A mold for injection molding of household appliance housing

Abstract

The present invention relates to the technical field of injection molding production of household appliance shells, and specifically to a mold for injection molding of household appliance shells, comprising: a cooling detection mechanism, the cooling detection mechanism comprising a semiconductor refrigeration plate for cooling cooling water, and also comprising an upper mold and a lower mold for injection molding, wherein a refrigeration cavity is provided inside the upper mold and the lower mold. During the molding process, an ultrasonic transmitting plate will emit ultrasonic waves to pass through the raw material, and an ultrasonic receiving plate will receive the reflected ultrasonic waves. By analyzing the changes in the received ultrasonic energy, the curing degree and molding quality of the raw material can be judged, and then the electrical signal is transmitted to a PLC controller through the ultrasonic receiving plate, and then the PLC controller can adjust the power of the semiconductor refrigeration plate and the working state of the water pump in real time according to the changes in the ultrasonic energy detected by the ultrasonic receiving plate, thereby dynamically adjusting the temperature and flow rate of the cooling water.

Description

Technical Field

[0001] The invention relates to the technical field of injection molds, and in particular to a mold for injection molding of a household appliance housing. Background Art

[0002] The housing of household appliances refers to the appearance structure used to protect and decorate household appliances. It not only protects the internal circuits and components and prevents the intrusion of dust, moisture and other external factors, but also has a beautiful appearance to enhance the overall texture of the product and the user experience. When designing the housing of household appliances, factors such as safety, durability and ease of cleaning must also be considered to ensure the reliability and convenience of the product in daily use. The housing of household appliances injects heated and molten plastic material (usually thermoplastic) into a pre-designed mold, and then quickly cools and solidifies it through the precision cavity of the mold to form the desired shell shape. For example, a mold for injection molding of a housing of household appliances disclosed in application number CN202210617521.6 is injection molded through the above process.

[0003] Existing injection molds usually condense the raw materials in the mold to achieve rapid solidification and molding of plastic materials. However, existing injection molds can usually only condense and mold the raw materials at a fixed condensation temperature. During the condensation process, the plastic material will undergo a transition from a molten state to a solid state. If it is directly cooled rapidly from a high temperature to a low temperature, a large internal stress will be generated inside the material. These internal stresses may cause warping, deformation or cracking of the product. This method cannot adjust the condensation temperature according to the different requirements of the molding stage, which will lead to unstable molding quality and prone to quality problems such as bubbles, shrinkage holes and surface defects. Therefore, it is necessary to adaptively control the condensation temperature according to different stages. Summary of the invention

[0004] In view of the above-mentioned shortcomings of the prior art, the present invention provides a mold for injection molding of a housing of a household appliance, which can effectively solve the problem that the prior art cannot adjust the condensation temperature according to different requirements of the molding stage.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0006] The present invention provides a mold for injection molding of a housing of a household appliance, comprising:

[0007] A cooling detection mechanism, the cooling detection mechanism includes a semiconductor refrigeration plate for cooling cooling water, and an upper mold and a lower mold for injection molding, wherein a refrigeration cavity is provided inside the upper mold and the lower mold, and a condenser is provided inside the refrigeration cavity, and the cooling detection mechanism also includes a detection component, wherein the detection component includes an ultrasonic transmitting plate for transmitting ultrasonic waves and an ultrasonic receiving plate for receiving ultrasonic waves, and the ultrasonic waves are used to detect the forming state of the shell;

[0008] The auxiliary demoulding mechanism also includes a plurality of push grooves opened on the inner bottom wall of the lower mold, the inner wall of the push groove is slidably connected with a sliding block, the top of the sliding block is provided with a push plate for pushing out the rear shell after molding, and the inner bottom wall of the lower mold is provided with a plurality of placement grooves in airtight sliding contact with the push plate.

