Heat dissipation assembly and power conversion equipment

Abstract

The invention provides a heat dissipation assembly and power conversion equipment. The power conversion equipment comprises a shell, a power device and a heat dissipation assembly. The shell comprises a first cavity and a second cavity which are arranged at an interval in the first direction. The shell is provided with an air inlet hole and an air outlet hole which are communicated with the second cavity. The power device is accommodated in the first cavity. The radiator comprises a radiator body contained in the second cavity and a working medium pump. The radiator comprises a radiating substrate, a plurality of condensing flat pipes and a communicating part. The heat dissipation substrate comprises a first cavity and a second cavity which are divided by a partition part, and in the first direction, the first cavity is located on the side, close to the power device, of the second cavity. And a through hole communicated with the first chamber and the second chamber is formed in the top of the separation part. The multiple condensation flat pipes are communicated with one another through the communicating parts, communicate with the second cavity and are located between the air inlet holes and the air outlet holes. The first cavity, the second cavity and the condensation flat pipe are all used for containing cooling working media, and the working medium pump is used for driving the cooling working media to flow to the first cavity. And miniaturization is facilitated.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a heat dissipation component and a power conversion device. Background Art

[0002] In the existing power conversion equipment, the power device is accommodated in the first cavity of the shell, the evaporator and the condenser are accommodated in the second cavity of the shell, and the evaporator and the condenser are connected by a pipeline. The evaporator accommodates the cooling medium. The heat generated by the power device during operation can be transferred to the cooling medium in the evaporator, and the cooling medium absorbs heat and boils to form a gaseous cooling medium. The gaseous cooling medium is transferred to the condenser and then releases heat and condenses. The liquid cooling medium in the condenser then flows back to the evaporator, and the heat dissipation of the power device is achieved through the gas-liquid two-phase circulation of the cooling medium. However, the existing gas-liquid two-phase conversion of the cooling medium by gravity requires the condenser to be set higher than the evaporator and the power device. The evaporator and the condenser occupy a large volume, resulting in low space utilization of the power conversion equipment, which is not conducive to the miniaturization design of the power conversion equipment. Summary of the invention

[0003] The present application provides a heat dissipation component and a power conversion device, aiming to solve the problem that the power conversion device is not conducive to miniaturization design.

[0004] In the first aspect, an embodiment of the present application provides a power conversion device. The power conversion device includes: a housing, a power device, and a heat dissipation assembly. The housing includes a first cavity and a second cavity. In the first direction, the first cavity and the second cavity are arranged at intervals. The housing is provided with a connecting hole, an air inlet hole, and an air outlet hole. The connecting hole is connected to the first cavity and the second cavity. The air inlet hole and the air outlet hole are both connected to the second cavity. The first direction is different from the gravity direction. The power device is accommodated in the first cavity. The heat dissipation assembly includes a radiator and a working fluid pump. The radiator is accommodated in the second cavity. The radiator includes a heat dissipation substrate, a plurality of condensation flat tubes, and a connecting portion; wherein the heat dissipation substrate contacts the power device through the connecting hole, and covers the connecting hole to close the first cavity. The heat dissipation substrate includes a first chamber and a second chamber divided by a partition. In the first direction, the first chamber is located on the side of the second chamber close to the power device. In the gravity direction, a through hole is provided on the top of the partition, and the first chamber is connected to the second chamber through the through hole. A plurality of condensation flat tubes are located on a side of the heat dissipation substrate away from the power device and are arranged at intervals. The plurality of condensation flat tubes are interconnected through a connecting portion, and the second chamber is connected to the plurality of condensation flat tubes. The condensation flat tubes are located between the air inlet and the air outlet. The first chamber, the second chamber, and the condensation flat tubes are all used to accommodate a cooling medium for gas-liquid two-phase conversion, and the working medium pump is used to drive the liquid cooling medium to flow to the first chamber.

[0005] In the above implementation scheme, the heat generated by the power device when working is transferred to the radiator, and the external airflow can flow into the second cavity from the air inlet, and then flow out of the second cavity from the air outlet through the radiator to achieve heat dissipation of the power device. Among them, the heat generated by the power device when working is transferred to the liquid cooling medium in the first chamber, and the cooling medium absorbs heat and boils to form a gaseous cooling medium. The gaseous cooling medium flows from the first chamber through the through hole at the top to the second chamber, and then flows to the connecting part through multiple condensation flat tubes. The gaseous cooling medium releases heat and condenses to form a liquid cooling medium. The liquid cooling medium accumulates in the first chamber, the condensation flat tube and the connecting part under the action of gravity. The heat transferred from the power device to the cooling medium can be transferred to the external environment through the airflow flowing through the radiator, thereby achieving heat dissipation of the power device through the gas-liquid two-phase conversion of the cooling medium. In the embodiment of the present application, the working medium pump can recycle the cooling medium to ensure that the liquid cooling medium in the first chamber always has a sufficient amount. Combined with the partition, the first chamber used for evaporation is isolated from other chambers, and the working fluid pump can drive the liquid cooling medium from the second chamber or the connecting part to the first chamber through the working fluid pump, so that the liquid level of the liquid cooling medium in the first chamber and the second chamber can be controlled by the working fluid pump. In other words, the parameters of the working fluid pump can be set as needed so that the liquid level of the liquid cooling medium in the first chamber can meet the product requirements. For example, when there are more power devices, the liquid level of the liquid cooling medium in the first chamber can be higher, and the liquid level of the liquid cooling medium in the first chamber can be lower, so that more power devices can be attached to the heat dissipation substrate and dissipate heat through the cooling medium in the first chamber. Among them, the liquid level refers to the height of the surface of the liquid medium in the equipment and the container.

[0006] Compared with the prior art, the present application integrates the functions of the evaporator and the condenser through the radiator, which can avoid the need to set up complex pipelines between the evaporator and the condenser by welding or bonding, etc., which is conducive to reducing the structural complexity of the radiator, improving the structural stability and reliability of the radiator, and reducing the volume of the radiator. Moreover, the design of combining gravity with a working fluid pump to achieve the gas-liquid two-phase conversion of the cooling working fluid and the recycling of the cooling working fluid in the present application is conducive to reducing the influence of gravity on the design of the radiator. The bottom wall of the second chamber may not be higher than the bottom wall of the first chamber, and the setting of the second chamber may not consider the position of the power device. The bottom wall of the second chamber may not be higher than the power device, which is conducive to reducing the volume of the radiator and improving the space utilization of the power conversion equipment. In addition, it is also convenient for more flexible arrangement of power devices, as long as the liquid level of the first chamber is adjusted by the working fluid pump to cover the power device.

[0007] Furthermore, since the working fluid pump only needs to overcome the flow resistance of the liquid cooling working fluid flowing from the second chamber or the connecting part through the working fluid pump to the first chamber, the pressure head and life requirements of the working fluid pump are low, and the processing cost of the working fluid pump is low, which is beneficial to reducing the heat dissipation cost, reducing the processing cost of the power conversion equipment, and increasing the speed of the gas-liquid two-phase conversion of the cooling working fluid, which is beneficial to improving the heat dissipation efficiency of the power device.

[0008] In a possible implementation manner, in the gravity direction, the liquid level of the liquid coolant in the first chamber is higher than the power device.

[0009] In the above implementation scheme, the liquid level of the liquid cooling medium in the first chamber is higher than the design of the power device, which is beneficial to improve the efficiency of transferring the heat generated by the power device during operation to the liquid cooling medium in the first chamber, and is beneficial to improving the heat dissipation efficiency of the power device.

[0010] In a possible implementation manner, in the gravity direction, the liquid level of the liquid coolant in the first chamber is higher than the liquid coolant in the second chamber.

[0011] In the above implementation scheme, the working fluid pump can drive more liquid working fluid to flow into the first chamber, so that the liquid working fluid in the first chamber is higher, thereby covering more power devices, allowing more power devices to contact the heat dissipation substrate and dissipate heat through the heat sink, thereby reducing the volume of the power converter and improving the heat dissipation efficiency.

[0012] In a possible implementation manner, in the gravity direction, a projection of the through hole in the first direction is located above a projection of the power device in the first direction.

[0013] In the above implementation scheme, in the gravity direction, the projection of the through hole in the first direction is located above the projection of the power device in the first direction. In the process of driving the liquid level of the liquid cooling medium in the first chamber to be higher than the power device, the liquid cooling medium in the first chamber is avoided from flowing from the through hole to the second chamber. This is conducive to reducing the difficulty of driving the liquid level of the liquid cooling medium in the first chamber to be higher than the power device, and is conducive to improving the heat dissipation efficiency of the power device.

[0014] In a possible implementation, the working fluid pump is located outside the radiator, the working fluid pump includes an inlet and an outlet, the power conversion device also includes an input pipe body and an output pipe body, the inlet of the working fluid pump is connected to the second chamber or the connecting part through the input pipe body, and the outlet of the working fluid pump is connected to the first chamber through the output pipe body.

[0015] In the above implementation scheme, the working fluid pump is located outside the radiator, the inlet of the working fluid pump is connected to the second chamber or the connecting part through the input pipe body, and the outlet of the working fluid pump is connected to the first chamber through the output pipe body. This design facilitates maintenance and replacement of the working fluid pump, helps to reduce the maintenance cost of the radiator, and helps to reduce the maintenance cost of the power conversion equipment.

[0016] The design in which the inlet of the working fluid pump is connected to the second chamber through the input pipe body is beneficial to reducing the structural complexity and length of the input pipe body, reducing the material cost of the radiator, reducing the structural complexity of the radiator, improving the structural reliability of the radiator, and improving the efficiency of the cooling working fluid flowing from the second chamber to the first chamber through the working fluid pump, which is beneficial to improving the heat dissipation efficiency of the power device.

[0017] In addition, the power conversion device can be installed on various bearing surfaces, and the design that the inlet of the working fluid pump is connected to the second chamber or the connecting part through the input pipe body can adapt to various installation scenarios of the power conversion device.

[0018] When the power conversion device is installed on a bearing surface (for example, mounted on a wall perpendicular to the horizontal plane), and the first direction is perpendicular to the direction of gravity, the liquid cooling medium formed by heat release and condensation can be accumulated at the bottom of the second chamber under the action of gravity, and a large amount of cooling medium is stored at the bottom of the second chamber. In this case, the working medium pump can stably drive the liquid cooling medium from the second chamber to the first chamber through the working medium pump through the input pipe body connected to the second chamber, which is conducive to improving the reliability and stability of heat dissipation of the power device.

[0019] When the power conversion device is installed on a bearing surface (for example, mounted on a wall inclined to a horizontal plane), and the second chamber is located below the connecting portion in the direction of gravity, the liquid cooling medium formed by heat release and condensation can be accumulated at the bottom of the second chamber under the action of gravity, and a large amount of the cooling medium is stored at the bottom of the second chamber. In this case, the working medium pump can stably drive the liquid cooling medium from the second chamber to the first chamber through the working medium pump through the input pipe body connected to the second chamber, which is conducive to improving the reliability and stability of heat dissipation of the power device.

[0020] When the power conversion device is installed on a bearing surface (for example, mounted on a wall inclined to the horizontal plane), the second chamber is located above the connecting portion in the direction of gravity, the first direction is inclined to the horizontal plane, and the angle between the first direction and the horizontal plane is less than 30°, under the action of gravity, the liquid cooling medium formed by heat release and condensation can accumulate at the bottom of the second chamber, and a large amount of cooling medium is stored at the bottom of the second chamber. In this case, the working medium pump can stably drive the liquid cooling medium from the second chamber to the first chamber through the working medium pump through the input pipe body connected to the second chamber, which is conducive to improving the reliability and stability of heat dissipation of the power device.

[0021] When the power conversion device is installed on a bearing surface (for example, mounted on a wall inclined to the horizontal plane), and the second chamber is located above the connecting portion in the direction of gravity, the liquid cooling medium formed by heat release and condensation accumulates at the bottom of the connecting portion under the action of gravity, and a large amount of the cooling medium is stored at the bottom of the connecting portion. In this case, the working medium pump can stably drive the liquid cooling medium from the connecting portion through the working medium pump to the first chamber through the input pipe body connected to the connecting portion, which is conducive to improving the reliability and stability of heat dissipation of the power device.

[0022] In a possible implementation, the radiator is further provided with an input tube mounting hole and an output tube mounting hole. In the direction of gravity, the input tube mounting hole is located below the second chamber or the connecting portion, and the output tube mounting hole is located below the first chamber. The working fluid pump is located below the radiator, the input tube is inserted into the input tube mounting hole, and the output tube is inserted into the output tube mounting hole.

