3D interconnection supercomputing system and server integration method

CN119248481APending Publication Date: 2025-01-03SHANGHAI TECH UNIV +1
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Patent Information

Application Number
CN202411278555.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-12
Publication Date
2025-01-03

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Abstract

The invention provides a 3D interconnection supercomputing system and a server integration method, and the method comprises the steps: respectively splitting a CPU processing module which has monitoring and management functions and an XPU processing module which has a computing function in a standard server into a management blade server and a computing blade server; one management blade server is correspondingly connected with a plurality of calculation blade servers, so that the integration density of the servers in the 3D interconnection supercomputing system is improved, meanwhile, the calculation blade servers can perform data calculation tasks in a centralized manner, and the calculation efficiency of the 3D interconnection supercomputing system is greatly improved; in addition, a plurality of CPU processing modules are integrated in the same management blade server, and a plurality of XPU processing modules are integrated in the same computing blade server, so that the integration density is further improved, the distance between computing nodes in the 3D interconnection supercomputing system is shortened, the flight time of signals is shortened, and the supercomputing performance of the system is ensured.
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