Camera module and manufacturing method thereof

By covering the lens holder on the outside of the imaging element in the camera module and fixing it with adhesive, the problem of additional processing in the prior art is solved, and a high-precision lens holder positioning and simplified manufacturing process are achieved.

CN119316688AInactive Publication Date: 2025-01-14SHARP SENSING TECH CORP
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN202410938151.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-07-13
Filing Date
2024-07-12
Publication Date
2025-01-14
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The existing camera module needs to be provided with recesses on the sensor chip for additional processing to position the lens bracket, resulting in complexity and high accuracy requirements.

Method used

A lens holder is used to cover the outside of the imaging element and is fixed to the substrate by adhesive to ensure that the positional relationship between the lens holder and the imaging element is within the allowable error and avoid additional processing.

Benefits of technology

The lens holder can be positioned with high accuracy without additional processing of the camera element, simplifying the manufacturing process and improving positioning accuracy, avoiding additional processing of the sensor chip.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119316688A_ABST
    Figure CN119316688A_ABST
Patent Text Reader

Abstract

The objective of the present invention is to position a lens holder in the surface direction of a substrate without additional processing of an imaging element. A camera module (1) is provided with a substrate (2), a sensor chip (3), a lens holder (4), and a lens (5). The positional relationship between the inner peripheral surface (420) of the lens holder (4) and the outer peripheral surface (30) of the sensor chip (3) is such that the amount of offset between the central axis (C2) of the sensor chip (3) and the optical axis (C1) of the lens (5) in the plane direction of the substrate (2) is controlled to be less than or equal to an allowable error.
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Image pick-up module and electronic information apparatus

    JP2012074781A