Imaging system with EMI correction

By introducing dedicated data lines and pixel configurations with different electrical connections into the X-ray detector, sampling and subtracting EMI noise signals, the image artifacts caused by EMI are solved, achieving lightweight and high-quality X-ray imaging.

CN119278375APending Publication Date: 2025-01-07VAREX IMAGING CORP
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Patent Information

Application Number
CN202380042483.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-03-31
Filing Date
2023-06-29
Publication Date
2025-01-07

AI Technical Summary

Technical Problem

X-ray detectors are susceptible to electromagnetic interference (EMI), which can lead to image artifacts and reduced diagnostic quality. Existing shielding materials can increase weight or reduce radiation transmittance, and software corrections struggle to handle temporal and spatial variations in noise.

Method used

By introducing dedicated data lines and pixel configurations with different electrical connections into the detector, EMI noise signals are sampled and subtracted. Noise is eliminated within a single frame using dedicated data lines and pixel combination technology, and signal processing is optimized by combining interpolation techniques.

Benefits of technology

It effectively reduces or eliminates EMI noise, maintains the detector's lightweight design and high image quality, while improving the accuracy of medical diagnosis and the flexibility of applications.

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Abstract

A detector includes: a plurality of first pixels, each first pixel configured to convert radiation into an electrical signal; a plurality of second pixels; and a plurality of data lines coupled to the first pixel and the second pixel; a control logic configured to combine a signal from at least one of the second pixels with an electrical signal from one of the first pixels; wherein the electrical connection of each of the second pixels is different from the electrical connection of the first pixels, such that for each second pixel: a component of the second pixels is different from a component of each of the first pixels; the electrical connection between the components of the second pixels is different from the electrical connection between the components of each of the first pixels; or the number of electrical connections to the second pixel is different from the number of electrical connections to each of the first pixels.
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Description

[0001] X-ray detectors may be affected by electromagnetic interference (EMI). EMI may add temporally and spatially varying noise during a frame. EMI can be mitigated by additional shielding to reduce EMI. BRIEF DESCRIPTION OF THE DRAWINGS

[0002] Figure 1 is a block diagram of a detector according to some embodiments.

[0003] FIG. 2A to FIG. 2D is a block diagram of a pixel of a detector according to some embodiments.

[0004] Figures 3A to 3G is a block diagram of the connections of pixels and data lines of a detector according to some other embodiments.

[0005] Figure 4 is a block diagram of a detector including a detector according to some embodiments.

[0006] Figure 5 is a flow chart of a technique for operating a detector according to some embodiments.

[0007] Figure 6 is a flow chart of a technique for operating an imaging system, according to some embodiments.

[0008] Figure 7 is a block diagram of a 2D x-ray imaging system according to some embodiments. DETAILED DESCRIPTION

[0009] Some embodiments relate to imaging systems with electromagnetic interference (EMI) correction. As will be described in further detail below, various configurations of data lines and / or pixels can be used to generate signals that can be used to reduce or eliminate noise due to EMI.

[0010] X-ray flat panel detectors (FPDs) can be subject to low-frequency magnetic field electromagnetic interference. When the FPD is near magnetic field noise from sources such as transformers, solenoids, switches, motors, etc., image artifacts may appear in the x-ray images. Such artifacts may make details in the x-ray images invisible or difficult to detect. As a result, image-based medical diagnoses may be affected.

[0011] Some industry trends may exacerbate the effects of EMI. For example, copper-painted plastic housings may reduce cost and weight; however, susceptibility to EMI may increase. Conductive shielding materials may be used to prevent high-frequency EMI; however, for low-frequency EMI, a relatively thick sheet of conductive material may be required to effectively reduce the low-frequency EMI. Such additional materials may increase the weight of the FPD, possibly exceeding specified limits, and attenuate the x-ray radiation intended to be detected. High permeability magnetic shielding materials can reduce EMI, but may also reduce image quality by attenuating x-ray radiation. The embodiments described herein may allow the detector to have a cheaper housing assembly and / or less shielding material and still maintain the same or improved performance.

[0012] Software correction of EMI can be difficult because the noise can vary in both time and space. The noise can vary from frame to frame, the amplitude can vary based on location, etc. Since the amplitude can vary faster than the readout time of the row, correlated double sampling may not be able to mitigate the interference. As a result, the second sample of the row may include a different, uncorrelated contribution to the EMI that cannot be eliminated by correlated double sampling.

[0013] In order to mitigate the effects of EMI, in some embodiments, EMI noise can be sampled. The sampling of EMI noise can be performed locally or in the same frame where the EMI noise occurs. As will be described in further detail below, when the signal is sampled using the data line, the sense line can be used to sample the noise generated by EMI. Subsequently, the sampling noise can be subtracted from the sampled signal. In addition, since the sampling noise can be removed from the sampled signal, the operation can be performed within a single frame. Therefore, the detector described herein can be used for both radiography and fluoroscopy applications.

[0014] Figure 1 is a block diagram of a detector according to some embodiments. FIG. 2A to FIG. 2D is a block diagram of a pixel of a detector according to some embodiments. Figures 1 to 2D In some embodiments, the detector 100 includes an array 102. The array 102 may include various pixels 108. The pixels 108 are arranged in rows 107 and columns 109.

[0015] The detector 100 includes a plurality of gate lines 106 associated with rows 107 of pixels 108 and a plurality of data lines 104 associated with columns 109. As will be described in further detail below, the data lines 104 may be configured to provide signals to a sampling circuit (not shown). These signals may include desired signals from detected x-rays and signals due to EMI. In some embodiments, the data lines 104 may be dedicated to sensing EMI and may be referred to as data lines 104'. In some embodiments, the data lines 104 may be configured to provide desired signals for some rows 107 and to provide EMI signals for other rows 107. When providing EMI signals, the data lines 104 may be referred to as data lines 104'. In some embodiments, when different rows 107 are sampled, the data lines 104 operating as data lines (or sense lines) 104' to sense EMI signals may vary from row 107 to row 107. The data lines 104 that may be changed from providing desired signals to providing EMI signals are shown as data lines 104 / 104'.

