Moisturizing method, wafer cleaning device, storage medium

Abstract

This application provides a moisturizing method, a wafer cleaning apparatus, a storage medium, and an electronic device. The moisturizing method is applied to a drive mechanism in a wafer cleaning apparatus. The drive mechanism includes a wheel and a rotating shaft. The rotating shaft rotates synchronously with the wheel. A first flow channel is provided inside the rotating shaft. A second flow channel is provided inside the wheel along the radial direction of the wheel. A gap is provided on the outer edge of the wheel to mate with the wafer and communicate with the second flow channel. The moisturizing method includes: monitoring whether the wafer is in place; if the wafer is in place, controlling the control fluid to flow into the first flow channel in a slightly positive pressure mode and flow out from the outer edge of the wheel through the second flow channel; if the wafer switches from in place to out of place, drawing fluid from the first flow channel in a negative pressure mode to moisturize the wheel.

Description

Technical Field

[0001] This application relates to the field of wafer cleaning technology, and more particularly to a moisturizing method, wafer cleaning apparatus, storage medium, and electronic equipment. Background Technology

[0002] In the semiconductor field, CMP (Chemical Mechanical Polishing) is one of the core processes in wafer manufacturing. After CMP, the wafer surface will be contaminated and / or have particulate matter introduced. Therefore, post-processing such as cleaning and drying is required.

[0003] Typically, a wafer cleaning system includes a drive module and a spray module. The drive module rotates the wafer, and the spray module sprays cleaning fluid onto the wafer surface for cleaning and moisturizing. However, in existing technologies, the water consumption for moisturizing the drive module is relatively large, resulting in high water loss. Summary of the Invention

[0004] In view of this, this application provides a moisturizing method, a wafer cleaning apparatus, a storage medium, and an electronic device to at least partially solve the above-mentioned problems.

[0005] According to a first aspect of this application, a moisturizing method is provided, applied to a drive mechanism in a wafer cleaning apparatus. The drive mechanism includes a wheel and a rotating shaft, the rotating shaft rotating synchronously with the wheel. A first flow channel is provided inside the rotating shaft, and a second flow channel is provided inside the wheel along the radial direction of the wheel. A gap is provided on the outer edge of the wheel to mate with the wafer and communicate with the second flow channel. The moisturizing method includes: monitoring whether the wafer is in place; if the wafer is in place, controlling the fluid to flow into the first flow channel in a slightly positive pressure mode and flow out from the outer edge of the wheel through the second flow channel; if the wafer switches from in place to out of place, drawing fluid from the first flow channel in a negative pressure mode to moisturize the wheel.

[0006] According to a second aspect of this application, a wafer cleaning apparatus is provided, comprising: a fluid supply module, a drive mechanism, and a controller. The drive mechanism includes a wheel and a rotating shaft, the rotating shaft rotating synchronously with the wheel. A first flow channel is provided inside the rotating shaft, and a second flow channel is provided inside the wheel radially. A gap is provided on the outer edge of the wheel to mate with the wafer and communicate with the second flow channel. The controller is used to perform the following moisturizing method: monitoring whether the wafer is in place; if the wafer is in place, controlling the fluid to flow into the first flow channel in a slightly positive pressure mode and flow out from the outer edge of the wheel through the second flow channel; if the wafer switches from in place to out of place, drawing fluid from the first flow channel in a negative pressure mode to moisturize the wheel.

[0007] According to a third aspect of this application, a computer storage medium is provided having a computer program stored thereon that, when executed by a processor, implements the method described in the first aspect.

[0008] According to a fourth aspect of this application, an electronic device is provided, including a processor, a memory, a communication interface, and a communication bus, wherein the processor, the memory, and the communication interface communicate with each other via the communication bus; the memory is used to store at least one executable instruction, which causes the processor to perform an operation corresponding to the method described in the first aspect.

[0009] In this application, a first flow channel is provided inside the rotating shaft of the drive mechanism, and a second flow channel is provided inside the wheel body along the radial direction of the wheel body. When the wafer is in place, the fluid is controlled to flow into the first flow channel in a slightly positive pressure mode and flow out from the outer edge of the wheel body through the second flow channel. This can clean the contact position between the wafer and the wheel body, thereby avoiding wear or contamination at the wafer edge. At the same time, the fluid flowing out from the outer edge of the wheel body through the second flow channel can keep the wheel body moisturized, eliminating the need for separate spraying of moisture to keep the wheel body moisturized. Furthermore, if the wafer switches from being in place to being out of place, fluid is drawn from the first flow channel in a negative pressure mode, which can draw out residual contaminants on the wheel body, improving the cleanliness of the wheel body and using less water.

