Liquid supply conditioning device and polishing apparatus

Abstract

The application relates to the field of chemical mechanical polishing, and discloses a liquid supply trimming device and a polishing equipment. The liquid supply trimming device comprises a trimming mechanism, a liquid supply mechanism, a first driving member and a second driving member. The trimming mechanism is rotationally connected to a bearing member through a rotating shaft, and the trimming mechanism can trim a polishing pad. The liquid supply mechanism is rotationally arranged on the bearing member through an annular rotating member, the annular rotating member is arranged around the rotating shaft, the rotating axis of the annular rotating member is collinear with the rotating axis of the rotating shaft, and the liquid supply mechanism can supply polishing liquid to the polishing pad. The first driving member is fixed relative to the bearing member, the first driving member is connected with the rotating shaft to drive the trimming mechanism to swing, and the second driving member is fixed relative to the bearing member, the second driving member is connected with the annular rotating member to drive the liquid supply mechanism to swing. The liquid supply trimming device and the polishing equipment disclosed by the application integrate the trimming mechanism and the liquid supply mechanism, installation space is saved, and space utilization is improved.

Description

Technical Field

[0001] This application relates to the field of chemical mechanical polishing, and more particularly to a liquid supply dressing device and polishing equipment. Background Technology

[0002] CMP stands for Chemical Mechanical Polishing, a key technology in semiconductor surface processing. The polishing module of a CMP equipment mainly consists of a polishing pad, polishing head, cleaning station, polishing slurry supplier, and polishing pad dresser. The polishing slurry supplier is responsible for supplying polishing slurry and deionized water to the polishing pad during the polishing process, while the polishing pad dresser is responsible for repairing the polishing pad during polishing.

[0003] However, in one type of polishing equipment in the existing related technology, the polishing liquid supplier and the polishing pad dresser are arranged on the liquid supply station and the dressing station respectively, and are arranged in different positions around the polishing pad. This not only occupies the space on the worktable of the polishing equipment, but also requires consideration of whether there will be interference between the devices when arranging them. Summary of the Invention

[0004] This application discloses a liquid supply and finishing device and a polishing equipment, which integrates the finishing mechanism and the liquid supply mechanism, saving the installation space required for the finishing mechanism and the liquid supply mechanism on the carrier and improving the space utilization of the CMP equipment.

[0005] To achieve the above objectives, in a first aspect, embodiments of this application disclose a liquid supply dressing device for use in polishing equipment. The polishing equipment includes a polishing platform and a support member. The polishing platform is provided with a polishing pad for carrying materials. The support member is used to support the liquid supply dressing device. The liquid supply dressing device includes:

[0006] A trimming mechanism is rotatably connected to the carrier via a rotating shaft, and the trimming mechanism is capable of trimming the polishing pad;

[0007] The liquid supply mechanism is rotatably mounted on the support member via an annular rotating member. The annular rotating member is arranged around the rotation axis, and the rotation axis of the annular rotating member is collinear with the rotation axis of the rotation axis. The liquid supply mechanism can provide polishing liquid to the polishing pad.

[0008] A first driving member is fixed relative to the carrier member and is connected to the rotating shaft to drive the trimming mechanism to swing.

[0009] The second driving member is fixed relative to the carrier member and is connected to the annular rotating member to drive the liquid supply mechanism to swing.

[0010] As an optional implementation, the first driving component is a first motor, which includes a first stator and a first rotor. The first stator is fixedly connected to the support member, and the first rotor is connected to the rotating shaft. The second driving component is a second motor, which includes a second stator and a second rotor. The second stator surrounds the rotating shaft and is fixedly connected to the support member, and the second rotor is connected to the annular rotating member.

[0011] As an alternative implementation, the first stator is fixedly connected to the lower surface of the carrier, and the second stator is fixedly connected to the upper surface of the carrier.

[0012] In one optional implementation, the first rotor is rotatably connected to the carrier via a first rotary connector, and the second rotor is rotatably connected to the carrier via a second rotary connector.

[0013] In one optional embodiment, the first rotary connector includes a first sliding member and a first guide member, which are slidably connected; the second rotary connector includes a second sliding member and a second guide member, which are slidably connected; the first guide member and the second guide member are respectively fixedly connected to the bearing member around the rotation axis of the rotary shaft; the first sliding member is fixedly connected to the first rotor, and the second sliding member is fixedly connected to the second rotor.