[0016] Pixel 108a is an example of a pixel 108 configured to generate a desired signal based on incident radiation, such as x-rays. Pixel 108a includes a sensor 110 electrically connected to a switch 112. Sensor 110 may include a device such as a photodiode, a photodetector, a circuit including such a device, etc. Sensor 110 is configured to convert x-rays, light, or other photons into an electrical signal, such as an electric charge or voltage. Scintillators, direct conversion materials, or other x-ray conversion materials may be part of array 102 and configured to convert incident x-rays into photons, which sensor 110 may convert into an electrical signal. For example, scintillators may include various materials that are configured to convert x-ray photons into photons detectable by sensor 110, such as cesium iodide (CsI), cadmium tungstate (CdWO4), polyvinyl toluene (PVT), gadolinium oxysulfide (Gd2O2S; GOS; Gadox), gadolinium oxysulfide doped with terbium (Gd2O2S:Tb), etc. Examples of direct conversion materials include cadmium telluride (CdTe), cadmium zinc telluride (CdZnTe or CZT), mercury iodide (HgI), lead iodide (PbI), selenium, and the like.

[0017] The switch 112 can be a variety of devices, including transistors, such as transistors based on amorphous silicon (a-Si), complementary metal oxide semiconductor (CMOS), indium gallium zinc oxide (IGZO), etc. The switch 112 is electrically connected to the corresponding gate line 106 and the corresponding data line 104. The pixel 108a may include additional connections, such as bias lines. The bias line (not shown) may be connected to the sensor 110 in the column 109 of the pixel 108a. The pixel 108a may include other components and electrical connections. The signal can be integrated and / or collected in the pixel 108a. In response to the signal on the corresponding gate line 106, the signal can be read out by the switch 112 and the corresponding data line 104. For example, a charge can be integrated on the sensor 110. The charge can be read out by the switch and the data line 104.

[0018] As will be described in further detail below, in some embodiments, array 102 can include a second pixel 108'. Pixels 108b-d are examples of second pixels 108'. Pixels 108b-d can be similar to pixel 108a; however, the electrical connections associated with pixels 108b-d can be different from the electrical connections of pixel 108a. Other parasitic connections between switch 112, data line 104, gate line 106, sensor 110, etc. may still exist; however, the connections of, within, or to pixels 108b-d are different, such that the contribution of other desired signals generated due to incident x-rays from sensor 110 is reduced or eliminated in the signal on data line 104.

[0019] For example, in pixel 108b, sensor 110 is electrically disconnected from switch 112. However, the loading of switch 112 on data line 104' may be similar to the loading of pixel 108a on data line 104 (the switch is in the closed state, or there is no signal or minimal signal at pixel sensor 110). In addition, the parasitic connections between switch 112 and sensor 110, the connection from switch 112 to data line 104', etc. may also be similar to pixel 108a. Therefore, the load on data line 104' may be similar; however, the signal caused by the signal acquired by sensor 110 may be reduced or eliminated. Due to incident x-rays, signals may accumulate on sensor 110. When pixel 108a is sampled, switch 112 may be activated similar to those in pixel 108a. However, switch 112 of pixel 108b is not connected to sensor 110. As a result, the signal on sensor 110 either does not appear on data line 104' or appears only in a significantly reduced form due to the parasitic connections.

[0020] In another example, for pixel 108c, switch 112 is not electrically connected to gate line 106. Switch 112 can be configured to be in an off state. Therefore, even if a signal accumulates on sensor 110 and can be transmitted through switch 112, switch 112 is not connected to be activated. Therefore, due to the parasitic connection, the accumulated signal no longer appears or only appears in a significantly reduced form.

[0021] In another example, for pixel 108d, sensor 110 may not be present. Pixel 108d may be otherwise identical to pixel 108a. The absence of sensor 110 may be achieved by not forming all structures of sensor 110, not forming some of these structures (such as one or two electrodes or active materials, etc.). Thus, sensor 110 may be completely or partially absent. The loading of switch 112 on data line 104' may be similar to the loading of pixel 108b on data line 104.

[0022] While pixels 108b-108d are used as examples, other embodiments may include pixels 108' having other electrical connections that are different from first pixels 108a, which themselves are different from pixels 108b-108d. Any difference that prevents or significantly reduces the contribution of an otherwise desired signal in the output of pixel 108' on data line 104' may be a difference in the electrical connection relative to first pixel 108a.

[0023] In operation, magnetic fields or other EMI noise may be present near the detector 100. The noise is generated on the data line 104 and will be added to the desired signal read out when the switch 112 is open. The charge amplifier will amplify the desired signal and the noise, which may appear as an artifact in the image.

[0024] Data lines 104' coupled to pixels 108' (such as pixels 108b-d) may be substantially the same in susceptibility to EMI as digital lines 104 coupled to pixels 108 (such as pixel 108a). Therefore, substantially the same EMI noise will be generated on both data lines 104' and data lines 104. By reading the data line 104' signal and subtracting it from the data line 104 signal, which includes both the desired signal and the EMI noise, the EMI noise may be reduced or eliminated, leaving the desired signal.

[0025] In some embodiments, data line 104' has the same or substantially the same sensitivity to magnetic fields or other EMI as data line 104. Data line 104' has the same or substantially the same impedance as data line 104, parasitic interactions with other components, etc. Therefore, EMI noise appears on data line 104' without requiring sensor 110 to be connected to data line 104'.