[0010] In the semiconductor industry, wafer cleaning is an essential process, performed after every step of the manufacturing process, resulting in significant water consumption during wafer production. Furthermore, deionized water is typically used for wafer cleaning, which is also costly to produce, hindering energy conservation, emission reduction, and carbon reduction. The solution provided in this application improves wafer yield, saves on additional cleaning resources caused by wafer contamination or wear, reduces wheel cleaning costs, and enhances cleanliness, thus facilitating ESG (Environmental, Social, and Governance) management for enterprises. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0012] Figure 1 This is a schematic diagram of an exemplary drive mechanism corresponding to a moisturizing method according to an exemplary embodiment of this application;

[0013] Figure 2This is a schematic diagram of the outer end cover of a wheel in a drive mechanism according to an exemplary embodiment of this application;

[0014] Figure 3 This is a flowchart illustrating the steps of a moisturizing method according to an exemplary embodiment of this application;

[0015] Figure 4 This is a flowchart illustrating the steps of another moisturizing method according to an exemplary embodiment of this application;

[0016] Figure 5 This is a schematic diagram of the fluid control amount in a first moisturizing mode according to an exemplary embodiment of this application;

[0017] Figure 6 This is a schematic diagram of the structure of an electronic device according to an exemplary embodiment of this application;

[0018] Figure 7 This is a schematic diagram of a wafer cleaning apparatus according to an exemplary embodiment of this application. Detailed Implementation

[0019] To enable those skilled in the art to better understand the technical solutions in the embodiments, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art should fall within the scope of protection of this application.

[0020] Before describing the moisturizing method in the embodiments, the application scenarios of the moisturizing method will be briefly explained to facilitate understanding.

[0021] Reference Figure 1 , Figure 1 This is a schematic diagram of an exemplary drive mechanism corresponding to a moisturizing method according to an exemplary embodiment of this application. The moisturizing method of this embodiment can be used in a drive mechanism 100 of a wafer cleaning apparatus. The drive mechanism 100 includes a wheel and a rotating shaft 103. The rotating shaft 103 can rotate synchronously with the wheel. A first flow channel 105 is provided inside the rotating shaft 103, and the first flow channel 105 is arranged axially along the rotating shaft 103. The wheel includes a second flow channel arranged radially along the wheel. The first flow channel 105 and the second flow channel are connected. Fluid is delivered to the second flow channel through the first flow channel 105. The fluid flows out from the outer edge of the wheel through the second flow channel. The outer edge of the wheel is provided with a gap that mates with the wafer and communicates with the second flow channel. The fluid can wash away residual contaminants in the gap between the outer edge of the wheel and the wafer, thereby preventing wafer contamination.

[0022] In the embodiments, the wheel body can be the wheel body of the driving wheel or the wheel body of the driven wheel, and the fluid is used to clean the wafer or to clean the wheel body supporting the wafer. It can be water, chemical substances or any other suitable fluid, which is not limited in this application.

[0023] In one optional implementation, the wheel body may include an outer end cap 101, an inner end cap 102, and an annular pad 104. The outer end cap 101 and the inner end cap 102 are spaced apart on the rotating shaft 103 to form a gap, and the annular pad 104 is clamped in the gap. A first branch flow channel 108 is provided on the side of the outer end cap 101 opposite to the annular pad 104, and a second branch flow channel 107 is provided on the side of the inner end cap 102 opposite to the annular pad 104. The first branch flow channel 108 and the second branch flow channel 107 form a second flow channel. The edge of the outer end cap 101 may have multiple notches 109 along the circumferential direction, through which fluid flows out; or the outer end cap 101 may not have notches, and the fluid flows out in the tangential direction of the wheel body.

[0024] In the semiconductor industry, wafer cleaning is an essential process, performed after every step of the manufacturing process, resulting in significant water consumption during wafer production. Furthermore, deionized water is typically used for wafer cleaning, which is also costly to produce, hindering energy conservation, emission reduction, and carbon reduction. The solution provided in this application improves wafer yield, saves on additional cleaning resources caused by wafer contamination or wear, reduces wheel cleaning costs, and enhances cleanliness, thus facilitating ESG (Environmental, Social, and Governance) management for enterprises.

[0025] Reference Figure 3 The diagram illustrates a step flowchart of a moisturizing method according to an exemplary embodiment of this application.

[0026] The moisturizing method in this embodiment includes the following steps:

[0027] S201. Monitor whether the wafer is in place.