[0023] In the above implementation scheme, since the liquid cooling medium formed by exothermic condensation accumulates at the bottom of the first chamber, the bottom of the second chamber, the bottom of the condensation flat tube and the bottom of the connecting part under the action of gravity, the design of the working fluid pump being located below the radiator is beneficial to reducing the structural complexity and length of the input pipe body connected to the second chamber (or connecting part) and the inlet of the working fluid pump, and is beneficial to reducing the structural complexity and length of the output pipe body connected to the first chamber and the outlet of the working fluid pump, which is beneficial to reducing the material cost of the radiator, reducing the structural complexity of the radiator, and improving the structural reliability of the radiator.

[0024] In a possible implementation manner, in the gravity direction, a mounting hole is further provided at the bottom of the partition, the mounting hole is communicated with the first chamber and the second chamber, and the working fluid pump is accommodated in the mounting hole.

[0025] In the above implementation scheme, the design of accommodating the working fluid pump in the mounting hole and integrating the working fluid pump into the radiator can avoid the connection between the working fluid pump and the radiator through pipes, which is beneficial to improving the structural reliability between the working fluid pump and the radiator, and is beneficial to reducing the difficulty of accommodating the radiator and the working fluid pump in the second cavity, which is beneficial to improving the space utilization rate of the second cavity and reducing the processing cost of the power conversion equipment.

[0026] In a possible implementation, the connecting portion includes a flow cavity, the connecting portion is located on a side of the plurality of condensation flat tubes facing away from the heat dissipation substrate, the connecting portion is fixedly connected to the plurality of condensation flat tubes, and the flow cavity is connected to the plurality of condensation flat tubes.

[0027] In the above implementation scheme, the multiple condensation flat tubes are interconnected through the flow cavity. The connecting portion is located on the side of the multiple condensation flat tubes facing away from the heat dissipation substrate. The design of the connecting portion being fixedly connected to the multiple condensation flat tubes is conducive to improving the stability of the spacing arrangement of the multiple condensation flat tubes, and is conducive to improving the structural stability and reliability of the radiator.

[0028] In a possible implementation, a plurality of condensation flat tubes are sequentially spaced apart along a second direction to form ventilation holes, and the second direction is perpendicular to the first direction and the direction of gravity.

[0029] In the above implementation scheme, the external airflow can flow into the second cavity from the air inlet, and then flow through the ventilation holes through the multiple condensation flat tubes and out of the second cavity from the air outlet, so as to transfer the heat generated by the power device during operation to the external environment. The design of multiple condensation flat tubes being arranged in sequence along the second direction to form ventilation holes is conducive to increasing the contact area between the multiple condensation flat tubes and the external airflow, and is conducive to improving the heat dissipation efficiency of the power device. In addition, the structure is simple and stable, easy to design, and is conducive to reducing the processing cost of the radiator.

[0030] In a possible implementation, in the direction of gravity, a plurality of condensation flat tubes are located between the air inlet and the air outlet.

[0031] In the above implementation scheme, the design that multiple condensation flat tubes are located between the air inlet and the air outlet in the gravity direction is conducive to reducing the flow resistance of the external airflow flowing from the air inlet into the second cavity through the ventilation holes through the multiple condensation flat tubes, which is conducive to improving the heat dissipation efficiency of the multiple condensation flat tubes and the heat dissipation efficiency of the power devices.

[0032] In a possible implementation manner, a heat dissipation fin is further provided between two adjacent condensation flat tubes, and the heat dissipation fin is in contact with and fixedly connected to the two adjacent condensation flat tubes.

[0033] In the above implementation scheme, the external airflow can flow through the heat dissipation housing from the ventilation holes between two adjacent condensation flat tubes to transfer the heat generated by the power device during operation to the external environment, thereby achieving heat dissipation of the power device. The design of the heat dissipation fins is conducive to increasing the contact area between the condensation flat tubes and the external airflow, which is conducive to improving the heat dissipation efficiency of the condensation flat tubes and the heat dissipation efficiency of the power device.

[0034] In a possible implementation, each condensation flat tube includes a plurality of flow channels extending along a first direction, adjacent flow channels are separated by baffles, and the plurality of flow channels are connected to the second chamber and the connecting portion.

[0035] In the above implementation scheme, dividing the interior of the condensation flat tube into multiple flow channels can evenly disperse the pressure generated by the gaseous working medium in each flow channel, and the baffle can also withstand a certain pressure to avoid bulging problems, thereby improving the stability of the entire condensation flat tube and improving the structural stability and reliability of the radiator.

[0036] In a possible embodiment, a reinforcement portion is further provided in the second chamber, so that the second chamber is divided into a first sub-chamber and a second sub-chamber. In the direction of gravity, the first sub-chamber is located above the second sub-chamber, and the first sub-chamber is connected to the first chamber through a through hole; the first sub-chamber is connected to the connecting portion through a portion of the flow channel, and the second sub-chamber is connected to the connecting portion through another portion of the flow channel.

[0037] In the above implementation scheme, the heat generated by the power device during operation is transferred to the liquid cooling medium in the first chamber. The liquid cooling medium in the first chamber absorbs heat and boils to form a gaseous cooling medium. The gaseous cooling medium flows from the first chamber to the first sub-chamber through the through hole, and then flows from the first sub-chamber to the connecting part through a part of the flow channel. The gaseous cooling medium releases heat and condenses in the first sub-chamber, the flow channel between the first sub-chamber and the connecting part, and the connecting part to form a liquid cooling medium. The liquid cooling medium flows to the connecting part under the action of gravity. The second sub-chamber, the connecting part, and the flow channel between the connecting part and the second sub-chamber all contain liquid cooling medium. The design of the reinforcement part is conducive to improving the strength of the cavity wall of the second chamber, improving the structural stability and reliability of the heat dissipation substrate, and improving the structural stability and reliability of the radiator.

[0038] In a possible embodiment, the first chamber also includes multiple channels, and the multiple channels are separated by partition plates. In the first direction, each partition plate is fixedly connected to the cavity wall and partition portion of the first chamber, and each channel is connected to the through hole. The projection of the power device in the first direction overlaps with the projection of the multiple channels in the first direction.

[0039] In the above implementation scheme, liquid cooling medium is contained in multiple channels. The heat generated by the power device during operation is transferred to the liquid cooling medium in multiple channels. The liquid cooling medium in multiple channels absorbs heat and boils to form a gaseous cooling medium. The gaseous cooling medium flows to the second chamber through the through hole. The gaseous cooling medium releases heat and condenses to form a liquid cooling medium. The fluid pump drives the liquid cooling medium to flow to multiple channels in the first chamber through the fluid pump. Dividing the inner part of the first chamber into multiple channels by a partition plate can evenly disperse the pressure generated by the liquid working medium in each channel, and the partition plate can also withstand a certain pressure, so that the stability of the entire heat dissipation substrate is better, which is conducive to improving the structural stability and reliability of the radiator.

[0040] In a possible implementation, a plurality of partition plates are sequentially spaced apart along a second direction, the channel extends along a gravity direction, and the second direction is perpendicular to the first direction and the gravity direction.

[0041] In the above implementation scheme, the design of the channel extending along the direction of gravity is conducive to reducing the flow resistance of the liquid cooling medium flowing in the channel, reducing the difficulty of driving the liquid level of the liquid cooling medium higher than the power device, reducing the pressure head requirements and life requirements for the working fluid pump, reducing the processing cost of the working fluid pump, and reducing the processing cost of the power conversion equipment.

[0042] In a possible implementation, a plurality of partition plates are sequentially spaced apart along the direction of gravity, and the channel extends along a second direction, which is perpendicular to the first direction and the direction of gravity.

[0043] In the above implementation scheme, the design of the channel extending along the second direction is conducive to increasing the difficulty of the liquid cooling medium flowing from the channel through the through hole to the second chamber, is conducive to keeping the liquid cooling medium always higher than the power device, is conducive to improving the efficiency of transferring the heat generated by the power device during operation to the cooling medium, and is conducive to improving the heat dissipation efficiency of the power device.

[0044] In a possible embodiment, the multiple channels include multiple first channels and multiple second channels. In the direction of gravity, the multiple second channels and the multiple first channels are arranged in sequence, one end of each first channel is connected to one end of each second channel, and the other end of each second channel is connected to the through hole.

[0045] In the above implementation, the working fluid pump drives the cooling working fluid to flow through each first channel first and then through each second channel, which guides the flow of the cooling working fluid in the first chamber, which is conducive to reducing the difficulty of the liquid level of the cooling working fluid in the first chamber being higher than each power device, and is conducive to reducing the pressure head requirements and life requirements for the working fluid pump, which is conducive to reducing the processing cost of the working fluid pump and the processing cost of the power conversion device. Moreover, the structure of the first chamber is diverse and the design cost is low, which is conducive to reducing the processing cost of the power conversion device.

[0046] In the second aspect, the embodiment of the present application also provides a heat dissipation component for heat exchange with a power device. The heat dissipation component includes a radiator and a working fluid pump, the radiator includes a heat dissipation substrate, a plurality of condensation flat tubes and a connecting portion; wherein the heat dissipation substrate exchanges heat with the power device; the heat dissipation substrate includes a first chamber and a second chamber divided by a partition, in a first direction, the first chamber is located on a side of the second chamber close to the power device, and the first direction is different from the direction of gravity. In the direction of gravity, a through hole is provided on the top of the partition, and the first chamber is connected to the second chamber through the through hole. A plurality of condensation flat tubes are located on a side of the heat dissipation substrate away from the power device and are arranged at intervals, the plurality of condensation flat tubes are connected to each other through the connecting portion, and the second chamber is connected to a plurality of condensation flat tubes. The first chamber, the second chamber and the condensation flat tubes are all used to accommodate a cooling working fluid for gas-liquid two-phase conversion, and the working fluid pump is used to drive the liquid cooling working fluid to flow to the first chamber.

[0047] In the above implementation scheme, the heat dissipation component is applied to the power conversion equipment. The heat generated by the power device during operation is transferred to the liquid cooling medium in the first chamber. The cooling medium absorbs heat and boils to form a gaseous cooling medium. The gaseous cooling medium flows from the first chamber through the through hole to the second chamber, and then flows to the connecting part through a plurality of condensation flat tubes. The gaseous cooling medium releases heat and condenses to form a liquid cooling medium. The liquid cooling medium accumulates in the first chamber, the condensation flat tubes and the connecting part under the action of gravity. The heat dissipation of the power device is achieved by the gas-liquid two-phase conversion of the cooling medium. In the embodiment of the present application, the working fluid pump can recycle the cooling medium to ensure that there is always a sufficient amount of liquid cooling medium in the first chamber. Combined with the partition, the first chamber used for evaporation is isolated from other chambers, and the working fluid pump can drive the liquid cooling medium from the second chamber or the connecting part to the first chamber through the working fluid pump, so that the liquid level of the liquid cooling medium in the first chamber and the second chamber can be controlled by the working fluid pump. In other words, the parameters of the working fluid pump can be set as needed so that the liquid level of the liquid cooling medium in the first chamber can meet the product requirements. For example, when there are more power devices, the liquid level of the liquid cooling medium in the first chamber can be higher, and the liquid level of the liquid cooling medium in the first chamber can be lower, so that more power devices can be attached to the heat dissipation substrate and dissipate heat through the cooling medium in the first chamber.

[0048] Compared with the prior art, the present application integrates the functions of the evaporator and the condenser through the radiator, which is conducive to improving the integration of the radiator, reducing the structural complexity of the radiator, improving the structural stability and reliability of the radiator, reducing the volume of the radiator, and facilitating the miniaturization design of the power conversion device. Moreover, the design of combining gravity with the working fluid pump to realize the gas-liquid two-phase circulation of the cooling working fluid and the recycling of the cooling working fluid in the present application is conducive to reducing the influence of gravity on the design of the radiator, the bottom wall of the second chamber may not be higher than the bottom wall of the first chamber, the setting of the second chamber may not consider the position of the power device, and the bottom wall of the second chamber may not be higher than the power device, which is conducive to reducing the volume of the radiator, improving the space utilization rate of the power conversion device, and facilitating the miniaturization design of the power conversion device. In addition, it is not only conducive to reducing the design difficulty of the radiator and reducing the processing cost of the radiator, but also facilitates the more flexible arrangement of the power device, which is conducive to reducing the installation difficulty of the power device and the radiator, and is conducive to reducing the processing cost of the power conversion device.

