Film tearing apparatus

Abstract

The application discloses a film tearing device and relates to the technical field of circuit board film tearing. The circuit board has an adsorption surface and a film pasting surface, the film pasting surface has a first area and a second area, the first area and the second area are both attached with protective films, and the film tearing device comprises a base, a first film tearing mechanism, a temporary storage mechanism and a second film tearing mechanism. The first film tearing mechanism comprises an adsorption rotating assembly and a first film tearing assembly; the adsorption rotating assembly moves the circuit board to the first film tearing assembly; the first film tearing assembly tears the protective film in the first area; the adsorption rotating assembly drives the circuit board to rotate by a predetermined angle and places the circuit board in a temporary storage space of the temporary storage mechanism. The second film tearing mechanism comprises an adsorption assembly and a second film tearing assembly; the adsorption assembly moves the circuit board from the temporary storage space to the second film tearing assembly; and the second film tearing assembly tears the protective film in the second area. The film tearing device provided by the application improves the film tearing efficiency of multiple protective films and reduces the cost.

Description

Technical Field

[0001] This invention relates to the field of circuit board film peeling technology, and in particular to a film peeling device. Background Technology

[0002] Currently, to prevent electrical connection points on circuit boards from being damaged during transportation due to external factors such as collisions and friction, a common strategy in production is to add protective films to the circuit boards to provide necessary protection. In terms of specific protective measures, existing practices can be broadly divided into two categories: one is to cover one side of the circuit board with a single protective film, which effectively covers and protects all electrical connection points; this method is simple to operate and relatively inexpensive. The other is to use a multi-film strategy, where multiple protective films are placed on one side of the circuit board according to the distribution of electrical connection points in different areas, with each film specifically protecting the connection points in a particular area. The protective films need to be removed before the circuit board is used in subsequent processing.

[0003] For single protective films, existing film-tearing equipment typically uses a clamping mechanism to fix one end of the protective film. Then, the clamping mechanism moves along the length or width of the circuit board to tear off the entire protective film at once. The whole process is highly automated and has high production efficiency.

[0004] However, existing film removal solutions are less than ideal for circuit boards with multiple protective films. On the one hand, relying on manual film removal is not only inefficient and prone to errors, but also increases labor and time costs. On the other hand, while setting up multiple independent film removal devices to process each protective film separately can remove all the protective films, such systems are often complex in structure, difficult to debug and maintain, and the collaborative operation between multiple devices also increases the risk of operational errors, making the entire film removal process cumbersome and inefficient. Summary of the Invention

[0005] The main objective of this invention is to provide a film-removing device that aims to improve the efficiency of removing multiple protective films from a circuit board on one side and reduce costs.

[0006] To achieve the above objectives, the present invention proposes a film-removing device for removing the protective film from a circuit board. The circuit board has an adsorption surface and a film-coated surface. The film-coated surface has a first region and a second region, both of which are covered with a protective film. The film-removing device comprises:

[0007] abutment;

[0008] The first film-tearing mechanism includes an adsorption rotation component and a first film-tearing component disposed adjacent to the base. The adsorption rotation component includes a first driving module, a flipping component, and a first adsorption component. The flipping component is connected to the first driving module, and the first adsorption component is connected to the output end of the flipping component. The first adsorption component is used to adsorb the adsorption surface, and the first film-tearing component is used to tear off the protective film in the first area.

[0009] A temporary storage mechanism, wherein the temporary storage mechanism is provided with a temporary storage space, the temporary storage space being used to temporarily store the circuit board; and

[0010] The second film-removing mechanism includes an adsorption component and a second film-removing component disposed adjacent to the base. The adsorption component is connected to the output end of the second film-removing component. The adsorption component is used to adsorb the circuit board in the temporary storage space, and the second film-removing component is used to remove the protective film in the second area.

[0011] The flipping component drives the first adsorption component to rotate the circuit board along the axial direction of the film surface by a predetermined angle, and the first driving module drives the flipping component to move the first adsorption component to transfer the circuit board to the temporary storage space.

