Patch device cover plate control method

Abstract

The application relates to the technical field of chip mounter production equipment, in particular to a cover plate control method of a chip mounter. After a sensor obtains a reaching signal of a tray module reaching a cover plate dismounting station, the tray of the tray module is fixed; a cover plate adsorption body is driven to displace at least two suction cups above the cover plate dismounting station; the suction cups of the cover plate adsorption body are driven to move downwards and are adsorbed on the upper surface of the cover plate; the cover plate is separated from the tray by the suction cups and is displaced away from the cover plate dismounting station. Before the tray module reaches the cover plate dismounting station, the weight and the magnetic attraction of the cover plate are not limited too much, the weight and the magnetic attraction can be set to be larger to ensure stability, and the overall stability is improved by displacing the cover plate by the cover plate adsorption body before the tray module reaches the cover plate dismounting station.

Description

Technical Field

[0001] This application relates to the field of chip mounter production equipment technology, and in particular to a method for controlling the cover plate of chip mounter equipment. Background Technology

[0002] In existing integrated and automated mounting processes, multiple objects are processed at a single work station. In existing solutions, each tray uses a cover plate to position and shape multiple flashlight wiring harness modules. The cover plate is usually fixed to the tray using a magnetic attraction structure, and the weight of the cover plate and the magnetic attraction force press down on each flashlight wiring harness module.

[0003] To provide sufficient positioning and shaping pressure for each flash harness submodule, the cover plate needs to have a certain weight and / or magnetic force. If the cover plate is not heavy enough or the magnetic force is insufficient, slight displacement may occur during high-speed tray transport, affecting the overall shape of the multiple flash harnesses below. However, if the cover plate is too heavy or the magnetic force is too strong, it will be difficult to remove the cover plate before the mounting process. This contradiction seriously limits the stable and efficient operation of the flash harness mounting process.

[0004] Finding a suitable cover plate control method for surface mount equipment is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] Based on this, this application proposes a cover plate control device for a patch assembly equipment to solve the problems in the prior art.

[0006] In one implementation, a method for controlling the cover plate of a chip mounting device is provided, comprising the following steps:

[0007] After obtaining the arrival signal of the tray module at the cover removal station through the sensor, the tray of the tray module is fixed.

[0008] The drive cover suction body will displace at least two suction cups above the cover removal station;

[0009] The suction cup of the drive cover plate adsorbent moves down and adsorbs onto the upper surface of the cover plate;

[0010] The cover plate is separated from the tray by a suction cup and moved away from the cover plate removal worker.

[0011] In one implementation, the step of acquiring the arrival signal of the tray module at the cover removal station via a sensor includes:

[0012] Positioning holes are provided on the tray module, and the positioning holes can be provided on the tray or the cover plate;

[0013] When the tray module arrives at the cover removal station, the detection light emitted by the light source of the displacement sensor passes through the positioning hole and is acquired by the light receiver. When the light receiver continuously acquires the detection light for a period of time exceeding a preset time threshold, it is determined that the tray module is located at the cover removal station.

[0014] In one implementation, the step of the drive cover suction body displacing at least two suction cups above the cover removal station includes:

[0015] The cover plate adsorbent is lifted to its highest position by a vertical drive device to cross the transport track.

[0016] The cover plate adsorbent is moved to the position above the cover plate removal station by a linear drive device.

[0017] In one implementation, the step of the suction cup of the drive cover plate adsorbent moving downward and adsorbing onto the upper surface of the cover plate includes:

[0018] The vertical drive device presses down the cover plate suction body and causes the suction cup to adhere to the upper surface of the cover plate.

[0019] In one implementation, the suction cup is connected to a vacuum pump via an air duct. After the suction cup is adsorbed onto the upper surface of the cover plate, the vacuum pump is activated to further adsorb and fix the suction cup onto the upper surface of the cover plate.

[0020] In one implementation, the step of separating the cover from the tray using a suction cup includes:

[0021] Activate the lifting device to move the lifting rod upward and lift the cover plate. The lifted cover plate further combines with the suction cup and adheres firmly. The suction cup then separates the cover plate from the tray.

