computing server

Abstract

The application discloses a kind of computing servers.The computing server includes memory and the first wind scooping structure on the top of memory, the first wind scooping structure includes first wind scooping and multiple second wind scooping arranged along the first direction (X), wherein, the first wind scooping is overlapped in the orthographic projection on the plane where memory is located, network card and second wind scooping structure, the first end of second wind scooping structure and the first wind scooping structure are connected, the second end of second wind scooping structure is installed in the circumferential side of network card, and second wind scooping structure at least includes one both ends lead-through wind scooping passage, one end of wind scooping passage and first wind scooping and at least part second wind scooping are communicated, and the other end of wind scooping passage is communicated to the circumferential side area of network card.In this way, the heat dissipation difficulty of network card is reduced, avoid causing the local overheating of network card, and then reduce the risk of damage of network card.

Description

Technical Field

[0001] This application belongs to the field of server technology, specifically relating to a computing server. Background Technology

[0002] With the development of technology, the functions of computing servers are constantly increasing. However, this increase in functionality also leads to a rise in the overall power consumption and heat generation of computing servers. The temperature rises further as the heat reaches the rear of the server components, especially after the main components have already warmed up. As information technology advances, the amount of data that computing servers need to transmit is constantly increasing, resulting in larger and more power-consuming network interface cards (NICs). Furthermore, the NICs are located at the rear of the server, further increasing the difficulty of heat dissipation and making them prone to localized overheating, thus increasing the risk of damage. Summary of the Invention

[0003] The purpose of this application embodiment is to provide a computing server that at least solves the problem of the difficulty in heat dissipation of network cards.

[0004] This application embodiment provides a computing server, the computing server comprising:

[0005] The memory and a first air guide structure located on top of the memory, the first air guide structure including a first air guide groove and a plurality of second air guide grooves arranged along a first direction, wherein the orthographic projections of the first air guide grooves on the plane where the memory is located overlap, and the first direction is the direction intersecting with the airflow direction in the first air guide groove;

[0006] The network card and the second air guide structure are provided. The first end of the second air guide structure is connected to the first air guide structure, and the second end of the second air guide structure is installed on the periphery of the network card. The second air guide structure includes at least one air guide channel with both ends open. One end of the air guide channel is connected to the first air guide groove and at least part of the second air guide groove, and the other end of the air guide channel is connected to the periphery of the network card.

[0007] Optionally, the first end of the second air guide hood structure is provided with a flared air intake structure;

[0008] The flared air intake structure includes a baffle plate that extends in a second direction into the second air guide groove adjacent to the first air guide groove, wherein the second direction is the same as the flow direction of the airflow in the second air guide groove.

[0009] Optionally, the wind deflector includes a first baffle and a second baffle;

[0010] The second baffle is connected between the first baffle and the first end of the second air guide structure. The first baffle and the second baffle are bent together. The first baffle extends along the second direction. The distance between the second baffle and the first air guide groove decreases sequentially from the first end of the second baffle to the second end of the second baffle. The first end of the second baffle is connected to the first baffle, and the second end of the second baffle is connected to the first end of the second air guide structure.

[0011] Optionally, the distance between the first baffle and the partition between the first air guide trough and the second air guide trough is greater than a first value, the first value being greater than or equal to one-half of the size of the second air guide trough in the first direction, and less than or equal to three-quarters of the size of the second air guide trough in the first direction.

[0012] Optionally, the second air guide structure includes a first air intake structure and a second air intake structure;

[0013] The first air-guiding structure includes a first air-guiding cavity, the second air-guiding structure includes a second air-guiding cavity, the first air-guiding cavity and the second air-guiding cavity are connected, and the first air guide groove and at least a portion of the second air guide groove are connected to the first air-guiding cavity.

[0014] Optionally, the first air-expelling structure and the second air-expelling structure are connected by an air-guiding structure;

[0015] The air guiding structure includes an air guiding cavity, which has open ends in the second direction. The first air guiding structure has a through hole at the bottom in the third direction, which is connected to one end of the air guiding cavity and the other end of the air guiding cavity is connected to the second air guiding structure. The second direction intersects with the third direction, which is the direction of airflow in the first air guiding groove. The third direction intersects with the plane where the memory is located.

[0016] Optionally, the air guiding structure includes a first air guiding plate, a second air guiding plate, and an air guiding block;

[0017] The first air guide plate and the second air guide plate are arranged opposite to each other in the first direction. The first air guide plate and the second air guide plate are disposed on the end of the air guide block near the first air guide groove, and the air guide cavity is formed between the first air guide plate and the second air guide plate.

[0018] The orthographic projection of the air guiding structure on the first plane and the orthographic projection of the internal cavity on the first plane do not overlap. The orthographic projection of the connecting hole on the second aspect and the orthographic projection of the air guiding cavity formed between the first air guiding plate and the second air guiding plate on the second plane overlap. The first plane is the plane formed by the first direction and the third direction, and the second plane is the plane formed by the first direction and the second direction.

