Nozzle design for laser water jet micromachining

Abstract

A water jet nozzle assembly for a water jet guided laser processing system includes: a housing; the nozzle is arranged in the shell; a nozzle nut is configured to maintain the nozzle within the housing. The nozzle is configured to receive laser light and a water flow, and inject the laser light and the water flow through channels defined within the nozzle and the nozzle nut, and out of an outlet of the water jet nozzle assembly. A gas passage in fluid communication with the passage is defined within the water jet nozzle assembly. A plate disposed between the nozzle and the nozzle nut and configured to divide the channel into a first portion located within the nozzle and a second portion located within the nozzle nut; allowing gas to flow from the gas channel through the plate into the nozzle; and preventing airflow from the second portion of the passage within the nozzle nut into the first portion of the passage within the nozzle.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Application No. 63 / 344,848, filed May 23, 2022. The entire disclosure of the above application is incorporated herein by reference. Technical Field

[0002] The present disclosure relates to a water jet guided laser processing system, and more particularly to a laser water jet nozzle used in the water jet guided laser processing system. Background Art

[0003] The background description provided here is for the purpose of generally presenting the background of the present disclosure. The work of the currently designated inventors within the scope described in this background section and aspects of the specification that were not determined to be prior art at the time of filing the application are neither explicitly nor implicitly admitted to be prior art against the present disclosure.

[0004] Liquid (eg, water jet) directed laser machining systems include a water jet nozzle configured to direct a jet or stream of water at a surface of a workpiece. Summary of the invention

[0005] A water jet nozzle assembly for a water jet guided laser processing system comprises: a housing; a nozzle disposed in the housing; and a nozzle nut configured to maintain the nozzle in the housing, wherein the nozzle is configured to receive a laser and a water stream, and inject the laser and the water stream through a channel defined in the nozzle and the nozzle nut, and exit an outlet of the water jet nozzle assembly. A gas channel is defined in the water jet nozzle assembly, and the gas channel is in fluid communication with the channel. A plate is disposed between the nozzle and the nozzle nut, and the plate is configured to separate the channel into a first portion located in the nozzle and a second portion located in the nozzle nut, allowing gas to flow from the gas channel through the plate and into the nozzle, and preventing gas flow from the second portion of the channel in the nozzle nut into the first portion of the channel in the nozzle.

[0006] In other features, the plate includes a central opening that is aligned with the laser and the water stream, and at least one outer opening that is located radially outward from the central opening. The at least one outer opening is located directly above the gas passage. The upper surface of the plate defines an air chamber between the upper surface and the lower surface of the nozzle, and wherein the plate is configured to allow gas to flow from the gas passage through the at least one opening into the air chamber, and from the air chamber into the first portion of the passage in the nozzle. The plate includes an annular edge extending upward from an outer periphery of the upper surface, and the air chamber is defined between the annular edge, the upper surface of the plate, and the lower surface of the nozzle.

[0007] In other features, the plate includes at least one time-marked tab extending downwardly from an outer periphery of a lower surface of the plate, and the at least one time-marked tab is configured to align the at least one opening with the gas passage. The lower end of the nozzle includes a recessed portion configured to retain the plate. The upper end of the nozzle nut includes a recessed portion configured to retain the plate. The plate is made of at least one of brass and copper. The water jet nozzle assembly also includes a diaphragm disposed below the nozzle nut and over the outlet of the water jet nozzle assembly. The diaphragm includes a central hole aligned with the laser and the water stream. The diaphragm includes at least one side opening radially outward of the central hole. The at least one side opening is configured to allow water to flow out of the water jet nozzle assembly and through the outlet.