[0012] In one embodiment, the temporary storage mechanism includes:

[0013] A temporary storage holder, wherein the temporary storage holder has the temporary storage space, and the temporary storage holder further has a positioning block protruding along the extending direction of the temporary storage space; and

[0014] An adsorption section is provided in the temporary storage space, and the adsorption section is used to adsorb or release the circuit board in the temporary storage space;

[0015] The first driving module drives the flipping component to move the first adsorption component and the circuit board within the temporary storage space along the extension direction of the temporary storage space, and abuts against the positioning block.

[0016] In one embodiment, the base is provided with a slide rail, the temporary storage seat is provided with a slide block that slides with the slide rail, and the temporary storage mechanism further includes a driving part provided on the base, the driving part being connected to the temporary storage seat;

[0017] The driving unit drives the temporary storage seat to move along the extension direction of the slide rail to form a first position and a second position. The first position corresponds to the adsorption rotation component, and the second position corresponds to the adsorption component.

[0018] In one embodiment, the base is further provided with a feeding space for feeding the circuit board, and the first region and the second region are arranged in the feeding space along a first direction;

[0019] The first driving module drives the flipping component to move the first adsorption component from the feeding space to the first film-tearing assembly. The flipping component drives the first adsorption component to rotate the circuit board so that the first area and the second area are swapped in the first direction.

[0020] In one embodiment, both the first film-peeling assembly and the second film-peeling assembly include:

[0021] A flipping drive unit is disposed on the base;

[0022] A flip plate, wherein the flip plate is disposed at the output end of the flip drive member; and

[0023] A clamping member is disposed on the flip plate and has a clamping space for clamping the protective film.

[0024] The first driving module drives the flipping component to move the first adsorption component to the clamping space of the first film-tearing component, and the flipping driving component drives the clamping space to flip to tear off the protective film in the first area.

[0025] In one embodiment, there are two clamping members, which are spaced apart from each other on the flip plate. Each clamping member includes:

[0026] A substrate, wherein the substrate is disposed on the flip plate;

[0027] A clamping drive unit, wherein the clamp is disposed on the substrate;

[0028] A first clamping block, disposed on the substrate and adjacent to the clamping drive member; and

[0029] The second clamping block is located at the output end of the clamping drive member. The clamping drive member drives the second clamping block to move relative to the first clamping block. The clamping space is formed between the first clamping block and the second clamping block. The opening of the clamping space faces away from the flip plate.

[0030] In one embodiment, the first adsorption element includes two adsorption substrates arranged side by side at the output end of the flipping element and a suction cup disposed on each of the adsorption substrates, wherein the suction cup adsorbs the circuit board and makes it adhere tightly to the adsorption substrate.

[0031] In one embodiment, the adsorption component includes:

[0032] A second drive module, the second drive module being disposed on the base; and

[0033] The second adsorption element is disposed at the output end of the second drive module, and the second drive module drives the second adsorption element to adsorb the adsorption surface of the circuit board from the temporary storage space.

[0034] In one embodiment, the film-tearing device further includes a feeding mechanism disposed on the base. The feeding mechanism forms a feeding area and a feeding space. The feeding space is used to accommodate a tray containing a circuit board, and the feeding area is used to accommodate an empty tray.

[0035] In one embodiment, the film-peeling device further includes a feeding mechanism, which is disposed on the base and adjacent to the adsorption component. The feeding mechanism is used to transport the circuit board after film peeling to the next station.

[0036] The technical solution of this invention uses a first driving module of an adsorption-rotation assembly to move a first adsorption element to a first film-removing assembly. The first film-removing assembly removes the protective film from a first area. Then, a flipping component of the adsorption-rotation assembly flips the first adsorption element, rotating the circuit board to a predetermined angle to facilitate the second film-removing assembly's processing of the protective film in a second area. Simultaneously, the first driving module moves the circuit board to a temporary storage space, where the adsorption assembly adsorbs the circuit board and moves it to the second film-removing assembly, where the second film-removing assembly removes the protective film from the second area. Thus, multiple protective films on a circuit board can be efficiently removed using a single film-removing device. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0038] Figure 1 This is a schematic diagram of the structure of an embodiment of the film-tearing device provided by the present invention;

[0039] Figure 2 for Figure 1 Another structural diagram from a different perspective;

[0040] Figure 3 for Figure 1 A schematic diagram of the feeding mechanism in the middle;

[0041] Figure 4 for Figure 1 A schematic diagram of the structure of the first film-tearing assembly;

[0042] Figure 5 for Figure 1 A schematic diagram of the adsorption rotation component in the diagram;

[0043] Figure 6 for Figure 1 A schematic diagram of the adsorption component in the diagram;

[0044] Figure 7 for Figure 1 A schematic diagram of the temporary storage mechanism in the system;

[0045] Figure 8 for Figure 1 A schematic diagram of the feeding mechanism.