[0019] The end of the air guide block facing the air guide cavity formed between the first air guide plate and the second air guide plate is an inclined surface. The distance between the inclined surface and the first air guide groove increases sequentially from the first side of the inclined surface to the second side of the inclined surface. The first side of the inclined surface is the side where the inclined surface and the through hole are connected, and the second side of the inclined surface is the side of the inclined surface closer to the second air duct structure.

[0020] Optionally, the inclined surface extends into the second air intake cavity.

[0021] Optionally, the size of the second air-guiding cavity in the first direction decreases sequentially from the first port of the second air-guiding structure to the extension direction of the first port of the second air-guiding structure. The first port and the second port are two opposite ports of the second air-guiding structure in the second direction. The first port is close to the inclined surface, and the second port is away from the inclined surface.

[0022] Optionally, the computing server further includes an optical module, which is positioned close to the network card, and the second air-draft structure simultaneously covers the optical module and at least part of the network card.

[0023] Optionally, a heat exchange component is provided on one side of the air guide cavity formed between the first air guide plate and the second air guide plate, and the heat exchange component is disposed in close contact with the first air guide plate.

[0024] Optionally, the heat exchange assembly includes a potting compound heat exchange assembly;

[0025] The potting heat exchange assembly includes thermally conductive adhesive and a thermally conductive shell. The thermally conductive adhesive is attached to the first air guide plate, and the thermally conductive shell covers the thermally conductive adhesive.

[0026] Optionally, the heat exchange assembly includes an air-cooled heat exchange assembly;

[0027] The air-cooled heat exchange assembly includes a heat exchange fan and a heat exchange housing. The heat exchange fan is disposed inside the heat exchange housing, and the inner cavity of the heat exchange housing is connected to the air guide cavity formed between the first air guide plate and the second air guide plate.

[0028] Optionally, the heat exchange shell is connected to the outer wall of the air guide cavity and the first air guide plate. The heat exchange shell is provided with a first air guide hole on the outer wall of the air guide cavity, and the second air guide plate is provided with a second air guide hole. The first air guide hole and the second air guide hole are connected, and the fan blade of the heat exchange fan faces the first air guide hole.

[0029] Optionally, the size of the first air-guiding cavity in the first direction decreases sequentially from the first opening of the first air-guiding structure to the second opening of the first air-guiding structure. The first opening and the second opening are two opposite ports of the first air-guiding structure in the second direction. The first opening is close to the first air guide groove, and the second opening is far away from the air guide groove. The second direction is the direction of airflow in the first air guide groove.

[0030] In this embodiment, due to the memory and the first air guide structure located on top of the memory, the first air guide structure includes a first air guide groove and a plurality of second air guide grooves arranged along a first direction, wherein the orthographic projections of the first air guide grooves on the plane where the memory is located overlap, and the first direction is the direction that intersects with the flow direction of the airflow in the first air guide groove. Therefore, the low-temperature air opposite to the top of the memory can be introduced through the first air guide groove and the second air guide groove, and the internal heat at the bottom of the first air guide structure can be isolated. Furthermore, due to the network card and the second air guide structure, the first end of the second air guide structure is connected to the first air guide structure, and the second end of the second air guide structure is installed on the periphery of the network card. The second air guide structure includes at least one air guide channel with both ends open. One end of the air guide channel is connected to the first air guide groove and at least part of the second air guide groove, and the other end of the air guide channel is connected to the periphery area of ​​the network card. Therefore, the relatively low-temperature air in the first air guide groove and the second air guide groove on the top of the memory can be introduced to the network card through the second air guide groove to achieve the heat dissipation effect of the network card, reduce the heat dissipation difficulty of the network card, avoid local overheating of the network card, and thus reduce the risk of damage to the network card. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the structure of a computing server provided in an embodiment of this application;

[0033] Figure 2 This is a second schematic diagram of the structure of a computing server provided in an embodiment of this application;

[0034] Figure 3 This is one of the structural schematic diagrams of a computing server including a second air guide structure provided in an embodiment of this application;

[0035] Figure 4 This is a second schematic diagram illustrating the structure of a computing server including a second air guide shroud provided in an embodiment of this application.

[0036] Figure 5 This is the third structural schematic diagram of a computing server including a second air guide structure according to an embodiment of this application;

[0037] Figure 6 This is the fourth structural schematic diagram of a computing server including a second air guide structure provided in an embodiment of this application;

[0038] Figure 7 This is a schematic diagram showing the structure of a computing server including a first air guide structure provided in an embodiment of this application.

