Array substrate, its broken line repairing method, display panel and display device

Abstract

The application provides an array substrate, a display panel and a display device. The array substrate comprises a substrate, a plurality of data lines, a first insulating layer, a common electrode layer, a plurality of repair lines, a first conductive part and a second conductive part. The data lines comprise a broken data line; the broken data line has a breakpoint and a first repair point and a second repair point on both sides of the breakpoint, and the broken data line is disconnected at the breakpoint. The common electrode layer is provided with a plurality of hollow areas in a display area; the repair lines comprise a breakpoint repair line; the orthographic projection of the first repair point on the substrate and the orthographic projection of the second repair point on the substrate both fall within the orthographic projection of the breakpoint repair line on the substrate; the first conductive part and the second conductive part both penetrate through the first insulating layer, and the orthographic projection of the first conductive part and the second conductive part on the substrate both fall within the corresponding hollow area and the orthographic projection of the corresponding breakpoint repair line on the substrate. The integration degree of the array substrate can be improved while repairing the data line.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to an array substrate and its broken wire repair method, a display panel, and a display device. Background Technology

[0002] In LCD displays, as screen resolution increases, the number of data lines also increases. A break in any one of these lines can cause a vertical black screen, resulting in low yield. Currently, the common method for repairing data lines is to use a trace located on the periphery of the display area, connected to the source driver chip, as a rescue line. This rescue line connects the end of the broken data line without signal input back to the source driver chip. Because the rescue line is long and has high impedance, an operational amplifier integrated circuit (IC) is usually needed on the circuit board for signal amplification. However, this repair method typically only allows for one repairable rescue line, making it impossible to repair multiple data lines. Furthermore, the operational amplifier IC occupies a large area on the circuit board, increasing cost and hindering the integration and miniaturization of display panels. Summary of the Invention

[0003] This application addresses the shortcomings of related technologies by proposing an array substrate and its broken line repair method, display panel, and display device to solve the problems in related technologies where the number of rescue lines is limited, the rescue line loop is long and requires additional operational amplifiers that occupy a large area or are costly.

[0004] This application provides an array substrate, including a display area, wherein the array substrate includes:

[0005] Substrate;

[0006] Multiple data lines are located on one side of the substrate, including a broken data line; the broken data line has a break point and a first repair point and a second repair point located on both sides of the break point, and the broken data line is disconnected at the break point.

[0007] A first insulating layer is located on the side of the plurality of data lines away from the substrate;

[0008] A common electrode layer is located on the side of the first insulating layer away from the multiple data lines. The common electrode layer has multiple cutout areas located in the display area. The orthographic projection of each data line on the substrate and the orthographic projection of one of the cutout areas on the substrate have an overlapping area.

[0009] Multiple repair lines are located on the side of the first insulating layer away from the substrate, and at least a portion of the orthographic projection of each repair line on the substrate lies within one of the overlapping regions; the repair lines include break repair lines; the orthographic projections of the first repair point on the substrate and the second repair point on the substrate both fall within the orthographic projection of the break repair line on the substrate;

[0010] Both the first conductive part and the second conductive part penetrate the first insulating layer, and their orthogonal projections on the substrate are located within the corresponding hollow area and the orthogonal projection of the corresponding break repair line on the substrate; the two ends of the first conductive part are respectively connected to the first repair point and the break repair line, and the two ends of the second conductive part are respectively connected to the second repair point and the break repair line.

[0011] In some embodiments, the array substrate further includes a non-display area located on one side of the display area, the common electrode layer includes a plurality of common electrodes arranged in parallel in the display area and a common voltage line located in the non-display area, each of the cutout areas is located between two adjacent common electrodes; each of the common electrodes is connected to the common voltage line.

[0012] In some embodiments, the break repair line includes a repair segment and a section spaced apart from the repair segment, the first conductive part and the second conductive part are respectively connected to the repair segment; the portions of the plurality of repair lines other than the repair segment are all electrically connected to the common voltage line.

[0013] In some embodiments, the orthographic projection of each of the repair lines on the substrate lies within the orthographic projection of one of the data lines on the substrate; and / or,

[0014] The orthographic projection of each of the data lines on the substrate falls within the orthographic projection of one of the cutout areas on the substrate.

[0015] In some embodiments, the array substrate further includes a pixel electrode layer located on the side of the common electrode layer away from the substrate, the pixel electrode layer having a plurality of spaced pixel electrodes; the orthographic projection of the pixel electrode on the substrate does not overlap with the orthographic projection of the first conductive portion on the substrate or the orthographic projection of the second conductive portion on the substrate.

[0016] In some embodiments, the array substrate further includes an auxiliary layer disposed on the side of the common electrode layer away from the substrate, wherein the orthographic projection of the auxiliary layer on the substrate does not overlap with the orthographic projection of the cutout area on the substrate, and the auxiliary layer is electrically connected to the common electrode layer.

[0017] In some embodiments, the auxiliary layer is disposed on the same layer as the plurality of repair lines.

[0018] In some embodiments, the array substrate further includes a second insulating layer located on the side of the first insulating layer away from the substrate; each of the repair lines is located within a cutout area and in contact with the first insulating layer, and at least a portion of the second insulating layer is located within the gap between the common electrode layer and the repair line.

[0019] In some embodiments, the array substrate further includes a second insulating layer located on the side of the first insulating layer away from the substrate; each of the repair lines is disposed on the side of the second insulating layer away from the first insulating layer, and at least a portion of the second insulating layer is located within each of the cutout areas.