[0028] See Figure 7The wafer cleaning apparatus includes a housing 601, a drive mechanism, and a wafer 602 housed within the housing. The drive mechanism may include an A drive wheel 603, a B drive wheel 604, and a driven wheel 605. The A drive wheel 603 and B drive wheel 604 support the wafer 602, and the driven wheel 605 monitors the wafer's rotational speed. Any one or more of the A drive wheel 603, B drive wheel 604, and driven wheel 605 may employ the aforementioned drive structure. The A drive wheel, B drive wheel, and / or driven wheel employing the aforementioned drive structure are also connected to a fluid supply module. When cleaning the wafer, the fluid supply module controls the fluid pressure, causing fluid to flow into the corresponding A drive wheel, B drive wheel, and / or driven wheel, thereby cleaning the wafer.

[0029] During the wafer cleaning process, since the wafer is supported on the wheel and the outer edge of the wheel is provided with a gap that matches the wafer and communicates with the second flow channel, the fluid flowing out of the wheel may affect the rotation of the wafer, thereby affecting the wafer cleaning process.

[0030] Therefore, different moisturizing methods can be adopted depending on the different scenarios of wafer cleaning, such as wafer cleaning in progress, wafer replacement, and wafer cleaning paused. To reduce the impact of the moisturizing process on the wafer cleaning process, the presence of the wafer can be monitored, and different moisturizing methods can be used when the wafer is in place and when it is not.

[0031] In one optional implementation, monitoring whether the wafer is in place includes: monitoring whether the wheel is in motion; if the wheel is in motion, then the wafer is determined to be in place; if the wheel is stationary, then the action of the robot corresponding to the wafer cleaning device is monitored; if the robot does not perform a wafer picking action, then the wafer is determined to be in place; if the robot performs a wafer picking action, then the wafer is determined to be out of place.

[0032] Ideally, the wafer and the wheel should rotate synchronously. However, in actual cleaning processes, the wheel may stall. Therefore, to ensure the accuracy of the monitoring results, the movement of the robotic arm in the wafer cleaning device can be used to determine whether the wafer is in place.

[0033] In one alternative implementation, monitoring whether the wafer is in place includes: monitoring whether the wafer is in place via a light sensor in a wafer cleaning device.

[0034] The light sensor includes a transmitter and a receiver, located on opposite sides of the wafer. If the light emitted by the transmitter is received by the receiver, it indicates that the wafer is not in place; if the light emitted by the transmitter is not received by the receiver, it indicates that the light is blocked by the wafer, and the wafer is in place.

[0035] S202. If the wafer is in place, the fluid is controlled to flow into the first flow channel in a micro-positive pressure mode and flow out from the outer edge of the wheel body through the second flow channel.

[0036] If the wafer is in place, the fluid flows into the first flow channel in a slightly positive pressure mode. This allows the pressure generated by the fluid at the outer edge of the wheel to be close to 0, maintaining a slightly positive pressure state. This ensures that contaminants do not flow into the flow channel while the pressure generated by the fluid does not damage the wafer. In the slightly positive pressure mode, the pressure of the fluid is greater than 0 ps i and less than 100 ps i.

[0037] Reference Figure 1 The annular pad 104, on its side 106 away from the rotation axis, contacts the edge of the wafer through a gap. The outer end cap 101, the annular pad 104, and the inner end cap 102 rotate synchronously with the wafer around the axis of the rotation axis 103. By maintaining a slight positive pressure on the fluid, after the fluid enters the first flow channel 105, it flows through the first branch flow channel 108 and the second branch flow channel 107, respectively, across both sides of the annular pad 104, and flows out from the side of the annular pad 104 away from the rotation axis, that is, from the outer edge of the wheel body in the tangential direction of the wheel body. At this time, the fluid is controlled to flow into the first flow channel in a slight positive pressure mode, with a low fluid velocity and a fluid pressure greater than 0 ps i and less than 100 ps i. While moisturizing the wheel body, this ensures that contaminants are discharged outward with the flow of fluid, minimizing the entry of contaminants into the interior of the rinsing drive mechanism, reducing contaminant residue, and ensuring the cleaning effect of the wafer.

[0038] Furthermore, referring to Figure 2 The outer end cap 101 has multiple notches 109 along its circumferential edge, and the height of the notches 109 can be the same as the gap on the wheel body. After the fluid flows through the first branch flow channel 108 and the second branch flow channel 107 respectively through both sides of the annular pad 104, it passes through the gap in contact with the wafer and finally flows out from the notches 109 of the outer end cap 101.

[0039] S203. If the wafer switches from being in place to being out of place, fluid is drawn from the first flow channel in negative pressure mode to moisturize the wheel body.

