Organic substrate metal shell plate

Abstract

The invention provides an organic substrate metal shell plate. The organic substrate metal shell plate comprises: a substrate; the bonding pad plate is mounted at the bottom of the substrate, and a plurality of bonding pads are arranged on the bonding pad plate; the electronic circuit is arranged at the top of the substrate, a plurality of connecting pieces are arranged at the top of the substrate, chip particles are arranged at the top of the substrate, a plurality of thin wires are arranged at the tops of the chip particles through welding heads, components are arranged at the top of the substrate, and a shell is arranged at the top of the substrate. The bottom of each connecting piece is provided with a connecting line. According to the organic substrate metal shell plate provided by the invention, the signal receiving and transmitting effects can be achieved while the chip is protected, the metal shell is used for replacing an antenna, the manual laying step is reduced, the laying difficulty of the radar chip is reduced through the design, and meanwhile, the material cost and the time cost for laying the antenna are reduced.

Description

Technical Field

[0001] The invention relates to the field of radar chip technology shell plate technology, in particular to an organic substrate metal shell plate. Background Art

[0002] Radar chips are miniature sensors based on radar frequency applications. They use wide-beam radar to identify movement, speed and distance. They operate at a radar frequency of 60 GHz, or 10 to the 9th power of Hertz, and can scan movements at a speed of 10,000 frames per second.

[0003] The main functions of radar chips include operating radars, guiding ballistic missiles, and protecting military hardware from nuclear radiation and solar radiation. In the civilian field, radar chips can be used in automobiles, robots, and smart phones to identify movement, speed, and distance. The radar chips, microwave radars, centimeter-wave radars, millimeter-wave radars, etc. currently on the market detect targets by emitting waves in specific bands or frequency bands, and radar chips are generally installed inside organic metal shells.

[0004] In actual application, the antenna needs to be deployed outside the chip, which places high demands on application engineers and has high costs for deploying the antenna.

[0005] Therefore, it is necessary to provide an organic substrate metal shell version to solve the above technical problems. Summary of the invention

[0006] The present invention provides an organic substrate metal shell plate, which solves the problem that after the existing radar chip is installed inside the metal shell plate, the antenna needs to be laid out outside, which has high requirements on engineering personnel and increases costs.

[0007] In order to solve the above technical problems, the organic substrate metal shell provided by the present invention comprises: a substrate;

[0008] A pad board, the pad board is mounted on the bottom of the substrate, and a plurality of pads are arranged on the pad board;

[0009] An electronic circuit, wherein the electronic circuit is arranged on the top of a substrate, a plurality of connecting pieces are arranged on the top of the substrate, a chip particle is arranged on the top of the substrate, a plurality of fine wires are arranged on the top of the chip particle through a welding head, components are arranged on the top of the substrate, a shell is arranged on the top of the substrate, a connecting wire is arranged at the bottom of each connecting piece, the chip particle is fixed on the metal substrate on the top of the substrate through a solid crystal process, the shell is a metal or alloy shell made by a stamping metal processing method, the substrate is single-layered and double-sided copper-clad as a basic material, and the fine wire is a gold wire;

[0010] Electronic circuits and connecting pieces are used to install components and chip particles. Thin wires can connect chip particles and connecting pieces. The materials of connecting wires and thin wires are the same. A series of conventional PCB manufacturing processes are carried out on the top of the substrate according to the designed circuits, holes and pads. The components are welded through the SMT patch welding process and welded to the internal wire surface of the chip. The top of the substrate is to the wire surface, and thin wires are used for wire bonding. There is a hollow design on the shell. Non-standard special-shaped designs will be carried out according to actual needs to prevent dust from entering the hollow part and protect the chip. There will be two processes. One is to install the shell after sealing with glue, and the other is to place isolation materials in the inner cavity of the shell. The metal or alloy shell to be used as the antenna is welded to the internal wire surface of the chip and used as a radar antenna. The shell can be fixed by gluing to ensure the sealing of the connection with the substrate. The chip particles are convenient for connecting to the radar chip.