[0020] In some embodiments, the material of the first conductive part includes a carbonized material;

[0021] And / or, the material of the second conductive part includes a carbonized material.

[0022] This application also provides a method for repairing broken lines on an array substrate, the array substrate including a display area; the array substrate including a substrate and a plurality of data lines, a first insulating layer, a common electrode layer and a plurality of repair lines sequentially stacked on the substrate; the data lines include broken data lines, the broken data lines having a break point, the broken data lines being disconnected at the break point, the portion of the common electrode layer located in the display area having a plurality of cutout areas, the orthographic projection of each data line on the substrate and the orthographic projection of one of the cutout areas on the substrate having an overlapping area; at least a portion of the orthographic projection of each repair line on the substrate is located within one of the overlapping areas; the broken line repair method includes:

[0023] Determine the location of the break in the broken data cable;

[0024] The positions of the two processing areas corresponding to the broken data line are determined based on the location of the break point of the broken data line; the orthographic projections of the two processing areas on the substrate are located on opposite sides of the orthographic projection of the break point of the broken data line on the substrate, and are respectively located within the orthographic projections of the broken data line, the hollow area corresponding to the broken data line, and the break point repair line corresponding to the broken data line on the substrate.

[0025] Laser processing is performed on the two processing areas to form a first conductive portion and a second conductive portion that penetrate the first insulating layer; the two ends of the first conductive portion are respectively connected to the first repair point and the break repair line of the broken data line, and the two ends of the second conductive portion are respectively connected to the second repair point and the break repair line of the broken data line.

[0026] In some embodiments, the array substrate further includes a pixel electrode layer located on the side of the common electrode layer away from the substrate, the pixel electrode layer having a plurality of spaced pixel electrodes; the orthographic projection of the pixel electrodes on the substrate does not overlap with the orthographic projection of each processing area on the substrate.

[0027] This application also provides a display panel, including the aforementioned array substrate.

[0028] This application also provides a display device, including the aforementioned display panel.

[0029] The beneficial effects of this application include:

[0030] In this embodiment, by creating multiple cutout areas corresponding to multiple data lines on the common electrode layer and providing multiple repair lines corresponding to each cutout area on the side of the common electrode layer away from the substrate, when a broken data line is detected, a conductive path can be formed on both sides of the break point: first repair point - first conductive part - break point repair line - second conductive part - second repair point. Therefore, the break point of the broken data line can be directly repaired within the display area, eliminating the need for additional rescue lines with large loops outside the display area. Furthermore, since the orthographic projections of the broken data line and the break point repair line on the substrate correspond, the length difference between the repaired conductive path and the original conductive path of the broken data line is small. Thus, there is no need to additionally place operational amplifier integrated circuits (OPICs) on the circuit board to reduce the large impedance difference caused by large loops, further avoiding the occupation of circuit board layout area. Furthermore, the multiple data lines and multiple repair lines in this application are configured in a corresponding manner. When some of the data lines break, the corresponding repair line can be selected for repair. Therefore, even if multiple data lines break, the corresponding repair can be performed within the display area without the need to lay multiple rescue lines around the display area. The number of repairable data lines is not limited by the available wiring area around the display area, thus avoiding occupying the wiring area around the display area and improving the overall integration and miniaturization of the array substrate. After repairing the broken data lines, vertical black screens can also be avoided when the array substrate forms the display panel.

[0031] Additional aspects and advantages of this application will be set forth in part in the description which follows, and will become apparent from the description or may be learned by practice of this application. Attached Figure Description

[0032] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0033] Figure 1The image shown is a schematic diagram of the array substrate in a display panel in the related technology;

[0034] Figure 2 The following is along Figure 1 A sectional view cut by the mid-section line M'M';

[0035] Figure 3 The image shown is a schematic diagram of the layout of an array substrate provided in an exemplary embodiment of this application;

[0036] Figure 4 As shown Figure 3 Enlarged view of point A in the middle;

[0037] Figure 5 As shown Figure 3 A sectional view cut along section line MM;

[0038] Figure 6 As shown Figure 3 A sectional view taken along section line NN;

[0039] Figure 7 The image shown is a cross-sectional view of an array substrate provided in an exemplary embodiment of this application;

[0040] Figure 8 The image shown is a cross-sectional view of an array substrate provided in an exemplary embodiment of this application;

[0041] Figure 9 The image shown is a cross-sectional view of an array substrate provided in an exemplary embodiment of this application;

[0042] Figure 10 The image shown is a cross-sectional view of an array substrate provided in an exemplary embodiment of this application;

[0043] Figure 11 The image shown is a cross-sectional view of an array substrate provided in an exemplary embodiment of this application;

[0044] Figure 12 The diagram shows a layout of an array substrate with broken data lines.

[0045] Figure 13 As shown Figure 12 Enlarged view of point A in the middle;

[0046] Figure 14 As shown Figure 12 A sectional view cut along section line MM;

[0047] Figure 15 As shown Figure 12 A sectional view taken along section line NN;

[0048] Figure 16The diagram shown is a schematic layout of the array substrate for one step of the broken wire repair method provided in this embodiment.

[0049] Figure 17 As shown Figure 16 Enlarged view of point A in the middle;

[0050] Figure 18 As shown Figure 16 A sectional view cut along section line MM;

[0051] Figure 19 As shown Figure 16 A sectional view taken along section line NN;

[0052] Figure 20 The diagram shown is a schematic layout of the array substrate for one step of the broken wire repair method provided in this embodiment.