[0049] In addition, since the working fluid pump only needs to overcome the flow resistance of the liquid cooling working fluid flowing from the second chamber or the connecting part through the working fluid pump to the first chamber, the pressure head and life requirements of the working fluid pump are low, and the processing cost of the working fluid pump is low, which is beneficial to reducing the heat dissipation cost, and is beneficial to increasing the speed of the gas-liquid two-phase conversion of the cooling working fluid, which is beneficial to improving the heat dissipation efficiency of the power device. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0051] Figure 1 It is a structural block diagram of the cooperation between the power conversion device provided in the embodiment of the present application and the photovoltaic module and the power grid;

[0052] Figure 2 yes Figure 1 A schematic diagram of the three-dimensional structure of the power conversion device shown;

[0053] Figure 3 yes Figure 2 The schematic diagram of the structure of the power conversion device shown is from another angle;

[0054] Figure 4 yes Figure 3 The schematic diagram of the structure of the power conversion device (cooling medium and heat exchanger omitted) cut along the AA line shown;

[0055] Figure 5 yes Figure 3 A schematic diagram of the structure of the heat dissipation assembly of the power conversion device (omitting the first fan, the heat exchanger and the second fan) and the power device;

[0056] Figure 6 yes Figure 5 The schematic diagram of the structure of the radiator shown is cut along the BB line;

[0057] Figure 7 yes Figure 5 The schematic diagram of the structure of the radiator shown is cut along the CC line;

[0058] Figure 8 yes Figure 3 The structure diagram of the power conversion device shown in another embodiment;

[0059] Fig. 9 yes Figure 3 The schematic diagram of the structure of the power conversion device shown in another embodiment;

[0060] Fig.10 yes Figure 2 The schematic diagram of the structure of the power conversion device shown in another embodiment;

[0061] Fig.11 yes Figure 3 The schematic diagram of the structure of the power conversion device shown is cut along the DD line;

[0062] Fig.12 is a structural schematic diagram of another power conversion device provided in an embodiment of the present application;

[0063] Fig.13 yes Fig.12 A schematic diagram of the structure of the heat dissipation assembly of the power conversion device (omitting the first fan, the heat exchanger and the second fan) and the power device;

[0064] Fig.14 is a structural schematic diagram of another power conversion device provided in an embodiment of the present application;

[0065] Fig.15 yes Fig.14 The schematic diagram of the partial structure of the power conversion device shown is cut along the EE line;

[0066] Fig.16 yes Fig.15 The schematic diagram of the structure of the power conversion device shown is cut along the FF line;

[0067] Fig.17 is a structural schematic diagram of another power conversion device provided in an embodiment of the present application;

[0068] Fig.18 yes Fig.17 A schematic diagram of the structure of the heat dissipation assembly of the power conversion device (omitting the first fan, the heat exchanger and the second fan) and the power device;

[0069] Fig.19 yes Fig.18 The schematic diagram of the structure of the radiator shown is cut along the GG line;

[0070] Fig. 20 is a structural schematic diagram of another power conversion device provided in an embodiment of the present application;

[0071] Fig.21 yes Fig. 20 The schematic diagram of the structure of the heat dissipation component (omitting the first fan, the heat exchanger and the second fan) of the power conversion equipment cooperates with the power device. DETAILED DESCRIPTION

[0072] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0073] See also Figure 1 , Figure 1 It is a structural block diagram of the cooperation between the power conversion device 100 provided in the embodiment of the present application, the photovoltaic component 200 and the power grid 300.

[0074] Exemplarily, the power conversion device 100 is a photovoltaic inverter. In some other embodiments, the power conversion device 100 may also be an electronic device for power conversion such as a rectifier, a transformer, a converter or other inverter. The power conversion device 100 is used to convert the direct current output by the photovoltaic component 200 into alternating current and supply it to the power grid 300. In some other embodiments, the power conversion device 100 can also be used to convert the direct current output by the photovoltaic component 200 into alternating current and supply it to the load device. The load device can be an electronic device that uses alternating current, including but not limited to a motor, a fan or an air conditioner. In some other embodiments, the power conversion device 100 can also be applied to an electric drive controller. For example, the power conversion device 100 can convert the direct current output by the battery into alternating current to supply the motor.

[0075] As the power of power conversion equipment increases, the heat generated by the circuit board components inside the power conversion equipment chassis also increases, resulting in an increase in the temperature inside the chassis, which is very unfavorable for the heat-generating components installed inside the chassis. In particular, for some power devices with high heat dissipation density, the failure risk of power devices increases significantly under the influence of continuous high temperature.

[0076] In the prior art, the heat generated by the power devices of the power conversion equipment during operation will be transferred to the liquid cooling medium in the evaporator. The cooling medium in the evaporator absorbs heat and boils. The gaseous cooling medium will be transferred to the condenser through the pipeline. The gaseous cooling medium will release heat and condense in the condenser to form a liquid cooling medium. The liquid cooling medium will flow back to the evaporator through the pipeline under the action of gravity, thus realizing the recycling of the cooling medium. The air flowing into the power conversion equipment flows through the condenser and then flows out of the power conversion equipment, thereby dissipating the heat of the power devices. The gas-liquid two-phase conversion of the cooling medium and the recycling of the cooling medium can stably dissipate the heat of the power devices. However, in order to ensure that the gaseous working fluid in the evaporator that absorbs the heat generated by the power devices during operation can flow into the condenser, and at the same time ensure that the liquid cooling working fluid in the condenser can flow back to the evaporator under the action of gravity, this heat dissipation method requires that the condenser be placed above the evaporator and the power devices. The condenser, evaporator and the pipelines between the two will occupy a large amount of space, resulting in low space utilization of the power conversion equipment, which is not conducive to the miniaturized design of the power conversion equipment.

[0077] In response to the above problems, the embodiments of the present application provide a heat dissipation component to replace the evaporator and condenser to dissipate heat from the power device, which not only simplifies the structure for heat dissipation, but also reduces the influence of gravity on the structure of the heat dissipation component by changing the way the cooling medium is recycled, thereby reducing the volume of the heat dissipation component, improving the space utilization of the power conversion equipment, and facilitating the miniaturization design of the power conversion equipment.

[0078] For ease of description, the present application defines three mutually perpendicular directions as a first direction (i.e., the X-axis direction shown in the figure), a second direction (i.e., the Z-axis direction shown in the figure) and a third direction (i.e., the Y-axis direction shown in the figure), and the first direction, the second direction and the third direction are mutually perpendicular. The first direction and the second direction are both different from the direction of gravity. In the present embodiment, the first direction is perpendicular to the direction of gravity. The first direction is parallel to the horizontal plane. The second direction is perpendicular to the first direction and the direction of gravity. The third direction is parallel to the direction of gravity, and the third direction is perpendicular to the horizontal plane. In some other embodiments, the third direction (i.e., the Y-axis direction shown in the figure) may also be inclined to the direction of gravity. The first direction (i.e., the X-axis direction shown in the figure) may not be perpendicular to the direction of gravity. The second direction (i.e., the Z-axis direction shown in the figure) may not be perpendicular to the direction of gravity. The horizontal plane refers to a plane perpendicular to the direction of gravity, that is, the horizontal plane is perpendicular to the direction of gravity.

[0079] See also Figure 2 , Figure 3 and Figure 4 , and combined with Figure 1 , Figure 2 yes Figure 1 The three-dimensional structural schematic diagram of the power conversion device 100 is shown. Figure 3 yes Figure 2The structure diagram of the power conversion device 100 shown is shown at another angle. Figure 4 yes Figure 3 The schematic diagram of the structure of the power conversion device 100 (cooling medium 41a and heat exchanger 60 are omitted) cut along the AA line. It should be understood that the above schematic diagrams are all position relationship diagrams of the power conversion device 100 in the working state when it is hung on the wall or placed on the ground, that is, the third direction in the figure (the Y-axis direction in the figure) is parallel to the gravity direction. During installation or transportation, the power conversion device 100 may be in other placement states, and the gravity direction may not be the gravity direction referred to in this patent application.

[0080] like Figure 2 , Figure 3 and Figure 4 As shown, the power conversion device 100 includes a housing 10, a power conversion circuit 20 and a heat dissipation component 30. The power conversion circuit 20 and the heat dissipation component 30 are both accommodated in the housing 10. The direct current output by the photovoltaic component 200 is transmitted to the power conversion circuit 20. The power conversion circuit 20 is used to convert the direct current output by the photovoltaic component into alternating current. The alternating current output by the power conversion circuit 20 is transmitted to the power grid 300 to supply the power grid 300. The heat dissipation component 30 is used to dissipate heat from the power conversion circuit 20.

[0081] Specifically, the housing 10 includes a first cavity 11 and a second cavity 12. In the X-axis direction (i.e., the first direction), the first cavity 11 and the second cavity 12 are spaced apart by an isolation cavity wall 13a. Specifically, the housing 10 includes an isolation cavity wall 13a, a first cavity wall 13b and a second cavity wall 13c, the first cavity wall 13b and the isolation cavity wall 13a are combined to form the first cavity 11, and the second cavity wall 13c and the isolation cavity wall 13a are combined to form the second cavity 12. The first cavity 11 is a closed cavity for accommodating power devices, and the second cavity 12 is an open and ventilated heat dissipation cavity. Among them, the housing 10 is provided with an air inlet 14 and an air outlet 15. The air inlet 14 and the air outlet 15 are both connected to the second cavity 12. External airflow can flow into the second cavity 12 from the air inlet 14, and then flow out of the second cavity 12 from the air outlet 15 to dissipate heat for the devices accommodated in the second cavity 12.

[0082] like Figure 1 and Figure 2As shown, the power conversion circuit 20 includes a power device 21, a circuit board 22, a magnetic device 23 and other electronic devices 24. In some embodiments, the power device 21, the circuit board 22 and other electronic devices 24 are all accommodated in the first cavity 11, and the magnetic device 23 is accommodated in the second cavity 12. The power device 21 and other electronic devices 24 are all installed on the circuit board 22. Specifically, the circuit board 22 is installed on the side of the power device 21 facing away from the second cavity 12, and the electronic device 24 is installed on the side of the circuit board 22 facing away from the power device 21. In some other embodiments, other electronic devices 24 may also be installed on the side of the circuit board 22 facing the power device 21. The magnetic device 23 is electrically connected to the circuit board 22. The power device 21 is a packaging module or device for converting the direct current output by the photovoltaic module 200 into alternating current. Exemplarily, the power device 21 may include but is not limited to an IGBT (Insulated Gate Bipolar Transistor) chip, an FRD (Fast Recovery Diode) chip or a Mosfet (Metal oxide semiconductor field-effect transistor) chip, etc. The magnetic device 23 cooperates with other electronic devices 24 to filter the current transmitted in the power conversion circuit 20. Exemplarily, the magnetic device 23 is an inductor and the other electronic device 24 is a capacitor. In some other embodiments, the other electronic device 24 may also be a fuse or other switching device.

[0083] like Figure 2 , Figure 3 and Figure 4 As shown, the heat dissipation assembly 30 includes a radiator 41 and a working fluid pump 42, and also includes a first fan 50, a heat exchanger 60 and a second fan 70. In some embodiments, the radiator 41, the working fluid pump 42, the first fan 50 and the heat exchanger 60 are all accommodated in the second cavity 12, and the second fan 70 is accommodated in the first cavity 11. The radiator 41 cooperates with the working fluid pump 42 to exchange heat with the power device 21. The heat exchanger 60 is used for heat exchange with the first cavity 11. The working fluid pump 42 is installed on the radiator 41. The radiator 41, the working fluid pump 42, the heat exchanger 60 and the magnetic device 23 are located on one side of the first fan 50.

[0084] Among them, the radiator 41 includes a heat dissipation substrate 411, a plurality of condensation flat tubes 412 and a connecting portion 413. The plurality of condensation flat tubes 412 are located between the heat dissipation substrate 411 and the connecting portion 413. The heat dissipation substrate 411 is used for heat exchange with the power device 21. Specifically, the shell 10 is provided with a connecting hole 16, and the connecting hole 16 passes through the isolation cavity wall 13a along the X-axis direction. The connecting hole 16 is connected to the first cavity 11 and the second cavity 12. The power device 21 can be installed in the connecting hole 16. The heat dissipation substrate 411 contacts the power device 21 through the connecting hole 16, and covers the connecting hole 16 to close the first cavity 11. In some other embodiments, the heat dissipation substrate 411 may also contact and be fixedly connected with the power device 21, thereby improving the structural stability between the heat dissipation substrate 411 and the power device 21, and improving the stability of thermal conduction between the power device 21 and the heat dissipation substrate 411.

[0085] The heat dissipation substrate 411 includes a first chamber 415 and a second chamber 416 divided by a partition 414. In the X-axis direction, the first chamber 415 is located on the side of the second chamber 416 close to the power device 21. In the Y-axis direction (i.e., the gravity direction), a through hole 4141 is provided at the top of the partition 414, and the first chamber 415 is connected to the second chamber 416 through the through hole 4141. Specifically, the through hole 4141 passes through the partition 414 along the X-axis direction and is connected to the first chamber 415 and the second chamber 416. A plurality of condensation flat tubes 412 are located on the side of the heat dissipation substrate 411 away from the power device 21 and are arranged at intervals. Specifically, a plurality of condensation flat tubes 412 are located on the side of the heat dissipation substrate 411 facing away from the power device 21 and are arranged at intervals. A plurality of condensation flat tubes 412 are connected to each other through a connecting portion 413, and the second chamber 416 is connected to a plurality of condensation flat tubes 412. The condensation flat tube 412 is located between the air inlet 14 and the air outlet 15 .