[0040] If the wafer changes from being in place to being out of place, it means that the wafer has been removed from the cavity after cleaning. At this time, no new contaminants will be added to the wheel, and the wheel can be cleaned.

[0041] After cleaning, some water droplets and contaminants will remain on the surface of the wheel, and the contaminants that have not been cleaned will also concentrate in the water droplets. At this time, the fluid can be drawn from the first flow channel in negative pressure mode to draw out the water droplets that may contain contaminants on the wheel, thereby improving the cleanliness of the wheel.

[0042] Specifically, in negative pressure mode, the first and second flow channels draw water droplets from the gaps at the outer edge of the wheel body, minimizing the impact on the humid environment near the outer edge of the wheel body and ensuring that the wheel body remains humid.

[0043] In negative pressure mode, the suction pressure can be greater than 0 ps i and less than 100 ps i, which is a micro negative pressure that can suck out water droplets in the gaps at the outer edge of the wheel body without affecting the humidity of the environment.

[0044] In this application, a first flow channel is provided inside the rotating shaft of the drive mechanism, and a second flow channel is provided inside the wheel body along the radial direction of the wheel body. When the wafer is in place, the fluid is controlled to flow into the first flow channel in a slightly positive pressure mode and flow out from the outer edge of the wheel body through the second flow channel. This can clean the contact position between the wafer and the wheel body, thereby avoiding wear or contamination at the wafer edge. At the same time, the fluid flowing out from the outer edge of the wheel body through the second flow channel can keep the wheel body moisturized, eliminating the need for separate spraying of moisture to keep the wheel body moisturized. Furthermore, if the wafer switches from being in place to being out of place, fluid is drawn from the first flow channel in a negative pressure mode, which can draw out residual contaminants on the wheel body, improving the cleanliness of the wheel body and using less water.

[0045] Reference Figure 4 The diagram illustrates a flowchart of another moisturizing method according to an exemplary embodiment of this application.

[0046] The moisturizing method in this embodiment includes the following steps:

[0047] S301, Monitor whether the wafer is in place.

[0048] S302. If the wafer is in place, the fluid is controlled to flow into the first flow channel in a micro-positive pressure mode and flow out from the outer edge of the wheel body through the second flow channel.

[0049] S303. If the wafer changes from being in place to being out of place, the control fluid flows into the first flow channel in a flushing mode to flush the wheel until it is determined that the wafer has been removed from the wafer cleaning device, and then the fluid is drawn from the first flow channel in a negative pressure mode.

[0050] If the wafer is detected to switch from in-place to out-of-place, it indicates that the wafer cleaning is complete. Once the wafer has been cleaned and removed from the cavity, no new contaminants will be added inside the cavity. At this time, the control fluid flows into the first flow channel in rinsing mode to rinse the wheel body. The fluid pressure in rinsing mode is greater than the fluid pressure in micro-positive pressure mode in order to minimize the contaminants remaining in the previous wafer cleaning process.

[0051] After rinsing, fluid can be drawn from the first flow channel in negative pressure mode, further reducing the contaminants remaining on the wheel body.

[0052] S304. Control the fluid to flow into the first flow channel in a first moisturizing mode to moisturize the wheel body.

[0053] In addition, if the wafer is not in place, it means that the wafer cleaning device needs to wait for a period of time before cleaning the next wafer. In this case, the fluid can be controlled to flow into the first flow channel in the first moisturizing mode to moisturize the wheel body.

[0054] Specifically, when the fluid flows into the first flow channel in a first moisturizing mode, the control amount of the fluid can be determined according to the wafer running frequency of the drive mechanism. The wafer running frequency refers to the number of wafers that the drive mechanism can process per unit time. Different control amounts of the fluid are set according to different wafer running frequencies to moisturize the wheel body during wafer running. Moisturizing the wheel body can be done after rinsing and before the wheel body carries the next wafer. The control amount of the fluid can include the opening interval, duration, and flow rate, etc., which are not limited in this embodiment.

[0055] In one optional implementation, the first moisturizing mode includes a correspondence between different frequency ranges and the control quantity of the fluid. The control quantity includes an opening interval and a duration. The fluid is controlled to flow into the first flow channel in the first moisturizing mode to moisturize the wheel body. This includes: determining the wafer running frequency of the wafer cleaning device; based on the first moisturizing mode, determining the target control quantity of the fluid corresponding to the target frequency range according to the target frequency range corresponding to the wafer running frequency; and controlling the fluid to flow into the first flow channel according to the target control quantity of the fluid to moisturize the wheel body.