[0014] As an optional implementation, the trimming mechanism includes a first swing arm and a trimming head. The end of the first swing arm near the rotating shaft is connected to the rotating shaft, and the trimming head is connected to the end of the first swing arm away from the rotating shaft. The liquid supply mechanism also includes a second swing arm and a liquid supply nozzle. The second swing arm is connected to the annular rotating member, and the liquid supply nozzle is disposed on the second swing arm.

[0015] As an alternative implementation, the length of the first swing arm is greater than the length of the second swing arm, and the first swing arm is located above the second swing arm.

[0016] As an optional implementation, the liquid supply nozzle includes a first liquid supply nozzle and a second liquid supply nozzle. The first liquid supply nozzle is disposed toward the polishing pad and is used to supply polishing liquid to the polishing pad or to rinse the polishing pad. The second liquid supply nozzle is used to rinse the dressing mechanism.

[0017] As an optional implementation, the liquid supply and conditioning device further includes a first housing and a second housing. The first housing is disposed on the support member and is connected to the liquid supply mechanism. The second housing is connected to the conditioning mechanism and is spaced apart from the first housing.

[0018] Secondly, embodiments of this application disclose a polishing apparatus, comprising:

[0019] A carrier component, wherein a polishing platform is provided on the carrier component;

[0020] A polishing pad is disposed on the polishing platform and is used to polish materials.

[0021] A polishing head assembly is disposed on the carrier and is disposed corresponding to the polishing pad. The polishing head assembly is used to carry the material.

[0022] A loading assembly is disposed on the carrier and is used for cleaning and temporarily storing the polished material;

[0023] The liquid supply trimming device described in the first aspect is disposed on the carrier.

[0024] Compared with the prior art, the beneficial effects of this application are:

[0025] The liquid supply and trimming device provided in this application integrates the trimming mechanism and the liquid supply mechanism. The first driving component is connected to the rotating shaft, and the second driving component is connected to the annular rotating component. The annular rotating component is sleeved on the rotating shaft to achieve coaxiality between the trimming mechanism and the liquid supply mechanism. This can save the installation space required for the trimming mechanism and the liquid supply mechanism on the carrier and improve the space utilization rate of the CMP equipment. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the liquid supply conditioning device disclosed in the embodiments of this application;

[0028] Figure 2 This is a schematic diagram of the structure of a polishing device disclosed in an embodiment of this application;

[0029] Figure 3 for Figure 2Another schematic diagram of the polishing equipment is shown.

[0030] Explanation of reference numerals in the attached figures:

[0031] 100-Liquid supply and dressing device; 1-Dressing mechanism; 11-Rotating shaft; 12-First swing arm; 13-Dressing head; 2-Liquid supply mechanism; 21-Annular rotating component; 22-Second swing arm; 3-First driving component; 31-First stator; 32-First rotor; 33-Mounting base; 4-Second driving component; 41-Second stator; 42-Second rotor; 5-First rotating connector; 6-Second rotating connector; 7-Outer shell; 71-First housing; 72-Second housing; 200-Polishing equipment; 201-Polishing platform; 202-Bearing component; 203-Polishing pad; 204-Polishing head assembly; 205-Loading assembly. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] In this application, the terms "upper," "lower," "inner," "vertical," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0034] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0035] Furthermore, the terms "set up," "equipped with," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0036] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0037] CMP, or Chemical Mechanical Planarization, is a key process in semiconductor manufacturing to achieve ultra-high surface flatness. This technology combines chemical action with mechanical polishing to effectively remove material and ensure the microscopic precision and flatness of the wafer surface. Specifically, the polishing module of the CMP equipment's polishing slurry supply system distributes polishing slurry and deionized water to the polishing pad surface, while the polishing pad dressing device dynamically maintains the flatness and structural integrity of the polishing pad during operation, ensuring that the polishing pad is always in optimal working condition.

[0038] In related technologies, the polishing slurry supply system and the polishing pad dressing mechanism are placed in different areas around the workbench. This layout not only occupies working space but also causes interference between the devices.

