Tsv interposer, method of making same, and three-dimensional chip

Abstract

The application provides a TSV adapter plate, a manufacturing method thereof and a three-dimensional chip. The TSV adapter plate comprises a substrate, the inside of the substrate has a cavity and a first structure layer covering part of the inner wall of the cavity, wherein the material type of the first structure layer is different from that of the substrate; a through-hole structure penetrating through the substrate and located on one side of the cavity; and a liquid metal located in the cavity, the liquid metal and the first structure layer comprising the same material element. The application solves the problem of poor heat dissipation capacity of the TSV adapter plate in the prior art.

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