[0056] For example, the first moisturizing mode includes the correspondence between different frequency ranges and the controlled amount of fluid, referring to... Figure 5 Multiple frequency ranges can be set, corresponding to the control quantities of various fluids. By determining the target frequency range corresponding to the running frequency, the target control quantity of the corresponding fluid can be determined, namely the target opening interval and the target duration. Based on the target control quantity of the fluid, the fluid is controlled to flow into the first flow channel to keep the wheel body moist.

[0057] In this implementation, different frequency ranges are set to correspond to the control quantities of the fluid. This allows the control quantities of the fluid to be determined based on the frequency range reached by the running frequency of the wheel, thereby reducing fluid loss while ensuring the moisturizing effect of the wafer cleaning device during operation.

[0058] In one optional implementation, the frequency range includes a first frequency range, a second frequency range, and a third frequency range that do not overlap. Based on the first moisturizing mode, the target control quantity of the fluid corresponding to the target frequency range corresponding to the running frequency is determined, including: if the running frequency of the wheel is in the first frequency range, then the target control quantity of the fluid is determined as the first control quantity; if the running frequency of the wheel is in the second frequency range, then the target control quantity of the fluid is determined as the second control quantity, where the value in the second frequency range is greater than the value in the first frequency range, and the second control quantity is less than the first control quantity; if the running frequency of the wheel is in the third frequency range, then the target control quantity of the fluid is determined as the third control quantity, where the value in the third frequency range is greater than the value in the second frequency range, and the third control quantity is less than the second control quantity.

[0059] For example, refer to Figure 5 The frequency range can include a first frequency range, a second frequency range, and a third frequency range that do not overlap. For example, the first frequency range is less than 5 pcs / h, the second frequency range is 5-15 pcs / h, and the third frequency range is 15-30 pcs / h. The first, second, and third frequency ranges can be flexibly set by those skilled in the art according to actual conditions, and this embodiment does not impose any restrictions on this. The values ​​in the second frequency range are greater than the values ​​in the first frequency range, and the values ​​in the third frequency range are greater than the values ​​in the second frequency range. Correspondingly, the second control quantity is less than the first control quantity, and the third control quantity is less than the second control quantity. That is, as the running frequency increases, both the fluid opening interval and the duration decrease.

[0060] In this implementation, by setting the opening interval and duration of the fluid to decrease as the wafer running frequency increases, fluid loss can be further reduced while ensuring the moisturizing effect of the wafer cleaning device during operation.

[0061] Optionally, in this embodiment, during operation, the fluid can be controlled to flow into the first channel in the first moisturizing mode throughout the process, or it can be controlled specifically according to the state of the wafer in the wafer cleaning device, both of which are within the protection scope of this application.

[0062] Another embodiment of this application provides a wafer cleaning apparatus, including: a fluid supply module, a drive mechanism, and a controller. The drive mechanism includes a wheel and a rotating shaft. The rotating shaft rotates synchronously with the wheel. A first flow channel is provided inside the rotating shaft. A second flow channel is provided inside the wheel along the radial direction of the wheel. A gap is provided on the outer edge of the wheel that mates with the wafer and communicates with the second flow channel. The controller is used to perform a moisturizing method.

[0063] In one implementation, the moisturizing method may include: monitoring whether the wafer is in place; if the wafer is in place, controlling the fluid to flow into the first flow channel in a slightly positive pressure mode and flow out from the outer edge of the wheel body through the second flow channel; if the wafer switches from in place to out of place, drawing fluid from the first flow channel in a negative pressure mode to moisturize the wheel body.

[0064] Optionally, in this embodiment, the pressure of the fluid in the micro-positive pressure mode is greater than 0 ps i and less than 100 psi.

[0065] Optionally, in this embodiment, under negative pressure mode, the first flow channel and the second flow channel draw water droplets from the gap at the outer edge of the wheel body.

[0066] Optionally, in this embodiment, the step of drawing fluid from the first flow channel in negative pressure mode when the wafer switches from being in place to being out of place includes: if the wafer switches from being in place to being out of place, controlling the fluid to flow into the first flow channel in a rinsing mode to rinse the wheel until it is determined that the wafer has been removed from the wafer cleaning device, and then drawing fluid from the first flow channel in negative pressure mode.

[0067] Optionally, in this embodiment, if the wafer is not in place, after the fluid is drawn from the first flow channel in negative pressure mode, the method further includes: controlling the fluid to flow into the first flow channel in a first moisturizing mode to moisturize the wheel body.