[0039] Based on this, this application discloses a liquid supply trimming device and a polishing equipment, which integrates the trimming mechanism and the liquid supply mechanism, saving the installation space required for the trimming mechanism and the liquid supply mechanism on the carrier and improving the space utilization of CMP equipment.

[0040] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0041] Please see Figure 1 , Figure 1 This is a schematic diagram of the liquid supply conditioning device 100 disclosed in the embodiments of this application.

[0042] In a first aspect, embodiments of this application disclose a liquid supply trimming device 100 for use in a polishing device 200. The polishing device 200 includes a polishing platform 201 and a support member 202. The polishing platform 201 is provided with a polishing pad 203 for carrying materials, and the support member 202 is used to support the liquid supply trimming device 100. The liquid supply trimming device 100 includes:

[0043] The trimming mechanism 1 is rotatably connected to the carrier 202 via the rotating shaft 11, and the trimming mechanism 1 can trim the polishing pad 203.

[0044] The liquid supply mechanism 2 is rotatably mounted on the support member 202 via an annular rotating member 21. The annular rotating member 21 is arranged around the rotation axis 11, and the rotation axis of the annular rotating member 21 is collinear with the rotation axis of the rotation axis 11. The liquid supply mechanism 2 can provide polishing liquid to the polishing pad 203.

[0045] The first driving member 3 is fixed relative to the carrier member 202 and is connected to the rotating shaft 11 to drive the trimming mechanism 1 to swing.

[0046] The second driving member 4 is fixed relative to the carrier member 202 and is connected to the annular rotating member 21 to drive the liquid supply mechanism 2 to swing.

[0047] Specifically, the main function of the dressing mechanism 1 is to repair and maintain the surface of the polishing pad 203, ensuring that the polishing pad 203 can provide a uniform polishing effect during the polishing process. The dressing mechanism 1 typically includes one or more dressing heads 13, which can perform reciprocating scanning motions on the surface of the polishing pad 203 to remove protrusions and damage on the surface of the polishing pad 203, restoring the flatness and polishing performance of the polishing pad 203.

[0048] The supply mechanism 2 is responsible for supplying polishing fluid to the polishing pad 203. The polishing fluid contains abrasive particles and chemical additives. During the polishing process, the polishing fluid interacts with the material surface to remove the material. The supply mechanism 2 needs to ensure that the polishing fluid is evenly distributed on the surface of the polishing pad 203 and is continuously supplied during the polishing process to maintain the polishing effect.

[0049] The first driving component 3 and the second driving component 4 control the swing of the trimming mechanism 1 and the liquid supply mechanism 2 respectively, and drive the relevant components to achieve the required dynamic adjustment and control.

[0050] In one embodiment, when the polishing equipment 200 is ready to perform polishing operation, the dressing mechanism 1 and the liquid supply mechanism 2 of the liquid supply dressing device 100 move to a preset position. After the polishing equipment 200 completes the feeding, the liquid supply mechanism 2 supplies polishing liquid to the polishing pad 203, and the polishing equipment 200 begins to perform polishing operation on the polishing pad 203. The dressing mechanism 1 swings back and forth around the axis of the rotation shaft 11 according to a preset path to dress the polishing pad 203.

[0051] In one embodiment, after the polishing equipment 200 completes the polishing operation, the polishing equipment 200 transfers the polished material away from the polishing pad 203, the liquid supply mechanism 2 stops supplying polishing liquid and starts supplying deionized water to rinse the polishing pad 203, the trimming mechanism 1 stops reciprocating motion and waits for the polishing equipment 200 to feed the material again before starting to swing.

[0052] In one embodiment, after the polishing equipment 200 has finished reloading, the liquid supply mechanism 2 stops supplying deionized water and starts supplying polishing liquid, and the trimming mechanism 1 starts to oscillate back and forth around the axis of the rotating shaft 11 according to a preset path.

[0053] In the liquid supply trimming device 100 provided in this application embodiment, the trimming mechanism 1 is connected to the rotating shaft 11, and the annular rotating component 21 in the liquid supply mechanism 2 is arranged around the rotating shaft 11, so that the trimming mechanism 1 and the liquid supply mechanism 2 are coaxially arranged, integrating the trimming mechanism 1 and the liquid supply mechanism 2 into one device. Thus, the liquid supply trimming device 100 provided in this application embodiment, while achieving both trimming and liquid supply functions, saves the installation space required for the trimming mechanism 1 and the liquid supply mechanism 2 on the support component 202, improving the space utilization rate of the CMP equipment.