[0046] Explanation of icon numbers:

[0047] 100. Film-tearing device; 1. Base; 2. First film-tearing mechanism; 21. Adsorption rotation assembly; 211. First drive module; 2111. Translation part; 2112. Lifting part; 212. Flipping part; 213. First adsorption part; 2131. Adsorption substrate; 2132. Suction cup; 22. First film-tearing assembly; 221. Clamping space; 222. Clamping part; 2221. Substrate; 2222. Clamping drive part; 2223. First clamping block; 2224. Second clamping block; 2 23. Flip drive; 224. Flip plate; 3. Temporary storage mechanism; 31. Temporary storage seat; 311. Temporary storage space; 312. Positioning block; 313. Slide groove; 32. Adsorption part; 33. Drive part; 34. Slide rail; 35. Slide base; 36. Limit switch; 4. Second film tearing mechanism; 41. Adsorption assembly; 411. Second drive module; 412. Second adsorption part; 42. Second film tearing assembly; 5. Feeding mechanism; 51. Feeding space; 52. Unloading area; 6. Unloading mechanism.

[0048] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0049] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0050] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0051] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0052] Currently, to prevent electrical connection points on circuit boards from being damaged during transportation due to external factors such as collisions and friction, a common strategy in production is to add protective films to the circuit boards to provide necessary protection. In terms of specific protective measures, existing practices can be broadly divided into two categories: one is to cover one side of the circuit board with a single protective film, which effectively covers and protects all electrical connection points; this method is simple to operate and relatively inexpensive. The other is to use a multi-film strategy, where multiple protective films are placed on one side of the circuit board according to the distribution of electrical connection points in different areas, with each film specifically protecting the connection points in a particular area. The protective films need to be removed before the circuit board is used in subsequent processing.

[0053] For single protective films, existing film-tearing equipment typically uses a clamping mechanism to fix one end of the protective film. Then, the clamping mechanism moves along the length or width of the circuit board to tear off the entire protective film at once. The whole process is highly automated and has high production efficiency.

[0054] However, existing film removal solutions are not ideal for circuit boards with multiple protective films. On the one hand, relying on manual film removal is not only inefficient and prone to errors, but also increases labor and time costs. On the other hand, while using multiple film removal devices to process each protective film separately can remove all the protective films, such systems are often complex in structure, difficult to debug and maintain, and the collaborative operation between multiple devices also increases the risk of operational errors, making the entire film removal process cumbersome and inefficient.

[0055] This invention proposes a film-removing device 100, which aims to improve the efficiency of removing multiple protective films from a circuit board on one side and reduce costs.

[0056] Please see Figures 1 to 8 In one embodiment of the present invention, a film-removing device 100 is used to remove the protective film from a circuit board. The circuit board has an adsorption surface and a film-attached surface. The film-attached surface has a first region and a second region, both of which are covered with a protective film. The film-removing device 100 includes a base 1, a first film-removing mechanism 2, a temporary storage mechanism 3, and a second film-removing mechanism 4. The first film-removing mechanism 2 includes an adsorption-rotation assembly 21 and a first film-removing assembly 22, which are adjacently disposed on the base 1. The adsorption-rotation assembly 21 includes a first driving module 211, a flipping member 212, and a first adsorption member 213. The flipping member 212 is connected to the first driving module 211, and the first adsorption member 213 is connected to the output end of the flipping member 212. The first adsorption member 213 is used to adsorb the adsorption surface, and the first film-removing assembly 22 is used to remove the protective film in the first region. The temporary storage mechanism 3 has a temporary storage space 311 for temporarily storing the circuit board. The second film-peeling mechanism 4 includes an adsorption component 41 and a second film-peeling component 42 disposed adjacent to the base 1. The adsorption component 41 is connected to the output end of the second film-peeling component 42. The adsorption component 41 is used to adsorb the circuit board in the temporary storage space 311, and the second film-peeling component 42 is used to peel off the protective film in the second area. The flipping component 212 drives the first adsorption component 213 to rotate the circuit board along the axial direction of the film-coated surface by a predetermined angle, and the first driving module 211 drives the flipping component 212 to move the first adsorption component 213 to transfer the circuit board to the temporary storage space 311.