[0053] Figure 21 As shown Figure 20 Enlarged view of point A in the middle;

[0054] Figure 22 As shown Figure 20 A sectional view taken along section line NN;

[0055] Figure 23 The diagram shown is a schematic layout of the array substrate for one step of the broken wire repair method provided in this embodiment.

[0056] Figure 24 As shown Figure 23 Enlarged view of point A in the middle;

[0057] Figure 25 As shown Figure 23 A sectional view cut along section line MM;

[0058] Figure 26 As shown Figure 23 A sectional view taken along section line NN;

[0059] Figure 27 The image shown is a cross-sectional view of a display panel provided in an exemplary embodiment of this application.

[0060] In the figure: 1-substrate; 21-thin film transistor; 211-gate; 212-active layer; 213-source; 214-drain; 22-gate insulating layer; 3-data line; 31-broken data line; 31a-break point; 311-first repair point; 312-second repair point; 4-first insulating layer; 5-common electrode layer; 5a-cutout area; 51-common electrode; 52-common voltage line; 6-repair line; 61-break point repair line; 611-repair segment; 7-interlayer insulating layer; 8-pixel electrode layer; 81-pixel electrode; 91-first conductive part; 92-second conductive part; 93-second insulating layer; 94-auxiliary layer; 200-color filter substrate; 300-liquid crystal; 400-spacer; AA-display area; NA-non-display area; DA1, DA2-processing areas. Detailed Implementation

[0061] like Figure 1 The diagram shown is a layout schematic of the array substrate in a display panel in related technologies. Figure 2 The following is along Figure 1 A sectional view cut by the mid-section line M'M'. (Example) Figure 1 As shown, the display panel includes a display area AA' and a non-display area NA' located to one side of the display area AA'. Figure 2 As shown, the array substrate includes a substrate 1', a data line 3', a first insulating layer 4', a common electrode layer 5', a metal layer 6', an interlayer insulating layer 7', and a pixel electrode layer 8' stacked sequentially. The array substrate also includes a thin-film transistor 21' and a gate insulating layer 22' disposed on the substrate 1'. Figure 1 As shown, when a broken data line 31' with a breakpoint 31a' is detected on the array substrate, the conventional repair method is to use the trace located around the display area AA' and connected to the source driver chip (source IC) as a rescue line 32'. Laser processing is used to melt the breakpoint 31a', and the two ends of the broken line without signal input are connected to the rescue line 32' surrounding the display area AA' and then reconnected to the source driver chip, for example, by... Figure 1Points a, b, c, and d are connected sequentially to form a rescue line. Because the rescue line 32' loop around the display area AA' is large, its impedance is several times greater than the normal line, which can cause signal distortion. Therefore, it is common practice to add an OP IC (Operational Amplifier IC) to the PCB circuit board and connect it to the rescue line 32' to amplify the signal, ensuring that the repaired part can work normally and has the same display performance as other unrepaired parts, thus achieving the purpose of repairing the broken line. However, this repair method has certain limitations, specifically: the area around the display area AA' where the rescue line can be set is limited, making it impossible to repair multiple broken data lines; adding an OP IC to the PCB circuit board increases cost and the PCB circuit board's wiring area.

[0062] The array substrate, its broken wire repair method, display panel, and display device provided in this application are intended to solve the above-mentioned technical problems in related technologies.

[0063] The array substrate, its broken line repair method, display panel, and display device according to the embodiments of this application will be described in detail below with reference to the accompanying drawings. Unless otherwise specified, the features in the following embodiments can complement or combine with each other.

[0064] This application provides an array substrate, such as... Figures 3 to 6 As shown, where, Figure 3 The diagram shown is a layout schematic of the array substrate provided in this embodiment. Figure 4 As shown Figure 3 Enlarged view at point A in the middle. Figure 5 As shown Figure 3 A sectional view cut along section line MM. Figure 6 for Figure 3A cross-sectional view taken along section line NN. The array substrate includes a display area AA, a substrate 1, multiple data lines 3, a first insulating layer 4, a common electrode layer 5, multiple repair lines 6, a first conductive portion 91, and a second conductive portion 92. The multiple data lines 3 are located on one side of the substrate 1. The data lines 3 include a broken data line 31. The broken data line 31 has a break point 31a and a first repair point 311 and a second repair point 312 located on both sides of the break point 31a. The broken data line 31 is broken at the break point 31a. The first insulating layer 4 is located on the side of the multiple data lines 3 away from the substrate 1. The common electrode layer 5 is located on the side of the first insulating layer 4 away from the multiple data lines 3. The common electrode layer 5 has multiple hollow areas 5a located in the display area AA. The orthographic projection of each data line 3 on the substrate 1 overlaps with the orthographic projection of a hollow area 5a on the substrate 1. Multiple repair lines 6 are located on the side of the first insulating layer 4 away from the substrate 1, and at least a portion of the orthographic projection of each repair line 6 on the substrate 1 lies within an overlapping area; the repair line 6 includes a break repair line 61; the orthographic projection of the first repair point 311 on the substrate 1 and the orthographic projection of the second repair point 312 on the substrate 1 both fall within the orthographic projection of the break repair line 61 on the substrate 1; the first conductive part 91 and the second conductive part 92 both penetrate the first insulating layer 4, and their orthographic projections on the substrate 1 are both located within the corresponding cutout area 5a and the corresponding orthographic projection of the break repair line 61 on the substrate 1; the two ends of the first conductive part 91 are respectively connected to the first repair point 311 and the break repair line 61, and the two ends of the second conductive part 92 are respectively connected to the second repair point 312 and the break repair line 61.

