Capacitor pin pre-shaping device

Abstract

The application relates to the technical field of capacitor processing, and discloses a capacitor pin pre-shaping device which comprises a rack, a bending assembly is installed on the rack, a slide rail assembly is arranged on one side of the bending assembly, and a positioning mechanism for clamping a capacitor body is installed on the slide rail assembly; the positioning mechanism comprises a base connected with the slide rail assembly, and a positioning seat capable of ascending and descending is installed on the base; a guide hole is formed in the positioning seat, and a top plate is embedded in the guide hole; a pressing mechanism is further arranged above the positioning mechanism, the capacitor body is clamped on the positioning seat of the positioning mechanism, the pin body is subjected to interference with the bending assembly when the capacitor body moves backward along the slide rail assembly, so that the pin body is subjected to primary bending; subsequently, the pressing block of the pressing mechanism drives the positioning seat to move downward, so that the top plate protrudes from the guide hole and the pin body is subjected to secondary bending; the device can realize secondary bending of the pin body, and greatly improves the application range of capacitor pin customization shaping.

Description

Technical Field

[0001] This invention relates to the field of capacitor processing technology, and more specifically to a capacitor pin pre-shaping device. Background Technology

[0002] The two leads of a capacitor are connected to different nodes in a circuit, serving to connect the internal plates of the capacitor to the external circuit. Common capacitor leads are straight; however, some special types of capacitors, such as surface mount capacitors (SMC / SMD), have flat metal leads. This shape is suitable for direct mounting on a printed circuit board (PCB) using processes like reflow soldering. For through-hole capacitors, in addition to straight leads, some may have bent leads. For example, in situations where the capacitor needs to be mounted in a specific location and avoid other components, the leads may be bent at an angle (e.g.,...). Figure 9 (As shown).

[0003] To shape capacitor leads into a specific shape for easier soldering, Chinese Patent Publication No. CN205798242U, published on December 14, 2016, discloses a capacitor lead shaping device. This device includes: a positioning seat for positioning the capacitor, two bending mechanisms symmetrically arranged on both sides of the positioning seat, and a pressure seat positioned directly above the positioning seat. The positioning seat includes a positioning block and two limiting blocks symmetrically arranged on the top surface of the positioning block. Each limiting block has a connected receiving groove and a lead groove. The positioning block has two symmetrically arranged rotating holes. Each limiting block has a bending end face at its front. The bending mechanisms include a drive cylinder, a telescopic plate, a connecting block, a pin, and a rotating shaft. This capacitor lead shaping device is safe, reliable, convenient, and efficient.

[0004] The capacitor pin shaping device disclosed in the aforementioned patent can only bend and shape the capacitor pins to a certain extent, but it cannot meet the needs of customizing pins with a raised part in the middle after bending. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a capacitor pin pre-shaping device. During the process of the positioning mechanism moving backward along the slide rail assembly, the pin body is initially bent and perpendicular to the axis of the capacitor body under the interference of the bending assembly. Subsequently, the pressing block of the pressing mechanism drives the positioning seat to move downward, so that the top plate protrudes out of the guide hole and performs a second bending on the pin body.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A capacitor lead pre-shaping device includes a frame on which a bending assembly is mounted. A slide rail assembly is provided on one side of the bending assembly, and a positioning mechanism for clamping a capacitor body is mounted on the slide rail assembly. The positioning mechanism includes a base connected to the slide rail assembly, and a height-adjustable positioning seat is mounted on the base. When the positioning mechanism moves backward along the slide rail assembly, the bending assembly bends the lead body at the end of the capacitor body. A guide hole is provided on the positioning seat, and a top plate is slidably embedded within the guide hole. A pressing mechanism is also provided above the positioning mechanism, and the pressing mechanism includes a height-adjustable pressing block. When the pressing block presses down, causing the positioning seat to move downward, the upper end of the top plate protrudes from the guide hole and bends the lead body a second time.

[0007] Optionally, the base has a groove, and a guide post is fixedly installed in the groove. The guide post slides through the positioning seat, and a spring is sleeved on the guide post. The spring is located between the base and the positioning seat.

[0008] Optionally, the positioning seat has a positioning groove for accommodating the capacitor body, and the side wall of the positioning groove has a positioning notch for the lead body to pass through. A positioning block is provided on the front side of the positioning notch, and the guide hole is located between the positioning notch and the positioning block.

[0009] Optionally, the positioning seat is also equipped with a pressure plate that can be flipped longitudinally, and the bottom of the pressure plate is provided with a pad that can contact the capacitor body.