[0057] Understandable, please refer to Figure 1 and Figure 2 The first drive module 211 moves the circuit board to the first film-removing assembly 22, which removes the protective film from the first area. Then, the flipping component 212 flips the circuit board, rotating it to a predetermined angle to facilitate the second film-removing assembly 42 in processing the protective film in the second area. Simultaneously, the first drive module 211 moves the circuit board to the temporary storage space 311, where the adsorption assembly 41 adsorbs the circuit board and moves it to the second film-removing assembly 42, which then removes the protective film from the second area. Thus, multiple protective films on a circuit board can be efficiently removed using a single film-removing device 100, thereby reducing costs.

[0058] In this embodiment, please refer to Figure 5The first drive module 211 includes a translation part 2111 disposed on the base 1 and a lifting part 2112 disposed on the output end of the translation part 2111. The flipping member 212 is disposed on the output end of the lifting part 2112. The translation part 2111 realizes the movement of the first adsorption member 213 in the horizontal plane, the lifting part realizes the movement of the first adsorption member 213 in the vertical direction, and the flipping member 212 realizes the rotation of the first adsorption member 213 around the vertical axis.

[0059] In one embodiment, the temporary storage mechanism 3 includes a temporary storage base 31 and an adsorption part 32. The temporary storage base 31 is provided with a temporary storage space 311, and a positioning block 312 protrudes from the temporary storage base 31 along the extending direction of the temporary storage space 311. The adsorption part 32 is disposed in the temporary storage space 311 and is used to adsorb or release the circuit board in the temporary storage space 311. The first driving module 211 drives the flipping member 212 to move the first adsorption member 213 and the circuit board within the temporary storage space 311 along the extending direction of the temporary storage space 311, and abuts against the positioning block 312.

[0060] Understandable, please refer to Figure 1 and Figure 7 When the flipping component 212 rotates the circuit board, the circuit board is placed in the temporary storage space 311. At this time, if the circuit board is not positioned, the adsorption component 41 directly adsorbs the circuit board in the temporary storage space 311. The position of the circuit board on the adsorption component 41 is uncertain. Accordingly, when the circuit board is moved to the second film-peeling component 42, the second film-peeling component 42 may not correspond to the circuit board, thus failing to complete the film-peeling operation in the second area. Therefore, in this embodiment, a positioning block 312 is also provided along the extension direction of the temporary storage space 311. When the circuit board moves to abut against the positioning block 312, the position of the circuit board is determined, and the adsorption component 41 only needs to adsorb at the corresponding position, thereby ensuring that the second film-peeling component can perform the film-peeling operation on the circuit board adsorbed by the adsorption component 41 at the same position each time.

[0061] The working process of the temporary storage mechanism 3 is as follows: The first adsorption component 213 adsorbs the circuit board and moves it into the temporary storage space 311. After the circuit board abuts against the positioning block 312, the adsorption part 32 is activated, the first adsorption component 213 stops adsorbing the circuit board, and the circuit board is adsorbed onto the temporary storage seat 31 through the adsorption part 32, thereby completing the temporary storage of the circuit board. The adsorption assembly 41 moves above the circuit board in the temporary storage space 311, activates the adsorption function, the adsorption part 32 closes, and the circuit board is adsorbed onto the adsorption assembly 41, thereby completing the release of the circuit board.

[0062] In one embodiment, the surface of the temporary storage seat 31 is provided with a groove 313, the surface of the groove 313 forms a temporary storage space 311, the adsorption part 32 is provided at the bottom of the groove 313, and the positioning block 312 is provided at one end of the groove 313 along the extension direction of the groove 313.