[0065] In this embodiment, by creating multiple cutout areas 5a corresponding to multiple data lines 3 on the common electrode layer 5 and providing multiple repair lines 6 corresponding to each cutout area 5a on the side of the common electrode layer 5 away from the substrate 1, when a broken data line 31 is detected in the data line 3, a conductive path can be formed on both sides of the break point 31a of the broken data line 31: first repair point 311 - first conductive part 91 - break point repair line 61 - second conductive part 92 - second repair point 312. Therefore, the break point 31a of the broken data line 31 can be repaired directly within the display area AA, without the need to set up a rescue line with a large loop outside the display area AA. In addition, since the orthographic projections of the broken data line 31 and the break point repair line 61 on the substrate 1 correspond, the length of the conductive path after repair is less than the length of the original conductive path of the broken data line 31. Therefore, it is not necessary to set up an operational amplifier integrated circuit (OP IC) on the circuit board to reduce the large impedance difference caused by the large loop, and further avoid occupying the layout area of ​​the circuit board. Furthermore, the multiple data lines 3 and multiple repair lines 6 in this application are correspondingly arranged. When some of the data lines 3 break, the corresponding repair line 6 can be selected for repair. Therefore, even if multiple data lines 3 break, the corresponding repair can be performed within the display area AA. There is no need to lay multiple rescue lines around the display area AA. The number of repairable data lines 3 is not limited by the wiring area around the display area AA, which can avoid occupying the wiring area around the display area AA, thereby improving the overall integration and miniaturization of the array substrate. After the broken data lines 31 are repaired, the vertical black screen of the display panel can also be avoided when the array substrate forms the display panel.

[0066] In some embodiments, substrate 1 can be a rigid substrate or a flexible substrate. The rigid substrate can be made of glass or quartz, and the flexible substrate can be made of polymer materials such as polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), polyethylene terephthalate (PEN), or graphite.

[0067] In some embodiments, the material of the data cable 3 includes one or any combination of the following metals: silver (Ag), magnesium (Mg), aluminum (Al), tungsten (W), copper (Cu), nickel (Ni), chromium (Cr), molybdenum (Mo), titanium (Ti), platinum (Pt), tantalum (Ta), neodymium (Nd) or scandium (Sc), their alloys, their nitrides, etc.

[0068] In some embodiments, the material of the first insulating layer 4 includes an organic dielectric material, which may include one or any combination of polyimide, acrylic resin, epoxy resin, benzocyclobutene, siloxane, polyester, and polycarbonate. In some embodiments, the material of the first insulating layer 4 further includes silicon-containing oxides, nitrides, or oxynitrides. The material of the first insulating layer 4 may include silicon dioxide (SiO2) or silicon nitride (SiN). x ).

[0069] In some embodiments, the material of the common electrode layer 5 includes indium tin oxide (ITO), aluminum-doped zinc oxide (AZO), and gallium-doped zinc oxide (GZO).

[0070] In some embodiments, the material of the repair line 6 includes one or any combination of the following metals: silver (Ag), magnesium (Mg), aluminum (Al), tungsten (W), copper (Cu), nickel (Ni), chromium (Cr), molybdenum (Mo), titanium (Ti), platinum (Pt), tantalum (Ta), neodymium (Nd) or scandium (Sc), their alloys, their nitrides, etc.

[0071] In some embodiments, the first conductive portion 91 is made of a carbonized material. The first conductive portion 91 may be formed by carbonizing a portion of the first insulating layer 4 after it is heated by a laser beam.

[0072] In some embodiments, the material of the first conductive part 91 includes a carbonized material and the same material as the repair line 6. The first conductive part 91 may also be a mixture of the metal material molten after the portion of the break repair line 61 corresponding to the first repair point 311 is subjected to a laser beam and the material formed by carbonization of the portion of the first insulating layer 4 corresponding to the first repair point 311 after being subjected to a laser beam.

[0073] In some embodiments, the material of the second conductive portion 92 includes a carbonized material. The second conductive portion 92 may be formed by carbonizing a portion of the first insulating layer 4 after it is heated by a laser beam.

[0074] In some embodiments, the material of the second conductive part 92 includes a carbonized material and a material identical to that of the repair line 6. The second conductive part 92 may also be a mixture of a metal material formed by melting the portion of the break repair line 61 corresponding to the second repair point 312 after being subjected to a laser beam and a material formed by carbonizing the portion of the first insulating layer 4 corresponding to the second repair point 312 after being subjected to a laser beam.

[0075] In some embodiments, such as Figure 3As shown, the array substrate also includes a non-display area NA located on one side of the display area AA. The common electrode layer 5 includes multiple common electrodes 51 located in the display area AA and arranged in parallel, and a common voltage line 52 located in the non-display area NA. Each cutout area 5a is located between two adjacent common electrodes 51. Each common electrode 51 is connected to the common voltage line 52.

[0076] In this embodiment, each common electrode 51 located in the display area AA is connected to the common voltage line 52 in the non-display area NA. Therefore, even if the common electrode layer 5 has a cutout area 5a, it will not affect the electrical connection between each common electrode 51 and the circuit board, and will not affect the signal reception of each common electrode 51.

[0077] In some embodiments, such as Figure 3 As shown, the extension direction of each common electrode 51 is parallel to the extension direction of each data line 3, and the arrangement direction of each common electrode 51 is perpendicular to the extension direction of the data line 3. The extension direction of each cutout area 5a is also parallel to the extension direction of each data line 3, and the position of the cutout area 5a can be designed according to the wiring position of the data line 3. Thus, the broken data line 31 has a corresponding cutout area 5a and a corresponding break repair line 61, so the positions of the first repair point 311 and the second repair point 312 can be arbitrarily selected on both sides of the break point 31a for repair, which provides a relatively flexible design.