[0054] Specifically, please refer to Figure 1 The first driving component 3 is a first motor, which includes a first stator 31 and a first rotor 32. The first stator 31 is fixedly connected to the support component 202, and the first rotor 32 is connected to the rotating shaft 11. The second driving component 4 is a second motor, which includes a second stator 41 and a second rotor 42. The second stator 41 surrounds the rotating shaft 11 and is fixedly connected to the support component 202, and the second rotor 42 is connected to the annular rotating component 21.

[0055] In one embodiment, a first stator 31 is fixedly connected to a support member 202, a first rotor 32 is connected to a rotating shaft 11, the first stator 31 drives the first rotor 32 to rotate via electromagnetic induction, and the first rotor 32 drives the rotating shaft 11 and the trimming mechanism 1 to swing. A second stator 41 is fixedly connected to the support member 202, and a second rotor 42 is connected to an annular rotating member 21, the second stator 41 drives the second rotor 42 to rotate via electromagnetic induction, and the second rotor 42 drives the annular rotating member 21 to rotate around the axis of the rotating shaft 11.

[0056] The first rotor 32 is connected to the rotating shaft 11, and the second rotor 42 is connected to the annular rotating component 21. The annular rotating component 21 is arranged around the rotating shaft 11, achieving coaxiality between the trimming mechanism 1 and the liquid supply mechanism 2, and enabling independent control of their rotation. This integrates the trimming mechanism 1 and the liquid supply mechanism 2. Furthermore, the coaxial design reduces the need for additional guiding and supporting structures, making the structure of the liquid supply trimming device 100 simpler and reducing manufacturing costs and complexity.

[0057] Optionally, please refer to Figure 2 , Figure 2This is a schematic diagram of a polishing device 200 disclosed in an embodiment of this application. A first stator 31 is fixedly connected to the lower surface of a support member 202, and a second stator 41 is fixedly connected to the upper surface of the support member 202. A rotating shaft 11 passes through the upper surface of the support member 202 and connects to the first stator 31 and the dressing mechanism 1. Specifically, the support member 202 has a mounting cavity, the first stator 31 is disposed within the mounting cavity and fixedly connected to the support member 202, and the second stator 41 is disposed on the upper surface of the support member 202, so that the first driving member 3 and the second driving member 4 are stacked vertically without interfering with each other.

[0058] On the one hand, by arranging the first driving component 3 and the second driving component 4 vertically and integrating the trimming mechanism 1 and the liquid supply mechanism 2, the space occupied by the trimming mechanism 1 and the liquid supply mechanism 2 can be further reduced, improving space utilization. On the other hand, the independent positioning of the first driving component 3 and the second driving component 4 reduces potential mechanical or electrical interference between them, ensuring more stable and reliable operation of the first driving component 3 and the second driving component 4.

[0059] Please see Figure 1 The first rotor 32 is rotatably connected to the carrier 202 via the first rotary connector 5, and the second rotor 42 is rotatably connected to the carrier 202 via the second rotary connector 6. Specifically, the first rotary connector 5 includes a first sliding member and a first guide member, which are slidably connected; the second rotary connector 6 includes a second sliding member and a second guide member, which are slidably connected; the first guide member and the second guide member are respectively fixedly connected to the carrier 202 around the rotation axis of the rotation shaft 11; the first sliding member is fixedly connected to the first rotor 32, and the second sliding member is fixedly connected to the second rotor 42.

[0060] In one embodiment, the first stator 31 is fixedly connected to the carrier 202 via the mounting base 33. The first stator 31 is connected to the mounting base 33, the first rotor 32 is connected to the rotating shaft 11, the rotating shaft 11 is connected to the first rotating connector 5, and the first rotating connector 5 is connected to the carrier 202, so that when the first rotor 32 drives the rotating shaft 11 to rotate, the rotating shaft 11 can rotate relative to the carrier 202.