[0010] Optionally, the bending assembly includes a support plate fixedly connected to the frame, a bending plate is mounted on the top of the support plate, a limiting groove is formed at the bottom end of the bending plate, and the pin body passes through the limiting groove.

[0011] Optionally, a support frame is fixedly installed on the frame, the pressing mechanism is installed on the support frame, and the positioning mechanism is located inside the support frame.

[0012] Optionally, the pressing mechanism includes a first linear module installed on the top of the support frame, the output end of the first linear module extending to the inner side of the support frame and connected to a bracket, the pressing block being installed at the bottom of the bracket, and the pressing block being able to contact the positioning seat.

[0013] Optionally, the positioning seat has a sliding groove at its front end, the base has a receiving tray that communicates with the sliding groove at its front end, and the bracket is also equipped with a cutting mechanism for cutting off the excess length of the pin body.

[0014] Optionally, the cutting mechanism includes a second linear module mounted on the bracket, the output end of the second linear module being connected to a cutter, and the end of the cutter being able to extend into the groove.

[0015] Beneficial effects

[0016] (1) In this invention, the capacitor body is clamped on the positioning seat of the positioning mechanism. As it moves backward along the slide rail assembly, the lead body interferes with the bending assembly, causing the lead body to complete the initial bending. Subsequently, the pressing block of the pressing mechanism drives the positioning seat to move downward, causing the top plate to protrude out of the guide hole and perform a second bending on the lead body. The device has a compact structure, is easy to operate, and can realize the second bending of the lead body, which greatly improves the applicability of customized shaping of capacitor leads.

[0017] (2) In this invention, the excess length of the pin body after pre-shaping can be removed by the cutting mechanism. As the cutter moves down, the excess part of the pin body is cut off, and the excess material head can fall into the receiving tray along the chute, which is convenient for subsequent unified collection and processing. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the capacitor pin pre-shaping device according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the positioning mechanism in an embodiment of the present invention; Figure 3 This is a schematic diagram of the top plate in the positioning mechanism of an embodiment of the present invention; Figure 4 This is a schematic diagram of the positioning seat in the positioning mechanism of an embodiment of the present invention; Figure 5 This is a schematic diagram of the internal structure of the positioning mechanism in an embodiment of the present invention; Figure 6 This is a schematic diagram of the bending component in an embodiment of the present invention; Figure 7 This is a schematic diagram of the pressing mechanism in an embodiment of the present invention; Figure 8 This is a schematic diagram of the cutting mechanism in an embodiment of the present invention; Figure 9 This is a schematic diagram of the positional structure of the capacitor body and the pin body in an embodiment of the present invention; Among them, 1. frame; 2. support frame; 3. Pressing mechanism; 31. Bracket; 32. Pressure block; 33. First linear module; 34. Guide rod; 4. Positioning mechanism; 41. Base; 411. Groove; 42. Positioning seat; 421. Positioning slot; 422. Pick-up and drop slot; 43. Guide post; 44. Top plate; 45. Pressure plate; 451. Pad plate; 46. Bending assembly; 461. Support plate; 462. Bending plate; 463. Limiting slot; 47. Guide hole; 48. Positioning notch; 49. Positioning block; 5. Cutting mechanism; 51. Second linear module; 52. Cutting blade; 53. Slide groove; 54. Receiving tray; 6. Slide rail assembly; 7. Telescopic assembly; 8. Operation button; 91. Capacitor body; 92. Pin body. Detailed Implementation

[0019] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. These drawings are simplified schematic diagrams, which are only used to illustrate the basic structure of the present invention and therefore only show the components relevant to the present invention.

[0020] Example 1

[0021] like Figures 1-2 As shown, a capacitor pin pre-shaping device includes a frame 1, on which a support frame 2, a slide rail assembly 6, a telescopic assembly 7, and a bending assembly 46 are mounted. The support frame 2 adopts a gantry structure, and a pressing mechanism 3 is installed on its top. The bending assembly 46 is located inside the support frame 2, and the slide rail assembly 6 is located on one side of the bending assembly 46. A positioning mechanism 4 is installed on the slide rail assembly 6, which is located inside the support frame 2. The telescopic assembly 7 is used to drive the positioning mechanism 4 to move along the slide rail assembly 6, and its output end is connected to the positioning mechanism 4.

[0022] The capacitor body 91 has a lead body 92 at its end, and the two are coaxial for ease of manufacturing. After the capacitor body 91 is clamped in the positioning mechanism 4, the lead body 92 extends to the outside of the positioning mechanism 4. Under the drive of the telescopic component 7, the positioning mechanism 4 moves backward along the slide rail component 6. The lead body 92 interferes with the bending component 46. That is, under the restriction of the bending component 46, as the positioning mechanism 4 moves backward, the lead body 92 is forced to bend. At this time, it is perpendicular to the axis of the capacitor body 91. Subsequently, under the cooperative action of the pressing mechanism 3 and the positioning mechanism 4, the lead body 92 can be bent a second time.