[0078] In some embodiments, such as Figure 3 As shown, the common voltage line 52 is located in the non-display area NA, is set around the display area AA, extends and connects to the power signal on the circuit board.

[0079] In some embodiments, such as Figure 3 and Figure 6 As shown, the break repair line 61 includes a repair section 611 and sections spaced apart from the repair section 611. The first conductive part 91 and the second conductive part 92 are respectively connected to the repair section 611. The parts of the multiple repair lines 6 other than the repair section 611 are all electrically connected to the common voltage line 52.

[0080] In this embodiment, the repair segment 611 of the break repair line 61 is electrically connected to the data line 3. The repair segment 611 serves as part of the signal transmission path in the data line 3, enabling normal signal transmission within the data line 3 after the broken data line 31 has been repaired. Furthermore, the portion outside the repair segment 611, after being connected to the common voltage line 52, can be further electrically connected to multiple common electrodes 51 via the common voltage line 52. This serves as an auxiliary conductive path, reducing the total resistance in the signal transmission path of the common electrodes 51 and significantly lowering the impedance of the entire path.

[0081] In some embodiments, such as Figure 3As shown, the orthographic projection of each repair line 6 on the substrate 1 lies within the orthographic projection of a data line 3 on the substrate 1. This embodiment avoids the situation where the area where the repair line 6 is located is too large, causing signal interference to other film layers besides the data line 3 during the repair of the broken data line 31. This is because during the electrical connection process between the repair segment 611 of the break repair line 61 and the first repair points 311 and second repair points 312 on both sides of the break point 31a of the broken data line 31, such as during laser processing, the components of the break repair line 61 diffuse into other areas. In addition, the repair line 6 also avoids signal interference between the data line 3 and the signal lines on the side of the repair line 6 away from the substrate 1.

[0082] In some embodiments, such as Figure 3 As shown, the extension direction of the repair line 6 is the same as that of the data line 3. In the direction perpendicular to the extension of the repair line 6, the width d1 of the repair line 6 is smaller than the width d2 of the data line 3.

[0083] In some embodiments, such as Figure 3 As shown, the orthographic projection of each data line 3 on the substrate 1 falls within the orthographic projection of a cutout area 5a on the substrate 1. In this embodiment, when a broken data line 31 appears among multiple data lines 3, the break point 31a of the broken data line 31 can be located at any position. The break point repair line 61 can penetrate the first insulating layer 4 through the cutout area 5a to achieve the first repair point 311 and the second repair point 312 on both sides of the break point 31a of the broken data line 31. This avoids the repair segment 611 of the break point repair line 61 from contacting the common electrode layer 5 when it is connected to the broken data line 31, thus preventing electrical connection and interference with the signal of the common electrode layer 5.

[0084] In some embodiments, such as Figure 3 As shown, the extension direction of data line 3 is the same as the extension direction of the cutout area 5a. In the direction perpendicular to the extension of data line 3, the width d2 of data line 3 is smaller than the width d3 of cutout area 5a.

[0085] In some embodiments, such as Figure 5 and Figure 6 As shown, the array substrate also includes a pixel electrode layer 8 located on the side of the common electrode layer 5 away from the substrate 1. The pixel electrode layer 8 is provided with a plurality of pixel electrodes 81 spaced apart. The orthographic projection of the pixel electrode 81 on the substrate 1 does not overlap with the orthographic projection of the first conductive part 91 on the substrate 1 or the orthographic projection of the second conductive part 92 on the substrate 1.

[0086] In this embodiment, after the array substrate is fabricated, when a broken data line 31 is detected, the broken repair line 61 can be repaired (e.g., laser treatment) on the side of the pixel electrode layer 8 away from the substrate 1, while avoiding the repair treatment from affecting the pixel electrode layer 8, and avoiding the formation of an electrical connection between the pixel electrode 81 of the pixel electrode layer 8 and the repair line 6 during the repair process, which would cause signal crosstalk.

[0087] In some embodiments, such as Figure 5 and Figure 6 As shown, the array substrate also includes an interlayer insulating layer 7 disposed between the common electrode layer 5 and the pixel electrode layer 8 to avoid signal crosstalk between the common electrode layer 5 and the pixel electrode layer 8.

[0088] In some embodiments, such as Figure 5 As shown, in a direction perpendicular to the extension direction of the data line 3, the array substrate is further provided with a thin-film transistor 21. The thin-film transistor 21 includes a source 213, a drain 214, an active layer 212, and a gate 211. In this embodiment, the thin-film transistor 21 is a bottom-gate thin-film transistor. In this embodiment, the source and drain layers 214 are disposed on the same layer as the data line 3. In other embodiments, the thin-film transistor 21 may also be a top-gate thin-film transistor or a dual-gate thin-film transistor.

[0089] In some embodiments, the gate 211, source 213, and drain 214 are made of metals such as silver (Ag), magnesium (Mg), aluminum (Al), tungsten (W), copper (Cu), nickel (Ni), chromium (Cr), molybdenum (Mo), titanium (Ti), platinum (Pt), tantalum (Ta), neodymium (Nd), or scandium (Sc), their alloys, their nitrides, or any combination thereof.

[0090] In some embodiments, the active layer 212 may be made of one or any combination of indium gallium zinc oxide, indium zinc tin oxide, or indium gallium zinc tin oxide.