[0068] Optionally, in this embodiment, the first moisturizing mode includes a correspondence between different frequency ranges and the control quantity of the fluid. The control quantity includes an opening interval and a duration. Controlling the fluid to flow into the first flow channel in the first moisturizing mode to moisturize the wheel body includes: determining the wafer running frequency of the wafer cleaning device; based on the first moisturizing mode, determining the target control quantity of the fluid corresponding to the target frequency range according to the target frequency range corresponding to the wafer running frequency; and controlling the fluid to flow into the first flow channel according to the target control quantity of the fluid to moisturize the wheel body.

[0069] Optionally, in this embodiment, the frequency range includes a first frequency range, a second frequency range, and a third frequency range that do not overlap. The step of determining the target control quantity of the fluid corresponding to the target frequency range corresponding to the first moisturizing mode includes: if the wheel's running frequency is in the first frequency range, then the target control quantity of the fluid is determined to be a first control quantity; if the wheel's running frequency is in the second frequency range, then the target control quantity of the fluid is determined to be a second control quantity, where the value in the second frequency range is greater than the value in the first frequency range, and the second control quantity is less than the first control quantity; if the wheel's running frequency is in the third frequency range, then the target control quantity of the fluid is determined to be a third control quantity, where the value in the third frequency range is greater than the value in the second frequency range, and the third control quantity is less than the second control quantity.

[0070] Optionally, in this embodiment, monitoring whether the wafer is in place includes: monitoring whether the wheel is in motion; if the wheel is in motion, then the wafer is determined to be in place; if the wheel is stationary, then the action of the robot corresponding to the wafer cleaning device is monitored; if the robot does not perform a wafer picking action, then the wafer is determined to be in place; if the robot performs a wafer picking action, then the wafer is determined to be out of place.

[0071] Reference Figure 6 This diagram illustrates a structural schematic of an electronic device according to an exemplary embodiment of the present application. The specific embodiments of the present invention do not limit the specific implementation of the electronic device.

[0072] like Figure 6 As shown, the electronic device may include: a processor 501, a memory 503, a communication bus 504, and a communication interface 505.

[0073] The processor 501, memory 503, and communication interface 505 communicate with each other via communication bus 504.

[0074] Communication interface 505 is used to communicate with other electronic devices or servers.

[0075] The processor 501 is used to execute the program 502, which can specifically execute the steps of any of the moisturizing methods in the above embodiments.

[0076] Specifically, program 502 may include program code that includes computer operation instructions.

[0077] Processor 501 may be a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits configured as described in the embodiments. The smart device may include one or more processors of the same type, such as one or more CPUs; or it may include processors of different types, such as one or more CPUs and one or more ASICs.

[0078] Memory 503 is used to store program 502. Memory 503 may include high-speed RAM memory, and may also include non-volatile memory, such as at least one disk storage device.

[0079] Specifically, program 502 can be used to cause processor 501 to execute steps to implement any of the moisturizing methods described in the embodiments. The specific implementation of each step in program 502 can be found in the corresponding descriptions of the steps and units executed in any of the above-described moisturizing methods, and will not be repeated here. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working process of the devices and modules described above can be referred to the corresponding process descriptions in the foregoing method embodiments.

[0080] See Figure 7 A wafer cleaning apparatus is provided, which may include a fluid supply module, a drive mechanism, and a controller.

[0081] Specifically, the wafer cleaning apparatus includes a housing 601, a drive mechanism, and a wafer 602 housed within the housing. The drive mechanism may include an A drive wheel 603, a B drive wheel 604, and a driven wheel 605. The A drive wheel 603 and B drive wheel 604 support the wafer 602, and the driven wheel 605 monitors the wafer's rotational speed. Any one or more of the A drive wheel 603, B drive wheel 604, and driven wheel 605 may employ the aforementioned drive structure. The A drive wheel, B drive wheel, and / or driven wheel employing the aforementioned drive structure are also connected to a fluid supply module. When cleaning the wafer, the fluid supply module controls the fluid pressure, causing fluid to flow into the corresponding A drive wheel, B drive wheel, and / or driven wheel, thereby cleaning the wafer.

[0082] The driving wheel or driven wheel may include: a wheel body and a rotating shaft. The rotating shaft rotates synchronously with the wheel body. A first flow channel is provided inside the rotating shaft. The wheel body includes a second flow channel arranged radially along the wheel body. The first flow channel is used to deliver fluid to the second flow channel. The fluid flows out from the outer edge of the wheel body through the second flow channel. The outer edge of the wheel body is provided with a gap that mates with the wafer and communicates with the second flow channel. The specific structure is as described above and will not be repeated here.