[0086] The first chamber 415, the second chamber 416 and the condensation flat tube 412 are all used to accommodate the cooling medium 41a for gas-liquid two-phase conversion. The connecting portion 413 can also be used to accommodate the cooling medium 41a for gas-liquid two-phase conversion. The working fluid pump 42 is used to drive the liquid cooling medium 41a to flow to the first chamber 415. Among them, the working fluid pump 42 can drive the liquid cooling medium 41a from the second chamber 416 or the connecting portion 413 to the first chamber 415 through the working fluid pump 42. The cooling medium 41a can be a cooling fluid including but not limited to water, ethylene glycol or propylene glycol. In the embodiment of the present application, the condensation flat tube 412 can be a flat hollow plate structure for the flow of liquid working medium. It should be understood that the condensation flat tube 412 can also be other structural designs, which are not limited in the present application.

[0087] The heat generated by the power device 21 when working is transferred to the radiator 41, and the external airflow can flow into the second cavity 12 from the air inlet 14, and then flow out of the second cavity 12 from the air outlet 15 through the radiator 41, so as to achieve heat dissipation of the power device 21. The heat generated by the power device 21 when working is transferred to the liquid cooling medium 41a in the first cavity 415, and the cooling medium 41a absorbs heat and boils to form a gaseous cooling medium 41a, and the gaseous cooling medium 41a flows from the first cavity 415 to the second cavity 416 through the through hole 4141, and then flows to the connecting portion 413 through a plurality of condensation flat tubes 412. The gaseous cooling medium 41a releases heat and condenses to form a liquid cooling medium 41a, and the liquid cooling medium 41a accumulates in the first cavity 415, the condensation flat tubes 412 and the connecting portion 413 under the action of gravity. The first fan 50 can drive the external airflow to flow into the second cavity 12 from the air inlet 14, and then flow through the heat sink 41 and out of the second cavity 12 from the air outlet 15. The airflow flowing through the heat sink 41 can transfer the heat transferred from the power device 21 to the cooling medium 41a to the external environment, thereby realizing the heat dissipation of the power device 21 through the gas-liquid two-phase conversion of the cooling medium 41a.

[0088] The fluid pump 42 can drive the liquid cooling medium 41a to flow from the second chamber 416 or the connecting portion 413 to the first chamber 415 through the fluid pump 42, so as to realize the recycling of the cooling medium 41a and ensure that the liquid cooling medium 41a in the first chamber 415 always has a sufficient amount so as to stably dissipate heat for the power device 21. The first fan 50 can drive the external airflow to flow into the second chamber 12 from the air inlet 14, and then flow out of the second chamber 12 from the air outlet 15 through the magnetic device 23, so as to realize the heat dissipation of the magnetic device 23. The heat generated by the electronic device 24 during operation can be transferred to the heat exchanger 60 through the second fan 70. The first fan 50 can drive the external airflow to flow into the second chamber 12 from the air inlet 14, and then flow out of the second chamber 12 from the air outlet 15 through the heat exchanger 60, so as to realize the heat dissipation of the electronic device 24.

[0089] It can be seen that the power conversion device 100 provided in the present application replaces the existing evaporator and condenser by the radiator 41 and the working fluid pump 42 to dissipate heat for the power device 21. The radiator 41 integrates the functions of the evaporator and the condenser, avoids the setting of complex pipelines, simplifies the structure of the radiator 41, and is conducive to reducing the volume of the radiator 41 and reducing the space occupancy rate of the radiator 41. Moreover, the working fluid pump 42 applies a driving force to the liquid cooling medium 41a, so that the liquid cooling medium 41a formed by heat release and condensation can replenish the liquid cooling medium 41a in the first chamber 415, so as to realize the recycling of the cooling medium 41a, and then realize the stable heat dissipation of the power device 21, reduce the influence of gravity on the design of the radiator 41, and is conducive to reducing the volume of the radiator 41, which is conducive to improving the space utilization rate of the power conversion device 100 and facilitating the miniaturization design of the power conversion device 100.

[0090] Based on the concept of recycling the cooling medium 41a through the working medium pump 42, the working medium pump 42 only needs to drive the liquid cooling medium 41a formed by heat release and condensation to flow to the first chamber 415. There are many ways to install the working medium pump 42 and the radiator 41. For example, the working medium pump 42 can be located outside the radiator 41, where the working medium pump 42 can be above, on the side, below, above the side or other positions of the radiator 41; the working medium pump 42 can also be located inside the radiator 41, etc., which is not specifically limited in this application. The following is an exemplary description with multiple embodiments.

[0091] See also Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.11 , and combined with Figure 3 and Figure 4 , Figure 5 yes Figure 3 The schematic diagram of the structure of the heat dissipation assembly 30 (the first fan 50, the heat exchanger 60 and the second fan 70 are omitted) of the power conversion device 100 cooperates with the power device 21. Figure 6 yes Figure 5 The structure diagram of the heat sink 41 shown is a cross-section diagram along line BB. Figure 7 yes Figure 5 The structure diagram of the heat sink 41 shown is a cross-section diagram along line CC. Figure 8 yes Figure 3 The structure diagram of the power conversion device 100 shown in another embodiment. Fig. 9 yes Figure 3 The power conversion device 100 shown is a schematic structural diagram in another embodiment. Fig.10 yes Figure 2 The power conversion device 100 shown is a schematic structural diagram of another embodiment. Fig.11 yes Figure 3 The schematic diagram of the structure of the power conversion device 100 shown is a cross-section diagram along the DD line. It should be noted that: Figure 7 The dotted box in Schematically indicates the position of the power device 21.

[0092] like Figure 3 and Figure 4 As shown, in Figure 3 and Figure 4 In the illustrated embodiment, the connecting portion 413 includes a flow cavity 4130, and the flow cavity 4130 is used to accommodate the cooling medium 41a used for gas-liquid two-phase conversion. The connecting portion 413 is located on the side of the multiple condensation flat tubes 412 facing away from the power device 21, the connecting portion 413 is fixedly connected to the multiple condensation flat tubes 412, and the flow cavity 4130 is connected to the multiple condensation flat tubes 412. The multiple condensation flat tubes 412 are interconnected through the flow cavity 4130. The connecting portion 413 is located on the side of the multiple condensation flat tubes 412 facing away from the heat dissipation substrate 411, and the design of the connecting portion 413 being fixedly connected to the multiple condensation flat tubes 412 is conducive to improving the stability of the spacing of the multiple condensation flat tubes 412, and is conducive to improving the structural stability and reliability of the radiator 41.

[0093] Further, a plurality of condensation flat tubes 412 are arranged in sequence along the Z-axis direction (i.e., the second direction) to form ventilation holes 4120. The ventilation holes 4120 extend along the Y-axis direction. Exemplarily, the number of condensation flat tubes 412 is 3. The three condensation flat tubes 412 are arranged in sequence along the Z-axis direction to form three ventilation holes 4120. In some other embodiments, the number of condensation flat tubes 412 may also be 2, 4, or more. The external airflow can flow into the second cavity 12 from the air inlet 14, and then flow through the ventilation holes 4120 through the plurality of condensation flat tubes 412 and out of the second cavity 12 from the air outlet 15 to transfer the heat generated by the power device 21 during operation to the external environment. The design that the plurality of condensation flat tubes 412 are arranged in sequence along the second direction to form ventilation holes 4120 is conducive to increasing the contact area between the plurality of condensation flat tubes 412 and the external airflow, and is conducive to improving the heat dissipation efficiency of the power device 21, and the structure is simple and stable, easy to design, and is conducive to reducing the processing cost of the radiator 41.

[0094] In this embodiment, in the direction of gravity (i.e., the Y-axis direction), the condensation flat tube 412 is located between the air inlet 14 and the air outlet 15. In the direction of gravity, the design of multiple condensation flat tubes 412 being located between the air inlet 14 and the air outlet 15 is conducive to reducing the flow resistance of the external airflow flowing from the air inlet 14 into the second cavity 12 through the ventilation holes 4120 and flowing through the multiple condensation flat tubes 412, which is conducive to improving the heat dissipation efficiency of the multiple condensation flat tubes 412 and the heat dissipation efficiency of the power device 21. Specifically, the air inlet 14 penetrates the second cavity wall 13c along the Y-axis direction. The air outlet 15 penetrates the second cavity wall 13c along the X-axis direction. In the direction of gravity (i.e., the Y-axis direction), the air inlet 14 is located below the condensation flat tube 412, and the air outlet 15 is located above the condensation flat tube 412. In the X-axis direction, the air outlet 15 is located on the side of the second cavity 12 that is away from the isolation cavity wall 13a. Thus, the external airflow flows into the second cavity 12 from the bottom of the power conversion device 100, and then flows out from the back of the power conversion device 100 after passing through multiple condensation flat tubes 412, thereby preventing the external airflow from discharging from the top of the power conversion device 100 and preventing foreign objects (such as fallen leaves or dust, etc.) from clogging the air outlet 15, thereby ensuring that the external airflow can flow smoothly, which is beneficial to improving the heat dissipation effect of the condensation flat tubes 412.

[0095] In some embodiments, the projections of at least a plurality of condensation flat tubes 412 in the gravity direction and the projections of the air inlet holes 14 in the gravity direction are arranged so as to increase the heat dissipation area between the condensation flat tubes 412 and the external airflow, thereby improving the heat dissipation efficiency. Of course, the projections of the air inlet holes 14 in the gravity direction can also cover more parts of the radiator 41 to further increase the heat dissipation area.

[0096] like Figure 5 and Figure 6 As shown, each condensation flat tube 412 may include a plurality of flow channels 4121 extending along the first direction, and adjacent flow channels are separated by baffles 4122, and the plurality of flow channels 4121 are all connected to the second chamber 416 and the connecting portion 413. Specifically, the plurality of flow channels 4121 are all connected between the second chamber 416 and the circulation chamber 4130, and the plurality of flow channels 4121 are arranged in sequence along the Y-axis direction. Dividing the interior of the condensation flat tube 412 into a plurality of flow channels 4121 can evenly disperse the pressure generated by the gaseous working fluid in each flow channel 4121, and the baffle 4122 can also withstand a certain pressure to avoid bulging problems, thereby improving the stability of the entire condensation flat tube 412, which is beneficial to improving the structural stability and reliability of the radiator 41.

[0097] In some embodiments, the working fluid pump 42 is located outside the radiator 41, and the working fluid pump 42 includes an inlet 421 and an outlet 422. The heat dissipation assembly 30 (i.e., the power conversion device 100) further includes an input pipe body 43 and an output pipe body 44. The inlet 421 of the working fluid pump 42 is connected to the second chamber 416 or the connecting portion 413 through the input pipe body 43, and the outlet 422 of the working fluid pump 42 is connected to the first chamber 415 through the output pipe body 44. The design that the working fluid pump 42 is located outside the radiator 41, the inlet 421 of the working fluid pump 42 is connected to the second chamber 416 or the connecting portion 413 through the input pipe body 43, and the outlet 422 of the working fluid pump 42 is connected to the first chamber 415 through the output pipe body 44 facilitates maintenance and replacement of the working fluid pump 42, which is conducive to reducing the maintenance cost of the radiator 41 and the maintenance cost of the power conversion device 100.

[0098] Furthermore, the radiator 41 is also provided with an input tube mounting hole 417 and an output tube mounting hole 418. In the direction of gravity, the input tube mounting hole 417 is located below the second chamber 416 or the connecting portion 413, and the output tube mounting hole 418 is located below the first chamber 415. The working fluid pump 42 is located below the radiator, the input tube 43 is inserted into the input tube mounting hole 417, and the output tube 44 is inserted into the output tube mounting hole 418.

[0099] like Figure 5 , Figure 6 and Figure 7 As shown, in Figure 5 , Figure 6 and Figure 7 In the specific embodiment shown, in the gravity direction, the input pipe body mounting hole 417 is located below the second chamber 416, and the output pipe body mounting hole 418 is located below the first chamber 415. The input pipe body mounting hole 417 is installed in the input pipe body mounting hole 417, the inlet 421 of the working fluid pump 42 is connected to the second chamber 416 through the input pipe body 43, and the output pipe body 44 is installed in the output pipe body mounting hole 418. The outlet 422 of the working fluid pump 42 is connected to the first chamber 415 through the output pipe body 44.