[0091] In some embodiments, the array substrate is further provided with a gate insulating layer 22 located between the active layer 212 and the gate 211. The material of the gate insulating layer 22 may be one or a combination of silicon oxide, silicon nitride, high dielectric constant dielectric materials (such as aluminum oxide, hafnium oxide, zirconium oxide, etc.) and organic dielectric materials.

[0092] In some embodiments, such as Figure 5As shown, the array substrate also includes a second insulating layer 93 located on the side of the first insulating layer 4 away from the substrate 1; each repair line 6 is located within a cutout area 5a and in contact with the first insulating layer 4, and at least a portion of the second insulating layer 93 is located within the gap between the common electrode layer 5 and the repair line 6. In this embodiment, the second insulating layer 93 is located within the gap, which does not increase the overall thickness of the film layer, and at the same time avoids electrical connection between the multiple common electrodes 51 in the common electrode layer 5 and the repair line 6, thus avoiding signal crosstalk.

[0093] In some embodiments, such as Figure 7 or Figure 8 As shown, the array substrate also includes a second insulating layer 93 located on the side of the first insulating layer 4 away from the substrate 1; each repair line 6 is disposed on the side of the second insulating layer 93 away from the first insulating layer 4, and at least a portion of the second insulating layer 93 is located within each cutout area 5a.

[0094] In this embodiment, considering that the width of the multiple hollow areas 5a of the common electrode layer 5 is small, the width of the second insulating layer 93 needs to be set even smaller. In the actual manufacturing process, it may be difficult to set the second insulating layer 93 between the repair line 6 and the common electrode 51 to achieve insulation between the common electrode 51 and the repair line 6. Therefore, filling the hollow area 5a with the second insulating layer 93 to avoid the common electrode 51 and the repair line 6 from contacting and forming an electrical connection is easier to achieve in the manufacturing process and simpler to operate.

[0095] In some embodiments, such as Figure 7 As shown, in the direction perpendicular to the substrate 1, the thickness of the second insulating layer 93 is less than or equal to the thickness of the common electrode layer 5. In this embodiment, the second insulating layer 93 is directly disposed within the cutout area 5a, which can be achieved without adding an additional film layer and avoid increasing the overall thickness of the array substrate.

[0096] In some embodiments, such as Figure 8 As shown, in the direction perpendicular to the substrate 1, the thickness of the second insulating layer 93 is greater than the thickness of the common electrode layer 5, and the side of the second insulating layer 93 away from the common electrode layer 5 at least partially covers the surface of the common electrode layer 5 away from the substrate 1. In this embodiment, since the second insulating layer 93 covers the common electrode layer 5, the orthographic projection of the repair line 6 on the substrate 1 does not need to be limited to the orthographic projection of the cutout area 5a on the substrate 1. Therefore, the area setting of the repair line 6 is more flexible and has higher operability.

[0097] In some embodiments, such as Figure 9 or Figure 10 or Figure 11As shown, the array substrate also includes an auxiliary layer 94, which is disposed on the side of the common electrode layer 5 away from the substrate 1. The orthographic projection of the auxiliary layer 94 on the substrate 1 does not overlap with the orthographic projection of the cutout area 5a on the substrate 1. The auxiliary layer 94 is electrically connected to the common electrode layer 5.

[0098] In this embodiment, by adding an auxiliary layer 94 and an electrical connection between it and the common electrode layer 5, it can further serve as an auxiliary conductive path for the common electrode layer 5, thereby reducing the total resistance in the signal transmission path and significantly reducing the impedance of the entire path.

[0099] In some embodiments, there is a gap between the auxiliary layer 94 and the repair line 6 to avoid signal crosstalk.

[0100] In some embodiments, such as Figure 10 or Figure 11 As shown, the auxiliary layer 94 is disposed on the same layer as the multiple repair lines 6. In this embodiment, no additional film layer is added to accommodate the auxiliary layer 94, thereby reducing the overall thickness of the array substrate and improving the integration and miniaturization of the device.

[0101] In some embodiments, the auxiliary layer 94 and the repair line 6 are made of the same material. Therefore, during the fabrication of the array substrate, the patterns of the repair line 6 and the auxiliary layer 94 can be formed on the same mask, and the repair line 6 and the auxiliary layer 94 can be deposited on the array substrate, which simplifies the fabrication process.

[0102] Based on the same inventive concept, this application also provides a method for repairing broken lines on an array substrate, such as... Figures 12 to 15 As shown, Figure 12 The diagram shows a layout of an array substrate with a broken data line 31. Figure 13 As shown Figure 12 Enlarged view at point A in the middle. Figure 14 As shown Figure 12 A sectional view cut along section line MM. Figure 15 As shown Figure 12 A cross-sectional view taken along section line NN; the array substrate includes a display area AA; the array substrate includes a substrate 1 and multiple data lines 3, a first insulating layer 4, a common electrode layer 5, and multiple repair lines 6 sequentially stacked on the substrate 1; the data lines 3 include broken data lines 31, the broken data lines 31 have a break point 31a, the broken data lines 31 are broken at the break point 31a, the common electrode layer 5 has multiple hollow areas 5a in the portion located in the display area AA, and the orthographic projection of each data line 3 on the substrate 1 overlaps with the orthographic projection of a hollow area 5a on the substrate 1; at least a portion of the orthographic projection of each repair line 6 on the substrate 1 is located in an overlapping area; the broken line repair method includes the following steps:

[0103] Step 100: As Figures 12 to 15As shown, determine the location of the break point 31a of the broken data line 31;