[0023] like Figures 2-5 As shown, the positioning mechanism 4 includes a base 41, a positioning seat 42, a guide post 43, a top plate 44, and a pressure plate 45.

[0024] The base 41 has a groove 411, and the positioning seat 42 is floatingly embedded in the groove 411. The positioning seat 42 has a positioning groove 421, and the capacitor body 91 is placed in the positioning groove 421. The positioning groove 421 also has a pick-and-place groove 422 on both sides to facilitate the removal of the capacitor. The pressure plate 45 has an L-shaped structure, one end of which is rotatably connected to the base 41, and the other end is snapped into the base 41. The bottom of the pressure plate 45 is also equipped with a pad 451. The pad 451 is in close contact with the capacitor body 91 and can firmly fix the capacitor body 91 in the positioning groove 421.

[0025] One end of the guide post 43 is fixedly installed in the groove 411, and the other end slides through the positioning seat 42. A spring is sleeved on the guide post 43, and the spring is located between the base 41 and the positioning seat 42. A guide hole 47 is also provided on the positioning seat 42. The lower end of the top plate 44 is fixedly installed in the groove 411, and the upper end slides into the guide hole 47.

[0026] Driven by the pressing mechanism 3, the positioning seat 42 moves down along the guide post 43 and compresses the spring, causing the upper end of the top plate 44 to protrude outward from the guide hole 47, thus performing a secondary bend on the pin body 92. As the pressing mechanism 3 resets, the positioning seat 42 rises and resets under the elastic force of the spring. At this time, the upper end of the top plate 44 is re-embedded in the guide hole 47, which will not affect the initial bend of the pin body 92.

[0027] Furthermore, a positioning notch 48 is provided on the side wall of the positioning groove 421, and a positioning block 49 is provided on the front side of the positioning notch 48, with a guide hole 47 located between the positioning notch 48 and the positioning block 49. When the capacitor body 91 is inserted into the positioning groove 421, the lead body 92 can pass through the positioning notch 48 and extend to the outside; the positioning block 49 is integrally formed with the base 41, which can ensure that the initial bending of the lead body 92 will not be excessive, that is, ensure that the lead body 92 after the initial bending is perpendicular to the axis of the capacitor body 91.

[0028] The capacitor body 91 is clamped on the positioning seat 42 of the positioning mechanism 4. As it moves backward along the slide rail assembly 6, the lead body 92 interferes with the bending assembly 46, causing the lead body 92 to complete the initial bending. Subsequently, the pressing mechanism 3 drives the positioning seat 42 to move downward, causing the top plate 44 to protrude out of the guide hole 47 and perform a secondary bending on the lead body 92. The device has a compact structure, is easy to operate, and can realize the secondary bending of the lead body 92, which greatly improves the applicability of customized shaping of capacitor leads.

[0029] like Figures 2-3 , Figure 6 As shown, the bending assembly 46 includes a support plate 461 fixedly connected to the frame 1. A bending plate 462 is mounted on the top of the support plate 461. A limiting groove 463 is formed at the bottom end of the bending plate 462, and the pin body 92 passes through the limiting groove 463.

[0030] The bending assembly 46 is fixed relative to the slide rail assembly 6. The positioning mechanism 4 can slide along the slide rail assembly 6 under the drive of the telescopic assembly 7. One end of the bending plate 462 extends to the outside of the positioning notch 48. Due to the obstruction of the bending plate 462, when the capacitor body 91 slides with the positioning mechanism 4, the pin body 92 interferes with the bending plate 462. As the capacitor body 91 continues to move, the pin body 92 is forced to bend. When bending, the pin body 92 is located in the limiting groove 463. The limiting groove 463 can ensure that when the pin body 92 is bent, it only deforms in the specified direction, avoiding it from warping upward or in other directions.

[0031] like Figure 1 , Figure 7 As shown, the pressing mechanism 3 includes a first linear module 33 installed on the top of the support frame 2. The output end of the first linear module 33 extends to the inner side of the support frame 2 and is connected to a bracket 31. A pressure block 32 is installed at the bottom of the bracket 31, and the pressure block 32 can contact the positioning seat 42.

[0032] Driven by the first linear module 33, the bracket 31 can drive the pressure block 32 to rise and fall in the vertical direction. As the first linear module 33 extends, the pressure block 32 moves down and contacts the positioning seat 42. When the pressure block 32 presses down and drives the positioning seat 42 to move down, the upper end of the top plate 44 protrudes out of the guide hole 47 and bends the pin body 92 twice.