[0100] Specifically, the heat dissipation substrate 411 includes a first connecting wall 4111, a second connecting wall 4112, a third connecting wall 4113, a fourth connecting wall 4114 and two fifth connecting walls 4115. The first connecting wall 4111, the second connecting wall 4112, the third connecting wall 4113, the fourth connecting wall 4114 and the two fifth connecting walls 4115 enclose an inner cavity of the heat dissipation substrate 411. In the X-axis direction, the first connecting wall 4111 and the second connecting wall 4112 are opposite and spaced apart. In the Y-axis direction (i.e., the gravity direction), the third connecting wall 4113 and the fourth connecting wall 4114 are opposite and spaced apart, and are located above the fourth connecting wall 4114. In the Z-axis direction, the two fifth connecting walls 4115 are opposite and spaced apart. The partition is arranged between the fourth connecting wall 4114 and the third connecting wall 4113 to divide the inner cavity of the heat dissipation substrate 411 into a first chamber 415 and a second chamber 416. The input tube body mounting hole 417 penetrates the fourth connecting wall 4114 along the Y-axis direction and communicates with the second chamber 416. The output tube body mounting hole 418 penetrates the fourth connecting wall 4114 along the Y-axis direction and communicates with the second chamber 416. The axis of the input tube body mounting hole 417 and the axis of the output tube body mounting hole 418 can be parallel to the Y-axis direction or can be inclined relative to the Y-axis direction. The input tube body 43 communicates with the second chamber 416 and the inlet 421. The output tube body 44 communicates with the first chamber 415 and the outlet 422.

[0101] The design in which the inlet 421 of the working fluid pump 42 is connected to the second chamber 416 through the input pipe body 43 is beneficial to reducing the structural complexity and length of the input pipe body 43, reducing the material cost of the radiator 41, reducing the structural complexity of the radiator 41, and improving the structural reliability of the radiator 41. It is beneficial to improve the efficiency of the cooling working fluid 41a flowing from the second chamber 416 to the first chamber 415 through the working fluid pump 42, and is beneficial to improving the heat dissipation efficiency of the power device 21.

[0102] In some other embodiments, in the gravity direction, the input tube body mounting hole 417 may also be located below the circulation cavity 4130 (i.e., the connecting portion 413), the input tube body 43 is inserted into the input tube body mounting hole 417, and the inlet 421 of the working fluid pump 42 is connected to the circulation cavity 4130 (i.e., the connecting portion 413) through the input tube body 43. For example, the connecting portion 413 may include a first matching wall 4131, a second matching wall 4132, a third matching wall 4133, a fourth matching wall 4134, and two fifth matching walls 4135 that enclose and constitute the circulation cavity 4130. In the X-axis direction, the first matching wall 4131 and the second matching wall 4132 are arranged opposite to each other and spaced apart. In the Y-axis direction, the third matching wall 4133 and the fourth matching wall 4134 are arranged opposite to each other and spaced apart, and are located above the fourth matching wall 4134. In the Z-axis direction, the two fifth matching walls 4135 are arranged opposite to each other and spaced apart. The output tube body mounting hole 418 passes through the fourth matching wall 4134 along the Y-axis direction and is connected to the circulation cavity 4130. The axis of the input tube body mounting hole 417 and the axis of the output tube body mounting hole 418 can be parallel to the Y-axis direction, or can be inclined relative to the Y-axis direction. The input tube body 43 is connected to the circulation cavity 4130 (i.e., the connecting portion 413) and the inlet 421. There are various ways to connect the working fluid pump 42 and the radiator 41 through the input tube body 43, which can be designed according to needs, which is conducive to reducing the installation cost of the radiator 41 and the working fluid pump 42.

[0103] Since the liquid cooling medium 41a formed by exothermic condensation accumulates at the bottom of the first chamber 415, the bottom of the second chamber 416, the bottom of the condensation flat tube 412 and the bottom of the connecting portion 413 under the action of gravity, the design of the working fluid pump 42 being located below the radiator 41 is beneficial to reducing the structural complexity and length of the input pipe body 43 connected to the second chamber 416 (or the connecting portion 413) and the inlet 421 of the working fluid pump 42, and is beneficial to reducing the structural complexity and length of the output pipe body 44 connected to the first chamber 415 and the outlet 422 of the working fluid pump 42, which is beneficial to reducing the material cost of the radiator 41, reducing the structural complexity of the radiator 41, and improving the structural reliability of the radiator 41.

[0104] In addition, the power conversion device 100 can be installed on various bearing surfaces, and the design that the inlet 421 of the working fluid pump 42 is connected to the second chamber 416 or the connecting portion 413 through the input pipe body 43 can adapt to various installation scenarios of the power conversion device 100. For details, please refer to Figure 5 , Figure 8 , Fig. 9 and Fig.10 , exemplary installation scenarios of the power conversion device 100 installed on various bearing surfaces are listed.

[0105] exist Figure 5In the specific embodiment shown, the working fluid pump 42 is connected to the second chamber 416 through the input pipe body 43. When the power conversion device 100 is installed on a bearing surface (for example, mounted on a wall perpendicular to the horizontal plane), and the first direction (i.e., the X-axis direction) is perpendicular to the gravity direction, under the action of gravity, the liquid cooling medium 41a formed by heat release and condensation can be accumulated at the bottom of the second chamber 416, and a large amount of cooling medium 41a is stored at the bottom of the second chamber 416. In this case, the working fluid pump 42 can stably drive the liquid cooling medium 41a from the second chamber 416 to the first chamber 415 through the working fluid pump 42 through the input pipe body 43 connected to the second chamber 416, which is conducive to improving the reliability and stability of heat dissipation of the power device 21. Moreover, in this case, under the action of gravity, the liquid cooling medium 41a formed by heat release and condensation will also accumulate at the bottom of the connecting portion 413 (i.e., the bottom of the circulation cavity 4130), and a large amount of cooling medium will be stored at the bottom of the connecting portion 413 (i.e., the bottom of the circulation cavity 4130). At this time, if the working medium pump 42 is connected to the connecting portion 413 through the input pipe body 43, the working medium pump 42 can also stably drive the liquid cooling medium 41a from the connecting portion 413 to the first chamber 415 through the input pipe body 43 connected to the connecting portion 413, which is also conducive to improving the reliability and stability of heat dissipation of the power device 21.

[0106] exist Figure 8 In the specific embodiment shown, the working fluid pump 42 is connected to the second chamber 416 through the input pipe body 43. When the power conversion device 100 is installed on a bearing surface (for example, mounted on a wall inclined to the horizontal plane), and the second chamber 416 is located below the connecting portion 413 in the direction of gravity, the liquid cooling working fluid 41a formed by heat release and condensation can be accumulated at the bottom of the second chamber 416 under the action of gravity, and a large amount of the cooling working fluid 41a is stored at the bottom of the second chamber 416. In this case, the working fluid pump 42 can stably drive the liquid cooling working fluid 41a from the second chamber 416 to the first chamber 415 through the working fluid pump 42 through the input pipe body 43 connected to the second chamber 416, which is conducive to improving the reliability and stability of heat dissipation of the power device 21.

[0107] exist Fig. 9In the specific embodiment shown, the working fluid pump 42 is connected to the second chamber 416 through the input pipe body 43. When the power conversion device 100 is installed on a bearing surface (for example, mounted on a wall inclined to the horizontal plane), the second chamber 416 is located above the connecting portion 413 in the direction of gravity, the first direction is inclined to the horizontal plane, and the angle θ between the first direction and the horizontal plane is less than 30°, under the action of gravity, the liquid cooling working fluid 41a formed by heat release and condensation can be accumulated at the bottom of the second chamber 416, and a large amount of cooling working fluid 41a is stored at the bottom of the second chamber 416. In this case, the working fluid pump 42 can stably drive the liquid cooling working fluid 41a from the second chamber 416 to the first chamber 415 through the working fluid pump 42 through the input pipe body 43 connected to the second chamber 416, which is conducive to improving the reliability and stability of heat dissipation of the power device 21.

[0108] exist Fig.10 In the specific embodiment shown, the working fluid pump 42 is connected to the connecting portion 413 through the input pipe body 43. When the power conversion device 100 is installed on a bearing surface (for example, mounted on a wall inclined to the horizontal plane), and the second chamber 416 is located above the connecting portion 413 in the direction of gravity, the liquid cooling working fluid 41a formed by heat release and condensation accumulates at the bottom of the connecting portion 413 under the action of gravity, and a large amount of the cooling working fluid 41a is stored at the bottom of the connecting portion 413. Among them, the first direction is inclined to the horizontal plane. Exemplarily, the angle θ between the first direction and the horizontal plane is greater than 30°. In some other embodiments, the angle θ between the first direction and the horizontal plane can also be less than or equal to 30°. In this case, the working fluid pump 42 can stably drive the liquid cooling working fluid 41a from the connecting portion 413 to the first chamber 415 through the input pipe body 43 connected to the connecting portion 413, which is conducive to improving the reliability and stability of heat dissipation of the power device 21.

[0109] exist Figure 3 and Figure 4In the illustrated embodiment, in the gravity direction, the liquid level of the liquid cooling medium 41a in the first chamber 415 is higher than the power device 21. The design that the liquid level of the liquid cooling medium 41a in the first chamber 415 is higher than the power device 21 is conducive to improving the efficiency of transferring the heat generated by the power device 21 during operation to the liquid cooling medium 41a in the first chamber 415, and is conducive to improving the heat dissipation efficiency of the power device 21. Exemplarily, the number of power devices 21 is multiple, the number of connecting holes 16 is multiple, and the multiple connecting holes 16 correspond to the multiple power devices 21 one by one. The heat dissipation substrate 411 contacts each power device 21 through the corresponding connecting holes 16, and covers the corresponding connecting holes 16 to close the first chamber 11. Among them, the multiple power devices 21 may include two first power devices 21a and two second power devices 21b. In the Y-axis direction, the two first power devices 21a are arranged in sequence. In the Z-axis direction, the two second power devices 21b are located on one side of the two first power devices 21a. In the Y-axis direction, the two second power devices 21 b are arranged in sequence and spaced apart. In the gravity direction, the liquid level of the liquid cooling medium 41 a in the first chamber 415 is higher than that of each power device 21 .

[0110] Furthermore, in the direction of gravity, the liquid level of the liquid cooling medium in the first chamber is higher than that of the liquid cooling medium in the second chamber. In this way, the working medium pump can drive more liquid working medium to flow to the first chamber, so that the liquid working medium in the first chamber is higher, so that more power devices can be covered, so that more power devices can contact the heat dissipation substrate and dissipate heat through the heat sink, thereby reducing the volume of the power converter and improving the heat dissipation efficiency.

[0111] exist Figure 3 and Figure 4 In the illustrated embodiment, the projection of the through hole 4141 in the first direction is located above the projection of the power device 21 in the first direction. The design that the projection of the through hole 4141 in the first direction is located above the projection of the power device 21 in the first direction in the gravity direction prevents the liquid cooling medium 41a in the first chamber 415 from flowing from the through hole 4141 to the second chamber 416 during the process of driving the liquid level of the cooling medium 41a in the first chamber 415 to be higher than the power device 21, which is conducive to reducing the difficulty of driving the liquid level of the cooling medium 41a in the first chamber 415 to be higher than the power device 21, and is conducive to improving the heat dissipation efficiency of the power device 21.

[0112] In some embodiments, the liquid level of the liquid cooling medium 41a in the second chamber 416, the liquid level of the liquid cooling medium 41a in the condensing flat tube 412, and the liquid level of the liquid cooling medium 41a in the connecting portion 413 are all lower than the power device 21. In this way, it is convenient to accommodate more gaseous cooling medium 41a in the second chamber 416, the condensing flat tube 412, and the connecting portion 413, which is conducive to increasing the rate at which the gaseous cooling medium 41a flows from the through hole 4141 into the second chamber 416, and is conducive to improving the heat dissipation efficiency of the power device 21.

[0113] like Figure 3 As shown, the air inlet side of the first fan 50 faces the air inlet hole 14. In the Y-axis direction, the first fan 50 can be located on the side of the radiator 41 facing or facing away from the air inlet hole 14. Specifically, in the Y-axis direction, the first fan 50 is located on the side of the condensation flat tube 412 facing the air inlet hole 14. The first fan 50 can drive the air flow to form heat dissipation wind. The first fan 50 can drive the heat dissipation wind to flow from the air inlet hole 14 into the second cavity 12, and then flow out of the second cavity 12 from the air outlet hole 15 through the radiator 41.