[0008] Further scope of applicability of the present disclosure will become apparent from the detailed description, claims and drawings.The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The present disclosure will be more fully understood from the detailed description and accompanying drawings, in which:

[0010] Figure 1A It is a water jet nozzle assembly used in water jet guided laser processing system;

[0011] Figure 1B yes Figure 1A A plan view of an exemplary diaphragm of a water jet nozzle assembly;

[0012] Figure 2A is an exemplary water jet nozzle assembly including a plate disposed below the nozzle; and

[0013] Figure 2B and Figure 2C They are Figure 2A Top and bottom views of the board.

[0014] Among the drawings, reference numerals may be repeated to identify similar and / or identical elements. DETAILED DESCRIPTION

[0015] The water jet nozzle is configured to inject a laser into a stream of water to cut and / or remove material from a surface of a workpiece (e.g., a component of a substrate processing system). The water guides the laser, removes debris, and cools the surface of the workpiece. For example, the water stream is directed through a central opening or hole at the bottom end of the nozzle assembly, and the laser is injected into the water stream through the central opening.

[0016] During operation, debris generated by the workpiece (e.g., dust consisting of removed material, such as silicon dust removed from silicon components of a substrate processing system) can enter the nozzle assembly and can be deposited on the nozzle and other surfaces within the nozzle assembly. Such debris can interfere with the operation of the nozzle and shorten the useful life of the nozzle.

[0017] A water jet nozzle assembly according to the present disclosure includes a plate disposed near a nozzle within the nozzle assembly. For example, the plate is disposed between the nozzle and a nozzle nut. The plate is configured to allow a shielding gas (e.g., helium) to flow above the plate inside the nozzle to prevent debris from entering the nozzle. Thus, any debris that enters the nozzle assembly is confined to a lower portion of the nozzle assembly below the nozzle and the plate.

[0018] Figure 1A An exemplary water jet nozzle assembly 100 according to the present disclosure is shown. The nozzle assembly 100 encloses a nozzle 104 within a housing 108. For example, the nozzle 104 is made of brass. In some examples, the nozzle assembly 100 includes a nozzle nut 112 that is configured to retain the nozzle 104 within the housing 108.

[0019] The laser focusing assembly 116 uses a window (e.g., a quartz window) 120 above the nozzle 104 to focus (as shown at 118) the laser. The laser light 122 is directed downward into a cavity or channel 124 defined within the nozzle 104 and the housing 108 (e.g., within the nozzle nut 112), and exits the nozzle assembly 100 through an outlet 126. A liquid (e.g., water) is injected into the nozzle assembly 100 via a water inlet 128 and into a water channel 132 defined within the housing 108 and surrounding the nozzle 104. The water forms a stream 134 that is injected into the nozzle 104 and downward through the channel 124. The stream 134 guides and maintains the alignment of the laser light 122. The flow of water within the nozzle assembly 100 is generally represented by the solid arrows.

[0020] In some examples, a gas (e.g., helium) is injected into the nozzle assembly 100 via the gas inlet 140 and enters a gas passage 142 defined within the housing 108 and the nozzle nut 112 and enters the passage 124 below the nozzle 104. The gas flows downward within the passage 124 to maintain a desired flow pattern (e.g., a laminar flow pattern) of the stream 134. The passage 124 defined within the nozzle nut 112 is configured to maintain and stabilize the flow pattern of the stream 134 and the gas. The flow of gas within the nozzle assembly 100 is generally indicated by dashed arrows.

[0021] Although the gas generally flows downward, the gas may flow upward from the outlet 126 back toward the nozzle 104. Water and / or debris (e.g., silicon dust) may re-enter the nozzle assembly 100 via the outlet 126. For example, splashback from the workpiece may be ejected upward. The upward gas flow within the channel 124 may carry water and debris into the nozzle 104. The debris may be deposited on and / or damage the surface of the nozzle 104, the surface of the optical head (e.g., a sapphire or diamond optical head) 144 disposed in the opening between the laser focusing assembly 116 and the nozzle 104, the surface of the window 120, etc.