[0011] Preferably, a printing plate is fixedly connected to the top of the housing, and ink characters are arranged on the top of the printing plate;

[0012] Printing process: The chip model or text is formed on the A or B side by ink silk screen printing or laser engraving, and the side where the chip pad is arranged is coated with ink. The ink printing plate and the top of the shell are integrated and also adopt a hollow design, and the shape is the same as the hollow shape on the shell.

[0013] Preferably, the front and back sides of the substrate are both fixedly connected to two fixing blocks at the top, and the front and back sides of the shell are both fixedly connected to a mounting frame;

[0014] The top of the fixing block is provided with threaded holes, one of which is for air intake and the other for exhaust.

[0015] Preferably, two docking blocks are fixedly connected at the bottom of the front and back of the housing, and bolts are installed at the tops of the docking blocks;

[0016] The bolt thread penetrates through the butt joint block and is threadedly connected with the top of the fixing block. The butt joint block is also provided with a through hole which is threadedly connected with the bolt.

[0017] Preferably, a mounting opening is provided on the top of the substrate, and a through hole is provided inside the mounting opening;

[0018] The mounting opening is convenient for laying out electronic circuits and for connecting and sealing the substrate and the housing, and the perforation is convenient for passing the connecting wires.

[0019] Preferably, a mounting groove is provided on the top of the substrate, and a sealing ring is fixedly connected to the bottom of the shell;

[0020] The mounting groove is located at the top of the base plate close to the outer surface, and the sealing ring is inserted into the mounting groove.

[0021] Preferably, a first fixing frame is installed on one side of one of the installation frames, and a ventilation hole is opened on the other side of the first fixing frame;

[0022] The ventilation holes facilitate air circulation.

[0023] Preferably, two first filter cottons are installed inside the first fixing frame, and a second fixing frame is fixedly connected to the other side of the other fixing frame;

[0024] The first filter cotton can filter dust and absorb water vapor, and the heat dissipation fan corresponds to the space inside the second fixing frame.

[0025] Preferably, a second filter cotton is installed inside the second fixing frame, and a plurality of heat dissipation fans are installed inside the second fixing frame via a mounting frame;

[0026] The cooling fan has an exhaust effect, the second filter cotton has the same function as the first filter cotton, and the other side of the second fixing frame is also provided with air holes.

[0027] Compared with the related art, the organic substrate metal shell provided by the present invention has the following beneficial effects:

[0028] The present invention provides an organic substrate metal shell plate. In order to reduce the difficulty and cost of antenna layout outside a radar chip, an electronic circuit is arranged on the top of the substrate, and components and chip particles are installed on the substrate through connecting pieces and thin wires. A pad board with pads is installed on the bottom of the substrate, and the pads are connected through connecting wires and connecting pieces. A shell is installed on the top of the substrate, which can seal the top of the substrate, thereby sealing the components, chip particles, connecting pieces and thin wires on the top of the substrate, so that the chip can be protected and the signal can be received and transmitted at the same time. The metal shell is used instead of the antenna, which reduces the steps of manual layout. The design reduces the difficulty of radar chip layout and reduces the material and time costs of antenna layout. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic structural diagram of a first embodiment of an organic substrate metal shell provided by the present invention;

[0030] Figure 2 A schematic diagram of the structure of an electronic circuit is provided for the present invention;

[0031] Figure 3 The present invention provides Figure 2 An enlarged view of point A is shown;

[0032] Figure 4A schematic structural diagram of a second embodiment of an organic substrate metal shell provided by the present invention;

[0033] Figure 5 A structural schematic diagram of a first fixing frame is provided for the present invention;

[0034] Figure 6 A structural schematic diagram of a mounting port is provided for the present invention;

[0035] Figure 7 The present invention provides Figure 6 An enlarged view of point B is shown;

[0036] Figure 8 A structural schematic diagram of a second filter cotton is provided for the present invention.