[0063] In this embodiment, please refer to Figure 7 The temporary storage base 31 is provided with a sliding groove 313. The sliding groove 313 enables the circuit board to move smoothly on the temporary storage base 31 along a predetermined trajectory, effectively preventing the circuit board from falling off or shifting during transportation and reducing positioning errors.

[0064] In one embodiment, the base 1 is provided with a slide rail 34, and the temporary storage seat 31 is provided with a slide block 35 that slides in cooperation with the slide rail 34. The temporary storage mechanism 3 also includes a driving part 33 provided on the base 1, and the driving part 33 is connected to the temporary storage seat 31. The driving part 33 drives the temporary storage seat 31 to move along the extension direction of the slide rail, forming a first position and a second position. The first position corresponds to the adsorption rotation component 21, and the second position corresponds to the adsorption component 41.

[0065] Understandable, please refer to Figure 1 and Figure 2 When the temporary storage space 311 is in the first position, it corresponds to the adsorption rotation component 21, allowing the adsorption rotation component 21 to easily transfer the circuit board into the temporary storage space 311. When the temporary storage space 311 moves to the second position, it corresponds to the second adsorption mechanism 42, facilitating the adsorption component 41 to remove the circuit board from the temporary storage space 311. Furthermore, limit switches 36 are provided at both ends of the slide 35, allowing the temporary storage space 311 to accurately move to the first and second positions. This not only optimizes the transfer process of the circuit board in the film-peeling equipment but also significantly improves the automation level and operational efficiency of the equipment.

[0066] In one embodiment, both the first film-tearing assembly 22 and the second film-tearing assembly 42 include a flipping drive 223, a flipping plate 224, and a clamping member 222. The flipping drive 223 is disposed on the base 1. The flipping plate 224 is disposed at the output end of the flipping drive 223. The clamping member 222 is disposed on the flipping plate 224, and the clamping member 222 forms a clamping space 221 for clamping the protective film. Specifically, the first drive module 211 drives the flipping member 212 to move the first adsorption member 213 to the clamping space 221 of the first film-tearing assembly 22, and the flipping drive 223 drives the clamping space 221 to flip and tear off the protective film in the first area.

[0067] In this embodiment, please refer to Figure 4Since the structures of the first film-tearing assembly 22 and the second film-tearing assembly 42 are exactly the same, the following description will use the first film-tearing assembly 22 as an example, and the structure of the second film-tearing assembly 42 will not be repeated. The first film-tearing assembly 22 clamps the protective film through the clamping space 221 formed on the clamping member 222. Then, the flipping drive member 223 drives the flipping plate 224 to rotate the clamping member 222, thereby tearing off the protective film in the first area.

[0068] In one embodiment, there are two clamping members 222, which are spaced apart on the flip plate 224. Each clamping member 222 includes a base plate 2221, a clamping drive member 2222, a first clamping block 2223, and a second clamping block 2224. The base plate 2221 is disposed on the flip plate 224. The clamping member is disposed on the base plate 2221. The first clamping block 2223 is disposed on the base plate 2221 and is disposed adjacent to the clamping drive member 2222. The second clamping block 2224 is disposed at the output end of the clamping drive member 2222. The clamping drive member 2222 drives the second clamping block 2224 to move relative to the first clamping block 2223. A clamping space 221 is formed between the first clamping block 2223 and the second clamping block 2224. The opening of the clamping space 221 faces away from the flip plate 224.

[0069] In this embodiment, the protective film is held by the first clamping block 2223 and the second clamping block 2224, and the opening of the clamping space 221 faces away from the flip plate 224, thereby avoiding motion interference between the circuit board and the flip plate.

[0070] In one embodiment, the first adsorption member 213 includes two adsorption substrates 2131 arranged side by side at the output end of the flipping member 212 and a suction cup 2132 disposed on each adsorption substrate 2131, wherein the suction cup 2132 adsorbs the circuit board in close contact with the adsorption substrate 2131.

[0071] In this embodiment, please refer to Figure 4 and Figure 5 In order to speed up the film removal efficiency of the circuit boards, the first adsorption member 213 adsorbs two circuit boards at a time for film removal. Correspondingly, the first film removal assembly 22 is provided with two clamping members 222.