[0039] Figure label:

[0040] 1: Memory; 2: First air guide shroud structure; 21: First air guide slot; 22: Second air guide slot; 3: Network card; 4: Second air guide shroud structure; 41: First air intake structure; 42: Second air intake structure; 43: Air guide structure; 431: First air guide plate; 432: Second air guide plate; 433: Air guide block; 4331: Inclined surface; 44: Flared air intake structure; 441: First baffle; 442: Second baffle; 5: Heat exchange component. Detailed Implementation

[0041] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0042] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0043] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0044] like Figures 1 to 7 As shown in the figure, this application embodiment provides a computing server, which includes:

[0045] The memory 1 and the first air guide structure 2 located on top of the memory 1. The first air guide structure 2 includes a first air guide groove 21 and a plurality of second air guide grooves 22 arranged along the first direction X. The orthographic projections of the first air guide groove 21 on the plane where the memory 1 is located overlap. The first direction X is the direction that intersects with the flow direction of the airflow in the first air guide groove 21.

[0046] The network card 3 and the second air guide structure 4 are provided. The first end of the second air guide structure 4 is connected to the first air guide structure 2. The second end of the second air guide structure 4 is installed on the periphery of the network card 3. The second air guide structure 4 includes at least one air guide channel with both ends open. One end of the air guide channel is connected to the first air guide groove 21 and at least part of the second air guide groove 22. The other end of the air guide channel is connected to the periphery of the network card 3.

[0047] As can be seen from the above embodiments, in this application embodiment, due to the memory 1 and the first air guide structure 2 located on top of the memory 1, the first air guide structure 2 includes a first air guide groove 21 and a plurality of second air guide grooves 22 arranged along the first direction X, wherein the orthographic projections of the first air guide groove 21 on the plane where the memory 1 is located overlap, and the first direction X is the direction intersecting with the flow direction of the airflow in the first air guide groove 21, so the low-temperature air opposite to the top of the memory 1 can be introduced through the first air guide groove 21 and the second air guide groove 22, and the internal heat at the bottom of the first air guide structure 2 can be isolated. Furthermore, due to the network card 3 and the second air guide structure 4, the first end of the second air guide structure 4 is connected to the first air guide structure 2, and the second end of the second air guide structure 4 is installed on the periphery of the network card 3. The second air guide structure 4 includes at least one air guide channel with both ends open. One end of the air guide channel is connected to the first air guide groove 21 and at least part of the second air guide groove 22, and the other end of the air guide channel is connected to the periphery of the network card 3. Therefore, the relatively low-temperature air in the first air guide groove 21 and the second air guide groove 22 on the top of the memory 1 can be introduced to the network card 3 through the second air guide groove 22 to achieve the heat dissipation effect of the network card 3, reduce the heat dissipation difficulty of the network card 3, avoid local overheating of the network card 3, and thus reduce the risk of damage to the network card 3.

[0048] It should be noted that in the above embodiments, since the heat-generating components inside the computing server (such as memory 1 and motherboard) are usually located at the bottom of the computing server, the temperature at the bottom of the computing server is usually higher than the temperature at the top. Based on this, in this embodiment, a first air guide structure 2 is provided on the top of memory 1 to introduce low-temperature air from the top of the computing server through the first air guide structure 2. The first air guide structure 2 includes a first air guide slot 21 and a plurality of second air guide slots 22 arranged along the first direction X. The first air guide slot 21 is positioned relative to memory 1 in the third direction Z, that is, the first air guide slot 21 is located on top of memory 1. The number of second air guide slots 22 is determined according to the distribution of heat-generating components inside the computing server, and can be two, three, or other numbers. This embodiment does not limit this. The first air guide may include a base plate and a plurality of side plates. The plurality of side plates are disposed on the base plate, and each pair of adjacent side plates is spaced apart along the first direction X. Each pair of adjacent side plates is separated by a first air guide slot 21 and a second air guide slot 22.

[0049] The Open Compute Project (OPC) network interface card (NIC) is primarily used to improve the network transmission performance and data processing capabilities of computing servers. NIC 3 is located on the Y-side of memory 1, meaning it is located at the rear of memory 1. A second air guide structure 4 connects the first air guide structure 2 and the periphery of NIC 3. The second air guide structure 4 can be a monolithic shell structure or a shell structure comprising multiple cavities, ensuring that the second air guide structure 43 includes at least one air guide channel with open ends, thereby introducing low-temperature air from the top of the internal structure into the periphery of NIC 3 through the air guide channel.

