Grinding tool and grinding method for grinding inner hole of hard and brittle pipe fitting with large length-diameter ratio

CN119282914AActive Publication Date: 2025-01-10TIANJIN UNIV

Patent Information

Application Number
CN202411625386.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-14
Publication Date
2025-01-10
Estimated Expiration
2044-11-14

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Abstract

The invention discloses a grinding tool and a grinding method for grinding an inner hole of a hard and brittle pipe fitting with a large length-diameter ratio, and belongs to the field of hard and brittle material processing. In order to solve the problems that the hard and brittle pipe fitting has the characteristics of high hardness and brittleness, ultra-large length-diameter ratio and small wall thickness of a finished product, so that the hard and brittle pipe fitting is easy to damage and the machining precision is difficult to guarantee in the machining process. The grinding tool with the large length-diameter ratio is formed by alternately arranging the annular grinding heads and the annular grooves, the grinding tool is divided into the guiding section, the taper section and the sizing section in the length direction of the grinding tool, the grinding tool penetrates through an inner hole of the hard and brittle pipe fitting through the guiding section and is straightened, the grinding tool rotates, and the diameter of the inner hole of the hard and brittle pipe fitting is adjusted. The hard and brittle pipe fitting moves forwards from the guiding section to the sizing section and does reciprocating motion at the same time till the hard and brittle pipe fitting moves to the sizing section and is ground, and therefore machining of the inner hole of the hard and brittle pipe fitting is achieved. The method is mainly used for machining hard and brittle pipe fittings.
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Citation Information

Patent Citations

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  • Method for conditioning polishing pads for the simultaneous double-side polishing of semiconductor wafers

    US20140235143A1

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    US6045436A

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