[0104] Step 200: As Figures 16 to 19 As shown, where, Figure 16 The diagram shown is a schematic layout of the array substrate for one step of the broken wire repair method provided in this embodiment. Figure 17 As shown Figure 16 Enlarged view at point A in the middle. Figure 18 As shown Figure 16 A sectional view cut along section line MM. Figure 19 As shown Figure 16 A cross-sectional view taken along section line NN; the positions of two processing areas DA1 and DA2 corresponding to the broken data line 31 are determined according to the position of the break point 31a of the broken data line 31; the orthographic projections of the two processing areas DA1 and DA2 on the substrate 1 are located on opposite sides of the orthographic projection of the break point 31a of the broken data line 31 on the substrate 1, and are respectively located within the orthographic projections of the broken data line 31, the hollow area 5a corresponding to the broken data line 31, and the break point repair line 61 corresponding to the broken data line 31 on the substrate 1;

[0105] Step 300: As Figures 20 to 26 As shown, where, Figure 20 The diagram shown is a schematic layout of the array substrate for one step of the broken wire repair method provided in this embodiment. Figure 21 As shown Figure 20 Enlarged view at point A in the middle. Figure 22 As shown Figure 20 A sectional view taken along section line NN; Figure 23 The diagram shown is a schematic layout of the array substrate for one step of the broken wire repair method provided in this embodiment. Figure 24 As shown Figure 23 Enlarged view at point A in the middle. Figure 25 As shown Figure 23 A sectional view cut along section line MM; Figure 26 As shown Figure 23 A cross-sectional view taken along section line NN; laser processing is performed on two processing areas DA1 and DA2 to form a first conductive part 91 and a second conductive part 92 penetrating the first insulating layer 4; the two ends of the first conductive part 91 are connected to the first repair point 311 and the break repair line 61 of the broken data line 31, respectively, and the two ends of the second conductive part 92 are connected to the second repair point 312 and the break repair line 61 of the broken data line 31, respectively.

[0106] In this embodiment, by setting a cutout area 5a corresponding to the data line 3 in the common electrode layer 5, and setting multiple repair lines 6 corresponding to the multiple data lines 3, after determining the location of the break point 31a of the broken data line 31 in the data line 3, laser processing can be used to repair the broken data line 31 through the break point repair line 61, thereby ensuring the normal transmission of signals on the array substrate.

[0107] In some embodiments, the two ends of the first conductive portion 91 are connected to the first repair point 311 and the repair segment 611 of the break repair line 61, respectively, and the two ends of the second conductive portion 92 are connected to the second repair point 312 and the repair segment 611 of the break repair line 61, respectively. The portion of the break repair line 61 other than the repair segment 611 is connected to the common voltage line 52.

[0108] In some embodiments, step 300 specifically includes the following steps:

[0109] Step 310: As Figures 20 to 22 As shown, where, Figure 20 The diagram shown is a schematic layout of the array substrate for one step of the broken wire repair method provided in this embodiment. Figure 21 As shown Figure 20 Enlarged view at point A in the middle. Figure 22 As shown Figure 20 A cross-sectional view along the section line NN; laser cutting is performed on the first repair point 311 on the side away from the break point 31a and the second repair point 312 on the side away from the break point 31a corresponding to the broken data line 31, to form the repair segment 611.

[0110] Step 320: As Figures 23 to 26 As shown, Figure 23 The diagram shown is a schematic layout of the array substrate for one step of the broken wire repair method provided in this embodiment. Figure 24 As shown Figure 23 Enlarged view at point A in the middle. Figure 25 As shown Figure 23 A sectional view cut along section line MM; Figure 26 As shown Figure 23 A cross-sectional view along section line NN; laser welding is performed on the repair section 611 at the position of the first repair point 311 corresponding to the data line 3 and the position of the second repair point 312 corresponding to the data line 3 to form the first conductive part 91 and the second conductive part 92 penetrating the first insulating layer 4, respectively.

[0111] In this embodiment, the connection between the repair segment 611 of the break repair line 61 and the broken data line 31 is achieved by laser cutting and laser welding. The operation is relatively simple and feasible.

[0112] In some embodiments, the following steps are included prior to step 100:

[0113] Check if there is a broken data line 31 among the multiple data lines 3.

[0114] In some embodiments, the array substrate can be scanned by Automated Optical Inspection (AOI) to detect whether there is a broken data line 31 in the data line 3. When a broken data line 31 is detected, the broken line repair method as described in steps 100 to 300 of the aforementioned embodiments is implemented.

[0115] In some embodiments, the two processing areas DA1 and DA2 are located within the same cutout area 5a.

[0116] In other embodiments, the two processing areas DA1 and DA2 may be located in different cutout areas 5a to accommodate the positions of the first repair point 311 and the second repair point 312.

[0117] This application also provides a display panel, such as Figure 27 As shown, the embodiment includes the array substrate as described above, a color filter substrate 200 disposed opposite to the array substrate, and a liquid crystal 300 and a spacer 400 disposed between the array substrate and the color filter substrate 200. The technical features and beneficial effects of this embodiment are the same as those of the aforementioned embodiments, and will not be repeated here.

[0118] This application also provides a display device, including a display panel and a housing as described above. The technical features and beneficial effects of this embodiment are the same as those of the foregoing embodiments, and will not be repeated here.