[0050] It should be noted that, in the embodiments of this application, as Figure 1 and Figure 2 As shown, in this embodiment, the X-axis and Z-axis intersect, the X-axis and Y-axis intersect, and the Y-axis and Z-axis intersect. For ease of explanation, the first direction is defined as the X-axis direction (which is the direction in which the airflow directions in the first air guide trough 21 intersect), the second direction is defined as the Y-axis direction (which is the direction in which the airflow directions in the first air guide trough 21 intersect), and the third direction is defined as the Z-axis direction (which is the direction in which the plane containing memory 1 intersects). Further explanation: the definition of vertical in the specification should be understood as vertical if it fluctuates by 10% within 90 degrees. That is, the angle between the defined first and second directions should be understood as vertical if it is between 80 and 90 degrees, the angle between the defined first and third directions should be understood as vertical if it is between 80 and 90 degrees, and the angle between the defined second and third directions should be understood as vertical if it is between 80 and 90 degrees.

[0051] In some embodiments, the first end of the second air guide hood structure 4 is provided with a flared air guide structure 44; the flared air guide structure 44 includes a baffle plate, which extends in the second direction Y into the second air guide groove 22 adjacent to the first air guide groove 21, wherein the second direction Y is the same as the flow direction of the airflow in the second air guide groove 22.

[0052] In this embodiment, since the first end of the second air guide structure 4 is provided with a flared air guide structure 44, the flared air guide structure 44 includes a baffle plate that extends in the second direction Y into the second air guide groove 22 adjacent to the first air guide groove 21. Therefore, the conduction area of ​​the first end of the second air guide structure 4 can be increased by the flared air guide structure 44, thereby guiding more air into the second air guide structure 4 and further increasing the heat dissipation efficiency of the network card 3.

[0053] Regarding the specific form of the flared air intake structure 44, in some embodiments, the baffle plate includes a first baffle 441 and a second baffle 442; the second baffle 442 is connected between the first baffle 441 and the first end of the second air guide hood structure 4, the first baffle 441 and the second baffle 442 are bent together, the first baffle 441 extends along the second direction Y, the distance between the second baffle 442 and the first air guide groove 21 decreases sequentially from the first end of the second baffle 442 to the second end of the second baffle 442, the first end of the second baffle 442 is connected to the first baffle 441, and the second end of the second baffle 442 is connected to the first end of the second air guide hood structure 4.

[0054] In this embodiment, the first baffle 441 extends along the second direction Y, that is, the first baffle 441 is arranged parallel to the partition between the first air guide groove 21 and the second air guide groove 22. The distance between the second baffle 442 and the first air guide groove 21 decreases sequentially from the first end of the second baffle 442 to the second end of the second baffle 442, that is, the second baffle 442 is inclined. In this way, due to the bending arrangement between the first baffle 441 and the second baffle 442, the first baffle 441 extends along the second direction Y, and the distance between the second baffle 442 and the first air guide groove 21 decreases sequentially from the first end of the second baffle 442 to the second end of the second baffle 442, thus making the flared air intake structure 44 form a funnel shape, thereby giving the flared air intake structure 44 the function of gathering air, which facilitates guiding air from the flared air intake structure 44 to the second air guide hood structure 4.

[0055] Furthermore, in some embodiments, the distance between the first baffle 441 and the partition between the first air guide slot 21 and the second air guide slot 22 is greater than a first value. The first value is greater than or equal to one-half of the size of the second air guide slot 22 in the first direction X, and less than or equal to three-quarters of the size of the second air guide slot 22 in the first direction X.

[0056] In this embodiment, since the distance between the partition between the first baffle 441 and the first air guide slot 21 and the second air guide slot 22 is greater than a first value, and the first value is greater than or equal to half of the size of the second air guide slot 22 in the first direction X, and less than or equal to three-quarters of the size of the second air guide slot 22 in the first direction X, it can avoid the airflow being insufficient due to the flared air intake structure 44 being too small, and it can also avoid the air intake structure 44 being too large, which would introduce the high-temperature air in the middle of the server and affect the heat dissipation efficiency of the network card 3.

[0057] Regarding the specific form of the second air guide hood structure 4, in some embodiments, the second air guide hood structure 4 includes a first air guide structure 41 and a second air guide structure 42; the first air guide structure 41 includes a first air guide cavity, the second air guide structure 42 includes a second air guide cavity, the first air guide cavity and the second air guide cavity are connected, and the first air guide groove 21 and at least part of the second air guide groove 22 are connected to the first air guide cavity.

[0058] In this embodiment, both the first air-guiding structure 41 and the second air-guiding structure 42 are shell structures with open ends. Since the first air-guiding structure 41 includes a first air-guiding cavity and the second air-guiding structure 42 includes a second air-guiding cavity, and the first and second air-guiding cavities are connected, and the first air guide groove 21 and at least a portion of the second air guide groove 22 are connected to the first air-guiding cavity, low-temperature air from the top of the memory 1 can be introduced through the first air-guiding cavity and then introduced to the periphery of the network card 3 through the second air-guiding cavity. Thus, by sequentially introducing low-temperature air to the periphery of the network card 3 through the first and second air-guiding cavities, not only can the path of low-temperature air introduction be changed, but also sufficient heat dissipation of the network card 3 can be achieved. It should be noted that the first air-guiding structure 41 and the second air-guiding structure 42 can be directly connected or connected through other cavities.