[0022] Therefore, in some examples, a plate or diaphragm (e.g., a brass diaphragm) 148 is disposed in the passage 124 and above the outlet 126 to prevent water and debris from re-entering the nozzle assembly 100. For example, a diaphragm nut 152 is provided to hold the diaphragm 148 in place against the nozzle nut 112. Figure 1B As shown in the plan view of FIG. 1 , the diaphragm 148 includes a central hole 154. The laser light 122 and the water stream 134 pass through the central hole 154. The diaphragm 148 includes one or more side openings 158. These side openings 158 allow excess water within the nozzle assembly 100 to drain out of the passage 124, through the diaphragm 148, and out of the outlet 126. However, the side openings 158 allow water and debris to re-enter the passage 124 via the outlet 126.

[0023] Now refer to Figure 2A , 2B2C, another example of the nozzle assembly 100 according to the present disclosure includes a plate (e.g., a plate made of brass, copper, etc.) 200, which is disposed below the nozzle 104 and adjacent to the nozzle 104. The plate 200 may be provided in place of the diaphragm 148, or provided together with the diaphragm 148. For example, the plate 200 is disposed within the channel 124 and between the nozzle 104 and the nozzle nut 112. The plate 200 divides and separates the channel 124 into an upper portion defined within the nozzle 104 and a lower portion defined within the nozzle nut 112 and the diaphragm nut 152. The plate 200 is configured to allow gas to flow above the plate 200 inside the nozzle 104 to prevent debris from entering the nozzle 104 and contacting surfaces of the nozzle 104, the window 120, the optical head 144, etc. Therefore, any debris that enters the nozzle assembly 100 via the outlet 126 and the diaphragm 148 is confined to the lower portion of the nozzle assembly 100 below the plate 200.

[0024] For example, the plate 200 includes a central opening 204 that allows the laser 122 and the stream 134 to pass through the plate 200 and exit the nozzle 104. The plate 200 further includes outer gas holes or openings 208. These openings 208 are positioned to allow the protective gas (i.e., helium injected into the gas channel 142) to flow upward from the gas channel 142 through the plate 200 and into the channel 124 within the nozzle 104. For example, the openings 208 are aligned with the corresponding outlets of the gas channel 142. The gas flows upward along the outer edge of the channel 124 and then flows downward along the stream 134 toward the central opening 204. In this way, the plate 200 prevents debris from entering the nozzle 104, while the gas flow pattern within the nozzle 104 prevents debris from entering the nozzle 104 through the central opening 204.

[0025] As shown, the opening 208 is located radially outward of the passage 124 in the nozzle nut 112. In other words, the opening 208 is located directly above and aligned with the gas passage 142, but is not directly above the passage 124 through the nozzle nut 112. Therefore, the opening 208 is located outside the gas flow pattern of the gas in the nozzle nut 112. Therefore, water and debris carried by the gas in the nozzle nut 112 will not be brought near the opening 208 and are prevented from entering the opening 208.

[0026] Figure 2B and Figure 2C The top view and bottom view of the board 200 are shown in more detail, respectively. Although shown as a single piece, in some examples, the board 200 can be composed of separate components. Figure 2BAs shown, the upper surface 212 of the plate 200 includes a recessed portion or plenum 216. For example, the plate 200 includes an annular edge 220 that extends upward from the outer periphery of the upper surface 212 to define the plenum 216. The plenum 216 is further defined between the upper surface 212 of the plate 200 and the lower surface of the nozzle 104. In this way, the gas flowing upward through the opening 208 enters the plenum 216 and fills it, and flows from the plenum 216 into the interior of the nozzle 104. Although shown as a generally circular hole, in other examples, the opening 208 can be implemented as a slot or other type of opening.

[0027] like Figure 2A As shown, the lower end of the nozzle 104 includes a recess or cutout 228 for receiving and retaining the plate 200. In other examples, the plate 200 may instead be disposed within the nozzle nut 112 (e.g., in a cutout defined in the upper end of the nozzle nut 112), partially within each of the nozzle 104 and the nozzle nut 112, etc.