[0119] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

Claims

1. An array substrate, characterized in that, The array substrate includes a display area and comprises: Substrate; Multiple data lines are located on one side of the substrate, including a broken data line; the broken data line has a break point and a first repair point and a second repair point located on both sides of the break point, and the broken data line is disconnected at the break point. A first insulating layer is located on the side of the plurality of data lines away from the substrate; A common electrode layer is located on the side of the first insulating layer away from the multiple data lines. The common electrode layer has multiple cutout areas located in the display area. The array substrate also includes a non-display area located on one side of the display area. The common electrode layer includes multiple common electrodes arranged side by side in the display area and a common voltage line in the non-display area. Each cutout area is located between two adjacent common electrodes. Each common electrode is connected to the common voltage line. The orthographic projection of each data line on the substrate overlaps with the orthographic projection of one of the cutout areas on the substrate. Multiple repair lines are located on the side of the first insulating layer away from the substrate, and at least a portion of the orthographic projection of each repair line on the substrate lies within one of the overlapping regions; the repair lines include break repair lines; the orthographic projections of the first repair point on the substrate and the second repair point on the substrate both fall within the orthographic projection of the break repair line on the substrate; Both the first conductive part and the second conductive part penetrate the first insulating layer, and their orthographic projections on the substrate are located within the orthographic projections of the corresponding hollow area and the corresponding break repair line on the substrate; the two ends of the first conductive part are respectively connected to the first repair point and the break repair line, and the two ends of the second conductive part are respectively connected to the second repair point and the break repair line. The break repair line includes a repair section and sections spaced apart from the repair section. The first conductive part and the second conductive part are respectively connected to the repair section. The parts of the multiple repair lines other than the repair section are all electrically connected to the common voltage line.

2. The array substrate according to claim 1, characterized in that, The orthographic projection of each of the repair lines on the substrate lies within the orthographic projection of one of the data lines on the substrate; And / or, The orthographic projection of each of the data lines on the substrate falls within the orthographic projection of one of the cutout areas on the substrate.

3. The array substrate according to claim 1, characterized in that, The array substrate further includes a pixel electrode layer located on the side of the common electrode layer away from the substrate, and the pixel electrode layer is provided with a plurality of pixel electrodes spaced apart; the orthographic projection of the pixel electrode on the substrate does not overlap with the orthographic projection of the first conductive part on the substrate or the orthographic projection of the second conductive part on the substrate.

4. The array substrate according to claim 1, characterized in that, The array substrate further includes an auxiliary layer, which is disposed on the side of the common electrode layer away from the substrate. The orthographic projection of the auxiliary layer on the substrate does not overlap with the orthographic projection of the cutout area on the substrate. The auxiliary layer is electrically connected to the common electrode layer.

5. The array substrate according to claim 4, characterized in that, The auxiliary layer is disposed on the same layer as the multiple repair lines.

6. The array substrate according to claim 1, characterized in that, The array substrate further includes a second insulating layer located on the side of the first insulating layer away from the substrate; each of the repair lines is located within a cutout area and in contact with the first insulating layer, and at least a portion of the second insulating layer is located within the gap between the common electrode layer and the repair line.

7. The array substrate according to claim 1, characterized in that, The array substrate further includes a second insulating layer located on the side of the first insulating layer away from the substrate; each of the repair lines is disposed on the side of the second insulating layer away from the first insulating layer, and at least a portion of the second insulating layer is located within each of the cutout areas.

8. The array substrate according to claim 1, characterized in that, The material of the first conductive part includes a carbonized material; And / or, the material of the second conductive part includes a carbonized material.

9. A method for repairing broken lines on an array substrate, characterized in that, The array substrate includes a display area; the array substrate includes a substrate and multiple data lines, a first insulating layer, a common electrode layer, and multiple repair lines sequentially stacked on the substrate; the data lines include broken data lines, the broken data lines have a break point, the broken data lines are disconnected at the break point, the portion of the common electrode layer located in the display area has multiple cutout areas, the array substrate also includes a non-display area located on one side of the display area, the common electrode layer includes multiple common electrodes arranged side by side in the display area and a common voltage line located in the non-display area, each cutout area is located between two adjacent common electrodes; the orthographic projection of each data line on the substrate and the orthographic projection of a cutout area on the substrate have an overlapping area; At least a portion of the orthographic projection of each of the repair lines onto the substrate lies within one of the overlapping regions; The broken wire repair method includes: Determine the location of the break in the broken data cable; The positions of the two processing areas corresponding to the broken data line are determined based on the location of the break point of the broken data line; the orthographic projections of the two processing areas on the substrate are located on opposite sides of the orthographic projection of the break point of the broken data line on the substrate, and are respectively located within the orthographic projections of the broken data line, the hollow area corresponding to the broken data line, and the break point repair line corresponding to the broken data line on the substrate. Laser processing is performed on the two processing areas to form a first conductive portion and a second conductive portion penetrating the first insulating layer; the two ends of the first conductive portion are respectively connected to the first repair point and the break repair line of the broken data line, and the two ends of the second conductive portion are respectively connected to the second repair point and the break repair line of the broken data line; the break repair line includes a repair segment and a segment spaced apart from the repair segment, and the first conductive portion and the second conductive portion are respectively connected to the repair segment; the portions of the plurality of repair lines other than the repair segment are all electrically connected to the common voltage line.

10. The method for repairing broken wires according to claim 9, characterized in that, The array substrate further includes a pixel electrode layer located on the side of the common electrode layer away from the substrate, and the pixel electrode layer is provided with a plurality of pixel electrodes spaced apart; the orthographic projection of the pixel electrode on the substrate does not overlap with the orthographic projection of each processing area on the substrate.

11. A display panel comprising an array substrate as described in any one of claims 1 to 8.

12. A display device comprising the display panel as claimed in claim 11.

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