[0083] The embodiments also provide a computer storage medium having a computer program stored thereon, which, when executed by a processor, implements the moisturizing method as described in any of the above-described method embodiments.

[0084] The embodiments also provide a computer program product, including computer instructions that instruct a computing device to perform operations corresponding to the moisturizing method described in any of the above-described method embodiments.

[0085] It should be noted that, depending on the implementation needs, the various components / steps described in the embodiments can be broken down into more components / steps, or two or more components / steps or parts of the operation of components / steps can be combined into new components / steps to achieve the purpose of the embodiments.

[0086] The methods described above according to the embodiments can be implemented in hardware, firmware, or as software or computer code that can be stored in a recording medium (such as a CD-ROM, RAM, floppy disk, hard disk, or magneto-optical disk), or as computer code downloaded over a network that is originally stored in a remote recording medium or a non-transitory machine-readable medium and will be stored in a local recording medium. Thus, the methods described herein can be processed by software stored on a recording medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware (such as an ASIC or FPGA). It is understood that the computer, processor, microprocessor controller, or programmable hardware includes storage components (e.g., RAM, ROM, flash memory, etc.) capable of storing or receiving software or computer code that, when accessed and executed by the computer, processor, or hardware, implements the methods described herein. Furthermore, when a general-purpose computer accesses the code used to implement the methods shown herein, the execution of the code transforms the general-purpose computer into a dedicated computer for executing the methods shown herein.

[0087] Those skilled in the art will recognize that the units and method steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0088] The above embodiments are only used to illustrate this application and are not intended to limit this application. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of this application. Therefore, all equivalent technical solutions also fall within the scope of this application, and the patent protection scope of this application should be defined by the claims.

Claims

1. A method of moisturizing, characterized by, A drive mechanism used in a wafer cleaning apparatus includes a wheel and a rotating shaft. The rotating shaft rotates synchronously with the wheel. A first flow channel is provided inside the rotating shaft, and a second flow channel is provided inside the wheel along its radial direction. The outer edge of the wheel has a gap that mates with the wafer and communicates with the second flow channel. The moisturizing method includes: Monitor whether the wafer is in place; If the wafer is in place, the control fluid flows into the first channel in a slightly positive pressure mode and flows out from the outer edge of the wheel body through the second channel; If the wafer switches from in-situ to out-of-situ, the wheel body is cleaned. After cleaning, fluid is drawn from the first flow channel in a negative pressure mode that can extract water droplets from the gaps at the outer edge of the wheel body without affecting the humidity level of the environment. This is to extract and discharge water droplets that may contain contaminants on the wheel body and moisturize the wheel body.

2. The moisturizing method according to claim 1, wherein, In the micro-positive pressure mode, the pressure of the fluid is greater than 0 psi and less than 100 psi.

3. The moisturizing method according to claim 1, wherein, The cleaning of the wheel body includes: Fluid is controlled to flow into the first channel in a flushing mode to flush the wheel until it is determined that the wafer has been removed from the wafer cleaning apparatus.

4. The moisturizing method according to claim 3, wherein, If the wafer is not in place, after the negative pressure mode draws fluid from the first flow channel, the method further includes: The fluid is controlled to flow into the first flow channel in a first moisturizing mode to moisturize the wheel body.

5. The moisturizing method according to claim 4, wherein, The first moisturizing mode includes a correspondence between different frequency ranges and the control quantity of the fluid. The control quantity includes an on / off interval and a duration. Controlling the fluid to flow into the first flow channel in the first moisturizing mode to moisturize the wheel body includes: Determine the wafer running frequency of the wafer cleaning device; Based on the first moisturizing mode, the target control quantity of the fluid corresponding to the target frequency range is determined according to the target frequency range corresponding to the running frequency. According to the target control amount of the fluid, the fluid is controlled to flow into the first flow channel to moisturize the wheel body.

6. The moisturizing method according to claim 5, characterized in that, The frequency range includes a first frequency range, a second frequency range, and a third frequency range that do not overlap. The step of determining the target control quantity of the fluid corresponding to the target frequency range based on the first moisturizing mode and the target frequency range corresponding to the running frequency includes: If the running frequency of the wheel body is within the first frequency range, then the target control quantity of the fluid is determined to be the first control quantity; If the running frequency of the wheel body is in the second frequency range, then the target control quantity of the fluid is determined to be the second control quantity, the value in the second frequency range is greater than the value in the first frequency range, and the second control quantity is less than the first control quantity; If the running frequency of the wheel body is in the third frequency range, then the target control quantity of the fluid is determined to be the third control quantity. The value in the third frequency range is greater than the value in the second frequency range, and the third control quantity is less than the second control quantity.