[0072] In one embodiment, the adsorption assembly 41 includes a second driving module 411 and a second adsorption member 412. The second driving module 411 is disposed on the base 1. The second adsorption member 412 is disposed at the output end of the second driving module 411, and the second driving module 411 drives the second adsorption member 412 to adsorb the adsorption surface of the circuit board from the temporary storage space 311.

[0073] In this embodiment, please refer to Figure 5 and Figure 6The adsorption component 41 and the adsorption rotation component 21 have similar structures, but since the adsorption component 41 does not need to flip the circuit board, the adsorption component 41 does not have a flipping component 212. The second drive module 411 directly drives the second adsorption component 412 to move in the horizontal plane and vertical direction.

[0074] In one embodiment, the base 1 is further provided with a feeding space 51 for feeding circuit boards. The first region and the second region are arranged in the feeding space 51 along a first direction. The first driving module 211 drives the flipping member 212 to move the first suction member 213 from the feeding space 51 to the first film-peeling assembly 22. The flipping member 212 drives the first suction member 213 to rotate the circuit board so that the positions of the first region and the second region are swapped in the first direction.

[0075] In this embodiment, please refer to Figure 1 The adsorption rotation assembly 21 and the adsorption assembly 41 are arranged adjacent to each other and located on the same side of the temporary storage mechanism 3. Therefore, in order to reduce the space occupied by the film-tearing device 100, the first film-tearing assembly 22 and the second film-tearing assembly 42 are also arranged along the extension direction of the temporary storage mechanism 3. At this time, if it is necessary to process the protective film in the first area and the second area, the circuit board needs to be rotated 180 degrees. The adsorption rotation assembly 21 adsorbs the circuit board and performs the film-tearing operation on the protective film in the first area at the first film-tearing assembly 41. Subsequently, the flipping member 212 drives the circuit board to rotate 180 degrees so that the positions of the first area and the second area are swapped in the first direction, thereby facilitating the second film-tearing assembly to perform the film-tearing operation on the protective film in the second area.

[0076] In one embodiment, the film-tearing device 100 further includes a feeding mechanism 5, which is disposed on the base 1. The feeding mechanism 5 forms a feeding area 52 and a feeding space 51. The feeding space 51 is used to accommodate a tray containing a circuit board, and the feeding area 52 is used to accommodate an empty tray.

[0077] In this embodiment, the circuit board is transported from the previous station to the feeding space 51 of the feeding mechanism 5 by loading the material tray. After the adsorption rotation component 21 removes the circuit board, the empty material tray is transferred to the unloading area 52, waiting for other mechanisms to remove the empty material tray.

[0078] In one embodiment, the film-peeling device 100 further includes a feeding mechanism 6, which is disposed on the base 1 and adjacent to the adsorption component 41. The feeding mechanism 6 is used to transport the circuit board after film peeling to the next station.

[0079] In this embodiment, please refer to Figure 8The film-peeling equipment also includes a feeding mechanism 6, which is used to transport the peeled circuit boards to the next station. The feeding mechanism 6 is similar in structure to the temporary storage mechanism 3, so it will not be described in detail.

[0080] The technical solution of this invention uses an adsorption-rotation assembly 21 to transfer a circuit board from a feeding space 51 to a first film-peeling assembly 22. The first film-peeling assembly 22 holds the protective film in a clamping space 221, which then flips to peel off the protective film in the first area. A flipping component 212 drives a first adsorption component 213 to rotate the circuit board 180 degrees, simultaneously transferring it to a temporary storage space 311. The temporary storage space 311 moves the circuit board to a second position corresponding to the adsorption assembly 41. The adsorption assembly 41 removes the circuit board from the temporary storage space 311 and transfers it to a second film-peeling assembly 42, which peels off the protective film in the second area of ​​the circuit board. Finally, the adsorption assembly 41 transfers the circuit board to a feeding mechanism 6 for feeding. This achieves film peeling for circuit boards with multiple protective films attached to one side, improving peeling efficiency.

