一种复合铜箔及其制备方法
By performing dotted line cutting and double-sided copper plating on a polymer substrate, composite copper foil with built-in tabs can be directly prepared, solving the problem of increased process time and cost due to welding, and achieving the effects of simplifying the process and reducing costs.
CN119332242BActive Publication Date: 2026-07-17ANHUI FEITUO NEW MATERIALS TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ANHUI FEITUO NEW MATERIALS TECHNOLOGY CO LTD
- Filing Date
- 2024-09-14
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Existing composite copper foil requires a welding process when preparing tabs, which increases processing time and cost.
Method used
By making dotted cuts on a polymer substrate, first plating copper on the first surface and then removing the cutting strips, then plating copper on the second surface, and making centered cuts at the pure copper layer position, the tab welding process is eliminated, and composite copper foil with built-in tabs is directly prepared.
Benefits of technology
It simplifies the process, improves production efficiency, and reduces production costs.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN119332242B_ABST
Abstract
本发明公开了一种复合铜箔及其制备方法，包括以下步骤：S1、对高分子基材进行虚线切割处理，得到沿宽度方向间隔布置的若干个虚线切割条，每个虚线切割条沿高分子基材的长度方向延伸；S2、在高分子基材的第一表面磁控溅射镀铜，得到第一铜膜层；S3、在第一铜膜层上水电镀铜，得到增厚的第一铜层；S4、将高分子基材上的若干个虚线切割条去除；S5、对高分子基材的第二表面磁控溅射镀铜，得到第二铜膜层；S6、在第二铜膜层上水电镀铜，得到增厚的第二铜层，同时在去除虚线切割条的位置得到纯铜层；S7、在纯铜层位置沿高分子基材长度方向进行居中分切，得到自带极耳的多卷复合铜箔。本发明提供的复合铜箔及其制备方法，可简化工艺，提高生产效率。
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