Circuit Board and its Manufacturing Method
CN119342681BActive Publication Date: 2026-06-30AVARY HLDG (SHENZHEN) CO LTD +1
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- AVARY HLDG (SHENZHEN) CO LTD
- Filing Date
- 2023-07-20
- Publication Date
- 2026-06-30
AI Technical Summary
Technical Problem
Existing flexible circuit boards suffer structural damage and reduced lifespan due to bulging deformation caused by differences in the thickness of each layer when bent.
Method used
The design employs a multi-layered structure, combining cutouts and adhesive layers to create space for stress relief. The cutouts connect the space in the bending area to accommodate bending deformation, ensuring that the bending dimensions of each layer are matched.
Benefits of technology
It reduces structural damage caused by bending and deformation, and improves the service life and deformation resistance of the circuit board.
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Smart Images
Figure CN119342681B_ABST
Abstract
This application provides a circuit board having at least one bending region and at least one non-bending region, and comprising a first multilayer structure, a second multilayer structure, a third multilayer structure, a first adhesive layer, a second adhesive layer, and a plurality of cutouts. The first adhesive layer is disposed between the first multilayer structure and the second multilayer structure, and the second adhesive layer is disposed between the second multilayer structure and the third multilayer structure. The plurality of cutouts are located in the bending region. When the bending region is bent, the plurality of cutouts deform under force, changing the cross-sectional area of each of the plurality of cutouts. This reduces the structural damage to the circuit board due to bending deformation, helping to extend the service life of the circuit board.
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