[0114] In some embodiments, the projection of the first fan 50 in the Y-axis direction overlaps with the projection of the air inlet 14 in the Y-axis direction. Such a design is conducive to reducing the flow resistance of the heat dissipation air flowing through the multiple condensation flat tubes 412, increasing the air volume of the heat dissipation air flowing through the multiple condensation flat tubes 412, improving the heat dissipation efficiency of the heat dissipation air to the multiple condensation flat tubes 412, and improving the heat dissipation efficiency of the power device 21.

[0115] exist Figure 3 and Figure 4In the illustrated embodiment, the heat generated by the power device 21 when working is transferred to the radiator 41, and the external airflow can flow into the second cavity 12 from the air inlet 14, and then flow out of the second cavity 12 from the air outlet 15 through the radiator 41, so as to achieve heat dissipation of the power device 21. The heat generated by the power device 21 when working is transferred to the liquid cooling medium 41a in the first cavity 415, and the cooling medium 41a absorbs heat and boils to form a gaseous cooling medium 41a, and the gaseous cooling medium 41a flows from the first cavity 415 to the second cavity 416 through the through hole 4141, and then flows to the connecting portion 413 through a plurality of condensation flat tubes 412. The gaseous cooling medium 41a releases heat and condenses to form a liquid cooling medium 41a, and the liquid cooling medium 41a is accumulated in the first cavity 415, the condensation flat tubes 412 and the connecting portion 413 under the action of gravity. The heat transferred from the power device 21 to the cooling medium 41a can be transferred to the external environment by the airflow flowing through the radiator 41, so that the heat of the power device 21 is dissipated by the gas-liquid two-phase conversion of the cooling medium 41a. The working medium pump 42 can drive the liquid cooling medium 41a to flow from the second chamber 416 or the connecting portion 413 to the first chamber 415 through the working medium pump 42, so as to realize the recycling of the cooling medium 41a and ensure that the liquid cooling medium 41a in the first chamber 415 always has a sufficient amount so as to stably dissipate the heat of the power device 21. The design of the through hole 4141 provided on the top of the partition 414 not only guides the gaseous cooling medium 41a to flow from the first chamber 415 to the second chamber 416, but also helps to improve the efficiency of the gaseous cooling medium 41a flowing from the first chamber 415 to the second chamber 416, and helps to improve the efficiency of the heat dissipation of the power device 21.

[0116] Compared with the prior art, the present application integrates the functions of the evaporator and the condenser through the radiator 41, which can avoid setting up complex pipes between the evaporator and the condenser by welding or bonding, etc., which is conducive to reducing the structural complexity of the radiator 41, improving the structural stability and reliability of the radiator 41, reducing the volume of the radiator 41, and facilitating the miniaturization design of the power conversion device 100. Moreover, the design of combining gravity with the working medium pump 42 to realize the gas-liquid two-phase conversion of the cooling medium 41a and the recycling of the cooling medium 41a in the present application is conducive to reducing the influence of gravity on the design of the radiator 41, the bottom wall of the second chamber 416 can be no higher than the bottom wall of the first chamber 415, the setting of the second chamber 416 can be regardless of the position of the power device 21, and the bottom wall of the second chamber 416 can be no higher than the power device 21, which is conducive to reducing the volume of the radiator 41, improving the space utilization of the power conversion device 100, and facilitating the miniaturization design of the power conversion device 100. In addition, it is not only helpful to reduce the design difficulty of the radiator 41 and the processing cost of the radiator 41, but also facilitates more flexible arrangement of the power device 21, helps to reduce the installation difficulty of the power device 21 and the radiator 41, and helps to reduce the processing cost of the power conversion device 100.

[0117] In addition, since the working fluid pump 42 only needs to overcome the flow resistance of the liquid cooling working fluid 41a flowing from the second chamber 416 or the connecting part 413 through the working fluid pump 42 to the first chamber 415, the pressure head and life requirements of the working fluid pump 42 are low, and the processing cost of the working fluid pump 42 is low, which is beneficial to reducing the heat dissipation cost, reducing the processing cost of the power conversion equipment 100, and increasing the speed of the gas-liquid two-phase conversion of the cooling working fluid 41a, which is beneficial to improving the heat dissipation efficiency of the power device 21.

[0118] In some embodiments, the fluid pump 42 also has a speed regulation function. Specifically, the fluid pump 42 is driven by a motor. By controlling the speed of the motor, the operating speed of the fluid pump 42 can be controlled to control the rate at which the liquid cooling medium 41a flows to the first chamber 415 through the fluid pump 42. When the power conversion device 100 is overloaded, the heat generated by the power device 21 during operation is transferred to the cooling medium 41a in the first chamber 415 at a faster rate, the cooling medium 41a in the first chamber 415 boils faster, and the cooling medium 41a in the first chamber 415 is easy to dry out. By controlling the operating speed of the fluid pump 42, the rate at which the liquid cooling medium 41a flows to the first chamber 415 through the fluid pump 42 is increased, and the cooling medium 41a in the first chamber 415 is prevented from drying out, ensuring that the radiator 41 can stably dissipate heat for the power device 21, which is conducive to extending the service life of the power conversion device 100.

[0119] like Figure 3As shown, in some embodiments, in the Y-axis direction, the magnetic device 23, the heat exchanger 60 and the radiator 41 are all located on one side of the first fan 50, and the magnetic device 23 and the heat exchanger 60 are located on both sides of the radiator 41. Specifically, the magnetic device 23 is located on the side of the radiator 41 that is away from the first fan 50, and the heat exchanger 60 is located between the first fan 50. The projection of the magnetic device 23 in the X-axis direction overlaps with the projection of the air outlet 15 in the X-axis direction. In the Y-axis direction, the magnetic device 23, the heat exchanger 60 and the radiator 41 are all located on one side of the first fan 50, and the design of the magnetic device 23 and the heat exchanger 60 being located on both sides of the radiator 41 can enable the first fan 50 to drive the external airflow to flow into the second cavity 12 from the air inlet 14, and then flow out of the second cavity 12 from the air outlet 15 through the heat exchanger 60, the radiator 41 and the magnetic device 23 in sequence, thereby realizing the heat dissipation of the power device 21, the magnetic device 23 and the electronic device 24. The heat exchanger 60, the radiator 41 and the magnetic device 23 share the air duct, which is beneficial to improving the utilization rate of the first fan 50 and reducing the heat dissipation cost.

[0120] In some embodiments, the magnetic device 23 is further provided with a heat conducting fin 231. Specifically, in the X-axis direction, a heat conducting fin 231 is provided on the side of the magnetic device 23 facing away from the isolation cavity wall 13a. The design of the heat conducting fin 231 is conducive to increasing the heat dissipation area of ​​the magnetic device 23 and improving the heat dissipation efficiency of the magnetic device 23.

[0121] like Figure 3 and Fig.11 As shown, in some embodiments, the housing 10 is further provided with a heat exchange hole 17, and the heat exchange hole 17 is connected to the first cavity 11 and the second cavity 12. Specifically, the heat exchange hole passes through the isolation cavity wall 13a along the X-axis direction. The heat exchanger 60 includes a heat exchange cavity 60a, and the heat exchange cavity 60a is connected to the first cavity 11 through the heat exchange hole 17. And the heat exchanger 60 covers the heat exchange hole 17 to close the first cavity 11. The heat generated by the electronic device 24 when working is transferred to the heat exchange cavity 60a through the air in the first cavity 11 through the heat exchange hole 17. Exemplarily, the number of heat exchange holes 17 is multiple. Specifically, the number of heat exchange holes 17 is 2. In the Z-axis direction, the two heat exchange holes are located on both sides of the circuit board 22.

[0122] Further, the air outlet side of the second fan 70 faces the heat exchange hole 17. Specifically, the air outlet side of the second fan 70 faces one heat exchange hole 17. The second fan 70 can drive the air flow in the first cavity 11 to improve the efficiency of the air in the first cavity 11 flowing into the heat exchange cavity 60a through the heat exchange hole 17, which is beneficial to improve the efficiency of transferring the heat generated by the electronic device 24 when working to the heat exchanger 60, and is beneficial to improve the heat dissipation efficiency of the electronic device 24.

[0123] exist Figure 3 and Fig.11In the illustrated embodiment, the heat exchanger 60 includes a first heat exchange portion 61, a second heat exchange portion 62 and a third heat exchange portion 63. In the Z-axis direction, the first heat exchange portion 61 and the second heat exchange portion 62 are arranged opposite to each other and spaced apart, and the third heat exchange portion 63 is fixedly connected between the first heat exchange portion 61 and the second heat exchange portion 62. Exemplarily, the number of the third heat exchange portions 63 is multiple. Specifically, the number of the third heat exchange portions 63 is 3. In the X-axis direction, the plurality of third heat exchange portions 63 are spaced apart in sequence. In some other embodiments, the number of the third heat exchange portions 63 may also be 1, 2 or more. Among them, the first heat exchange portion 61 covers one heat exchange hole 17 to close the first cavity 11, and the second heat exchange portion 62 covers another heat exchange hole 17 to close the first cavity 11.

[0124] The first heat exchange part 61 includes a first heat exchange sub-cavity 611. The second heat exchange part 62 includes a second heat exchange sub-cavity 621. The third heat exchange part 63 includes a third heat exchange sub-cavity 631. In the Z-axis direction, the third heat exchange sub-cavity 631 is connected between the first heat exchange sub-cavity 611 and the second heat exchange sub-cavity 621. Exemplarily, the number of the third heat exchange sub-cavities 631 is multiple. Specifically, the number of the third heat exchange sub-cavities 631 is 2. In the Y-axis direction, the two third heat exchange sub-cavities 631 are arranged in sequence. In some other embodiments, the number of the third heat exchange sub-cavities 631 may also be 1, 3 or more. Among them, the first heat exchange sub-cavity 611 is connected to one heat exchange hole 17. The second heat exchange sub-cavity 621 is connected to another heat exchange hole 17. The heat exchange cavity 60a includes the first heat exchange sub-cavity 611, the second heat exchange sub-cavity 621 and the third heat exchange sub-cavity 631. Specifically, the heat exchange chamber 60a includes a first heat exchange sub-chamber 611 , a second heat exchange sub-chamber 621 and six third heat exchange sub-chambers 631 .

[0125] The heat generated by the electronic device 24 when it is working is transferred to the air in the first cavity 11. The second fan 70 drives the air in the first cavity 11 to flow from one heat exchange hole 17 into the first heat exchange sub-cavity 611, from the first heat exchange sub-cavity 611 through multiple third heat exchange sub-cavities 631 into the second heat exchange sub-cavity 621, and then from the second heat exchange sub-cavity 621 through another heat exchange hole 17 back to the first cavity 11. The heat generated by the electronic device 24 when it is working is transferred to the heat exchange cavity 60a through the air in the first cavity 11, and the external airflow flowing into the second cavity 12 from the air inlet hole 14 flows through multiple third heat exchange parts 63 of the heat exchanger 60 and flows out from the air outlet hole 15, so that the external airflow can transfer the heat generated by the electronic device 24 when it is working to the external environment, thereby achieving heat dissipation of the electronic device 24.

[0126] In some embodiments, the heat exchanger 60 is further provided with heat exchange fins 64. Specifically, in the X-axis direction, a heat exchange fin 64 is provided between two adjacent third heat exchange parts 63. Exemplarily, between two adjacent third heat exchange parts 63, the number of heat exchange fins 64 can be multiple. In the Z-axis direction, multiple heat exchange fins 64 are arranged in sequence at intervals. The design of the heat exchange fins 64 is conducive to increasing the heat dissipation area between the third heat exchange part 63 and the external airflow, and is conducive to improving the heat dissipation efficiency of the third heat exchange part 63, the heat dissipation efficiency of the heat exchanger 60, and the heat dissipation efficiency of the electronic device 24.

[0127] See also Fig.12 and Fig.13 , and combined with Figure 3 , Fig.12 It is a structural schematic diagram of another power conversion device 100 provided in an embodiment of the present application. Fig.13 yes Fig.12 The schematic diagram of the structure of the heat dissipation assembly 30 (the first fan 50, the heat exchanger 60 and the second fan 70 are omitted) of the power conversion device 100 cooperates with the power device 21.

[0128] like Figure 3 , Fig.12 and Fig.13 As shown, Fig.12 The embodiment shown and Figure 3 The structures of the embodiments shown are similar, and the difference between the two is that the installation position of the working fluid pump 42 is different. Fig.12 In the illustrated embodiment, in the direction of gravity (i.e., the Y-axis direction), a mounting hole 4142 is further provided at the bottom of the partition 414, and the mounting hole 4142 is communicated with the first chamber 415 and the second chamber 416. The working fluid pump 42 is accommodated in the mounting hole 4142. Specifically, the mounting hole 4142 penetrates the partition 414 along the X-axis direction. In the Y-axis direction (i.e., the gravity direction), the mounting hole 4142 is located below the through hole 4141 and below the power device 21. The mounting hole 4142 extends toward the fourth connecting wall 4114 along the Y-axis direction. The inlet 421 of the working fluid pump 42 faces the second chamber 416, and the outlet 422 of the working fluid pump 42 faces the first chamber 415.