[0026] As described above, in some embodiments, the electrical connections of each pixel 108' that are different from pixel 108 include electrical connections between components of pixel 108'. In other embodiments, the electrical connections of each pixel 108' that are different from pixel 108 may include electrical connections to pixel 108' (such as pixel 108c).

[0027] In some embodiments, each row 107 of the array 102 includes at least one of the pixels 108a and at least one of the pixels 108' that has a different electrical connection than the pixel 108a. As will be described in further detail below, a plurality of pixels 108' may be included in each row 107. Each of these pixels 108', in conjunction with a corresponding data line 104', may be configured to generate an EMI noise signal substantially simultaneously with the desired signal generated on the data line 104 from the corresponding pixel 108a that is combined with the same or similar EMI noise signal.

[0028] Figures 3A to 3G is a block diagram of the connections of pixels and data lines of a detector according to some other embodiments. Figure 3A , in some embodiments, at least one group of pixels 108' forms one of the columns 109-1 (or sensing columns) of the array 102a. Other columns 109 (such as columns 109-2 to 109-5) include pixels 108a. In the array 102a and other examples described herein, pixels 108' may be shaded while pixels 108a are not. Although a certain number of rows 107 and columns 109 is used as an example, in other embodiments, the number of one or both may be different.

[0029] refer to Figure 3B , in some embodiments, array 102b can be similar to array 102a. However, array 102b can include multiple groups of pixels in pixel 108'. Each group of pixels in pixel 108' can be arranged in a different column 109. Therefore, array 102b can include multiple columns 109, which include second pixels 108'. In this example, columns 109-1, 109-6, and 109-11 including second pixels 108' are examples of multiple columns. Columns 109 with pixels 108' can be repeated every 5 columns. Although three columns 109 with second pixels 108' are used as examples, in other embodiments, the number can be any integer greater than 1.

[0030] Furthermore, although the pitch or spacing between the columns 109 and the second pixels 108' is 5 pixels, in other embodiments, the pitch may be different. For example, the pitch may be any integer greater than 1. Furthermore, the pitch between any two adjacent columns 109 with second pixels 108' may be different from the pitch between another two adjacent columns 109 with second pixels 108'. However, as in this embodiment, the pitch may be the same.

[0031] In some embodiments, some columns 109 include only pixels 108'. However, in other embodiments, each column 109 of array 102 includes at least one pixel 108a. That is, each column 109 may include some pixels 108', but no column 109 includes all pixels 108'.

[0032] In some embodiments, columns 109 formed by some to all pixels 108' may introduce regular artifacts in the final image. That is, pixels 108' may not contribute a desired signal to the image and may only be used to reduce or eliminate EMI. Therefore, as will be described in further detail below, other configurations of pixels 108' in array 102 may be used.

[0033] refer to Figure 3C , in some embodiments, array 102c can be similar to arrays 102a-b. However, each second pixel 108' of a row 107 of array 102c is offset from at least one second pixel 108' in another row 107 of array 102c. In this example, second pixels 108' in one row 107 are offset by one pixel from second pixels 108' in an adjacent row in a diagonal pattern. In other embodiments, second pixels 108' in adjacent rows can be offset by different numbers of pixels. Therefore, array 102c can have pixels 108' distributed across array 102c. Array 102c may lack the presence of one or more defective columns.

[0034] In some embodiments, if the spacing between pixels 108' of adjacent rows 107 is greater than 1, an additional pixel 108a having a signal including a desired signal from the conversion of incident radiation may be adjacent to each of the pixels 108'. In particular, each of the eight pixels 108 surrounding the pixel 108' may be a pixel 108a. The desired signals from those pixels 108a may be used for interpolation to replace the missing signal associated with the pixel 108'. Although the use of eight surrounding pixels 108 has been used as an example of a pixel whose signals may be used for interpolation, in other embodiments, signals from less than all eight (including only one pixel 108) and / or signals from pixels 108 other than the immediately adjacent pixel 108 may be used for interpolation.

[0035] refer to Figure 3D In some embodiments, array 102d may be similar to Figure 3C However, the pixels 108' of adjacent rows 107 may be offset by a different number of pixels 108. For example, the pixels 108' of a particular row 107 may be offset from the pixels 108' of an adjacent row 107 by any positive or negative number of pixels 108, such as + / -1, + / -2, + / -3, or more pixels 108. The pixels 108' of another row 107 may be offset by a different amount.

[0036] In some embodiments, the second pixels 108' may be offset from one another in the array 102d so that the second pixels 108' are randomly distributed or distributed in an asymmetric local pattern (within a specified pxq region or subset of the array 102d, where p represents the number of rows 107 and q represents the number of columns 109). In some embodiments, the second pixels 108' may be distributed so that the second pixels 108' are randomly distributed (or asymmetric distributed), but have a substantially uniform density. As used herein, a substantially uniform density means that the number of second pixels 108' in a given region of pixels 108 is within a defined range, such as from about 2 to about 10 or more across the array 102d. For example, the second pixels 108' may be distributed across the array 102d so that for any nxn region of pixels 108 (where n is the number of rows 107 and the number of columns 109), m pixels are second pixels 108', such as 1, 2, 3, or more. In another example, for any nxn region of pixels 108, the number of second pixels 108' present may be within a certain range, such as from about 2 to about 10 or more. That is, even though the density in the nxn region may vary, it may vary within a certain range so that a sufficient EMI signal may be obtained while limiting the loss of the desired signal due to the use of the pixels 108'.

[0037] refer to Figure 3E In some embodiments, the second pixels 108' can be distributed across an array 102e similar to the array 102b. However, the second pixels 108' can be arranged in a series of columns 109, such as 2 or more columns, but less than the pitch of adjacent groups of columns 109 containing the second pixels 108'. Here, the two columns 109-1 and 109-2 are examples of a series of columns. The series can be repeated in columns 109-6 and 109-7 and columns 109-11 and 109-12.