[0028] like Figure 2C As shown, the lower surface 232 of the plate 200 includes one or more clocking tabs 236 extending downwardly from the outer periphery of the lower surface 232. The clocking tabs 236 help align the plate 200 and the openings 208 with the gas passages 142. For example, the clocking tabs 236 are configured to align the openings with corresponding outlets of the gas passages 142.

[0029] As described above, debris entering the nozzle assembly 100 is confined to the lower portion of the passage 124 within the nozzle nut 112 and is prevented from entering the upper portion of the passage 124 within the nozzle 104. Thus, the plate 200 protects the interior of the nozzle 104, the window 120, the optical head 144, etc. from accumulation and damage caused by water and debris re-entering the nozzle assembly through the outlet 126 and the diaphragm 148.

[0030] The foregoing description is merely illustrative in nature and is by no means intended to limit the present disclosure, its application or use. The broad teachings of the present disclosure can be implemented in various forms. Therefore, although the present disclosure includes specific examples, the true scope of the present disclosure should not be so limited, because when studying the drawings, the specification and the appended claims, other modifications will become apparent. It should be understood that, without changing the principles of the present disclosure, one or more steps in the method can be performed in different orders (or simultaneously). In addition, although each embodiment is described above as having certain features, any one or more of those features described relative to any embodiment of the present disclosure can be implemented in the features of any other embodiment and / or combined with the features of any other embodiment, even if the combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and the replacement of one or more embodiments with each other remains within the scope of the present disclosure.

[0031] Various terms are used to describe the spatial and functional relationships between elements (e.g., between modules, between circuit elements, between semiconductor layers, etc.), including "connected," "engaged," "coupled," "adjacent," "next to," "on top of," "above," "below," and "disposed." Unless the relationship between a first and a second element is explicitly described as "direct," when such a relationship is described in the above disclosure, the relationship can be a direct relationship, in which there are no other intervening elements between the first and second elements, but can also be an indirect relationship, in which there are one or more intervening elements (spatially or functionally) between the first and second elements. As used herein, the phrase "at least one of A, B, and C" should be interpreted to mean a logical (A or B or C), using a non-exclusive logical OR, and should not be interpreted to mean "at least one of A, at least one of B, and at least one of C."

[0032] In some implementations, the controller is part of a system, which can be part of the above examples. Such a system can include a semiconductor processing device, which includes one or more processing tools, one or more chambers, one or more platforms for processing, and / or specific processing components (wafer pedestals, gas flow systems, etc.). These systems can be integrated with electronic devices for controlling their operation before, during, and after the processing of semiconductor wafers or substrates. The electronic device can be referred to as a "controller", which can control various components or subcomponents of one or more systems. Depending on the processing requirements and / or system type, the controller can be programmed to control any of the processes disclosed herein, including the delivery of process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, wafer transfer in and out of tools connected or docked with specific systems and other transfer tools and / or load locks.

[0033] In general, a controller can be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operations, enable cleaning operations, enable endpoint measurements, etc. The integrated circuit can include a chip in the form of firmware that stores program instructions, a digital signal processor (DSP), a chip defined as an application specific integrated circuit (ASIC), and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software). The program instructions can be instructions sent to the controller in the form of various individual settings (or program files) that define operating parameters for performing specific processing on or for a semiconductor wafer or system. In some embodiments, the operating parameters can be part of a recipe defined by a process engineer to complete one or more processing steps during the manufacture of one or more (kinds of) layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0034] In some implementations, the controller may be part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the "cloud" or may be all or part of a wafer fab host system that may allow remote access to wafer processing. The computer may enable remote access to the system to monitor the current progress of a manufacturing operation, check the history of past manufacturing operations, check trends or performance criteria for multiple manufacturing operations, to change the parameters of the current processing, set processing steps to follow the current processing, or start a new processing. In some examples, a remote computer (e.g., a server) may provide a processing recipe to the system via a network (which may include a local network or the Internet). The remote computer may include a user interface that enables input or programming of parameters and / or settings, which are then sent from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify parameters for each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of processing to be performed and the type of tool that the controller is configured to interface with or control. Thus, as described above, the controller may be distributed, for example, by including one or more discrete controllers networked together and working toward a common purpose (e.g., processing and control as described herein). An example of a distributed controller for such a purpose is one or more integrated circuits on a chamber that communicate with one or more integrated circuits remotely (e.g., at a platform level or as part of a remote computer), which combine to control processing on the chamber.