[0061] In one embodiment, the first rotary connector 5 includes a first sliding member and a first guide member. The first guide member is fixedly connected to the support member 202, and the first sliding member is connected to the rotating shaft 11. When the first stator 31 drives the first rotor 32 to rotate, the first rotor 32 drives the rotating shaft 11 to rotate, and the first sliding member rotates relative to the first guide member along with the rotating shaft 11. The first sliding member can be directly fixedly connected to the rotating shaft 11 or directly fixedly connected to the first stator 31.

[0062] The first rotating connector 5 can be a first bearing, the first guide is a first outer ring, the first sliding member is a first inner ring, the first outer ring is fixedly connected to the bearing member 202, and the first inner ring is fixedly connected to the rotating shaft 11. When the first stator 31 drives the first rotor 32 to rotate, the first rotor 32 drives the rotating shaft 11 to rotate, and the first inner ring follows the rotating shaft 11 to rotate relative to the first outer ring.

[0063] In another embodiment, the first guide member is an annular guide rail, and the first sliding member can be a pulley. The annular guide rail is fixedly connected to the bearing member 202, and the pulley is connected to the rotating shaft 11. When the first stator 31 drives the first rotor 32 to rotate, the first rotor 32 drives the rotating shaft 11 to rotate, and the pulley rolls on the annular guide rail following the rotating shaft 11. The choice of the first rotating connecting member 5 is not limited in this embodiment.

[0064] In one embodiment, the second stator 41 is fixedly connected to the support member 202, the second stator 41 is arranged around the rotation axis 11, the second rotating connector 6 is arranged around the rotation axis 11 and fixedly arranged on the support member 202, the second rotor 42 is rotatably arranged on the second rotating connector 6, and the annular rotating member 21 is fixedly connected to the second rotor 42. When the second stator 41 drives the second rotor 42 to rotate, the second rotor 42 drives the annular rotating member 21 to rotate relative to the second rotating connector 6.

[0065] In one embodiment, the second rotary connector 6 includes a connector body, a second guide, and a second sliding member. The connector body is fixedly disposed on the support member 202, the second guide is fixedly disposed on the connector body, and the second rotor is connected to the second sliding member. When the second stator 41 drives the second rotor 42 to rotate, the second rotor 42 drives the second sliding member to rotate relative to the second guide member, so that the second rotor 42 can rotate relative to the support member 202.

[0066] In one embodiment, the second rotating connector 6 may be a second bearing, which includes a second outer ring and a second inner ring. The second outer ring is connected to the second rotor 42, and the second inner ring is disposed on the carrier 202. When the second stator 41 drives the second rotor 42 to rotate, the second rotor 42 drives the second outer ring to rotate relative to the second inner ring. The second inner ring can be fixed to the carrier 202 by the connector body or directly fixed to the carrier 202.

[0067] In one embodiment, the second guide member can be an annular guide rail, and the second sliding member can be a pulley. The annular guide rail is disposed on the upper surface of the connector body, and the pulley is disposed on the lower surface of the second rotor 42. When the second stator 41 drives the second rotor 42 to rotate, the second rotor 42 can drive the pulley to roll on the annular guide rail. The selection of the second rotating connector 6 is not limited in this embodiment.

[0068] The first rotor 32 and the rotating shaft 11 are rotated relative to the support member 202 by the first rotating connector 5. On the one hand, the first sliding member and the first guide member in the first rotating connector 5 not only support the rotating shaft 11, but also prevent the rotating shaft 11 from shaking due to the lack of limit during rotation, and prevent the rotating shaft 11 from contacting the support member 202 during rotation, so as to avoid unnecessary wear on the support member 202 and the rotating shaft 11. This ensures the stability of the rotation of the rotating shaft 11 and the first rotor 32, and also extends the service life of the rotating shaft 11.

[0069] The second rotor 42 is able to rotate relative to the support member 202 through the second rotating connector 6. The connector body of the second rotating connector 6 is fixed on the support member 202, providing stable support and precise positioning for the second rotor 42 and the liquid supply mechanism 2, ensuring the smoothness and accuracy of the rotational movement of the second rotor 42. The second guide provides the movement path of the second rotor 42, ensuring that the second rotor 42 can rotate smoothly along the predetermined trajectory, avoiding wear caused by additional radial or lateral displacement, and extending the service life of the second rotor 42.