[0022] In one implementation, the step of moving the push rod upward and lifting the cover plate includes:

[0023] The tray is provided with a clearance hole or an extension edge. The push rod moves upward and passes through the clearance hole to lift the cover plate, or the push rod moves upward and pushes against the extension edge to lift the cover plate.

[0024] In one implementation, an electromagnet adsorption structure is provided between the tray and the cover plate of the tray module. The trigger switch of the electromagnet adsorption structure is located in the clearance hole. When the push rod moves upward, it passes through the clearance hole and closes the adsorption force of the electromagnet adsorption structure through the trigger switch. The push rod continues to move upward to lift the cover plate and avoid deformation or damage to the cover plate.

[0025] In one implementation, after the push rod lifts the tray upward and makes it fit tightly against the suction cup, a vacuum pump connected to the suction cup via an air duct is activated to fix the suction cup to the upper surface of the cover plate.

[0026] According to the cover plate control method for the patch panel equipment provided in this application, compared with the prior art, the advantages are as follows: after obtaining the arrival signal of the tray module reaching the cover plate removal station through the sensor, the tray of the tray module is fixed; the cover plate suction body is driven to move at least two suction cups above the cover plate removal station; the suction cups of the cover plate suction body are driven to move down and adhere to the upper surface of the cover plate; the cover plate is separated from the tray and moved away from the cover plate removal station by the suction cups. Before the tray module reaches the cover plate removal station, the weight and magnetic attraction of the cover plate are not greatly limited, and a larger weight and magnetic attraction can be set to ensure stability. Before the tray module reaches the cover plate removal station, the cover plate is moved away by the cover plate suction body, which improves the overall stability. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a flowchart illustrating a method for controlling the cover plate of a chip mounting device in one embodiment;

[0029] Figure 2 This is one of the structural schematic diagrams of the device used in the patch panel cover control method in one embodiment;

[0030] Figure 3 This is a second schematic diagram of the device used in the patch panel cover control method in one embodiment;

[0031] Reference numerals: 1. Cover plate removal station; 10. Cover plate; 20. Pallet; 30. Pallet track; 40. Vertical drive device; 50. Linear drive device; 60. Cover plate suction body; 70. Top rod. Detailed Implementation

[0032] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] In existing integrated and automated mounting processes, multiple objects are processed at a single work station. In existing solutions, each tray uses a cover plate to position and shape multiple flashlight wiring harness modules. The cover plate is usually fixed to the tray using a magnetic attraction structure, and the weight of the cover plate and the magnetic attraction force press down on each flashlight wiring harness module.

[0034] To provide sufficient positioning and shaping pressure for each flash harness submodule, the cover plate needs to have a certain weight and / or magnetic force. If the cover plate is not heavy enough or the magnetic force is insufficient, slight displacement may occur during high-speed tray transport, affecting the overall shape of the multiple flash harnesses below. However, if the cover plate is too heavy or the magnetic force is too strong, it will be difficult to remove the cover plate before the mounting process. This contradiction seriously limits the stable and efficient operation of the flash harness mounting process.

[0035] See Figure 1 , Figure 2 , Figure 3 As shown, in one embodiment, a method for controlling the cover plate 10 of a patch device is provided, comprising the following steps:

[0036] After obtaining the arrival signal of the tray 20 module reaching the cover plate 10 removal station 1 through the sensor, the tray 20 of the tray 20 module is fixed.

[0037] The drive cover plate 10 adsorption body displaces at least two suction cups above the cover plate 10 removal station 1;

[0038] The suction cup of the adsorbent body on the drive cover plate 10 moves down and adsorbs onto the upper surface of the cover plate 10;

[0039] The cover plate 10 is separated from the tray 20 by a suction cup and removed from the cover plate 10 removal station 1.