[0035] Exemplary systems may include, but are not limited to, plasma etching chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, chamfer edge etching chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etching (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and any other semiconductor processing system that may be associated with or used in the manufacture and / or preparation of semiconductor wafers.

[0036] As described above, depending on one or more processing steps to be performed by the tool, the controller can communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the factory, a host computer, another controller, or tools used in material transport to transport wafer containers to and from tool locations and / or load ports in a semiconductor manufacturing facility.

Claims

1. A water jet nozzle assembly for a water jet guided laser processing system, the water jet nozzle assembly comprising: shell; a nozzle disposed in the housing; a nozzle nut configured to maintain the nozzle within the housing, wherein the nozzle is configured to receive laser light and water flow and inject the laser light and water flow through passages defined within the nozzle and the nozzle nut and out of an outlet of the water jet nozzle assembly; a gas passage defined within the water jet nozzle assembly, the gas passage being in fluid communication with the passage; as well as a plate disposed between the nozzle and the nozzle nut, the plate being configured to (i) separate the passage into a first portion located within the nozzle and a second portion located within the nozzle nut, (ii) allow gas to flow from the gas passage through the plate and into the nozzle, and (iii) prevent gas flow from the second portion of the passage within the nozzle nut from entering the first portion of the passage within the nozzle.

2. The water jet nozzle assembly according to claim 1, wherein: The plate includes (i) a central opening aligned with the laser and the water stream, and (ii) at least one outer opening located radially outward of the central opening.

3. The water jet nozzle assembly according to claim 2, wherein: The at least one outer opening is located directly above the gas passage.

4. The water jet nozzle assembly according to claim 3, wherein: The upper surface of the plate defines a plenum between the upper surface and a lower surface of the nozzle, and wherein the plate is configured to allow gas to flow from the gas passage through the at least one opening into the plenum, and from the plenum into the first portion of the passage within the nozzle.

5. The water jet nozzle assembly according to claim 4, wherein: The plate includes an annular rim extending upward from an outer periphery of the upper surface, and wherein the air chamber is defined between the annular rim, the upper surface of the plate, and the lower surface of the nozzle.

6. The water jet nozzle assembly according to claim 1, wherein: The plate includes at least one timing tab extending downwardly from an outer periphery of a lower surface of the plate, and wherein the at least one timing tab is configured to align the at least one opening with the gas passage.

7. The water jet nozzle assembly according to claim 1, wherein: The lower end of the nozzle includes a recessed portion configured to retain the plate.

8. The water jet nozzle assembly according to claim 1, wherein: The upper end of the nozzle nut includes a recessed portion configured to retain the plate.

9. The water jet nozzle assembly according to claim 1, wherein: The plate is made of at least one of brass and copper.

10. The water jet nozzle assembly of claim 1 further comprising a diaphragm disposed below the nozzle nut and above the outlet of the water jet nozzle assembly, wherein the diaphragm includes a central hole aligned with the laser and the water stream.

11. The water jet nozzle assembly according to claim 10, wherein: The diaphragm includes at least one side opening located radially outward from the central bore, wherein the at least one side opening is configured to allow water to flow out of the water jet nozzle assembly and through the outlet.

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