[0059] Furthermore, in some embodiments, the first air-guiding structure 41 and the second air-guiding structure 42 are connected by an air-guiding structure 43; the air-guiding structure 43 includes an air-guiding cavity, the two ends of which are open structures in the second direction Y, the first air-guiding structure 41 has a connecting hole at the bottom in the third direction Z, the connecting hole is connected to one end of the air-guiding cavity, and the other end of the air-guiding cavity is connected to the second air-guiding structure 42, wherein the second direction Y and the third direction Z intersect, the second direction Y is the direction of airflow in the first air-guiding groove 21, and the third direction Z intersects with the plane where the memory 1 is located.

[0060] In this embodiment, since the air guide structure 43 includes an air guide cavity with open ends in the second direction Y, and the first air guide structure 41 has a connecting hole at the bottom in the third direction Z, the connecting hole is connected to one end of the air guide cavity, and the other end of the air guide cavity is connected to the second air guide structure 42, the first air guide structure 41 and the second air guide structure 42 are connected through the air guide structure 43, which facilitates the introduction of low-temperature air in the first air guide structure 41 into the second air guide structure 42 through the air guide structure 43, and the air guide structure 43 can ensure that the low-temperature air will not diffuse during the flow process. At the same time, the air guide structure 43 avoids the existence of local turbulence and increases the flow resistance.

[0061] It should be noted that if the air guide structure 43 is located in front of the memory 1 in the second direction Y, that is, if the air guide structure 43 blocks the air flow channel of the memory 1 on the second direction Y side, the air on one side of the memory 1 will accumulate, causing the pressure to rise. This will result in greater air flow resistance in the area where the memory 1 is located, thus affecting the heat dissipation effect of the memory 1.

[0062] Based on this, regarding the specific type of the air guiding structure 43, in some embodiments, the air guiding structure 43 includes a first air guiding plate 431, a second air guiding plate 432, and an air guiding block 433; the first air guiding plate 431 and the second air guiding plate 432 are arranged opposite to each other in the first direction X, and the first air guiding plate 431 and the second air guiding plate 432 are disposed on the end of the air guiding block 433 near the first air guiding groove 21, and an air guiding cavity is formed between the first air guiding plate 431 and the second air guiding plate 432; the orthographic projection of the air guiding structure 43 on the first plane and the orthographic projection of the memory 1 on the first plane do not overlap, and the through hole is formed between the orthographic projection in the second direction and the first air guiding plate 431 and the second air guiding plate 432. The air guide cavity is superimposed on the orthographic projection of the second plane, wherein the first plane is the plane formed by the first direction X and the third direction Z, and the second plane is the plane formed by the first direction X and the second direction Y; the end of the air guide block 433 facing the air guide cavity formed between the first air guide plate 431 and the second air guide plate 432 is an inclined surface 4331, and the distance between the inclined surface 4331 and the first air guide groove 21 increases sequentially from the first side of the inclined surface 4331 to the second side of the inclined surface 4331. The first side of the inclined surface 4331 is the side of the inclined surface 4331 connected to the through hole, and the second side of the inclined surface 4331 is the side of the inclined surface 4331 close to the second air intake structure 42.

[0063] In this embodiment, the orthographic projection of the air guide structure 43 on the first plane can be understood as the projection of the air guide structure 43 along the second direction Y onto the plane formed by the first direction X and the third direction Z. The orthographic projection of memory 1 on the first plane can be understood as the projection of memory 1 along the second direction Y onto the plane formed by the first direction X and the third direction Z. Thus, since the orthographic projections of the air guide structure 43 and memory 1 on the first plane do not overlap, the air guide structure 43 will not block the airflow channel of memory 1 in the second direction Y. Even if there is an airflow channel between the air guide structure 43 and memory 1, it can not only prevent air from accumulating on one side of memory 1, avoid pressure rise, reduce airflow resistance in the area where memory 1 is located, and ensure the heat dissipation effect of memory 1, but also completely isolate the air dissipating heat from memory 1 and network card 3 through the air guide structure 43, thereby ensuring that the air dissipating heat from memory 1 can flow away smoothly. In summary, this embodiment not only ensures the normal heat dissipation of memory 1, but also the normal heat dissipation of network card 3, and ensures that the air for heat dissipation of network card 3 and the air for heat dissipation of memory 1 do not interfere with each other.

[0064] Furthermore, in this embodiment, since the end of the air guide block 433 facing the air guide cavity formed between the first air guide plate 431 and the second air guide plate 432 is an inclined surface 4331, and the distance between the inclined surface 4331 and the first air guide groove 21 increases sequentially from the first side of the inclined surface 4331 to the second side of the inclined surface 4331, the first side of the inclined surface 4331 is the side connected to the through hole, and the second side of the inclined surface 4331 is the side of the inclined surface 4331 close to the second air intake structure 42, the air guide cavity formed by the air guide structure 43 can form a cavity structure with a large top and a small bottom. The low temperature air in the first air intake structure 41 can be smoothly introduced into the second air intake structure 42 through the air guide cavity, avoiding local turbulence and increasing flow resistance.