[0070] Optionally, please refer to Figure 1 The trimming mechanism 1 includes a first swing arm 12 and a trimming head 13. The end of the first swing arm 12 near the rotating shaft 11 is connected to the rotating shaft 11, and the trimming head 13 is connected to the end of the first swing arm 12 away from the rotating shaft 11. The liquid supply mechanism 2 includes a second swing arm 22 and a liquid supply nozzle. The second swing arm 22 is connected to the annular rotating member 21, and the liquid supply nozzle is disposed on the second swing arm 22.

[0071] In one embodiment, when the polishing equipment 200 is ready to perform a polishing operation, the first driving member 3 drives the rotating shaft 11 to rotate the first swing arm 12 and the dressing head 13 to a preset position, and the second driving member 4 drives the annular rotating member 21 to rotate the second swing arm 22 and the liquid supply nozzle to a preset position. When the polishing equipment 200 starts the polishing operation, the second driving member 4 and the second swing arm 22 are stationary, the liquid supply nozzle supplies polishing liquid to the polishing pad 203, the first driving member 3 drives the first swing arm 12 to swing back and forth along a preset path, and the dressing head 13 rotates to polish and dress the polishing pad 203.

[0072] In one embodiment, after the polishing equipment 200 completes the polishing operation, the first drive member 3 stops driving the rotating shaft 11 to rotate, the first swing arm 12 and the second swing arm 22 are stationary, the second drive member 4 and the second swing arm 22 are stationary, the liquid supply nozzle stops supplying polishing liquid and starts supplying deionized water to rinse the polishing pad 203.

[0073] It is understandable that by setting up the first swing arm 12 and the second swing arm 22, the first swing arm 12 is responsible for carrying the dressing head 13 and driving the dressing head 13 to perform grinding in the preset position; the second swing arm 22 ensures the positioning of the liquid supply nozzle. The first swing arm 12 and the second swing arm 22 work together to improve the accuracy of the polishing operation, and the independent first swing arm 12 and the second swing arm 22 are easy to maintain.

[0074] Optionally, please refer to Figure 1 On the one hand, the length of the first swing arm 12 is greater than the length of the second swing arm 22. Specifically, this is because swing arms of different lengths occupy different spaces during movement. In the polishing equipment 200, the first swing arm 12 and the second swing arm 22 swing around the rotation axis 11. If the lengths of the first swing arm 12 and the second swing arm 22 were the same, they would interfere with each other during swinging, limiting the range of motion and working freedom of the dressing mechanism 1. By designing the first swing arm 12 and the second swing arm 22 to have different lengths, it can be ensured that the first swing arm 12 and the second swing arm 22 will not collide with each other during operation, thus allowing the first swing arm 12 and the second swing arm 22 to move freely within a preset space, ensuring the normal operation of the polishing equipment 200.

[0075] On the other hand, the first swing arm 12 is located above the second swing arm 22. Specifically, when the first swing arm 12 and the second swing arm 22 are working, the liquid supply nozzle on the second swing arm 22 needs to supply polishing liquid to the polishing pad 203. The liquid supply mechanism 2 is usually fixed when the polishing equipment 200 is working. The dressing head 13 on the first swing arm 12 needs to dress different positions on the polishing pad 203. Therefore, the first swing arm 12 usually swings back and forth along a preset path when the polishing equipment 200 is working. If the first swing arm 12 is below the second swing arm 22, the polishing liquid or deionized water supplied by the liquid supply nozzle on the second swing arm 22 will spray out... The polishing fluid is a chemical liquid, and the first swing arm 12 and the dressing head 13 will be subjected to long-term liquid erosion, which will accelerate the wear and corrosion of mechanical parts, reduce the service life of the liquid supply dressing device 100, and increase maintenance costs. In addition, the polishing fluid or deionized water supplied by the liquid supply nozzle on the second swing arm 22 will splash in all directions when it is sprayed onto the first swing arm 12 and the dressing head 13. Accidental spraying of liquid may make the operating environment slippery, increase the risk of workers slipping, or cause safety problems such as short circuits near electrical components.