[0009] Preferably, it also includes an operating frame, and the inner wall of the operating frame is fixedly connected to the outer wall of the lower mold, the outer wall of the operating frame is fixedly connected to a placement box, the detection component also includes a sliding rod fixedly connected to the inner bottom wall of the operating frame, the top end of the sliding rod is fixedly connected to a first limiting plate, the inner bottom wall of the operating frame is rotatably connected to a threaded rod, the outer wall of the threaded rod is threadedly connected to a threaded plate, the outer wall of the sliding rod is slidably connected to a sliding plate, the sliding plate and the threaded plate are fixedly connected to the ultrasonic transmitting plate, the top end of the threaded plate is rotatably provided with a second limiting plate fixedly connected to the inner wall of the operating frame, and the top end of the second limiting plate is fixedly connected to a first motor for driving the threaded rod.

[0010] Preferably, the top of the upper mold is fixedly connected to four support blocks, the top of the support block is fixedly connected to a pressure plate, the bottom of the pressure plate is fixedly connected to an ultrasonic receiving plate, and the ultrasonic transmitting plate and the ultrasonic receiving plate are electrically connected to a PLC controller to form a detection loop.

[0011] Preferably, the inner wall of the placement box is fixedly connected with a heat conduction plate and a temperature insulation plate at the upper and lower parts, and the temperature insulation plate and the heat conduction plate divide the placement box into a raw material space, a temperature conduction space and a cooling water space at the upper and lower parts. The raw material space contains injection molding raw materials, and the cooling water space is filled with cooling water. The semiconductor refrigeration is embedded in the temperature insulation plate, and the cooling end of the semiconductor refrigeration plate faces the cooling water space, and the heating end of the semiconductor refrigeration plate faces the temperature conduction space and contacts with the heat conduction plate.

[0012] Preferably, the cooling detection mechanism also includes a first water pump and a second water pump fixedly connected to the bottom wall of the operating frame, the water pumping end of the first water pump penetrates the inner wall of the placement box and extends into the cooling water space, the drainage end of the first water pump is fixedly connected to a first shunt pipe, the outer wall of the first shunt pipe near the bottom end is fixedly connected to a first drainage pipe, the other end of the first drainage pipe is fixedly connected to the water inlet of the condenser located below, the outer wall of the first shunt pipe near the top end is fixedly connected to a first telescopic water inlet pipe, the other end of the first telescopic water inlet pipe is fixedly connected to the water inlet of the condenser located above The drainage end of the second water pump passes through the inner wall of the placement box and extends to the cooling water space. The water pumping end of the second water pump is fixedly connected with a second shunt pipe. The outer wall of the second shunt pipe near the bottom is fixedly connected with a second drainage pipe. The other end of the second drainage pipe is fixedly connected with the water outlet of the condenser tube below. The outer wall of the second shunt pipe near the top is fixedly connected with a second telescopic water inlet pipe. The other end of the second telescopic water inlet pipe is fixedly connected with the water outlet of the condenser tube above. The PLC controller is electrically connected with the first water pump, the second water pump, and the semiconductor refrigeration plate to form a regulation loop.

[0013] Preferably, the auxiliary demoulding mechanism also includes two symmetrical air outlet pipes fixedly connected to the bottom end of the lower mold, the top ends of the air outlet pipes are connected to the multiple push grooves one by one with connecting pipes, the ends on the same side of the two air outlet pipes are commonly fixedly connected to an air distribution pipe, the inner wall of the operating frame is fixedly connected to an exhaust pump, and the exhaust end of the exhaust pump is connected to the connecting pipe.

[0014] Preferably, the inner wall of the operating frame is fixedly connected to a support plate, the top end of the support plate is rotatably connected to a rotating rod, the outer wall of the rotating rod is provided with a sliding groove, the outer wall of the rotating rod is movably connected to a movable block, the inner circumferential wall of the movable block is fixedly connected to a limit block slidably connected to the sliding groove, the outer wall of the movable block is fixedly connected to the upper mold, the outer wall of the placement box is fixedly connected to an extension plate, the bottom end of the extension plate is fixedly connected to a multi-stage electric telescopic rod, the top end of the pressure plate is provided with an arc-shaped convex groove, the inner wall of the arc-shaped convex groove is slidably connected to a sliding column, and the telescopic end of the multi-stage electric telescopic rod is fixedly connected to the sliding column.