[0065] In the above embodiment, the second air intake structure 42 further includes a second air intake cavity, and the inclined surface 4331 extends into the second air intake cavity.

[0066] In this embodiment, since the second air intake structure 42 includes a second air intake cavity, the inclined surface 4331 extends into the second air intake cavity.

[0067] In this embodiment, since the second air intake structure 42 includes a second air intake cavity and the inclined surface 4331 extends into the second air intake cavity, low-temperature air can be smoothly introduced into the second air intake cavity under the guidance of the inclined surface 4331.

[0068] In some embodiments, the size of the second air-guiding cavity in the first direction X decreases sequentially from the first port of the second air-guiding structure 42 to the extension direction of the first port of the second air-guiding structure 42. The first port and the second port are two opposite ports of the second air-guiding structure 42 in the second direction Y. The first port is close to the inclined surface 4331, and the second port is far away from the inclined surface 4331.

[0069] In this embodiment, since the size of the second air intake cavity in the first direction X decreases sequentially from the first port of the second air intake structure 42 to the extension direction of the first port of the second air intake structure 42, and the first port and the second port are two opposite ports of the second air intake structure 42 in the second direction Y, with the first port close to the inclined surface 4331 and the second port far away from the inclined surface 4331, the second air intake cavity can be formed into a funnel shape. This facilitates the introduction of low-temperature air while increasing the resistance of the low-temperature air during flow, thereby reducing the speed at which the air flows out of the second air intake cavity, so that the network card 3 can be fully cooled.

[0070] In some embodiments, the computing server further includes an optical module disposed close to the network card 3, and a second air-draft structure 42 simultaneously covers the optical module and at least part of the network card 3.

[0071] In this embodiment, since the second air-expelling structure 42 simultaneously covers the optical module and at least part of the network card 3, the optical module and the network card 3 can be cooled at the same time.

[0072] In some embodiments, a heat exchange component 5 is provided on one side of the air guide cavity formed between the first air guide plate 431 and the second air guide plate 432, and the heat exchange component 5 is disposed in close contact with the first air guide plate 431.

[0073] In this embodiment, since a heat exchange component 5 is provided on one side of the air guide cavity formed between the first air guide plate 431 and the second air guide plate 432, and the heat exchange component 5 is provided in close contact with the first air guide plate 431, the air flow rate on one side of the air guide cavity can be increased by the heat exchange component 5, thereby further accelerating the heat dissipation efficiency of the network card 3.

[0074] It should be noted that the heat exchange component 5 can be one or more of a contact heat exchange component 5 or a convection heat exchange component 5, and the embodiments of this application do not limit this.

[0075] Regarding the type of heat exchange component 5, in one possible implementation, the heat exchange component 5 includes a potting heat exchange component 5; the potting heat exchange component 5 includes thermally conductive adhesive and a thermally conductive shell, the thermally conductive adhesive is attached to the first air guide plate 431, and the thermally conductive shell covers the thermally conductive adhesive.

[0076] In this embodiment, since the thermally conductive adhesive is attached to the first air guide plate 431 and the thermally conductive shell is covered with the thermally conductive adhesive, the heat in the air guide cavity formed between the first air guide plate 431 and the second air guide plate 432 can be introduced into the thermally conductive shell through the thermally conductive adhesive, thereby increasing the heat dissipation path and further accelerating the heat exchange efficiency of the network card 3.

[0077] In another possible implementation of the heat exchange component 5, the heat exchange component 5 includes an air-cooled heat exchange component 5; the air-cooled heat exchange component 5 includes a heat exchange fan and a heat exchange housing, the heat exchange fan is disposed inside the heat exchange housing, and the inner cavity of the heat exchange housing is connected to the air guide cavity formed between the first air guide plate 431 and the second air guide plate 432.

[0078] In this embodiment, since the air-cooled heat exchange component 5 includes a heat exchange fan and a heat exchange housing, and the heat exchange fan is located inside the heat exchange housing, and the inner cavity of the heat exchange housing is connected to the air guide cavity formed between the first air guide plate 431 and the second air guide plate 432, the air flow rate at the network card 3 can be increased by the heat exchange fan, thereby further accelerating the heat dissipation speed of the network card 3.

[0079] Furthermore, the outer wall of the heat exchange shell facing the air guide cavity is connected to the first air guide plate 431. The outer wall of the heat exchange shell facing the air guide cavity is provided with a first air guide hole, and the second air guide plate 432 is provided with a second air guide hole. The first air guide hole and the second air guide hole are connected, and the fan blade of the heat exchange fan faces the first air guide hole.