[0037] Numbers in the figure: 1. substrate, 2. pad board, 3. shell, 4. ink plate, 5. ink characters, 6. connecting wires, 7. mounting frame, 8. electronic circuit, 9. pads, 10. chip particles, 11. welding head, 12. fine wires, 13. connecting pieces, 14. components, 15. fixing blocks, 16. docking blocks, 17. first fixing frame, 18. mounting frame, 19. bolts, 20. second fixing frame, 21. mounting opening, 22. mounting groove, 23. perforation, 24. sealing ring, 25. air vents, 26. first filter cotton, 27. second filter cotton, 28. cooling fan. DETAILED DESCRIPTION

[0038] The present invention will be further described below in conjunction with the accompanying drawings and implementation modes.

[0039] Please refer to Figure 1 , Figure 2 , Figure 3 ,in, Figure 1 A schematic structural diagram of a first embodiment of an organic substrate metal shell provided by the present invention; Figure 2 A schematic diagram of the structure of an electronic circuit is provided for the present invention; Figure 3 The present invention provides Figure 2 The enlarged view of point A is shown. The organic substrate metal shell plate comprises: a substrate 1;

[0040] A pad board 2, wherein the pad board 2 is mounted on the bottom of the substrate 1, and a plurality of pads 9 are arranged on the pad board 2;

[0041] An electronic circuit 8, wherein the electronic circuit 8 is arranged on the top of a substrate 1, a plurality of connecting pieces 13 are arranged on the top of the substrate 1, a chip particle 10 is arranged on the top of the substrate 1, a plurality of fine wires 12 are arranged on the top of the chip particle 10 through a welding head 11, a component 14 is arranged on the top of the substrate 1, a shell 3 is arranged on the top of the substrate 1, a connecting wire 6 is arranged at the bottom of each connecting piece 13, the chip particle is fixed on the metal substrate on the top of the substrate 1 through a solid crystal process, the shell 3 is a metal or alloy shell made by a stamping metal processing method, the substrate 1 is a single-layer double-sided copper-clad base material, and the fine wire 12 is a gold wire;

[0042] The electronic circuit 8 and the connecting piece 13 are used to install the components 14 and the chip particles 10. The thin wire 12 can connect the chip particles 10 and the connecting piece 13. The materials of the connecting wire 6 and the thin wire 12 are the same. A series of conventional PCB manufacturing processes are carried out on the top of the substrate 1 according to the designed circuits, holes and pads. The components 14 are welded through the SMT patch welding process and welded to the internal wire surface of the chip. The top of the substrate 1 is to the wire surface, and the thin wire 12 is used for wire bonding. The metal welding pad on the chip particle 10 is welded and connected to the inner pin on the lead frame through gold wire. The other end of the connecting wire 6 is connected to the pad 9. The shell 3 of the metal or alloy shell to be used as the antenna is welded to the internal wire surface of the chip and used as the antenna of the radar. The substrate 1 can be a synthetic fiber hard board or a ceramic substrate.

[0043] The top of the housing 3 is fixedly connected with an ink plate 4, and the top of the ink plate 4 is provided with ink characters 5;

[0044] Printing process: The chip model or text is formed on the A or B side by ink silk screen printing or laser engraving, and the side where the chip pad is arranged is coated with ink to achieve the purpose of surface protection against welding, oxidation and scratching.

[0045] The working principle of the organic substrate metal shell provided by the present invention is as follows:

[0046] An electronic circuit 8 is arranged on the top of the substrate 1, and components 14 and chip particles 10 are installed on the substrate 1 through connecting pieces 13 and thin wires 12. A pad board 2 with pads 9 is installed on the bottom of the substrate 1, and the pads 9 are connected to the connecting pieces 13 through connecting wires 6. A shell 3 is installed on the top of the substrate 1, which can seal the top of the substrate 1, so that the components 14, chip particles 10, connecting pieces 13 and thin wires 12 on the top of the substrate 1 can be sealed. The shell 3 with a metal shell is used as a packaging protective shell for the chip and also makes it a radar antenna. Some common chip and circuit production processes are adopted, but the processes are cleverly combined. Through these comprehensive processes, a structure, a manufacturing method and a process of a radar chip with a built-in antenna can be produced, which can protect the chip while playing the effect of signal reception and transmission, and the metal shell 3 is used instead of the antenna, which reduces the steps of manual laying.