[0015] Preferably, it also includes a unloading mechanism, which includes a second motor fixedly connected to the outer wall of the placement box, the output end of the second motor is fixedly connected to a rotating shaft, the outer wall of the rotating shaft is fixedly connected to a stirring frame, the inner wall of the operating frame is fixedly connected to a suction pump, the suction end of the suction pump passes through the inner wall of the placement box and is connected to the raw material space, the discharge end of the suction pump is fixedly connected to a discharge telescopic tube, the other end of the discharge telescopic tube is connected to the upper mold, and an air outlet is opened at the top of the upper mold.

[0016] Compared with the known prior art, the technical solution provided by the present invention has the following beneficial effects:

[0017] During the molding process, the ultrasonic transmitting plate will emit ultrasonic waves through the raw materials, and the ultrasonic receiving plate will receive the reflected ultrasonic waves. By analyzing the changes in the received ultrasonic energy, the curing degree of the raw materials and the molding quality can be judged, and then the electrical signal is transmitted to the PLC controller through the ultrasonic receiving board. Then, the PLC controller can adjust the power of the semiconductor refrigeration plate and the working state of the water pump in real time according to the changes in ultrasonic energy detected by the ultrasonic receiving board, thereby dynamically adjusting the temperature and flow rate of the cooling water, ensuring that at different stages of molding, the cooling process can adapt to the changes in the physical state of the raw materials and provide the best condensation conditions.

[0018] When the shell is formed, the multi-stage electric telescopic rod is started, which drives the upper mold to be lifted up and rotated outward to assist in manually removing the shell. Then the exhaust pump is started to discharge the air into the push groove through the connecting pipe and the air outlet pipe. The air pressure pushes the sliding block upward, which in turn drives the push plate to synchronously push the formed shell upward to complete the demoulding, avoiding hard pulling or scratching, thereby maintaining the surface quality and dimensional accuracy of the molded parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0021] Figure 2 It is a schematic diagram of the cross-sectional three-dimensional structure of the placement box of the present invention;

[0022] Figure 3 The internal three-dimensional structure of the present invention is shown in FIG. Figure 1 ;

[0023] Figure 4 The internal three-dimensional structure of the present invention is shown in FIG. Figure 2 ;

[0024] Figure 5 It is a partial cross-sectional three-dimensional structural schematic diagram of the present invention;

[0025] Figure 6 It is a schematic diagram of the three-dimensional structure of the rotating rod of the present invention;

[0026] Figure 7It is a schematic diagram of the cross-sectional three-dimensional structure of the lower mold of the present invention.

[0027] Figure numerals: 1, operation frame; 2, placement box; 3, cooling detection mechanism; 31, semiconductor refrigeration plate; 32, upper mold; 33, lower mold; 34, condenser; 35, detection component; 351, ultrasonic transmitting plate; 352, ultrasonic receiving plate; 353, sliding rod; 354, first motor; 355, threaded rod; 356, threaded plate; 357, sliding plate; 358, support block; 359, pressure plate; 36, first water pump; 37, second water pump; 38, first shunt pipe; 39, first drain pipe; 310, first telescopic water inlet pipe; 311, second shunt pipe; 312, second drain pipe Water pipe; 313, second telescopic water inlet pipe; 4, auxiliary demoulding mechanism; 41, push groove; 42, sliding block; 43, push plate; 44, placement groove; 45, air outlet pipe; 46, air distribution pipe; 47, exhaust pump; 48, support plate; 49, rotating rod; 410, sliding groove; 411, movable block; 412, limiting block; 413, extension plate; 414, multi-stage electric telescopic rod; 415, arc convex groove; 416, sliding column; 5, unloading mechanism; 51, second motor; 52, rotating shaft; 53, stirring frame; 54, extraction pump; 55, discharge telescopic pipe; 56, air outlet; 6, heat conduction plate; 7, insulation plate. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] The present invention will be further described below in conjunction with the embodiments.

