Modified boron nitride, preparation method and application thereof, polyaryletherketone composite material and preparation method thereof
Patent Information
- Application Number
- CN202411471257.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-22
- Publication Date
- 2025-01-24
- Estimated Expiration
- 2044-10-22
AI Technical Summary
Polyaryletherketone materials lack thermal conductivity in high temperature environments, resulting in heat accumulation, affecting their service life and operating reliability.
Moisture through covalent bonds, and fluoride -containing communities to boron nanocrofi tablets to form modified boron nitride, and convergence the co -price keys with polyford etherone resin in situ. Formone ketone composite material.
Modified boron nitride significantly improves the thermal conductivity and mechanical properties of polyford etherone composite materials, enabling it to support the processing temperature above 300 ° C and extend the service life of the material.
Smart Images

Figure CN119350884A_ABST
Abstract
Citation Information
Patent Citations
Modified carbon nanotube, preparation method thereof, polyetheretherketone composite material, and preparation method of composite material
CN109851731A
Polyaryletherketone / carbon nanotube composite material, preparation method thereof and polyaryletherketone / carbon nanotube composite material film
CN109851776A
Heat-conducting filler grafted polyarylether-polyimide composite material and preparation method thereof
CN111690262A
Boron nitride-carboxylated polyarylether-polyimide composite material and preparation method thereof
CN111732835A
Surface-modified boron nitride powder for heat-conducting filler and preparation method of surface-modified boron nitride powder
CN113930087A
Cited By
Polyether-ether-ketone composite material and forming method
CN121777415A
Polyether ether ketone composite and method of forming
CN121777415B