[0038] In some embodiments, second pixels 108' may be distributed such that each row 107 of array 102 includes at least one of pixels 108'. That is, whether the distribution of pixels 108' is similar to the distribution of arrays 102a-e or another similar distribution, each row 107 includes at least one pixel 108'.

[0039] In some embodiments, each row 107 may include a plurality of second pixels 108'. Within a row 107, pixels 108' may be positioned such that the distance from pixel 108a to pixel 108' is less than the number of pixels, such as 5, 10, 20, or more. In some embodiments, even if pixels 108' are distributed across array 102 in a random manner, within any given row 107, second pixels may be evenly spaced. For example, even if pixels 108' are Figure 3D In some embodiments, the pitch of pixels 108' in other rows may be the same; however, the position of pixels 108' may be relatively shifted from column 109 to column 109 along row 107.

[0040] In some embodiments where there is a dedicated second pixel 108', a signal may be generated to approximate the expected signal that would be generated by the second pixel 108' if it were configured as the first pixel 108. As described above, any technique may be used to combine signals from neighboring pixels, pixels within a threshold distance, etc. to generate an approximate expected signal.

[0041] refer to Figure 3F In some embodiments, array 102f may include one or more additional data lines 104'. Additional data lines 104' may be parallel to and disposed along a corresponding one of data lines 104. Additional data lines 104' may be disposed in columns of any columns 109 of pixels 108' in arrays 102a, 102b, etc. That is, instead of using pixels 108' in columns in arrays 102a, 102b, etc., additional data lines 104' may be used.

[0042] In some embodiments, the additional data lines 104' are disposed on a different metal layer of the array 102f than the data lines 104. The additional data lines 104' can be disposed above the corresponding data lines 104. Thus, the additional data lines 104' can be hidden from the user. In some embodiments, the additional data lines 104' are disposed on the same metal layer as the data lines 104. The additional data lines 104' can be disposed adjacent to the corresponding data lines 104.

[0043] In some embodiments, the additional data line 104' may have a substantially identical structure to the corresponding data line 104. In other embodiments, the structure of the additional data line 104' may be different in some way, causing the additional data line 104' to be closer to or substantially the same as the data line 104 in sensitivity to EMI. For example, the additional data line 104' may have a different width, thickness, etc. In some embodiments, a switch 112, a second pixel 108' including the switch 112, another structure having a similar capacitance, etc., or may be coupled to the additional data line 104' to simulate the loading of the switch 112 of the pixel 108a coupled to the data line 104. The second pixel 108' / switch 112 is shown as an example of such a structure. In some embodiments, the number of pixels 108' coupled to the additional data line 104' may be less than the number of associated data lines 104. The number of second pixels 108' coupled to the additional data line 104' may be sufficient to make the additional data line 104' approximate the sensitivity of the data line 104 to EMI. In some embodiments, the number may be one second pixel 108'. In other embodiments, the additional data line 104' is not coupled to any pixel 108'.

[0044] In some embodiments, the presence of the additional data line 104' may cause the pixels 108a of the column 109 to be less sensitive relative to adjacent columns 109. Therefore, the values ​​sampled from the columns 109 that overlap with the additional data line 104' may be adjusted to compensate for the reduced sensitivity. In some embodiments, the location of the additional data line 104' may be on another metal layer and overlap with the associated data line 104. Therefore, the reduced sensitivity of the pixels 108a of the column 109 due to the presence of the data line 104 may be reduced or eliminated.

[0045] In some embodiments, the fill factor of array 102f may not be affected by the additional data lines 104'. That is, using additional data lines 104' does not result in a lack of pixels 108a converting radiation into electrical signals, as compared to embodiments where pixels 108a are replaced by pixels 108' and therefore do not contribute the desired signal to the final frame.

[0046] refer to Figure 3G , in some embodiments, array 102g can be similar to array 102f. However, data lines 104' can be coupled to some second pixels 108'. Second pixels 108' do not share data lines 104 with other pixels 108. Instead, second pixels 108' are coupled to dedicated additional data lines (or sense lines) 104'. Although the distribution of second pixels 108' is shown as Figure 3E The distribution of the array 102e is shown to be similar, but in other embodiments, the distribution of the second pixels 108' may be similar to the other configurations described above.

[0047] Figure 4 is a block diagram of a detector including a detector according to some embodiments. The imaging system 100 includes an array 102. The array 102 can be any of the arrays 102 described above, such as arrays 102a-f, etc. The array 102 includes a data line 104 / 104'. As described above, in some embodiments, the data line 104' can be a dedicated data line 104' coupled to a second pixel 108' for each row 107, or an additional data line 104' that coincides with another data line 104 of a column 109. In other embodiments, the operation of the data line 104 / 104' can change based on whether the data line 104 / 104' is coupled to a pixel 108a or a pixel 108' of a given row 107.

[0048] The imaging system 100 includes a row driver 122. The row driver 122 can be configured to generate signals on the gate lines 106 to selectively activate the rows 107 of the array 102.

[0049] The imaging system 100 includes a control logic 120. The control logic 120 includes a sampling circuit configured to sample a signal from the pixel 108. The sampling circuit includes circuits configured to perform sampling, such as a charge amplifier, an analog-to-digital converter (ADC), a sample and hold circuit, etc. The sampling circuit is coupled to the pixel 108 via a data line 104 / 104'. The control logic 120 may include a general purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a microcontroller, a programmable logic device, a discrete circuit, a combination of such devices, etc. The control logic 120 may include other circuits to couple the control logic 120 to a row driver 122, etc., so that the control logic 120 can control the operation of such circuits.

