Gating device material and memory
CN119317349APending Publication Date: 2025-01-14SHENZHEN HONGQIXIN TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202411286441.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-13
- Publication Date
- 2025-01-14
Abstract
The invention discloses a gating device material and a memory. The general chemical formula of the gating device material comprises (InaTeb) x (AsmSen) 1-x, wherein a / b represents the atomic number ratio of In to Te, m / n represents the atomic number ratio of As to Se, a / b is larger than 0, m / n is larger than 0, and x is larger than 0 and smaller than 1. A drift problem of a threshold voltage of a gate device including a gate device material is improved to enhance the reliability of a memory.
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