[0076] The first swing arm 12 and the dressing head 13 need to be rinsed after polishing the polishing pad 203 to ensure the dressing effect of the dressing head 13 on the polishing pad 203. In related technologies, a separate rinsing mechanism is usually set for the dressing mechanism 1. Optionally, the liquid supply nozzle includes a first liquid supply nozzle and a second liquid supply nozzle. The first liquid supply nozzle is set towards the polishing pad 203 and is used to supply polishing liquid to the polishing pad 203 or to rinse the polishing pad 203. The second liquid supply nozzle is used to rinse the dressing mechanism 1.

[0077] In one embodiment, when the polishing equipment 200 is ready to perform polishing operations, the second swing arm 22 drives the first liquid supply nozzle and the second liquid supply nozzle to move to a preset position, and the first liquid supply nozzle supplies polishing liquid to the polishing pad 203.

[0078] In another embodiment, after the polishing equipment 200 completes the polishing operation, the first swing arm 12 stops above the second swing arm 22, the first liquid supply nozzle on the first swing arm 12 provides deionized water to the polishing pad 203 to rinse the polishing pad 203, and the second liquid supply nozzle faces the dressing mechanism 1 to rinse the dressing mechanism 1.

[0079] Understandably, compared to setting up a separate rinsing mechanism for the trimming mechanism 1, by using a first liquid supply nozzle and a second liquid supply nozzle, with the first liquid supply nozzle used to supply polishing liquid and deionized water to the polishing pad 203 and the second liquid supply nozzle used to rinse the trimming mechanism 1, there is no need to design and install an additional independent rinsing mechanism, which reduces material and manufacturing costs. Furthermore, by setting up a first liquid supply nozzle and a second liquid supply nozzle, the need for an additional rinsing mechanism is reduced, simplifying the structure of the liquid supply trimming device 100, saving space, and making the liquid supply trimming device 100 more compact overall.

[0080] Optionally, the trimming mechanism 1 further includes a third driving member, which is connected to the first swing arm 12 to drive the first swing arm 12 to move the trimming head 13 in the vertical direction, so as to adjust the position and pressure of the trimming head 13.

[0081] It is understandable that by driving the first swing arm 12 through the third drive component, the position of the dressing head 13 in the vertical direction can be adjusted to ensure that the dressing head 13 can be aligned with a specific area of ​​the polishing pad 203, thereby improving the accuracy of the polishing process.

[0082] Optionally, the liquid supply and conditioning device 100 further includes a first housing 71 and a second housing 72. The first housing 71 is disposed on the support member 202, the liquid supply mechanism 2 is connected to the first housing 71, and the second housing 72 is connected to the conditioning mechanism 1. The first housing 71 and the second housing 72 are spaced apart.

[0083] Understandably, the first housing 71 and the second housing 72 prevent dust, impurities, and external forces from damaging the internal liquid supply mechanism 2 and trimming mechanism 1, ensuring the stable operation of the liquid supply trimming device 100. Furthermore, the application of shock-absorbing materials reduces vibration and noise during operation, creating a quieter working environment. The spacing between the first housing 71 and the second housing 72 allows for independent control of the liquid supply mechanism 2 and the trimming mechanism 1 during operation, ensuring their effectiveness.

[0084] Secondly, please refer to Figure 2 This application provides a polishing apparatus 200, comprising:

[0085] The support component 202 is provided with a polishing platform 201;

[0086] Polishing pad 203 is disposed on polishing platform 201 and is used to polish materials.

[0087] Polishing head assembly 204 is disposed on the carrier 202 and is disposed corresponding to the polishing pad 203. Polishing head assembly 204 is used to carry materials.

[0088] Loading component 205 is disposed on the carrier 202 and is used for cleaning and temporarily storing the polished material;

[0089] The first aspect is the liquid supply adjustment device 100, which is mounted on the carrier 202.

[0090] Please see Figure 2 and Figure 3 , Figure 3 for Figure 2 Another schematic diagram of the polishing apparatus 200 is shown. The polishing apparatus 200 of this application embodiment includes the following working process:

[0091] S1. The trimming mechanism 1 and the liquid supply mechanism 2 move to the preset positions;

[0092] S2. The polishing head assembly 204 loads material from the loading assembly 205;

[0093] S3. The polishing head assembly 204 moves to a preset position on the polishing pad 203;

[0094] S4. The liquid supply mechanism 2 delivers polishing liquid to the polishing pad 203, while the polishing head assembly 204 presses the material onto the polishing pad 203 for polishing.