[0040] It should be noted that a sensor is set up to monitor whether the tray 20 module has arrived at the designated cover 10 removal station 1. When the tray 20 module arrives, the sensor sends an arrival signal. The sensor can be a photoelectric sensor or a proximity sensor. The sensor will detect the presence of the tray 20 module. Once the arrival of the tray 20 module is detected, the control system will receive a new signal and trigger an action to fix the tray 20 module to prevent movement or shaking in subsequent operations; activate the drive mechanism of the cover 10 suction body, so that it moves at least two (or more, depending on the size and weight of the cover 10) suction cups to directly above the cover 10 removal station 1, ensuring that the suction cups can be accurately aligned with the surface of the cover 10, preparing for subsequent suction operations.

[0041] The control method for the cover plate 10 of the placement equipment provided in this application provides an efficient and precise way to handle the removal process of the cover plate 10 in the automated placement process. By integrating sensors, mechanical drives and adsorption technology, it achieves precise control and rapid removal of the cover plate 10.

[0042] According to the control method for the cover plate 10 of the patch device provided in this application, compared with the prior art, the beneficial effects are as follows: after obtaining the arrival signal of the tray 20 module reaching the cover plate 10 removal station 1 through the sensor, the tray 20 of the tray 20 module is fixed; the suction body of the cover plate 10 is driven to move at least two suction cups above the cover plate 10 removal station 1; the suction cups of the suction body of the cover plate 10 are driven to move down and be attracted to the upper surface of the cover plate 10; the cover plate 10 is separated from the tray 20 and removed from the cover plate 10 removal station 1 by the suction cups. Before the tray 20 module reaches the cover plate 10 removal station 1, the weight and magnetic attraction of the cover plate 10 are not greatly limited, and a larger weight and magnetic attraction can be set to ensure stability. Before the tray 20 module reaches the cover plate 10 removal station 1, the cover plate 10 is removed by the suction body of the cover plate 10, which improves the overall stability.

[0043] See Figure 1 , Figure 2 , Figure 3 As shown, in one embodiment, the step of acquiring the arrival signal of the tray 20 module reaching the cover plate 10 removal station 1 via a sensor includes:

[0044] A positioning hole is provided on the tray 20 module, and the positioning hole can be provided on the tray 20 or the cover plate 10;

[0045] When the tray 20 module arrives at the cover plate 10 removal station 1, the detection light emitted by the light source of the displacement sensor passes through the positioning hole and is acquired by the light receiver. When the light receiver continuously acquires the detection light for a longer time than a preset time threshold, it is determined that the tray 20 module is located at the cover plate 10 removal station 1.

[0046] It should be noted that positioning holes are pre-set on the tray 20 module or cover 10. The position and size of the positioning holes need to be set according to the specific structure of the tray 20 module or cover 10 to ensure that the sensor is accurately positioned through the positioning holes. In addition, the detection time is obtained by the light receiver. When the preset time threshold is exceeded, it is determined that the tray 20 module is located at the cover 10 removal station 1. If the preset time threshold is not reached, it is determined that the tray 20 module has not accurately stopped at the cover 10 removal station 1.

[0047] See Figure 1 , Figure 2 , Figure 3As shown, in one embodiment, the step of the drive cover 10 adsorption body displacing at least two suction cups above the cover 10 removal station 1 includes:

[0048] The cover plate 10 adsorbent is lifted to its highest position by the vertical drive device 40 to cross the transport track.

[0049] The linear drive device 50 moves the absorbent body of the cover plate 10 to above the cover plate 10 removal station 1.

[0050] It should be noted that the cover plate 10 is lifted to its highest position by a vertical drive device 40, which can be a cylinder, a servo motor with a lead screw, or a lifting mechanism. After the cover plate 10 is lifted to its highest position and crosses the transmission track, it is horizontally moved above the cover plate 10 removal station 1 by a linear drive device 50. The linear drive device 50 can be a linear guide rail, a servo motor with a slider, or other similar devices. This step is crucial for achieving precise positioning because the linear drive device 50 provides a stable and accurate motion trajectory. During the displacement process, the position of the cover plate 10 needs to be monitored in real time and adjusted according to preset coordinate parameters to ensure that it accurately stops directly above the cover plate 10 removal station 1.