[0129] The design of the working fluid pump 42 being accommodated in the mounting hole 4142 and the working fluid pump 42 being integrated into the radiator 41 can avoid the working fluid pump 42 and the radiator 41 being connected by a pipeline, which is beneficial to improving the structural reliability between the working fluid pump 42 and the radiator 41, and is beneficial to reducing the difficulty of accommodating the radiator 41 and the working fluid pump 42 in the second cavity 12, which is beneficial to improving the space utilization rate of the second cavity 12, and is beneficial to reducing the processing cost of the power conversion device 100.

[0130] See also Fig.14 , Fig.15 and Fig.16 , and combined with Figure 3 , Fig.14 It is a structural schematic diagram of another power conversion device 100 provided in an embodiment of the present application. Fig.15 yes Fig.14 The shown schematic diagram is a partial structural diagram of the power conversion device 100 cut along line EE. Fig.16 yes Fig.15 The power conversion device 100 shown is a schematic structural diagram cut along the FF line. It should be noted that: Fig.16 The dotted box in Schematically indicates the position of the power device 21.

[0131] like Fig.14 , Fig.15 and Fig.16 As shown, Fig.14 The embodiment shown and Figure 3 The structures of the embodiments shown are similar, and the difference between the two is that there is a structural improvement between the multiple condensation flat tubes 412, and the structure of the first chamber 415 is different. Fig.14 In the illustrated embodiment, a heat sink 419 is further provided between two adjacent condensation flat tubes 412. The heat sink 419 contacts and is fixedly connected to the two adjacent condensation flat tubes 412. The heat sink 419 is accommodated in the ventilation hole 4120. Exemplarily, there may be multiple heat sink fins 419 between two adjacent condensation flat tubes 412. Multiple heat sink fins 419 are sequentially spaced in the X-axis direction. External airflow can flow through the condensation flat tubes 412 from the ventilation holes 4120 between two adjacent condensation flat tubes 412 to transfer the heat generated by the power device 21 during operation to the external environment, thereby achieving heat dissipation of the power device 21. The design of the heat sink 419 is conducive to increasing the contact area between the condensation flat tubes 412 and the external airflow, which is conducive to improving the heat dissipation efficiency of the condensation flat tubes 412 and the heat dissipation efficiency of the power device 21.

[0132] exist Fig.14 In the illustrated embodiment, the first chamber 415 further includes a plurality of channels 4151, and the plurality of channels 4151 are separated by partition plates 4152. In the X-axis direction (i.e., the first direction), each partition plate 4152 is fixedly connected to the cavity wall of the first chamber 415 and the partition portion 414, and each channel 4151 is connected to the through hole 4141. The projection of the power device 21 in the X-axis direction (i.e., the first direction) overlaps with the projection of the plurality of channels 4151 in the X-axis direction (i.e., the first direction). The channel 4151 contains a liquid cooling medium 41a, and in the gravity direction, the liquid level of the liquid cooling medium 41a in the channel 4151 is higher than the power device 21.

[0133] Further, a plurality of partition plates 4152 are sequentially spaced apart in the Z-axis direction (i.e., the second direction), and the channel 4151 extends in the Y-axis direction (i.e., the gravity direction). Specifically, each partition plate 4152 is in contact with and fixedly connected to the first connecting wall 4111 and the partition 414. Each partition 414 is located on the side of the through hole 4141 facing the fourth connecting wall 4114 and is spaced apart from the fourth connecting wall 4114. Exemplarily, the plurality of partition plates 4152 include a first partition plate 4152a, a plurality of second partition plates 4152b, a third partition plate 4152c, a plurality of fourth partition plates 4152d, and a fifth partition plate 4152e, which are sequentially spaced apart in the Z-axis direction. Among them, the first partition plate 4152a and the fifth partition plate 4152e are respectively in contact with and fixedly connected to the two fifth connecting walls 4115. In the Z-axis direction, the first partition plate 4152a, the second partition plates 4152b and the third partition plate 4152c are sequentially arranged to form a plurality of first channels 4151a. The third partition plate 4152c, the fourth partition plates 4152d and the fifth partition plate 4152e are sequentially arranged to form a plurality of second channels 4151b.

[0134] Exemplarily, the number of power devices 21 is multiple, and the multiple power devices 21 include multiple first power devices 21a and multiple second power devices 21b. The multiple first power devices 21 correspond to the multiple first channels 4151a. Specifically, the projection of the first power device 21a in the X-axis direction overlaps with the projection of the multiple first channels 4151a in the X-axis direction. The multiple second power devices 21b correspond to the multiple second channels 4151b. With reference to the above, no further description is given. In the direction of gravity, the liquid level of the liquid cooling medium 41a in each channel 4151 is higher than that of each power device 21.

[0135] exist Fig.14In the illustrated embodiment, a liquid cooling medium 41a is contained in each of the multiple channels 4151. The heat generated by the power device 21 when working is transferred to the liquid cooling medium 41a in the multiple channels 4151, the liquid cooling medium 41a in the multiple channels 4151 absorbs heat and boils to form a gaseous cooling medium 41a, the gaseous cooling medium 41a flows to the second chamber 416 through the through hole 4141, the gaseous cooling medium 41a releases heat and condenses to form a liquid cooling medium 41a, and the working medium pump 42 drives the liquid cooling medium 41a to flow to the multiple channels 4151 of the first chamber 415 through the working medium pump 42. Specifically, the heat generated by the first power device 21a when working is transferred to the liquid cooling medium 41a in the multiple first channels 4151a, and the heat generated by the second power device 21b when working is transferred to the liquid cooling medium 41a in the multiple second channels 4151b. The liquid cooling medium 41a absorbs heat and boils to form a gaseous cooling medium 41a, and the gaseous cooling medium 41a flows from each channel 4151 toward the through hole 4141 to the second chamber 416 through the through hole 4141. The gaseous cooling medium 41a releases heat and condenses to form a liquid cooling medium 41a. The working medium pump 42 drives the liquid cooling medium 41a to flow from each channel 4151 to the side facing away from the through hole 4141 through the working medium pump 42 into each channel 4151.

[0136] By dividing the interior of the first chamber 415 into multiple channels 4151 through the partition plate 4152, the pressure generated by the liquid working medium can be evenly dispersed in each channel 4151, and the partition plate 4152 can also withstand a certain pressure, so that the stability of the entire heat dissipation substrate 411 is better, which is beneficial to improving the structural stability and reliability of the radiator 41.

[0137] The design of channel 4151 extending along the direction of gravity is conducive to reducing the flow resistance of the liquid cooling medium 41a flowing in the channel 4151, and is conducive to reducing the difficulty of driving the liquid level of the liquid cooling medium 41a to be higher than the power device 21, which is conducive to reducing the pressure head requirements and life requirements for the working fluid pump 42, which is conducive to reducing the processing cost of the working fluid pump 42 and reducing the processing cost of the power conversion device 100.

[0138] It can be understood that in this embodiment, the design of providing a heat dissipation fin 419 between two adjacent condensation flat tubes 412 and the structural improvement of the first chamber 415 are both applied to the scenario where the working fluid pump 42 is located outside the radiator 41. The design of providing a heat dissipation fin 419 between two adjacent condensation flat tubes 412 and the structural improvement of the first chamber 415 can also be applied to the scenario where the working fluid pump 42 is accommodated in the radiator 41.

[0139] See also Fig.17 , Fig.18 and Fig.19 , and combined with Figure 3 , Fig.17 It is a structural schematic diagram of another power conversion device 100 provided in an embodiment of the present application. Fig.18 yes Fig.17 The schematic diagram of the structure of the heat dissipation assembly 30 (the first fan 50, the heat exchanger 60 and the second fan 70 are omitted) of the power conversion device 100 cooperates with the power device 21. Fig.19 yes Fig.18 The heat sink 41 shown is a schematic structural diagram cut along the GG line. It should be noted that: Fig.19 The dotted box in Schematically indicates the position of the power device 21.

[0140] like Fig.17 , Fig.18 and Fig.19 As shown, Fig.17 The embodiment shown and Figure 3 The structures of the embodiments shown are similar, and the difference between the two is that the structure of the first chamber 415 is different. Fig.17 In the illustrated embodiment, the first chamber 415 further includes a plurality of channels 4151, and the plurality of channels 4151 are separated by partition plates 4152. In the X-axis direction (i.e., the first direction), each partition plate 4152 is fixedly connected to the cavity wall of the first chamber 415 and the partition portion 414, and each channel 4151 is connected to the through hole 4141. The projection of the power device 21 in the X-axis direction (i.e., the first direction) overlaps with the projection of the plurality of channels 4151 in the X-axis direction (i.e., the first direction). The channel 4151 contains a liquid cooling medium 41a, and in the gravity direction, the liquid level of the liquid cooling medium 41a in the channel 4151 is higher than the power device 21.

[0141] Further, the plurality of partition plates 4152 are sequentially arranged at intervals along the Y-axis direction (i.e., the gravity direction), and the channel 4151 extends along the Z-axis direction (i.e., the second direction). In this embodiment, the plurality of channels 4151 include a plurality of first channels 4151a and a plurality of second channels 4151b. In the Y-axis direction (i.e., the gravity direction), the plurality of second channels 4151b and the plurality of first channels 4151a are sequentially arranged, one end of each first channel 4151a is connected to one end of each second channel 4151b, and the other end of each second channel 4151b is connected to the through hole 4141.

[0142] Specifically, the plurality of partition plates 4152 include a first partition plate 4152a, a plurality of second partition plates 4152b, a third partition plate 4152c, a plurality of fourth partition plates 4152d, and a fifth partition plate 4152e. From the through hole toward the side of the fourth connecting wall 4114, the first partition plate 4152a, the plurality of second partition plates 4152b, the fourth partition plate 4152d, the plurality of third partition plates 4152c, and the fifth partition plate 4152e are sequentially arranged in intervals along the Y-axis direction. Each partition plate 4152 is in contact with and fixedly connected to the first connecting wall 4111 and the partition portion 414.

[0143] The first partition plate 4152a, the fourth partition plate 4152d and the fifth partition plate 4152e are all in contact with and fixedly connected to the two fifth connecting walls 4115. Each second partition plate 4152b and each third partition plate 4152c are spaced apart from the two fifth connecting walls 4115. The fourth partition plate 4152d, the plurality of third partition plates 4152c and the fifth partition plate 4152e are spaced apart in sequence to form a plurality of first channels 4151a. The first partition plate 4152a, the plurality of second partition plates 4152b and the fourth partition plate 4152d are spaced apart in sequence to form a plurality of second channels 4151b.

[0144] The first partition plate 4152a is provided with a first flow hole 4153, which penetrates the first partition plate 4152a along the Y-axis direction, and the first flow hole 4153 is connected to the through hole 4141. The fourth partition plate 4152d is provided with a second flow hole 4154, which penetrates the fourth partition plate 4152d along the Y-axis direction. The fifth partition plate 4152e is provided with a third flow hole 4155, which penetrates the fifth partition plate 4152e along the Y-axis direction. In the Z-axis direction, the first flow hole 4153 and the third flow hole 4155 are located on one side of each second partition plate 4152b and each third partition plate 4152c, and the second flow hole 4154 is located on the other side of each second partition plate 4152b and each third partition plate 4152c. One end of each first channel 4151a is communicated with one end of each second channel 4151b through the second flow hole 4154, and the other end is communicated with the third flow hole 4155. The other end of each second channel 4151b is communicated with the through hole 4141.

[0145] Exemplarily, there are multiple power devices 21, and the multiple power devices 21 include multiple first power devices 21a and multiple second power devices 21b. The multiple first power devices 21 correspond to the multiple first channels 4151a. The multiple second power devices 21b correspond to the multiple second channels 4151b. In the gravity direction, the liquid level of the liquid cooling medium 41a in each channel 4151 is higher than that of each power device 21.

[0146] exist Fig.17 In the illustrated embodiment, the heat generated by the first power device 21a when working is transferred to the liquid cooling medium 41a in the plurality of first channels 4151a, and the heat generated by the second power device 21b when working is transferred to the liquid cooling medium 41a in the plurality of second channels 4151b. The liquid cooling medium 41a absorbs heat and boils to form a gaseous cooling medium 41a, and the gaseous cooling medium 41a flows to the second chamber 416 through the first flow hole 4153 and the through hole 4141. The gaseous cooling medium 41a releases heat and condenses to form a liquid cooling medium 41a, and the working medium pump 42 drives the liquid cooling medium 41a to flow from the third flow hole 4155 to each first channel 4151a through the working medium pump 42, and then flows through each second channel 4151b.

