Electroplating process

Abstract

The electroplating technology comprises the following steps that S1, a multi-layer organic substrate, a conductive sponge and an electroplating jig are installed and fixed to a PCBA, so that a first internal circuit on the multi-layer organic substrate is electrically connected with a second internal circuit on the PCBA, and the electroplating jig is electrically connected with first matrix electric connection points on the PCBA through the conductive sponge; s2, the positive electrode and the negative electrode of a direct-current power source are connected to the first internal circuit and the electroplating jig correspondingly; and S3, after electroplating is completed, the direct-current power supply is disconnected. According to the electroplating process, the direct-current power supply, the multi-layer organic substrate, the PCBA, the conductive sponge and the electroplating jig form a complete loop, and the conductive sponge is pressed on the first matrix electric connection points of the PCBA through the electroplating jig, so that the electric connection between the first matrix electric connection points and the negative electrode of the direct-current power supply can be realized, and the whole electroplating process is more convenient and simpler; therefore, the electroplating efficiency of the electric connection points on the PCBA is effectively improved.

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