[0050] The control logic 120 may be configured to control various operations described herein. As will be described in further detail below, the control logic 120 may be configured to adjust an electrical signal from a pixel 108a of the array 102 based on an electrical signal received via at least one of the at least one data line 104'. In some embodiments, the control logic 120 is configured to combine the signal from the pixel 108a with a signal from a single pixel 108' or via a single data line 104'. However, in other embodiments, the signal from the pixel 108a may be combined with a signal generated based on a plurality of pixels 108' or received via a plurality of data lines 104'.

[0051] Figure 5 is a flow chart of a technique for operating a detector according to some embodiments. Figures 1 to 5, various operations of the detector 100 will be described. In 500, a plurality of first signals are received from a pixel 108a via a first set of data lines 104, the pixel being configured to convert incident radiation into an electrical signal. For example, the control logic 120 may be configured to control a row driver 122 to activate a row 107 of the array 102. The control logic 120 may sample an electrical signal (such as a current or voltage) via the data line 104.

[0052] In 502, at least one second signal is received by at least one data line 104' of a second group of data lines in the data lines 104 / 104' other than the first group of data lines 104. Relative to at least one first signal from an adjacent data line 104 in the first group of data lines in the plurality of data lines 104, the contribution of the at least one second signal is reduced due to radiation conversion. The data lines 104' of the second group may be the same for each row 107, may be different for each row 107, or may be shared by some rows 107 and different for other rows, etc. According to various embodiments described above, the data lines 104' of the second group may be different. For example, in some embodiments, the at least one second signal is received by a data line 104' that is not coupled to any pixel, such as a pixel related to a pixel. Figure 3F In other embodiments, at least one second signal is received via a data line coupled to a second pixel 108', the second pixel having an electrical connection different from the electrical connection of the first pixel 108, such that for the second pixel, the components of the second pixel are different from the components of each of the first pixels, such as with respect to Figure 2D As shown, the electrical connections between the components of the second pixel 108' are different from the electrical connections between each first pixel component in the first pixel, such as Figure 2B As shown, or the number of electrical connections to the second pixel 108' is different from the number of electrical connections to each of the first pixels 108, such as with respect to Figure 2C shown.

[0053] In some embodiments, the electrical connection of each second pixel in the second pixels 108' is different from the electrical connection of the first pixel. When the gate line of a particular row 107 is activated, the at least one data line 104' may include one or more data lines 104' coupled to the corresponding second pixels 108'. In another embodiment, the second data lines 104' may include dedicated data lines 104' as described with respect to the array 102f. The control logic 120 may be configured to sample the signal received through the data line 104'.

[0054] Therefore, a first signal and a second signal are available. The first signal includes both a portion representing the desired signal and a portion representing EMI. The second signal includes a portion representing EMI.

[0055] In 506, at least one second signal is combined with the first signal to generate a modified first signal. This combination can be performed in various ways. In some embodiments, the second signal of a row can be subtracted from each of the first signals of the row. In another embodiment, the leftmost second signal, the rightmost second signal, or the most recent second signal can be subtracted from a given first signal. Since the first signal and the second signal of a given row 107 are substantially sampled simultaneously, the EMI contribution of the second signal should be similar to the EMI contribution of the first signal. In particular, this makes the EMI correlated with the desired signal in time. Substantially simultaneously means within the readout period of a given row 107.

[0056] Figure 6 is a flowchart of a technique for operating an imaging system according to some embodiments. Refer to Figures 1 to 4 and Figure 6 , in some embodiments, the operation can be similar to Figure 5 the corresponding operations 500, 502, and 506. However, the combination of the first signal and the second signal in 506 can include interpolating a plurality of second signals in at least one second signal in 508 to generate an interpolated second signal for each first signal, and combining each first signal with the corresponding interpolated second signal in 510. Thus, the second signal can be correlated with a given pixel 108a in space and time.

[0057] The interpolation in 506 can be performed in various ways. In some embodiments, two second signals can be averaged to generate an interpolated second signal that can be subtracted from the first signal. In some embodiments, the positions of the two closest second signals and the pixel 108a that generates the first signal relative to the two second pixels 108' can be used to combine the signals using a weighted average. Formula 1 is where FS n is an example of the nth first signal from the pixel 108a at column 109 - n received through the data line 104. SS j and SS k are the jth second signal and the kth second signal received from the data lines 104' at columns 109 - j and 109 - k, where j < n < k. The result is the nth modified signal MS n .

[0058]

[0059] In another embodiment, multiple second signals can be combined together to generate a spline interpolation function. For example, a set of pixel columns and pairs of second signals from data lines 104' for rows can be used to generate a spline interpolation function. The column associated with a given data line 104 can be used to generate an EMI signal for that particular pixel based on the column and the spline interpolation function.

[0060] Although nearest neighbor interpolation and spline interpolation techniques are used as examples, any interpolation technique may be used to determine an interpolated second value to be subtracted from the first signal to generate a modified first signal.

[0061] In some embodiments, the number of data lines 104' used to generate the second signal for each row 107 can be based on the desired noise performance. For example, the spacing of the data lines 104' can be selected based on a signal-to-noise ratio of greater than 8, 10, 16, or more. The number of data lines 104' per row can be a percentage of the number of columns 109, such as 5, 10, or more.

[0062] The selection of the number of data lines 104' can be based on the expected EMI. The magnetic field can vary spatially. The spacing of the data lines 104' can be based on this spatial variance. The EMI that can pass through other EMI shields can be relatively low frequency EMI. Therefore, the placement of the data lines 104' does not need to be adjacent to any given pixel 108a. The placement can be based on the expected amplitude and frequency of the EMI.

[0063] Figure 7 7 is a block diagram of a 2D x-ray imaging system according to some embodiments. The 2D x-ray imaging system 700 includes an x-ray source 702 and a detector 710. The detector 710 can be similar to the detector 100 including the array 102, etc., as described above. The x-ray source 702 is disposed relative to the detector 710 so that x-rays 720 can be generated to pass through a specimen 722 and be detected by the detector 710. In some embodiments, the detector 710 is part of a medical imaging system, a non-destructive testing system, etc. In other embodiments, the 2D x-ray imaging system 700 can include a portable vehicle scanning system as part of a cargo scanning system.