[0147] The design of the channel 4151 extending along the second direction is conducive to increasing the difficulty of the liquid cooling medium 41a flowing from the channel 4151 through the through hole 4141 to the second chamber 416, is conducive to keeping the liquid cooling medium 41a always higher than the power device 21, is conducive to improving the efficiency of transferring the heat generated by the power device 21 during operation to the cooling medium 41a, and is conducive to improving the heat dissipation efficiency of the power device 21.

[0148] The working fluid pump 42 drives the cooling working fluid 41a to flow through each first channel 4151a first and then through each second channel 4151b, which guides the flow of the cooling working fluid 41a in the first chamber 415, which is conducive to reducing the difficulty of the liquid level of the cooling working fluid 41a in the first chamber 415 being higher than each power device 21, which is conducive to reducing the pressure head requirements and life requirements for the working fluid pump 42, which is conducive to reducing the processing cost of the working fluid pump 42 and the processing cost of the power conversion device 100. Moreover, the structure of the first chamber 415 is diverse and the design cost is low, which is conducive to reducing the processing cost of the power conversion device 100.

[0149] It can be understood that in this embodiment, the structure of the first chamber 415 is applied to the scenario where the working fluid pump 42 is located outside the radiator 41 , and the structural improvement of the first chamber 415 can also be applied to the scenario where the working fluid pump 42 is accommodated in the radiator 41 .

[0150] See also Fig. 20 and Fig.21 , and combined with Figure 3 , Fig. 20 It is a structural schematic diagram of another power conversion device 100 provided in an embodiment of the present application. Fig.21 yes Fig. 20 The schematic diagram of the structure of the heat dissipation assembly 30 (the first fan 50, the heat exchanger 60 and the second fan 70 are omitted) of the power conversion device 100 cooperates with the power device 21.

[0151] like Figure 3 , Fig. 20 and Fig.21 As shown, Fig. 20 The embodiment shown and Figure 3 The structures of the embodiments shown are similar, and the difference between the two is that the arrangement of the plurality of condensation flat tubes 412 is different, and the structure of the second chamber 416 is different. Fig. 20 In the illustrated embodiment, a plurality of condensation flat tubes 412 are arranged at intervals along the Y-axis direction. Exemplarily, the plurality of condensation flat tubes 412 include a first condensation flat tube 412a and a second condensation flat tube 412b. In the Y-axis direction (i.e., the gravity direction), the first condensation flat tube 412a is located above the second condensation flat tube 412b. Each condensation flat tube 412a includes a plurality of flow channels 4121. For details, please refer to Figure 3 The relevant description of the illustrated embodiment will not be repeated here.

[0152] exist Fig. 20 In the illustrated embodiment, a reinforcing portion 4160 is further provided in the second chamber 416, so that the second chamber 416 is divided into a first sub-chamber 4161 and a second sub-chamber 4162. In the Y-axis direction (i.e., the gravity direction), the first sub-chamber 4161 is located above the second sub-chamber 4162, and the first sub-chamber 4161 is connected to the first chamber 415 through the through hole 4141. The first sub-chamber 4161 is connected to the connecting portion 413 through a portion of the flow channel 4121, and the second sub-chamber 4162 is connected to the connecting portion 413 through another portion of the flow channel 4121.

[0153] Specifically, the reinforcement portion 4160 is in contact and fixed connection with the partition portion 414 and the second connecting wall 4112, and is in contact and fixed connection with the two fifth connecting walls 4115. The reinforcement portion 4160 is spaced apart from the third connecting wall 4113 and the fourth connecting wall 4114. The first sub-cavity 4161 is connected to the circulation cavity 4130 (i.e., the connecting portion 413) through the multiple flow channels 4121 of the second condensation flat tube 412a. The second sub-cavity 4162 is connected to the circulation cavity 4130 (i.e., the connecting portion 413) through the multiple flow channels 4121 of the first condensation flat tube 412a.

[0154] The heat generated by the power device 21 during operation is transferred to the liquid cooling medium 41a in the first chamber 415. The liquid cooling medium 41a in the first chamber 415 absorbs heat and boils to form a gaseous cooling medium 41a. The gaseous cooling medium 41a flows from the first chamber 415 to the first sub-chamber 4161 through the through hole 4141, and then flows from the first sub-chamber 4161 to the connecting portion 413 through a portion of the flow channel 4121. The gaseous cooling medium 41a releases heat and condenses in the first sub-chamber 4161, the flow channel 4121 between the first sub-chamber 4161 and the connecting portion 413, and the connecting portion 413 to form a liquid cooling medium 41a. The liquid cooling medium 41a flows to the connecting portion 413 under the action of gravity. The second sub-cavity 4162, the connecting portion 413, and the flow channel 4121 between the connecting portion 413 and the second sub-cavity 4162 all contain the liquid cooling medium 41a. The design of the reinforcing portion 4160 is conducive to improving the strength of the cavity wall of the second cavity 416, the structural stability and reliability of the heat dissipation substrate 411, and the structural stability and reliability of the heat sink 41.

[0155] exist Fig. 20 In the illustrated embodiment, the gaseous cooling medium 41a is transferred to the first sub-chamber 4161 through the through hole 4141, and then flows from the first sub-chamber 4161 to the circulation chamber 4130 through the multiple flow channels 4121 of the first condensation flat tube 412a. The gaseous cooling medium 41a releases heat and condenses in the first sub-chamber 4161, the first condensation flat tube 412a and the circulation chamber 4130 to form a liquid cooling medium 41a, which flows to the bottom of the circulation chamber 4130 under the action of gravity. The flow channels 4121 of the second sub-chamber 4162, the circulation chamber 4130 and the second condensation flat tube 412b all contain the liquid cooling medium 41a. The working medium pump 42 drives the liquid cooling medium 41a in the second sub-chamber 4162 or the circulation chamber 4130 to flow to the first chamber 415 through the working medium pump 42.

[0156] exist Fig. 20 In the illustrated embodiment, the first sub-cavity 4161 and the second sub-cavity 4162 are connected to the connecting portion 413 through different condensation flat tubes 412. In some other embodiments, the first sub-cavity 4161 and the second sub-cavity 4162 may also be connected through the same condensation flat tube 412. For example, in each condensation flat tube 412, the first sub-cavity 4161 is connected to the connecting portion 413 through the flow channel 4121 located above the condensation flat tube 412, and the second sub-cavity 4162 is connected to the connecting portion 413 through the flow channel 4121 located below the condensation flat tube 412.

[0157] Understandably, Fig. 20 The structural improvement of the second chamber 416 in the embodiment shown can be applied to Figures 2 to 19 In any of the embodiments shown.

Claims

1. A power conversion device, characterized in that: include: A shell, the shell comprising a first cavity and a second cavity, in a first direction, the first cavity and the second cavity are spaced apart, the shell is provided with a connecting hole, an air inlet hole and an air outlet hole, the connecting hole is connected with the first cavity and the second cavity, the air inlet hole and the air outlet hole are both connected with the second cavity, and the first direction is different from the direction of gravity; a power device, wherein the power device is accommodated in the first cavity; A heat dissipation component includes a radiator and a working fluid pump, wherein the radiator is accommodated in the second cavity, and the radiator includes a heat dissipation substrate, a plurality of condensation flat tubes and a connecting portion; wherein, The heat dissipation substrate contacts the power device through the connection hole and covers the connection hole to close the first cavity; the heat dissipation substrate includes a first cavity and a second cavity divided by a partition, and in the first direction, the first cavity is located on a side of the second cavity close to the power device; in the gravity direction, a through hole is provided on the top of the partition, and the first cavity is connected to the second cavity through the through hole; The plurality of condensation flat tubes are located on a side of the heat dissipation substrate away from the power device and are arranged at intervals, the plurality of condensation flat tubes are connected to each other through the connecting portion, and the second chamber is connected to the plurality of condensation flat tubes; the condensation flat tubes are located between the air inlet and the air outlet; The first chamber, the second chamber and the condensation flat tube are all used to accommodate a cooling medium for gas-liquid two-phase conversion, and the working medium pump is used to drive the liquid cooling medium to flow to the first chamber.

2. The power conversion device according to claim 1, characterized in that: In the gravity direction, the liquid level of the liquid cooling medium in the first chamber is higher than the power device.

3. The power conversion device according to claim 1, characterized in that: In the gravity direction, the liquid level of the liquid coolant in the first chamber is higher than the liquid coolant in the second chamber.

4. The power conversion device according to claim 1, characterized in that: The working fluid pump is located outside the radiator, and the working fluid pump includes an inlet and an outlet. The power conversion device also includes an input pipe body and an output pipe body. The inlet of the working fluid pump is connected to the second chamber or the connecting part through the input pipe body, and the outlet of the working fluid pump is connected to the first chamber through the output pipe body.

5. The power conversion device according to claim 4, characterized in that: The radiator is also provided with an input tube mounting hole and an output tube mounting hole. In the gravity direction, the input tube mounting hole is located below the second chamber or the connecting portion, and the output tube mounting hole is located below the first chamber. The working fluid pump is located below the radiator, the input tube is inserted into the input tube mounting hole, and the output tube is inserted into the output tube mounting hole.

6. The power conversion device according to claim 1, characterized in that: In the gravity direction, a mounting hole is further provided at the bottom of the partition, the mounting hole is communicated with the first chamber and the second chamber, and the working fluid pump is accommodated in the mounting hole.

7. The power conversion device according to any one of claims 1 to 6, characterized in that: The connecting portion includes a flow cavity, and the connecting portion is located on a side of the multiple condensation flat tubes facing away from the heat dissipation substrate. The connecting portion is fixedly connected to the multiple condensation flat tubes, and the flow cavity is connected to the multiple condensation flat tubes.

8. The power conversion device according to claim 7, characterized in that: The plurality of condensation flat tubes are sequentially spaced apart along a second direction to form ventilation holes, and the second direction is perpendicular to the first direction and the gravity direction.

9. The power conversion device according to claim 7, characterized in that: Each of the condensation flat tubes includes a plurality of flow channels extending along the first direction, adjacent flow channels are separated by baffles, and the plurality of flow channels are all connected to the second chamber and the connecting portion.

10. The power conversion device according to claim 9, characterized in that: A reinforcement portion is also provided in the second chamber, so that the second chamber is divided into a first sub-chamber and a second sub-chamber. In the gravity direction, the first sub-chamber is located above the second sub-chamber, and the first sub-chamber is connected with the first chamber through the through hole; the first sub-chamber is connected with the connecting portion through a part of the flow channel, and the second sub-chamber is connected with the connecting portion through another part of the flow channel.

11. The power conversion device according to any one of claims 1 to 10, characterized in that: The first chamber also includes multiple channels, which are separated by partition plates. In the first direction, each of the partition plates is fixedly connected to the cavity wall of the first chamber and the partition portion, and each of the channels is connected to the through hole. The projection of the power device in the first direction overlaps with the projection of the multiple channels in the first direction.

12. The power conversion device according to claim 11, characterized in that: The plurality of partition plates are sequentially spaced apart along a second direction, the channel extends along the gravity direction, and the second direction is perpendicular to the first direction and the gravity direction.

13. The power conversion device according to claim 11, characterized in that: The plurality of partition plates are sequentially spaced apart along the gravity direction, and the channel extends along a second direction, which is perpendicular to the first direction and the gravity direction.

14. The power conversion device according to claim 13, characterized in that: In the second direction, each of the partition plates is spaced apart from the cavity wall of the first chamber, and the multiple channels include multiple first channels and multiple second channels. In the gravity direction, the multiple second channels and the multiple first channels are arranged in sequence, one end of each of the first channels is connected to one end of each of the second channels, and the other end of each of the second channels is connected to the through hole.

15. A heat dissipation component for heat exchange with a power device, characterized in that: It includes a radiator and a working fluid pump, wherein the radiator includes a heat dissipation substrate, a plurality of condensation flat tubes and a connecting portion; wherein, The heat dissipation substrate is in heat exchange with the power device; the heat dissipation substrate comprises a first chamber and a second chamber divided by a partition, in a first direction, the first chamber is located on a side of the second chamber close to the power device, and the first direction is different from the gravity direction; in the gravity direction, a through hole is provided on the top of the partition, and the first chamber is connected with the second chamber through the through hole; The plurality of condensation flat tubes are located on a side of the heat dissipation substrate away from the power device and are arranged at intervals, the plurality of condensation flat tubes are connected to each other through the connecting portion, and the second chamber is connected to the plurality of condensation flat tubes; The first chamber, the second chamber and the condensation flat tube are all used to accommodate a cooling medium for gas-liquid two-phase conversion, and the working medium pump is used to drive the liquid cooling medium to flow to the first chamber.

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