7. The method of claim 1-6, wherein, The monitoring of whether the wafer is in place includes: Monitor whether the wheel is in motion; If the wheel is in motion, then the wafer is determined to be in place; If the wheel is stationary, the movement of the robotic arm corresponding to the wafer cleaning device is monitored. If the robotic arm does not perform a wafer picking action, the wafer is determined to be in place. If the robotic arm performs a wafer picking action, the wafer is determined to be out of place.

8. A wafer cleaning apparatus, characterized by comprising: include: Fluid supply module, drive mechanism and controller, The drive mechanism includes a wheel body and a rotating shaft. The rotating shaft rotates synchronously with the wheel body. A first flow channel is provided inside the rotating shaft. A second flow channel is provided inside the wheel body along the radial direction of the wheel body. A gap is provided on the outer edge of the wheel body that mates with the wafer and communicates with the second flow channel. The controller is used to perform the following moisturizing methods: Monitor whether the wafer is in place; If the wafer is in place, the control fluid flows into the first channel in a slightly positive pressure mode and flows out from the outer edge of the wheel body through the second channel; If the wafer switches from in-situ to out-of-situ, the wheel body is cleaned. After cleaning, fluid is drawn from the first flow channel in a negative pressure mode that can extract water droplets from the gaps at the outer edge of the wheel body without affecting the humidity level of the environment. This is to extract and discharge water droplets that may contain contaminants on the wheel body and moisturize the wheel body.

9. The wafer cleaning apparatus of claim 8, wherein In the micro-positive pressure mode, the pressure of the fluid is greater than 0 psi and less than 100 psi.

10. The wafer cleaning apparatus of claim 8, wherein The cleaning of the wheel body includes: Fluid is controlled to flow into the first channel in a flushing mode to flush the wheel until it is determined that the wafer has been removed from the wafer cleaning apparatus.

11. The wafer cleaning apparatus of claim 10, wherein If the wafer is not in place, after the negative pressure mode draws fluid from the first flow channel, the method further includes: The fluid is controlled to flow into the first flow channel in a first moisturizing mode to moisturize the wheel body.

12. The wafer cleaning apparatus of claim 11, wherein The first moisturizing mode includes a correspondence between different frequency ranges and the control quantity of the fluid. The control quantity includes an on / off interval and a duration. Controlling the fluid to flow into the first flow channel in the first moisturizing mode to moisturize the wheel body includes: Determine the wafer running frequency of the wafer cleaning device; Based on the first moisturizing mode, the target control quantity of the fluid corresponding to the target frequency range is determined according to the target frequency range corresponding to the running frequency. According to the target control amount of the fluid, the fluid is controlled to flow into the first flow channel to moisturize the wheel body.

13. The wafer cleaning apparatus of claim 12, wherein The frequency range includes a first frequency range, a second frequency range, and a third frequency range that do not overlap. The step of determining the target control quantity of the fluid corresponding to the target frequency range based on the first moisturizing mode and the target frequency range corresponding to the running frequency includes: If the running frequency of the wheel body is within the first frequency range, then the target control quantity of the fluid is determined to be the first control quantity; If the running frequency of the wheel body is in the second frequency range, then the target control quantity of the fluid is determined to be the second control quantity, the value in the second frequency range is greater than the value in the first frequency range, and the second control quantity is less than the first control quantity; If the running frequency of the wheel body is in the third frequency range, then the target control quantity of the fluid is determined to be the third control quantity. The value in the third frequency range is greater than the value in the second frequency range, and the third control quantity is less than the second control quantity.

14. The wafer cleaning apparatus of any one of claims 8-13, wherein, The monitoring of whether the wafer is in place includes: Monitor whether the wheel is in motion; If the wheel is in motion, then the wafer is determined to be in place; If the wheel is stationary, the movement of the robotic arm corresponding to the wafer cleaning device is monitored. If the robotic arm does not perform a wafer picking action, the wafer is determined to be in place. If the robotic arm performs a wafer picking action, the wafer is determined to be out of place.

15. An electronic device, comprising: include: The processor, memory, communication interface, and communication bus are provided, wherein the processor, memory, and communication interface communicate with each other via the communication bus. The memory is used to store at least one executable instruction that causes the processor to perform the operation corresponding to the method as described in any one of claims 1-7.

16. A computer storage medium having stored thereon a computer program, characterized in that When the program is executed by the processor, it implements the method as described in any one of claims 1-7.

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