[0080] In this embodiment, since the outer wall of the heat exchange shell facing the air guide cavity is connected to the first air guide plate 431, and a first air guide hole is formed on the outer wall of the heat exchange shell facing the air guide cavity, and a second air guide hole is formed on the second air guide plate 432, the first air guide hole and the second air guide hole are connected. The fan blade of the heat exchange fan faces the first air guide hole, thus ensuring that the airflow of the fan can flow smoothly into the air guide cavity formed between the first air guide plate 431 and the second air guide plate 432, ensuring the heat exchange efficiency of the heat exchange fan. Furthermore, it should be noted that in this embodiment, the temperature around the network card can be monitored in real time by the motherboard. If the temperature around the network card rises, the speed of the heat exchange fan is increased; conversely, the speed of the heat exchange fan is decreased, thereby achieving energy saving and consumption reduction.

[0081] In some embodiments, the size of the first air-guiding cavity in the first direction X decreases sequentially from the first opening of the first air-guiding structure 41 to the second opening of the first air-guiding structure 41 in the extension direction. The first opening and the second opening are two opposite ports of the first air-guiding structure 41 in the second direction Y. The first opening is close to the first air guide groove 21, and the second opening is far away from the air guide groove. The second direction Y is the direction of airflow in the first air guide groove 21.

[0082] In this embodiment, since the size of the first air intake cavity in the first direction X decreases sequentially from the first opening of the first air intake structure 41 to the second opening of the first air intake structure 41 in the extension direction, and the first opening and the second opening are two opposite ports of the first air intake structure 41 in the second direction Y, with the first opening close to the first air guide groove 21 and the second opening far away from the air guide groove, the first air intake cavity can be formed into a funnel shape. This facilitates the introduction of low-temperature air while increasing the resistance of the low-temperature air during flow, thereby allowing the network card 3 to be fully cooled.

[0083] As can be seen from the above embodiments, in this application embodiment, due to the memory 1 and the first air guide structure 2 located on top of the memory 1, the first air guide structure 2 includes a first air guide groove 21 and a plurality of second air guide grooves 22 arranged along the first direction X, wherein the orthographic projections of the first air guide groove 21 on the plane where the memory 1 is located overlap, and the first direction X is the direction intersecting with the flow direction of the airflow in the first air guide groove 21, so the low-temperature air opposite to the top of the memory 1 can be introduced through the first air guide groove 21 and the second air guide groove 22, and the internal heat at the bottom of the first air guide structure 2 can be isolated. Furthermore, due to the network card 3 and the second air guide structure 4, the first end of the second air guide structure 4 is connected to the first air guide structure 2, and the second end of the second air guide structure 4 is installed on the periphery of the network card 3. The second air guide structure 4 includes at least one air guide channel with both ends open. One end of the air guide channel is connected to the first air guide groove 21 and at least part of the second air guide groove 22, and the other end of the air guide channel is connected to the periphery of the network card 3. Therefore, the relatively low-temperature air in the first air guide groove 21 and the second air guide groove 22 on the top of the memory 1 can be introduced to the network card 3 through the second air guide groove 22 to achieve the heat dissipation effect of the network card 3, reduce the heat dissipation difficulty of the network card 3, avoid local overheating of the network card 3, and thus reduce the risk of damage to the network card 3.

[0084] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0085] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A computing server, characterized in that, The computing server includes: The memory and a first air guide structure located on top of the memory, the first air guide structure including a first air guide groove and a plurality of second air guide grooves arranged along a first direction, wherein the orthographic projection of the first air guide groove on the plane where the memory is located overlaps with the memory, and the first direction is the direction that intersects with the flow direction of the airflow in the first air guide groove; The network card and the second air guide structure are provided. The first end of the second air guide structure is connected to the first air guide structure, and the second end of the second air guide structure is installed on the periphery of the network card. The second air guide structure includes at least one air guide channel with both ends open. One end of the air guide channel is connected to the first air guide groove and at least part of the second air guide groove, and the other end of the air guide channel is connected to the periphery area of ​​the network card. The first end of the second air guide hood structure is provided with a flared air intake structure; The flared air intake structure includes a baffle plate, which extends in a second direction into the second air guide groove adjacent to the first air guide groove, wherein the second direction is the same as the flow direction of the airflow in the second air guide groove; The wind deflector includes a first baffle and a second baffle; The second baffle is connected between the first baffle and the first end of the second air guide hood structure. The first baffle and the second baffle are bent together. The first baffle extends along the second direction. The distance between the second baffle and the first air guide groove decreases sequentially from the first end of the second baffle to the second end of the second baffle. The first end of the second baffle is connected to the first baffle. The second end of the second baffle is connected to the first end of the second air guide hood structure. A partition is provided between the first air guide slot and the adjacent second air guide slot. The distance between the first baffle and the partition is greater than a first value. The first value is greater than or equal to one-half of the size of the second air guide slot in the first direction and less than or equal to three-quarters of the size of the second air guide slot in the first direction. The distance between the first baffle and the partition between the first air guide slot and the second air guide slot is set to avoid the airflow being insufficient due to the flared air intake structure being too small, and to avoid the high-temperature air in the middle of the server being introduced due to the flared air intake structure being too large.

