Molding resin composition and electronic component device

CN119256052APending Publication Date: 2025-01-03RESONAC CORP
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Patent Information

Application Number
CN202380037643.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2022-06-10
Filing Date
2023-06-09
Publication Date
2025-01-03

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Abstract

A resin composition for molding, comprising: a curable resin; an inorganic filler containing calcium titanate particles and at least one of silica particles and alumina particles; and a stress relaxation agent that contains at least one of an indene-styrene-coumarone copolymer, a trialkylphosphine oxide, and a triarylphosphine oxide.
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