3D interconnection supercomputing system and server integration method
CN119248481APending Publication Date: 2025-01-03SHANGHAI TECH UNIV +1
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Patent Information
- Application Number
- CN202411278555.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2025-01-03
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Figure CN119248481A_ABST
Abstract
The invention provides a 3D interconnection supercomputing system and a server integration method, and the method comprises the steps: respectively splitting a CPU processing module which has monitoring and management functions and an XPU processing module which has a computing function in a standard server into a management blade server and a computing blade server; one management blade server is correspondingly connected with a plurality of calculation blade servers, so that the integration density of the servers in the 3D interconnection supercomputing system is improved, meanwhile, the calculation blade servers can perform data calculation tasks in a centralized manner, and the calculation efficiency of the 3D interconnection supercomputing system is greatly improved; in addition, a plurality of CPU processing modules are integrated in the same management blade server, and a plurality of XPU processing modules are integrated in the same computing blade server, so that the integration density is further improved, the distance between computing nodes in the 3D interconnection supercomputing system is shortened, the flight time of signals is shortened, and the supercomputing performance of the system is ensured.
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