2. The computing server according to claim 1, characterized in that, The second air guide shroud structure includes a first air intake structure and a second air intake structure; The first air-guiding structure includes a first air-guiding cavity, the second air-guiding structure includes a second air-guiding cavity, the first air-guiding cavity and the second air-guiding cavity are connected, and the first air guide groove and at least a portion of the second air guide groove are connected to the first air-guiding cavity.

3. The computing server according to claim 2, characterized in that, The first air-expelling structure and the second air-expelling structure are connected by an air-guiding structure; The air guiding structure includes an air guiding cavity, which has open ends in the second direction. The first air guiding structure has a through hole at the bottom in the third direction, which is connected to one end of the air guiding cavity and the other end of the air guiding cavity is connected to the second air guiding structure. The second direction intersects with the third direction, which is the direction of airflow in the first air guiding groove. The third direction intersects with the plane where the memory is located.

4. The computing server according to claim 3, characterized in that, The air guiding structure includes a first air guiding plate, a second air guiding plate, and an air guiding block; The first air guide plate and the second air guide plate are arranged opposite to each other in the first direction. The first air guide plate and the second air guide plate are disposed on the end of the air guide block near the first air guide groove, and the air guide cavity is formed between the first air guide plate and the second air guide plate. The orthographic projection of the air guiding structure on the first plane and the orthographic projection of the internal cavity on the first plane do not overlap. The orthographic projection of the through hole on the second plane and the orthographic projection of the air guiding cavity formed between the first air guiding plate and the second air guiding plate on the second plane overlap. The first plane is the plane formed by the first direction and the third direction, and the second plane is the plane formed by the first direction and the second direction. The end of the air guide block facing the air guide cavity formed between the first air guide plate and the second air guide plate is an inclined surface. The distance between the inclined surface and the first air guide groove increases sequentially from the first side of the inclined surface to the second side of the inclined surface. The first side of the inclined surface is the side where the inclined surface and the through hole are connected, and the second side of the inclined surface is the side of the inclined surface closer to the second air duct structure.

5. The computing server according to claim 4, characterized in that, The inclined surface extends into the second air intake chamber.

6. The computing server according to claim 5, characterized in that, The size of the second air-guiding cavity in the first direction decreases sequentially from the first port of the second air-guiding structure to the second port of the second air-guiding structure. The first port and the second port are two opposite ports of the second air-guiding structure in the second direction. The first port is close to the inclined surface, and the second port is away from the inclined surface.

7. The computing server according to claim 3, characterized in that, The computing server also includes an optical module, which is positioned close to the network card, and the second air-draft structure simultaneously covers the optical module and at least part of the network card.

8. The computing server according to claim 4, characterized in that, A heat exchange component is provided on one side of the air guide cavity formed between the first air guide plate and the second air guide plate, and the heat exchange component is disposed in close contact with the first air guide plate.

9. The computing server according to claim 8, characterized in that, The heat exchange assembly includes a potting-type heat exchange assembly; The potting heat exchange assembly includes thermally conductive adhesive and a thermally conductive shell. The thermally conductive adhesive is attached to the first air guide plate, and the thermally conductive shell covers the thermally conductive adhesive.

10. The computing server according to claim 8, characterized in that, The heat exchange assembly includes an air-cooled heat exchange assembly; The air-cooled heat exchange assembly includes a heat exchange fan and a heat exchange housing. The heat exchange fan is disposed inside the heat exchange housing, and the inner cavity of the heat exchange housing is connected to the air guide cavity formed between the first air guide plate and the second air guide plate.

11. The computing server according to claim 10, characterized in that, The heat exchange shell is connected to the outer wall of the air guide cavity and the first air guide plate. The heat exchange shell is provided with a first air guide hole on the outer wall of the air guide cavity, and the second air guide plate is provided with a second air guide hole. The first air guide hole and the second air guide hole are connected. The fan blade of the heat exchange fan faces the first air guide hole.

12. The computing server according to claim 2, characterized in that, The size of the first air-guiding cavity in the first direction decreases sequentially from the first opening of the first air-guiding structure to the second opening of the first air-guiding structure. The first opening and the second opening are two opposite ports of the first air-guiding structure in the second direction. The first opening is close to the first air guide groove, and the second opening is far away from the first air guide groove. The second direction is the direction of airflow in the first air guide groove.

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