[0033] The pressure block 32 adopts an L-shaped structure to ensure that while it is in contact with the positioning seat 42, it does not affect the axial movement of the pin body 92 during the secondary bending, and at the same time, it can prevent the pin body 92 from warping, ensuring that the secondary bending is carried out smoothly.

[0034] To improve the stability of the lifting and lowering of the bracket 31, a guide rod 34 is movably inserted through the top of the support frame 2. The lower end of the guide rod 34 is fixedly connected to the bracket 31, and the guide rod 34 and the support frame 2 are connected by a linear bearing.

[0035] Working principle: Driven by the telescopic component 7, the positioning mechanism 4 moves forward along the slide rail component 6 to the upper and lower material positions, loads the capacitor into the positioning slot 421, and then closes the pressure plate 45. Subsequently, the operation button 8 is pressed, and the positioning mechanism 4 moves backward along the slide rail component 6. Under the constraint of the bending plate 462 and the limiting slot 463, the lead body 92 of the capacitor undergoes an initial bend, making the lead body 92 and the capacitor body 91 perpendicular to each other. Then, the pressing block 32 of the pressing mechanism 3 moves under the drive of the first linear module 33. When the pressing block 32 presses down and drives the positioning seat 42 to move down, the upper end of the top plate 44 protrudes out of the guide hole 47 and bends the lead body 92 a second time.

[0036] The first linear module 33, the second linear module 51, and the telescopic component 7 all adopt existing technologies, and cylinders can be preferred here; the slide rail component 6 is also an existing technology, including a slide rail and a slider that slide together. The slide rail is fixedly installed on the frame 1, and the slider is fixedly connected to the base 41.

[0037] Example 2

[0038] Based on Embodiment 1, the present invention also proposes a cutting mechanism 5 to remove the excess length of the bent pin body 92, ensuring that the size of the pin body 92 meets customer requirements.

[0039] like Figures 1-5 , Figures 7-8 As shown, the cutting mechanism 5 is mounted on the bracket 31, and the front end of the positioning seat 42 is provided with a sliding groove 53, and the front end of the base 41 is provided with a receiving tray 54 that communicates with the sliding groove 53.

[0040] The cutting mechanism 5 includes a second linear module 51 mounted on a bracket 31. The output end of the second linear module 51 is connected to a cutter 52, and the end of the cutter 52 can extend into the groove 53.

[0041] The sidewall of the chute 53 is flush with the side of the positioning block 49, and the bottom surface of the chute 53 is set as an inclined surface to facilitate the collection of the cut-off material. After the pin is bent twice, the excess part extends into the chute 53. At this time, the pressing mechanism 3 has not yet been reset. Under the drive of the second linear module 51, the cutter 52 moves down and neatly cuts off the excess pin along the sidewall of the chute 53. The cut-off material falls into the receiving tray 54 along the bottom surface of the chute 53 due to gravity.

[0042] Example 3

[0043] Based on Embodiment 1 and Embodiment 2, the present invention also proposes a method for pre-shaping capacitor pins.

[0044] A method for pre-shaping capacitor leads includes the following steps: Step S1: Clamp the capacitor to be shaped in the positioning mechanism 4; when clamping, place the capacitor body 91 in the positioning groove 421, and then lock the pressure plate 45 so that the pad 451 firmly fixes the capacitor body 91 in the positioning groove 421.

[0045] Step S2: The telescopic component 7 drives the positioning mechanism 4 to move backward along the slide rail assembly 6, and in the process completes the initial bending of the pin, so that the bent pin is perpendicular to the axis of the capacitor; the bending component 46 is fixed relative to the slide rail assembly 6, and the positioning mechanism 4 can slide along the slide rail assembly 6 under the drive of the telescopic component 7. Due to the obstruction of the bending plate 462, when the capacitor body 91 slides with the positioning mechanism 4, the pin body 92 interferes with the bending plate 462, and as the capacitor body 91 continues to move, it forces the pin body 92 to bend.

[0046] Step S3: After the initial bending is completed, the pressing mechanism 3 drives the positioning seat 42 to move down, so that the upper end of the top plate 44 protrudes out of the guide hole 47 and performs a second bending on the pin; as the first linear module 33 extends, the pressing block 32 moves down and contacts the positioning seat 42. When the pressing block 32 presses down and drives the positioning seat 42 to move down, the upper end of the top plate 44 protrudes out of the guide hole 47 and performs a second bending on the pin body 92.