[0081] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A film-removing device for removing protective film from a circuit board, the circuit board having an adsorption surface and a film-coated surface, the film-coated surface having a first region and a second region, both the first region and the second region being coated with a protective film, characterized in that, The film-peeling device includes: abutment; The first film-tearing mechanism includes an adsorption rotation component and a first film-tearing component disposed adjacent to the base. The adsorption rotation component includes a first driving module, a flipping component, and a first adsorption component. The flipping component is connected to the first driving module, and the first adsorption component is connected to the output end of the flipping component. The first adsorption component is used to adsorb the adsorption surface, and the first film-tearing component is used to tear off the protective film in the first area. A temporary storage mechanism is provided, wherein the temporary storage space is used to temporarily store the circuit board; the temporary storage mechanism includes a temporary storage base and an adsorption part, wherein the temporary storage base has the temporary storage space and a positioning block protruding along the extending direction of the temporary storage space; the adsorption part is disposed in the temporary storage space and is used to adsorb or release the circuit board in the temporary storage space; and The second film-removing mechanism includes an adsorption component and a second film-removing component disposed adjacent to the base. The adsorption component is used to adsorb the circuit board in the temporary storage space, and the second film-removing component is used to remove the protective film in the second area. The flipping component drives the first adsorption component to rotate the circuit board along the axial direction of the film surface by a predetermined angle, and the first driving module drives the flipping component to move the first adsorption component to transfer the circuit board to the temporary storage space. The first adsorption component and the circuit board move in the temporary storage space along the extension direction of the temporary storage space and abut against the positioning block.

2. The film-tearing device as described in claim 1, characterized in that, The base is provided with a slide rail, the temporary storage seat is provided with a slide block that slides with the slide rail, and the temporary storage mechanism further includes a drive unit provided on the base, the drive unit being connected to the temporary storage seat; The driving unit drives the temporary storage seat to move along the extension direction of the slide rail to form a first position and a second position. The first position corresponds to the adsorption rotation component, and the second position corresponds to the adsorption component.

3. The film-tearing device as described in claim 1, characterized in that, Both the first film-peeling assembly and the second film-peeling assembly include: A flipping drive unit is disposed on the base; A flip plate, wherein the flip plate is disposed at the output end of the flip drive member; and A clamping member is disposed on the flip plate and has a clamping space for clamping the protective film. The first driving module drives the flipping component to move the first adsorption component to the clamping space of the first film-tearing component, and the flipping driving component drives the clamping space to flip to tear off the protective film in the first area.

4. The film-tearing device as described in claim 3, characterized in that, There are two clamping members, which are spaced apart from each other on the flip plate. Each clamping member includes: A substrate, wherein the substrate is disposed on the flip plate; A clamping drive member is disposed on the substrate; A first clamping block is disposed on the substrate and adjacent to the clamping drive member; and The second clamping block is located at the output end of the clamping drive member. The clamping drive member drives the second clamping block to move relative to the first clamping block. The clamping space is formed between the first clamping block and the second clamping block. The opening of the clamping space faces away from the flip plate.

5. The film-tearing device as described in claim 1, characterized in that, The first adsorption element includes two adsorption substrates arranged side by side at the output end of the flipping element and a suction cup disposed on each of the adsorption substrates. The suction cup adsorbs the circuit board and makes it adhere tightly to the adsorption substrate.

6. The film-tearing device as described in claim 1, characterized in that, The adsorption component includes: A second drive module, the second drive module being disposed on the base; and The second adsorption element is disposed at the output end of the second drive module, and the second drive module drives the second adsorption element to adsorb the adsorption surface of the circuit board from the temporary storage space.

7. The film-tearing device according to any one of claims 1 to 6, characterized in that, The base is also provided with a feeding space for feeding the circuit board, and the first area and the second area are arranged in the feeding space along the first direction; The first driving module drives the flipping component to move the first adsorption component from the feeding space to the first film-tearing assembly. The flipping component drives the first adsorption component to rotate the circuit board so that the positions of the first area and the second area are swapped in the first direction.

8. The film-tearing device as described in claim 7, characterized in that, The film-tearing device also includes a feeding mechanism, which is located on the base. The feeding mechanism forms a feeding area and a feeding space. The feeding space is used to accommodate a tray containing a circuit board, and the feeding area is used to accommodate an empty tray.

9. The film-tearing device according to any one of claims 1 to 6, characterized in that, The film-peeling equipment also includes a feeding mechanism, which is located on the base and adjacent to the adsorption component. The feeding mechanism is used to transport the circuit board after film peeling to the next station.

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