[0064] Some embodiments include a detector comprising: a plurality of first pixels 108, each of the first pixels 108 being configured to convert radiation into an electrical signal; and a first group of data lines of a plurality of data lines 104 / 104' coupled to the first pixels 108; a control logic 120 configured to receive at least one second signal through at least one data line 104' of a second group of data lines of the plurality of data lines 104 / 104' other than the first group of data lines of the plurality of data lines 104 / 104', and to combine the at least one first signal with the first signal to generate a modified first signal, wherein the second group of data lines 104' is coupled to the first pixels 108; At least one data line 104' in the first pixel 108 is: not coupled to any pixel; or coupled to a second pixel 108' with an electrical connection different from the electrical connection of the first pixel 108, so that for the second pixel 108': the electrical connection between the components of the second pixel 108' is different from the electrical connection between the components of each pixel in the first pixel 108; the electrical connection between the components in the components of the second pixel 108' is different from the electrical connection between the components of each first pixel in the first pixel 108; or the number of electrical connections to the second pixel 108' is different from the number of electrical connections to each first pixel in the first pixel 108.

[0065] Some embodiments include a detector comprising: a plurality of first pixels 108, each first pixel 108 being configured to convert radiation into an electrical signal; a plurality of second pixels 108'; and a plurality of data lines 104 / 104' coupled to the first pixels 108 and the second pixels 108'; a control logic element 120, which is configured to combine a signal from at least one of the second pixels 108' with an electrical signal from one of the first pixels 108; wherein the electrical connection of each of the second pixels 108' is different from the electrical connection of the first pixel 108, so that for each second pixel: the components of the second pixel 108' are different from the components of each of the first pixels 108; the electrical connections between the components of the components of the second pixel 108' are different from the electrical connections between the components of each of the first pixels 108; or the number of electrical connections to the second pixel 108' is different from the number of electrical connections to each of the first pixels 108.

[0066] In some embodiments, each first pixel 108 includes: a sensor 110; and a switch 112, which is electrically connected between the sensor 110 and an associated data line among the data lines 104 / 104'; and each second pixel 108' includes: a sensor 110; and a switch 112, which is electrically connected to an associated data line among the data lines 104 / 104' and electrically disconnected from the sensor 110.

[0067] In some embodiments, each first pixel 108 includes: a sensor 110 ; and a switch 112 electrically connected between the sensor 110 and an associated one of the data lines 104 ; and each second pixel 108 ′ does not include the sensor 110 .

[0068] In some embodiments, the detector further includes a plurality of gate lines 106 associated with the first pixel 108 and the second pixel 108'; wherein for an electrical connection of each second pixel 108' that is different from the first pixel 108, the transistor 112 of each first pixel in the first pixel 108 is electrically connected to a corresponding gate line in the gate line 106, and the corresponding transistor 112 of each second pixel in the second pixel 108' is not electrically connected to a corresponding gate line in the gate line 106.

[0069] In some embodiments, first pixels 108 and second pixels 108 ′ are arranged in rows 107 and columns 109 of array 102 ; and each row 107 of array 102 includes at least one of first pixels 108 and at least one of second pixels 108 ′.

[0070] In some embodiments, at least one group of second pixels in the second pixels 108 ′ forms one of the columns 109 of the array 102 .

[0071] In some embodiments, the second pixels 108 ′ are arranged in a plurality of groups; and each group of second pixels in the second pixels 108 ′ forms a corresponding column in the columns 109 of the array 102 .

[0072] In some embodiments, each column 109 of the array 102 includes at least one first pixel 108 .

[0073] In some embodiments, each second pixel 108 ′ of a row 107 of the array 102 is offset along the row 107 of the array 102 from at least one second pixel 108 ′ in another row 107 of the array 102 .

[0074] In some embodiments, the second pixels 108 ′ have a substantially uniform density across the array 102 .

[0075] In some embodiments, the data lines 104 / 104' include a first data line 104 and at least one second data line 104'; the first data line 104 is coupled to the first pixel 108; at least one second data line 104' is coupled to the second pixel 108', each of the at least one second data line 104' is parallel to and arranged along the corresponding first data line of the first data lines 104; and the control logic element 120 is configured to adjust the electrical signal from the first pixel 108 based on the electrical signal received through at least one of the at least one second data line 104'.

[0076] In some embodiments, the control logic 120 is configured to combine an electrical signal from one of the first pixels 108 with a signal based on interpolating signals from at least two of the second pixels 108 ′.

[0077] In some embodiments, the first pixels 108 and the second pixels 108' are arranged in rows 107 and columns 109 of the array 102; each row 107 of the array 102 includes more than one first pixel in the first pixel 108 and more than one second pixel in the second pixel 108'; and for each first pixel 108 of the row, the control logic 120 is configured to combine the electrical signal from the first pixel 108 with a combination of electrical signals from at least two second pixels in the second pixel 108' of the row 107.

[0078] In some embodiments, each second pixel 108' has electrical connections to reduce electrical signals generated due to radiative conversion associated with an adjacent first pixel 108 on one of the plurality of data lines 104 / 104' coupled to the second pixel 108'.

[0079] In some embodiments, the data line 104 ′ coupled to the second pixel 108 ′ is not coupled to the first pixel 108 .

[0080] In some embodiments, for each of the data lines 104 ′ coupled to second pixels 108 ′, the number of second pixels 108 ′ coupled to that data line 104 ′ is less than the number of first pixels 108 coupled to the associated data line 104 coupled to the first pixel 108 .