[0047] Step S4: After the second bending, the pressing mechanism 3 remains stationary, and the cutting mechanism 5 removes the excess length of the pin. After the second bending of the pin is completed, the excess part extends into the slide groove 53. At this time, the pressing mechanism 3 has not yet been reset. Under the drive of the second linear module 51, the cutter 52 moves down and neatly cuts off the excess pin along the side wall of the slide groove 53.

[0048] Step S5: The cut-off material head falls into the receiving tray 54 along the chute 53. Then the cutting mechanism 5 and the pressing mechanism 3 are reset in sequence. The telescopic component 7 drives the positioning mechanism 4 to move forward along the slide rail component 6 to the position and remove the shaped capacitor.

[0049] In summary, this invention proposes a capacitor pin pre-shaping device that can perform secondary bending of capacitor pins, greatly improving the applicability of customized capacitor pin shaping. During the initial bending, the direction is controlled by the limiting groove 463. During the secondary bending, the limiting groove 463 and the L-shaped pressure block 32 cooperate with each other, and finally the bending is achieved under the lifting of the top plate 44.

[0050] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0051] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0052] Based on the preferred embodiments of the present invention described above, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A capacitor lead pre-shaping device, comprising a frame (1), characterized in that: A bending assembly (46) is installed on the frame (1), and a slide rail assembly (6) is provided on one side of the bending assembly (46). A positioning mechanism (4) for clamping the capacitor body (91) is installed on the slide rail assembly (6). The positioning mechanism (4) includes a base (41) connected to the slide rail assembly (6), on which a positioning seat (42) capable of being raised and lowered is installed, and when the positioning mechanism (4) moves backward along the slide rail assembly (6), the bending assembly (46) can bend the pin body (92) at the end of the capacitor body (91). The positioning base (42) is provided with a guide hole (47) and a positioning groove (421) for accommodating the capacitor body (91). The side wall of the positioning groove (421) is provided with a positioning notch (48) for the lead body (92) to pass through. A positioning block (49) is provided on the front side of the positioning notch (48), and the guide hole (47) is located between the positioning notch (48) and the positioning block (49). The base (41) has a groove (411) and a top plate (44) is slidably embedded in the guide hole (47). The lower end of the top plate (44) is fixedly installed in the groove (411) and the upper end is slidably embedded in the guide hole (47). Above the positioning mechanism (4) is a pressing mechanism (3), which includes a pressing block (32) that can be raised and lowered; and when the pressing block (32) presses down and drives the positioning seat (42) to move down, the upper end of the top plate (44) protrudes out of the guide hole (47) and bends the pin body (92) twice.

2. The capacitor pin pre-shaping device according to claim 1, characterized in that: A guide post (43) is fixedly installed in the groove (411). The guide post (43) slides through the positioning seat (42), and a spring is sleeved on the guide post (43). The spring is located between the base (41) and the positioning seat (42).

3. The capacitor pin pre-shaping device according to claim 2, characterized in that: The positioning seat (42) is also equipped with a pressure plate (45) that can be flipped in the longitudinal direction, and the bottom of the pressure plate (45) is provided with a pad (451) that can contact the capacitor body (91).

4. The capacitor pin pre-shaping device according to claim 1, characterized in that: The bending assembly (46) includes a support plate (461) fixedly connected to the frame (1), a bending plate (462) is installed on the top of the support plate (461), a limiting groove (463) is opened at the bottom of the end of the bending plate (462), and the pin body (92) passes through the limiting groove (463).

5. The capacitor pin pre-shaping device according to claim 1, characterized in that: A support frame (2) is fixedly installed on the frame (1), the pressing mechanism (3) is installed on the support frame (2), and the positioning mechanism (4) is located inside the support frame (2).

6. The capacitor pin pre-shaping device according to claim 5, characterized in that: The pressing mechanism (3) includes a first linear module (33) installed on the top of the support frame (2). The output end of the first linear module (33) extends to the inner side of the support frame (2) and is connected to a bracket (31). The pressing block (32) is installed at the bottom of the bracket (31) and can contact the positioning seat (42).

7. The capacitor pin pre-shaping device according to claim 6, characterized in that: The positioning seat (42) has a sliding groove (53) at its front end, and the base (41) has a receiving tray (54) that communicates with the sliding groove (53) at its front end. The bracket (31) is also equipped with a cutting mechanism (5) for cutting off the excess length of the pin body (92).

8. The capacitor pin pre-shaping device according to claim 7, characterized in that: The cutting mechanism (5) includes a second linear module (51) mounted on the bracket (31), the output end of the second linear module (51) is connected to a cutter (52), and the end of the cutter (52) can extend into the groove (53).

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