[0030] Example: Refer to Figures 1 to 7 , a mold for injection molding of a home appliance housing, comprising:

[0031] The raw material in the mold can be cooled and solidified by the cooling detection mechanism 3. Figures 3 to 5 The cooling detection mechanism 3 includes a semiconductor refrigeration plate 31 for cooling cooling water, and an upper mold 32 and a lower mold 33 for injection molding. The upper mold 32 and the lower mold 33 are both provided with a refrigeration cavity, and a condenser 34 is provided in the refrigeration cavity. The cooling detection mechanism 3 also includes a detection component 35. The detection component 35 includes an ultrasonic transmitting plate 351 for transmitting ultrasonic waves and an ultrasonic receiving plate 352 for receiving ultrasonic waves, and the ultrasonic waves are used to detect the forming state of the shell;

[0032] The molding condition of the raw material can be detected by the following detection component 35, refer to Figure 3 , Figure 4 , also includes an operating frame 1, and the inner wall of the operating frame 1 is fixedly connected to the outer wall of the lower mold 33, the outer wall of the operating frame 1 is fixedly connected to the placement box 2, the detection component 35 also includes a sliding rod 353 fixedly connected to the inner bottom wall of the operating frame 1, the top of the sliding rod 353 is fixedly connected to the first limit plate, the inner bottom wall of the operating frame 1 is rotatably connected to the threaded rod 355, the outer wall of the threaded rod 355 is threadedly connected to the threaded plate 356, the outer wall of the sliding rod 353 is slidably connected to the sliding plate 357, the sliding plate 357 and the threaded plate 356 are fixedly connected to the ultrasonic transmitting plate 351 Then, the top of the threaded plate 356 is rotatably provided with a second limit plate fixedly connected to the inner wall of the operating frame 1, and the top of the second limit plate is fixedly connected to a first motor 354 for driving the threaded rod 355; the top of the upper mold 32 is fixedly connected to four support blocks 358, and the top of the support blocks 358 is fixedly connected to a pressure plate 359, and the bottom end of the pressure plate 359 is fixedly connected to the ultrasonic receiving plate 352, and the ultrasonic transmitting plate 351 and the ultrasonic receiving plate 352 are electrically connected to the PLC controller to form a detection circuit, and the top of the placement box 2 has a feeding port;

[0033] Among them, the cooling detection mechanism 3 also includes a first water pump 36 and a second water pump 37 fixedly connected to the inner bottom wall of the operating frame 1, the water pumping end of the first water pump 36 penetrates the inner wall of the placement box 2 and extends into the cooling water space, the drainage end of the first water pump 36 is fixedly connected to a first shunt pipe 38, the outer wall of the first shunt pipe 38 near the bottom is fixedly connected to a first drainage pipe 39, the other end of the first drainage pipe 39 is fixedly connected to the water inlet of the condenser 34 at the bottom, the outer wall of the first shunt pipe 38 near the top is fixedly connected to a first telescopic water inlet pipe 310, the other end of the first telescopic water inlet pipe 310 is fixedly connected to the water inlet of the condenser 34 at the top, and the second The drainage end of the water pump 37 passes through the inner wall of the placement box 2 and extends to the cooling water space. The water pumping end of the second water pump 37 is fixedly connected to the second diverter pipe 311. The outer wall of the second diverter pipe 311 near the bottom is fixedly connected to the second drainage pipe 312. The other end of the second drainage pipe 312 is fixedly connected to the water outlet of the condenser 34 below. The outer wall of the second diverter pipe 311 near the top is fixedly connected to the second telescopic water inlet pipe 313. The other end of the second telescopic water inlet pipe 313 is fixedly connected to the water outlet of the condenser 34 above. The PLC controller is electrically connected to the first water pump 36, the second water pump 37, and the semiconductor refrigeration plate 31 to form a regulation loop.

[0034] The auxiliary demoulding mechanism 4 can assist the shell demoulding, refer to Figures 4 to 7The auxiliary demoulding mechanism 4 also includes a plurality of push grooves 41 formed on the inner bottom wall of the lower mold 33. The inner wall of the push groove 41 is slidably connected with a sliding block 42. A push plate 43 for pushing out the formed shell is formed on the top of the sliding block 42. A plurality of placement grooves 44 in airtight sliding contact with the push plate 43 are formed on the inner bottom wall of the lower mold 33. There is almost no gap between the placement grooves 44 and the push plate 43 to prevent the shell from having residual edges after demoulding.