[0095] S5. The dressing mechanism 1 begins to swing back and forth, and at the same time, the dressing mechanism 1 presses the dressing head 13 onto the polishing pad 203 for dressing.

[0096] S6. The polishing head assembly 204 transfers the polished material to the loading assembly 205, while the liquid supply mechanism 2 stops supplying polishing liquid and starts supplying deionized water to rinse the polishing pad 203.

[0097] S7. Repeat S2 to S6 for polishing;

[0098] S8. After the polishing operation is completed, the dressing mechanism 1 and the liquid supply mechanism 2 return to their initial positions.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A liquid supply and conditioning device for use in polishing equipment, the polishing equipment comprising a polishing platform and a support, the polishing platform being provided with a polishing pad for supporting materials, the support being used to support the liquid supply and conditioning device, characterized in that, The liquid supply conditioning device includes: A trimming mechanism is rotatably connected to the carrier via a rotating shaft, and the trimming mechanism is capable of trimming the polishing pad; The liquid supply mechanism is rotatably mounted on the support member via an annular rotating member. The annular rotating member is arranged around the rotation axis, and the rotation axis of the annular rotating member is collinear with the rotation axis of the rotation axis. The liquid supply mechanism can provide polishing liquid to the polishing pad. A first driving member is fixed relative to the carrier member and is connected to the rotating shaft to drive the trimming mechanism to swing. The second driving member is fixed relative to the carrier member and is connected to the annular rotating member to drive the liquid supply mechanism to swing. The trimming mechanism includes a first swing arm and a trimming head. The end of the first swing arm near the rotating shaft is connected to the rotating shaft, and the trimming head is connected to the end of the first swing arm away from the rotating shaft. The liquid supply mechanism also includes a second swing arm and a liquid supply nozzle. The second swing arm is connected to the annular rotating member, and the liquid supply nozzle is disposed on the second swing arm. The length of the first swing arm is greater than the length of the second swing arm, and the first swing arm is located above the second swing arm; The liquid supply nozzle includes a first liquid supply nozzle and a second liquid supply nozzle. The first liquid supply nozzle is disposed toward the polishing pad and is used to supply polishing liquid to the polishing pad or to rinse the polishing pad. The second liquid supply nozzle is used to rinse the dressing mechanism.

2. The liquid supply conditioning device according to claim 1, characterized in that, The first driving component is a first motor, which includes a first stator and a first rotor. The first stator is fixedly connected to the support member, and the first rotor is connected to the rotating shaft. The second driving component is a second motor, which includes a second stator and a second rotor. The second stator surrounds the rotating shaft and is fixedly connected to the support member, and the second rotor is connected to the annular rotating member.

3. The liquid supply conditioning device according to claim 2, characterized in that, The first stator is fixedly connected to the lower surface of the carrier, and the second stator is fixedly connected to the upper surface of the carrier.

4. The liquid supply conditioning device according to claim 2 or 3, characterized in that, The first rotor is rotatably connected to the carrier through a first rotating connector, and the second rotor is rotatably connected to the carrier through a second rotating connector.

5. The liquid supply conditioning device according to claim 4, characterized in that, The first rotary connector includes a first sliding member and a first guide member, which are slidably connected; the second rotary connector includes a second sliding member and a second guide member, which are slidably connected; the first guide member and the second guide member are respectively fixedly connected to the bearing member around the rotation axis of the rotary shaft; the first sliding member is fixedly connected to the first rotor, and the second sliding member is fixedly connected to the second rotor.

6. The liquid supply conditioning device according to claim 1, characterized in that, The liquid supply and conditioning device further includes a first housing and a second housing. The first housing is disposed on the support member and is connected to the liquid supply mechanism. The second housing is connected to the conditioning mechanism and is spaced apart from the first housing.

7. A polishing device, characterized in that, include: A carrier component, wherein a polishing platform is provided on the carrier component; A polishing pad is disposed on the polishing platform and is used to polish materials. A polishing head assembly is disposed on the carrier and is disposed corresponding to the polishing pad. The polishing head assembly is used to carry the material. A loading assembly is disposed on the carrier and is used for cleaning and temporarily storing the polished material; The liquid supply trimming device as described in any one of claims 1-6, wherein the liquid supply trimming device is disposed on the support member.

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