[0081] Some embodiments include a detector comprising: a plurality of pixels 108, each pixel 108 being configured to convert radiation into an electrical signal; a plurality of data lines 104 / 104', including a first group of data lines 104 coupled to the pixels 108 and a second group of data lines 104' not coupled to the pixels 108; and a control logic element 120 configured to combine, for each pixel in the pixels 108, an electrical signal from a data line 104 in the first group of data lines 104 coupled to the pixel 108 with an electrical signal from at least one data line 104" in the second group of data lines 104'.

[0082] In some embodiments, the detector further includes a switch 112 coupled to each of the data lines 104' in the second set of data lines.

[0083] Some embodiments include a method comprising: receiving a plurality of first signals from a first pixel 108 through a first group of data lines in a plurality of data lines 104, the first pixel being configured to convert radiation into an electrical signal; receiving at least one second signal through at least one data line 104' in a second group of data lines in a plurality of data lines 104 / 104' other than the first group of data lines in the plurality of data lines 104, wherein at least one data line 104' in the second group of data lines: is not coupled to any pixel; or is coupled to a second pixel 108' with an electrical connection different from that of the first pixel 108, such that for the second pixel: components of the second pixel 108' are different from components of each first pixel in the first pixel 108; electrical connections between components in the components of the second pixel 108' are different from electrical connections between components of each first pixel in the first pixel 108; or the number of electrical connections to the second pixel 108' is different from the number of electrical connections to each first pixel in the first pixel 108; and combining the at least one second signal with the first signal to generate a modified first signal.

[0084] In some embodiments, for each row 107 of the array 102 including the first pixels 108 , at least one data line 104 ′ in the plurality of data lines 104 / 104 ′ other than a first group of data lines in the plurality of data lines 104 is identical to the other rows 107 .

[0085] In some embodiments, for at least one row 107 of the array 102 including the first pixel 108 , at least one data line 104 ′ of the plurality of data lines 104 / 104 ′ other than a first group of data lines of the plurality of data lines 104 / 104 ′ is different from another row 107 .

[0086] In some embodiments, combining at least one second signal with a first signal to generate a modified first signal includes: interpolating multiple second signals in the at least one second signal to generate an interpolated second signal for each first signal in the first signal; and combining each first signal with the corresponding interpolated second signal.

[0087] Some embodiments include a detector comprising: a device for receiving multiple first signals from a first pixel through a first group of data lines in a plurality of data lines, the first pixel being configured to convert radiation into an electrical signal; a device for receiving at least one second signal through at least one data line of a second group of data lines in the plurality of data lines other than the first group of data lines in the data lines, wherein at least one data line in the second group of data lines: is not coupled to any pixel; or is coupled to a second pixel with an electrical connection different from that of the first pixel, such that for the second pixel: components of the second pixel are different from components of each first pixel in the first pixel; electrical connections between components in the components of the second pixel are different from electrical connections between components of each first pixel in the first pixel; or the number of electrical connections to the second pixel is different from the number of electrical connections to each first pixel in the first pixel; and a device for combining at least one second signal with the first signal to generate a modified first signal.

[0088] Examples of means for receiving a plurality of first signals from a first pixel configured to convert radiation into electrical signals via a first set of data lines of the plurality of data lines include data lines 104, row driver 122, control logic 120, etc.

[0089] Examples of means for receiving at least one second signal through at least one data line of a second group of data lines of the plurality of data lines other than the first group of data lines of the data lines include data line 104', row driver 122, control logic 120, etc.

[0090] Examples of means for combining at least one second signal with the first signal to generate a modified first signal include control logic 120 and the like.

[0091] In some embodiments, a device for combining at least one second signal with a first signal to generate a modified first signal includes: a device for interpolating multiple second signals in the at least one second signal to generate an interpolated second signal for each first signal in the first signal; and a device for combining each first signal with the corresponding interpolated second signal.

[0092] Examples of means for interpolating a plurality of second signals in the at least one second signal to generate an interpolated second signal for each first signal in the first signals include the control logic 120 and the like.

[0093] Examples of means for combining each first signal with a corresponding interpolated second signal include control logic 120 and the like.

[0094] Although structures, devices, methods and systems have been described according to specific embodiments, it will be readily appreciated by those skilled in the art that many variations of the specific embodiments are possible, and therefore any variation should be considered within the spirit and scope of the disclosure herein. Therefore, many modifications may be made by those skilled in the art without departing from the spirit and scope of the appended claims.

[0095] The claims appended to this written disclosure are hereby expressly incorporated into this written disclosure, with each claim standing on its own as a separate embodiment. This disclosure includes all permutations of independent claims with their dependent claims. In addition, additional embodiments that can be derived from the appended independent and dependent claims are also expressly incorporated into this written description. These additional embodiments are identified by replacing the dependencies of a given dependent claim with the phrase "any of the claims beginning with claim [x] and ending with the claim immediately preceding that claim", where the term "[x]" in parentheses is replaced with the number of the most recently cited independent claim. For example, for the first claim set beginning with independent claim 1, claim 4 may be dependent on any of claims 1 and 3, where these separate dependencies yield two different embodiments; claim 5 may be dependent on any of claims 1, 3, or 4, where these separate dependencies yield three different embodiments; claim 6 may be dependent on any of claims 1, 3, 4, or 5, where these separate dependencies yield four different embodiments; and so on.

[0096] Reference in a claim to a feature or element with the term "first" does not necessarily imply the presence of a second or additional such feature or element. Pursuant to 35 U.S.C. §112(f), elements specifically referenced in means-plus-function format, if any, are intended to be interpreted as encompassing the corresponding structures, materials, or acts described herein and their equivalents. Embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows.