[0035] Among them, the inner wall of the placement box 2 is fixedly connected with a heat conduction plate 6 and a thermal insulation plate 7. The thermal insulation plate 7 and the heat conduction plate 6 divide the placement box 2 into a raw material space, a temperature conduction space, and a cooling water space. The raw material space stores injection molding raw materials, and the cooling water space is filled with cooling water. The semiconductor refrigeration is embedded in the thermal insulation plate 7, and the cooling end of the semiconductor refrigeration plate 31 faces the cooling water space, and the heating end of the semiconductor refrigeration plate 31 faces the temperature conduction space and contacts with the heat conduction plate 6. The thermal insulation plate 7 is to prevent the temperature of the cooling water from being affected by the heat emitted by the heating end of the semiconductor refrigeration plate 31.

[0036] Among them, the auxiliary demoulding mechanism 4 also includes two symmetrical air outlet pipes 45 fixedly connected to the bottom end of the lower mold 33, the top of the air outlet pipe 45 is connected to the multiple push grooves 41 one by one with a connecting pipe, the ends of the two air outlet pipes 45 on the same side are commonly fixedly connected to a branch air pipe 46, and the inner wall of the operating frame 1 is fixedly connected to an exhaust pump 47, and the exhaust end of the exhaust pump 47 is connected to the connecting pipe.

[0037] Among them, the inner wall of the operating frame 1 is fixedly connected with a support plate 48, the top end of the support plate 48 is rotatably connected with a rotating rod 49, the outer wall of the rotating rod 49 is provided with a sliding groove 410, the outer wall of the rotating rod 49 is movably connected with a movable block 411, the inner peripheral wall of the movable block 411 is fixedly connected with a limit block 412 slidably connected to the sliding groove 410, the outer wall of the movable block 411 is fixedly connected with the upper mold 32, the outer wall of the placement box 2 is fixedly connected with an extension plate 413, the bottom end of the extension plate 413 is fixedly connected with a multi-stage electric telescopic rod 414, the top end of the pressure plate 359 is provided with an arc-shaped convex groove 415, the inner wall of the arc-shaped convex groove 415 is slidably connected with a sliding column 416, and the telescopic end of the multi-stage electric telescopic rod 414 is fixedly connected to the sliding column 416.

[0038] The material can be automatically unloaded through the unloading mechanism 5, refer to Figure 2 , Figure 3The unloading mechanism 5 also includes a second motor 51 fixedly connected to the outer wall of the placement box 2, the output end of the second motor 51 is fixedly connected to a rotating shaft 52, the outer wall of the rotating shaft 52 is fixedly connected to a stirring frame 53, and the inner wall of the operating frame 1 is fixedly connected to a pumping pump 54, the pumping end of the pumping pump 54 passes through the inner wall of the placement box 2 and is connected to the raw material space, and the discharge end of the pumping pump 54 is fixedly connected to a discharge telescopic pipe 55, and the other end of the discharge telescopic pipe 55 is connected to the upper mold 32. An air outlet 56 is provided at the top of the upper mold 32, and the heat emitted by the heating end of the semiconductor refrigeration plate 31 is transferred to the heat conducting plate 6, and the heat is transferred to the raw material space through the heat conducting plate 6, thereby maintaining the fluidity of the raw material, which can ensure that the raw material maintains a stable temperature and fluidity during the entire injection molding process, thereby making the injection process more uniform and reducing defects that may occur during the molding process, such as gaps or uneven thickness.

[0039] The working principle of the present invention is as follows:

[0040] First, the material pump 54 is started to discharge the injection molding material in the material space to between the lower mold 33 and the upper mold 32. After the discharge is completed (the discharge time is based on the time for filling the space between the upper mold 32 and the lower mold 33 with the injection molding material detected in advance), the first motor 354 is then started, and the threaded rod 355 is driven to rotate by the first motor 354, and the sliding plate 357 is limited by the sliding rod 353, so that the threaded plate 356 and the sliding plate 357 drive the ultrasonic transmitting plate 351 to contact the air outlet 45, and then the ultrasonic transmitting plate 351 is started. The high-frequency vibration of the ultrasonic wave emitted by the ultrasonic transmitting plate 351 can break the tiny bubbles in the material, making them smaller or completely disappear, and the local pressure change caused by the ultrasonic wave can prompt the bubbles to move to the surface of the material, so that they are more easily discharged, so that the bubbles discharge the excess gas through the air outlet 56, and then the first motor 354 is reversely started, and the threaded rod 355 is driven to rotate in the opposite direction by the first motor 354, so as to reset the ultrasonic transmitting plate 351;