[0051] See Figure 1 , Figure 2 , Figure 3 As shown, in one embodiment, the step of the suction cup of the drive cover 10 adsorbent moving downward and adsorbing onto the upper surface of the cover 10 includes:

[0052] The vertical drive device 40 presses down the suction body of the cover plate 10 and causes the suction cup to adhere to the upper surface of the cover plate 10.

[0053] It should be noted that, furthermore, a detection device can be set to detect the adsorption state. To ensure that the suction cup has been successfully adsorbed onto the cover plate 10, the adsorption state can be monitored by sensors or other detection devices. For example, it can be detected whether the negative pressure value inside the suction cup has reached a preset threshold, or the contact between the suction cup and the cover plate 10 can be observed through a vision system.

[0054] See Figure 1 , Figure 2 , Figure 3 As shown, in one embodiment, the suction cup is connected to a vacuum pump via an air duct. After the suction cup is adsorbed onto the upper surface of the cover plate 10, the vacuum pump is activated to further adsorb and fix the suction cup onto the upper surface of the cover plate 10.

[0055] It should be noted that the suction cup is connected to the vacuum pump via an air duct, and the vacuum pump is started after the suction cup is initially attached to the cover plate 10 to further enhance the suction force. This ensures that there is sufficient suction force to pick up the suction cup, making it easy to remove the cover plate 10.

[0056] See Figure 1 , Figure 2 , Figure 3 As shown, in one embodiment, the step of separating the cover plate 10 from the tray 20 by suction cup includes:

[0057] Start the lifting device to move the lifting rod 70 upward and lift the cover plate 10. The lifted cover plate 10 is further combined with the suction cup and firmly attached. The suction cup separates the cover plate 10 from the tray 20.

[0058] It should be noted that the cover plate 10 is lifted by the lifting device and separated from the tray 20 by the suction cup. The lifting rod 70 moves upward in the vertical direction, gradually approaching and contacting the lower surface of the cover plate 10. During the process of lifting the cover plate 10, since the suction cup has been firmly attached to the upper surface of the cover plate 10, the connection between the cover plate 10 and the suction cup will become tighter, ensuring that the cover plate 10 can be stably held on the suction cup during subsequent movement.

[0059] See Figure 1 , Figure 2 , Figure 3 As shown, in one embodiment, the step of moving the push rod 70 upward and lifting the cover plate 10 includes:

[0060] The tray 20 is provided with a clearance hole or an extension edge. The top rod 70 moves upward and passes through the clearance hole to lift the cover plate 10, or the top rod 70 moves upward and presses against the extension edge to lift the cover plate 10.

[0061] It should be noted that, in the previous embodiment, when the control system issues a command, the lifting device starts to work, driving the lifting rod 70 to move upward. The lifting rod 70 rises vertically along a preset trajectory until it passes through the clearance hole of the tray 20.

[0062] See Figure 1 , Figure 2 , Figure 3 As shown, in one embodiment, an electromagnet adsorption structure is provided between the tray 20 and the cover plate 10 of the tray 20 module. The trigger switch of the electromagnet adsorption structure is located in the clearance hole. When the push rod 70 moves upward, it passes through the clearance hole and closes the adsorption force of the electromagnet adsorption structure through the trigger switch. The push rod 70 continues to move upward to lift the cover plate 10 and avoid deformation or damage to the cover plate 10.

[0063] It should be noted that when the control system issues a command, the lifting device starts working, driving the lifting rod 70 to move upward. The lifting rod 70 rises vertically along a preset trajectory until it passes through the clearance hole of the tray 20. During the process of passing through the clearance hole, the lifting rod 70 contacts the trigger switch and triggers it. The trigger switch then sends a signal to the control system, and the control system responds to this signal and cuts off the power to the electromagnet. As the power to the electromagnet is cut off, the attraction force it generates quickly disappears. At this time, the cover plate 10 is no longer subject to the attraction force from the electromagnet. Since the attraction force of the electromagnet has been closed before the lifting rod 70 lifts the cover plate 10, the cover plate 10 will not be subjected to sudden tension or pressure from the electromagnet during the separation process, thereby avoiding possible deformation or damage.