Claims

1. A detector, comprising: a plurality of first pixels, each first pixel being configured to convert radiation into an electrical signal; a plurality of second pixels; as well as a plurality of data lines coupled to the first pixel and the second pixel; a control logic configured to combine a signal from at least one of the second pixels with an electrical signal from one of the first pixels; wherein the electrical connection of each of the second pixels is different from the electrical connection of the first pixel, such that for each second pixel: a component of the second pixel that is different from a component of each of the first pixels; the electrical connections between the components of the components of the second pixel are different from the electrical connections between the components of each of the first pixels; or The number of electrical connections to the second pixels is different than the number of electrical connections to each of the first pixels.

2. The detector according to claim 1, wherein: Each first pixel comprises: Sensors; and a switch electrically connected between the sensor and an associated one of the data lines; and Each second pixel comprises: Sensors; and A switch is electrically connected to an associated one of the data lines and electrically disconnected from the sensor.

3. The detector according to claim 1, wherein: Each first pixel comprises: Sensors; and a switch electrically connected between the sensor and an associated one of the data lines; and Each second pixel does not include a sensor.

4. The detector according to any one of claims 1 to 3, further comprising: a plurality of gate lines associated with the first pixel and the second pixel; Wherein for the electrical connection of each second pixel different from the first pixel, the transistor of each first pixel in the first pixels is electrically connected to the corresponding gate line in the gate lines, and the corresponding transistor of each second pixel in the second pixels is not electrically connected to the corresponding gate line in the gate lines.

5. The detector according to any one of claims 1 to 4, wherein: The data line includes a first data line and at least one second data line; The first data line is coupled to the first pixel; the at least one second data line is coupled to the second pixel; Each of the at least one second data line is parallel to a corresponding first data line of the first data lines and is disposed along a corresponding first data line of the first data lines; and The control logic is configured to adjust the electrical signal from the first pixel based on the electrical signal received through at least one of the at least one second data line.

6. A detector according to any one of claims 1 to 5, wherein: The control logic is configured to combine the electrical signal from one of the first pixels with a signal based on interpolating signals from at least two of the second pixels.

7. A detector according to any one of claims 1 to 6, wherein: The first pixels and the second pixels are arranged in rows and columns of an array; Each row of the array includes more than one first pixel of the first pixels and more than one second pixel of the second pixels; and For each first pixel of a row, the control logic is configured to combine the electrical signal from the first pixel with a combination of electrical signals from at least two of the second pixels of the row.

8. A detector according to any one of claims 1 to 7, wherein: Each second pixel has an electrical connection to reduce the electrical signal generated due to radiative conversion associated with an adjacent first pixel on one of the plurality of data lines coupled to the second pixel.

9. The detector according to any one of claims 1 to 8, wherein: The first pixels and the second pixels are arranged in rows and columns of an array; and Each row of the array includes at least one first pixel of the first pixels and at least one second pixel of the second pixels.

10. The detector according to claim 9, wherein: At least one group of the second pixels forms one of the columns of the array.

11. The detector according to claim 9, wherein: The second pixels are arranged in a plurality of groups; and Each group of the second pixels forms a corresponding one of the columns of the array.

12. A detector according to any one of claims 9 to 11, wherein: Each second pixel of a row of the array is offset along the row of the array from at least one second pixel in another row of the array.

13. A detector according to any one of claims 9 to 12, wherein: The second pixels have a substantially uniform density across the array.

14. A detector according to any one of claims 1 to 13, wherein: The data line coupled to the second pixel is not coupled to the first pixel.

15. The detector according to claim 14, wherein: For each of the data lines coupled to the second pixels, the number of second pixels coupled to the data line is less than the number of first pixels coupled to the associated data line coupled to the first pixel.

16. A method comprising: ; receiving a plurality of first signals from a first pixel via a first set of data lines among a plurality of data lines, the first pixel being configured to convert radiation into an electrical signal; receiving at least one second signal through at least one data line in a second group of data lines among the plurality of data lines other than the first group of data lines among the plurality of data lines, wherein the at least one data line in the second group of data lines: is not coupled to any pixel; or coupled to a second pixel with an electrical connection different from the electrical connection of the first pixel, such that for the second pixel: a component of the second pixel that is different from a component of each of the first pixels; the electrical connections between the components of the components of the second pixel are different from the electrical connections between the components of each of the first pixels; or the number of electrical connections to the second pixels being different than the number of electrical connections to each of the first pixels; as well as The at least one second signal is combined with the first signal to generate a modified first signal.

17. The method of claim 16, wherein: For at least one row of the array including the first pixel, the at least one of the plurality of data lines other than the first group of data lines of the plurality of data lines is different from another row.

18. The method according to any one of claims 16 to 17, wherein combining the at least one second signal with the first signal to generate the modified first signal comprises: interpolating a plurality of second signals in the at least one second signal to generate an interpolated second signal for each first signal in the first signal; as well as Each first signal is combined with a corresponding interpolated second signal.

19. A detector comprising: means for receiving a plurality of first signals from a first pixel via a first set of data lines of a plurality of data lines, the first pixel being configured to convert radiation into an electrical signal; means for receiving at least one second signal via at least one data line of a second group of data lines of the plurality of data lines other than the first group of data lines of the data lines, wherein the at least one data line of the second group of data lines: is not coupled to any pixel; or coupled to a second pixel with an electrical connection different from the electrical connection of the first pixel, such that for the second pixel: a component of the second pixel that is different from a component of each of the first pixels; the electrical connections between the components of the components of the second pixel are different from the electrical connections between the components of each of the first pixels; or the number of electrical connections to the second pixels being different than the number of electrical connections to each of the first pixels; as well as means for combining the at least one second signal with the first signal to generate a modified first signal.

20. The detector of claim 19, wherein the means for combining the at least one second signal with the first signal to generate the modified first signal comprises: means for interpolating a plurality of the at least one second signal to generate an interpolated second signal for each of the first signals; as well as Means for combining each first signal with a corresponding interpolated second signal.