[0041] Then start the first water pump 36, the second water pump 37, and the semiconductor refrigeration plate 31, condense and cool the cooling water through the semiconductor refrigeration plate 31, and then pump out the cooling water through the first water pump 36, and then discharge it to the first diversion pipe 38, and then discharge the cooling water into the first drainage pipe 39 and the first telescopic water inlet pipe 310 through the first diversion pipe 38, and then discharge it into the condensation pipes 34 at the upper and lower parts, so as to condense and solidify the raw materials inside the mold, and then the second water pump 37 pumps out the cooling water in the upper and lower condensation pipes 34 through the second drainage pipe 312 and the second telescopic water inlet pipe 313, and then discharges it into the cooling water space, so as to achieve the effect of recycling.

[0042] At the same time, ultrasonic waves are emitted through the ultrasonic transmitting plate 351, passing through the upper mold 32, the lower mold 33 and the raw material, and then received by the ultrasonic receiving plate 352. The ultrasonic waves are received by the ultrasonic receiving plate 352, and the forming condition of the shell is judged by the intensity of the ultrasonic waves.

[0043] In the liquid molding stage, the ultrasonic wave propagates through the liquid plastic material, and the path is relatively direct. The liquid material has a small attenuation of the ultrasonic wave, and the received ultrasonic wave energy is relatively high. As the material begins to solidify, the propagation path of the ultrasonic wave is affected by the solid part, and the path becomes complicated. The solid part has a large attenuation of the ultrasonic wave, and the received ultrasonic wave energy begins to decrease. With the condensation molding, the plastic material is completely solidified, and the propagation path of the ultrasonic wave becomes more complicated. It is hindered by the solid structure, and the attenuation of the ultrasonic wave by the solid material increases significantly, and the received ultrasonic wave energy is further reduced.

[0044] Generally speaking, as the shell is condensed and formed, when the ultrasonic wave is emitted from the bottom of the mold and received by the other side of the mold, the received ultrasonic energy will gradually decrease. The main reason for the attenuation is the absorption and scattering of ultrasonic waves by the solid material and the change of the ultrasonic propagation path. Therefore, the change of ultrasonic waves is sufficient to feedback the molding situation of the shell.

[0045] As the ultrasonic wave detected by the ultrasonic receiving board 352 gradually decreases, the electrical signal is transmitted to the PLC controller through the ultrasonic receiving board 352, and the power of the semiconductor refrigeration plate 31 is increased by the PLC controller to further reduce the temperature of the cooling water. At the same time, the power of the first pumping pump 36 and the second pumping pump 37 is increased by the PLC controller to further accelerate the flow of cooling water to further reduce the temperature. The reason is that when the molding starts, the plastic material is heated and injected into the mold. At this time, the temperature is relatively high. In order to ensure that the raw material can smoothly fill all the details of the mold, the condensation temperature in the initial stage is relatively low. The high temperature helps the material flow and reduces bubbles and incomplete filling. As the raw material gradually fills the mold and begins to solidify, the condensation temperature needs to be gradually reduced. Lowering the temperature helps to cool evenly and reduce internal stress and deformation. An appropriate cooling rate can ensure that the plastic is evenly cooled in the mold to avoid local overheating or overcooling. When the molding is nearing the end, the raw material has been mostly solidified. At this time, the cooling rate can be further accelerated to shorten the overall cooling time and improve production efficiency. Rapid cooling helps to reduce deformation and shrinkage of the plastic during the solidification process and ensure the dimensional accuracy and surface quality of the final molded part.