[0064] See Figure 1 , Figure 2 , Figure 3 As shown, in one embodiment, after the push rod 70 pushes the tray 20 upward and tightly fits it with the suction cup, the vacuum pump connected to the suction cup through an air duct is started to fix the suction cup to the upper surface of the cover plate 10.

[0065] It should be noted that before the push rod 70 tightly adheres the tray 20 to the suction cup, the suction cup is already connected to the vacuum pump via an air conduit. This connection ensures that when the vacuum pump is started, a negative pressure can be quickly generated inside the suction cup; as the negative pressure is generated, the air between the suction cup and the upper surface of the cover plate 10 is quickly expelled, forming a relatively vacuum environment. The suction force generated by this negative pressure environment firmly adheres the suction cup to the cover plate 10; since the tray 20 is now tightly attached to the suction cup, this suction force also indirectly acts on the tray 20, further enhancing the overall stability.

[0066] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly set on the other component; when a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to the other component.

[0067] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" or "several" means two or more, unless otherwise explicitly specified.

[0068] It should be noted that the structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which this application can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size should still fall within the scope of the technical content disclosed in this application, provided that they do not affect the effects and purposes that this application can produce.

[0069] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for controlling the cover plate of a chip mounting equipment, characterized in that, Includes the following steps: After obtaining the arrival signal of the tray module at the cover removal station through the sensor, the tray of the tray module is fixed. The drive cover suction body will displace at least two suction cups above the cover removal station; The suction cup of the drive cover plate adsorbent moves down and adsorbs onto the upper surface of the cover plate; The cover plate is separated from the tray and moved away from the cover plate removal worker by a suction cup; The step of separating the cover plate from the tray using a suction cup includes: Start the lifting device to move the lifting rod upward and lift the cover plate. The lifted cover plate is further combined with the suction cup and firmly attached. The cover plate is then separated from the tray by the suction cup. The step of moving the push rod upward and lifting the cover plate includes: The tray is provided with a clearance hole, and the push rod moves upward and passes through the clearance hole to lift the cover plate; An electromagnet adsorption structure is provided between the tray and the cover plate of the tray module. The trigger switch of the electromagnet adsorption structure is located in the clearance hole. When the push rod moves upward, it passes through the clearance hole and closes the adsorption force of the electromagnet adsorption structure through the trigger switch. The push rod continues to move upward to lift the cover plate and avoid deformation or damage to the cover plate.

2. The method for controlling the cover plate of a chip mounting device according to claim 1, characterized in that, The step of acquiring the arrival signal of the tray module at the cover plate removal station via a sensor includes: Positioning holes are provided on the tray module, and the positioning holes can be provided on the tray or the cover plate; When the tray module arrives at the cover removal station, the detection light emitted by the light source of the displacement sensor passes through the positioning hole and is acquired by the light receiver. When the light receiver continuously acquires the detection light for a period of time exceeding a preset time threshold, it is determined that the tray module is located at the cover removal station.

3. The method for controlling the cover plate of a chip mounting equipment according to claim 1, characterized in that, The step of the drive cover plate suction body displacing at least two suction cups above the cover plate removal station includes: The cover plate adsorbent is lifted to its highest position by a vertical drive device to cross the transport track. The cover plate adsorbent is moved to the position above the cover plate removal station by a linear drive device.

4. The method for controlling the cover plate of a chip mounting equipment according to claim 3, characterized in that, The step of driving the suction cup of the cover plate adsorbent to move downward and adsorb onto the surface of the cover plate includes: The vertical drive device presses down the cover plate suction body and causes the suction cup to adhere to the upper surface of the cover plate.

5. The patch panel cover control method according to claim 4, characterized in that, The suction cup is connected to a vacuum pump via an air duct. Once the suction cup is adsorbed onto the upper surface of the cover plate, the vacuum pump is activated to further adsorb and fix the suction cup onto the upper surface of the cover plate.

6. The method for controlling the cover plate of a chip mounting equipment according to claim 1, characterized in that, After the push rod lifts the tray upwards and makes it fit tightly against the suction cup, the vacuum pump connected to the suction cup through an air duct is started to fix the suction cup to the upper surface of the cover plate.

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