[0047] Compared with the related art, the organic substrate metal shell provided by the present invention has the following beneficial effects:

[0048] In order to reduce the difficulty and cost of antenna layout outside the radar chip, an electronic circuit 8 is arranged on the top of the substrate 1, and the components 14 and chip particles 10 are installed on the substrate 1 through the connecting piece 13 and the thin wire 12. A pad board 2 with a pad 9 is installed at the bottom of the substrate 1, and the pad 9 is connected to the connecting piece 13 through the connecting wire 6. A shell 3 is installed on the top of the substrate 1, which can seal the top of the substrate 1, so that the components 14, chip particles 10, connecting piece 13 and thin wire 12 on the top of the substrate 1 can be sealed. The shell 3 with a metal shell is used as a packaging protective shell of the chip, and it also makes it a radar antenna. Some common chip and circuit production processes are adopted, but the processes are cleverly combined. Through these comprehensive processes, a structure, a manufacturing method and a process of a radar chip with a built-in antenna can be produced, which can protect the chip while playing the effect of signal reception and transmission. The metal shell 3 is used instead of the antenna, which reduces the steps of manual laying. The design reduces the difficulty of laying the radar chip and reduces the material and time costs of laying the antenna.

[0049] Second embodiment

[0050] Please refer to Figure 4-Figure 5 - Figure 6-Figure 7 - Figure 8 , Figure 4 A schematic structural diagram of a second embodiment of an organic substrate metal shell provided by the present invention; Figure 5 A structural schematic diagram of a first fixing frame is provided for the present invention;

[0051] Figure 6 A structural schematic diagram of a mounting port is provided for the present invention; Figure 7 The present invention provides Figure 6 An enlarged view of point B is shown; Figure 8 The present invention provides a schematic diagram of the structure of the moisture absorbing plate; based on the organic substrate metal shell provided in the first embodiment of the present application, the second embodiment of the present application proposes another organic substrate metal shell. The second embodiment is only a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0052] Specifically, the difference of the organic substrate metal shell provided in the second embodiment of the present application is that the front and back of the substrate 1 are both fixedly connected to two fixing blocks 15 at the top, and the front and back of the shell 3 are both fixedly connected to a mounting frame 18;

[0053] The top of the fixing block 15 is provided with a threaded hole, and the opening on the mounting frame 18 passes through the housing 3 .

[0054] Two docking blocks 16 are fixedly connected to the front and back of the housing 3 at the bottom, and bolts 19 are installed on the tops of the docking blocks 16;

[0055] The bolt 19 is threadedly passed through the docking block 16 and the top of the fixing block 15 for threaded connection, and the docking block 16 and the fixing block 15 are located correspondingly.

[0056] The top of the substrate 1 is provided with a mounting opening 21, and each of the mounting openings 21 has a through hole 23 formed therein;

[0057] The mounting opening 21 is for arranging the electronic circuit 8 , and the through hole 23 is for passing the connecting wire 6 .

[0058] A mounting groove 22 is provided on the top of the base plate 1, and a sealing ring 24 is fixedly connected to the bottom of the housing 3;

[0059] The mounting groove 22 is located at the top of the substrate 1 close to the outer surface. The sealing ring 24 is inserted into the mounting groove 22 to achieve a sealing effect. The sealing ring 24 is made of silicone or rubber material.

[0060] A first fixing frame 17 is installed on one side of one of the installation frames 18, and a vent hole 25 is opened on the other side of the first fixing frame 17;

[0061] The ventilation holes 25 are used to assist ventilation.

[0062] Two first filter cottons 26 are installed inside the first fixing frame 17, and a second fixing frame 20 is fixedly connected to the other side of the other mounting frame 18;

[0063] The first filter cotton 26 can filter dust and absorb water vapor. The other side of the second fixing frame 20 is also provided with air holes 25 .