[0046] After molding, the multi-stage electric telescopic rod 414 is started, and the sliding column 416 is driven to move upward by the multi-stage electric telescopic rod 414, thereby driving the pressure plate 359, the support block 358, the ultrasonic receiving plate 352, and the upper mold 32 to move upward synchronously, and further driving the movable block 411 and the limit block 412 to move upward synchronously, and the limit block 412 is moved along the sliding groove 410 through the limit of the sliding groove 410, thereby causing the upper mold 32 to move upward, and then as the direction of the sliding groove 410 changes, the upper mold 32 is rotated outward by 90 degrees, and the sliding column 416 moves in the arc groove;

[0047] Then, by starting the exhaust pump 47, air is discharged into the push groove 41 through the air outlet pipe 45, thereby pushing the sliding block 42 upward, and then driving the push plate 43 to synchronously push the shell upward to assist the shell demoulding.

[0048] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A mold for injection molding of a home appliance housing, characterized in that: include: Operation box (1); A cooling detection mechanism (3), the cooling detection mechanism (3) comprising a semiconductor refrigeration plate (31) for cooling cooling water and an upper mold (32) and a lower mold (33) for injection molding, the upper mold (32) and the lower mold (33) both have refrigeration cavities in their interiors, the refrigeration cavities are both provided with condensing tubes (34), the cooling detection mechanism (3) further comprises a detection component (35), the detection component (35) comprises an ultrasonic wave transmitting plate (351) for transmitting ultrasonic waves and an ultrasonic wave receiving plate (352) for receiving ultrasonic waves, and the ultrasonic waves are used to detect the forming state of the shell, and the inner bottom wall of the operation frame (1) is fixedly connected with a first water pump (36) and a second water pump (37); An auxiliary demoulding mechanism (4), the auxiliary demoulding mechanism (4) further comprising a plurality of push grooves (41) provided on the inner bottom wall of the lower mold (33), the inner wall of the push groove (41) being slidably connected to a sliding block (42), the top end of the sliding block (42) being provided with a push plate (43) for pushing out the rear shell after molding, and the inner bottom wall of the lower mold (33) being provided with a plurality of placement grooves (44) in airtight sliding contact with the push plate (43); The ultrasonic transmitting plate (351), the ultrasonic receiving plate (352), the first water pump (36), the second water pump (37), and the semiconductor refrigeration plate (31) are electrically connected to a PLC controller to form a regulation loop.

2. A mold for injection molding of a home appliance housing according to claim 1, characterized in that: The inner wall of the operation frame (1) is fixedly connected to the outer wall of the lower mold (33); the outer wall of the operation frame (1) is fixedly connected to the placement box (2); the detection component (35) further comprises a sliding rod (353) fixedly connected to the inner bottom wall of the operation frame (1); the top end of the sliding rod (353) is fixedly connected to a first limiting plate; the inner bottom wall of the operation frame (1) is rotatably connected to a threaded rod (355); the outer wall of the threaded rod (355) is threadedly connected to a threaded plate (356); the outer wall of the sliding rod (353) is slidably connected to a sliding plate (357); the sliding plate (357) and the threaded plate (356) are fixedly connected to the ultrasonic transmitting plate (351); the top end of the threaded plate (356) is rotatably provided with a second limiting plate fixedly connected to the inner wall of the operation frame (1); the top end of the second limiting plate is fixedly connected to a first motor (354) for driving the threaded rod (355).

3. A mold for injection molding of a home appliance housing according to claim 2, characterized in that: The top end of the upper mold (32) is fixedly connected to four support blocks (358), the top end of the support block (358) is fixedly connected to a pressure plate (359), and the bottom end of the pressure plate (359) is fixedly connected to the ultrasonic receiving plate (352).

4. A mold for injection molding of a housing of a household appliance according to claim 3, characterized in that: The inner wall of the placement box (2) is fixedly connected with a heat conducting plate (6) and a temperature insulating plate (7) at the top and bottom. The temperature insulating plate (7) and the heat conducting plate (6) divide the placement box (2) into a raw material space, a temperature conducting space and a cooling water space at the top and bottom. The raw material space contains injection molding raw materials, and the cooling water space is filled with cooling water. The semiconductor refrigeration is embedded in the temperature insulating plate (7), and the cooling end of the semiconductor refrigeration plate (31) faces the cooling water space, and the heating end of the semiconductor refrigeration plate (31) faces the temperature conducting space and contacts the heat conducting plate (6).

