenoid valve based on the temperature sensor.

10. A server, characterized in that, The server includes the liquid cooling device according to any one of claims 1-9.

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