[0064] A second filter cotton 27 is installed inside the second fixing frame 20, and a plurality of cooling fans 28 are installed inside the second fixing frame 20 through a mounting frame 7;

[0065] The heat dissipation fan 28 corresponds to the space inside the second fixing frame 20 , and the heat dissipation fan 28 has an exhaust effect. The second filter cotton 27 has the same function as the first filter cotton 26 .

[0066] Compared with the related art, the organic substrate metal shell provided by the present invention has the following beneficial effects:

[0067] In order to facilitate the disassembly of the shell 3 and increase the heat dissipation effect of the shell 3, an open mounting frame 18 is installed on the front and back of the shell 3. After that, it is only necessary to install the first fixing frame 17 and the second fixing frame 20 on the two mounting frames 18 respectively, and two first filter cottons 26 are installed inside the first fixing frame 17, and a plurality of miniature cooling fans 28 are installed inside the second fixing frame 20 through the mounting frame 7. At the same time, a second filter cotton 27 is installed inside the second fixing frame 20, which can ensure that dust and moisture will not enter the interior of the shell 3 with the air. Finally, it is only necessary to connect the docking block 16 on the shell 3 with the fixing block 15 on the substrate 1 through the bolts 19. In order to increase the sealing of the shell 3 and the substrate 1, it is only necessary to insert the sealing ring 24 at the bottom of the shell 3 into the mounting groove 22 on the substrate 1. When the shell 3 needs to be disassembled, it is only necessary to remove four bolts 19 to remove the shell 3. This design reduces the difficulty of the shell 3, and at the same time increases the ventilation and heat dissipation functions of the shell 3 to ensure the internal working temperature of the shell 3.

[0068] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. Organic substrate metal shell version, characterized in that: include: substrate; A pad board, the pad board is mounted on the bottom of the substrate, and a plurality of pads are arranged on the pad board; An electronic circuit is arranged on the top of a substrate, a plurality of connecting pieces are arranged on the top of the substrate, a chip particle is arranged on the top of the substrate, a plurality of fine wires are arranged on the top of the chip particle through a welding head, components are arranged on the top of the substrate, a shell is arranged on the top of the substrate, a connecting wire is arranged on the bottom of each connecting piece, the chip particles are fixed on the metal substrate on the top of the substrate through a solid crystal process, the shell is a metal or alloy shell made by a stamping metal processing method, the substrate is single-layered and double-sided copper-clad as the basic material, and the fine wires are gold wires.

2. The organic substrate metal shell according to claim 1, characterized in that: The top of the shell is fixedly connected with an ink plate, and the top of the ink plate is provided with ink characters.

3. The organic substrate metal shell according to claim 1, characterized in that: Two fixing blocks are fixedly connected to the top positions of the front and back sides of the substrate, and mounting frames are fixedly connected to the front and back sides of the shell.

4. The organic substrate metal shell according to claim 1, characterized in that: Two docking blocks are fixedly connected to the bottom of the front and back sides of the shell, and bolts are installed on the tops of the docking blocks.

5. The organic substrate metal shell according to claim 1, characterized in that: The top of the base plate is provided with a mounting opening, and the inside of the mounting opening is provided with a through hole.

6. The organic substrate metal shell according to claim 1, characterized in that: A mounting groove is provided on the top of the base plate, and a sealing ring is fixedly connected to the bottom of the shell.

7. The organic substrate metal shell according to claim 5, characterized in that: A first fixing frame is installed on one side of one of the installation frames, and a ventilation hole is opened on the other side of the first fixing frame.

8. The organic substrate metal shell according to claim 7, characterized in that: Two first filter cottons are installed inside the first fixing frame, and a second fixing frame is fixedly connected to the other side of the other fixing frame.

9. The organic substrate metal shell according to claim 8, characterized in that: A second filter cotton is installed inside the second fixing frame, and a plurality of heat dissipation fans are installed inside the second fixing frame via a mounting frame.

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