5. A mold for injection molding of a housing of a household appliance according to claim 4, characterized in that: The cooling detection mechanism (3) also includes a first shunt pipe (38) fixedly connected to the drainage end of a first water pump (36); the water drainage end of the first water pump (36) penetrates the inner wall of the placement box (2) and extends into the cooling water space; the outer wall of the first shunt pipe (38) near the bottom end is fixedly connected to a first drainage pipe (39); the other end of the first drainage pipe (39) is fixedly connected to the water inlet of the condenser pipe (34) located below; the outer wall of the first shunt pipe (38) near the top end is fixedly connected to a first telescopic water inlet pipe (310); the other end of the first telescopic water inlet pipe (310) is fixedly connected to the water inlet of the condenser pipe (34) located above The second water pump (37) is fixedly connected, the drainage end of the second water pump (37) passes through the inner wall of the placement box (2) and extends to the cooling water space, the drainage end of the second water pump (37) is fixedly connected with a second diverter pipe (311), the outer wall of the second diverter pipe (311) near the bottom end is fixedly connected with a second drainage pipe (312), the other end of the second drainage pipe (312) is fixedly connected with the water outlet of the condenser pipe (34) at the bottom, the outer wall of the second diverter pipe (311) near the top end is fixedly connected with a second telescopic water inlet pipe (313), the other end of the second telescopic water inlet pipe (313) is fixedly connected with the water outlet of the condenser pipe (34) at the top.

6. The mold for injection molding of a housing of a household appliance according to claim 3, characterized in that: The auxiliary demoulding mechanism (4) also includes two symmetrical air outlet pipes (45) fixedly connected to the bottom end of the lower mold (33), the top ends of the air outlet pipes (45) are connected to the multiple push grooves (41) in a one-to-one correspondence with each other, and the ends of the two air outlet pipes (45) on the same side are fixedly connected to a branch air pipe (46), and the inner wall of the operating frame (1) is fixedly connected to an exhaust pump (47), and the exhaust end of the exhaust pump (47) is connected to the connecting pipe.

7. A mold for injection molding of a housing of a household appliance according to claim 6, characterized in that: The inner wall of the operation frame (1) is fixedly connected with a support plate (48), the top end of the support plate (48) is rotatably connected with a rotating rod (49), the outer wall of the rotating rod (49) is provided with a sliding groove (410), the outer wall of the rotating rod (49) is movably connected with a movable block (411), the inner peripheral wall of the movable block (411) is fixedly connected with a limit block (412) slidably connected to the sliding groove (410), the outer wall of the movable block (411) is fixedly connected with the upper mold (32), the outer wall of the placement box (2) is fixedly connected with an extension plate (413), the bottom end of the extension plate (413) is fixedly connected with a multi-stage electric telescopic rod (414), the top end of the pressure plate (359) is provided with an arc-shaped convex groove (415), the inner wall of the arc-shaped convex groove (415) is slidably connected with a sliding column (416), and the telescopic end of the multi-stage electric telescopic rod (414) is fixedly connected to the sliding column (416).

8. The mold for injection molding of a housing of a household appliance according to claim 2, characterized in that: The machine also comprises a material unloading mechanism (5), wherein the material unloading mechanism (5) comprises a second motor (51) fixedly connected to the outer wall of the placement box (2), the output end of the second motor (51) is fixedly connected to a rotating shaft (52), the outer wall of the rotating shaft (52) is fixedly connected to a stirring frame (53), the inner wall of the operation frame (1) is fixedly connected to a material extraction pump (54), the extraction end of the material extraction pump (54) passes through the inner wall of the placement box (2) and is connected to the raw material space, the discharge end of the material extraction pump (54) is fixedly connected to a discharge telescopic pipe (55), the other end of the discharge telescopic pipe (55) is connected to the upper mold (32), and the top end of the upper mold (32) is provided with an air outlet (56).

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