Chip mounter and chip mounting method

Abstract

The application discloses a chip mounter and a chip mounting method, and belongs to the chip mounting field. The chip mounter comprises a base, and further comprises: a transfer unit arranged on the base and used for intermittently transferring chips to a substrate; a lifting unit arranged between the base and the transfer unit, the transfer unit being capable of driving the lifting unit to rotate, and being used for separating the chips from a chip tray and pressing the chips on the substrate; and a suction unit arranged on the lifting unit and used for sucking the chips in the chip tray, wherein the suction unit releases the chips on the substrate when a pressure threshold is reached between the suction unit and the substrate; and a dustproof unit arranged on the suction unit and connected with the suction unit through a pipeline. The application can overcome the problems of low chip mounting efficiency, easy deviation, easy damage to the chips, and easy dust falling on the substrate.

Description

Technical Field

[0001] This invention relates to the field of chip mounting technology, and in particular to a chip mounting machine and a chip mounting method. Background Technology

[0002] A chip, also known as an integrated circuit, is a miniature electronic circuit that integrates a large number of tiny electronic components (such as transistors, resistors, capacitors, etc.) onto a single semiconductor substrate. It is the core component of modern electronic devices and computing systems. It usually needs to be mounted onto a printed circuit board by a pick-and-place machine before it can be used and is widely used in the electronics manufacturing industry.

[0003] Current chip placement machines typically only place one chip at a time during operation, resulting in low placement efficiency. Furthermore, during the chip suction and placement process, the chip is prone to misalignment, affecting the placement quality. The suction cups can also easily damage the chip. In addition, during the suction process, dust and other impurities can enter the suction cups, and when suction stops, the dust can easily fall onto the substrate, affecting the substrate's performance. Summary of the Invention

[0004] The purpose of this invention is to solve the problems of low chip placement efficiency, easy misalignment, easy damage to the chip, and easy dust falling onto the substrate in the prior art. Therefore, a chip placement machine and chip placement method are proposed.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A chip placement machine includes a base and further includes: a transfer unit disposed on the base for intermittently transferring chips to a substrate; a lifting unit disposed between the base and the transfer unit, the transfer unit being capable of driving the lifting unit to rotate, for detaching the chip from the chip tray and pressing the chip onto the substrate; an adsorption unit disposed on the lifting unit for adsorbing the chip in the chip tray, wherein when a pressure threshold is reached between the adsorption unit and the substrate, the adsorption unit releases the chip onto the substrate; and a dustproof unit disposed on the adsorption unit, the adsorption unit and the dustproof unit being connected by a pipe for preventing dust from falling onto the substrate after adsorption and for collecting the dust.

[0007] To facilitate the transfer and positioning of the chip's adsorption location, preferably, the transfer unit includes a support column rotatably connected to the base, a fixed plate fixedly connected to the end of the support column, multiple sets of connecting columns fixedly connected to the outer wall of the fixed plate, a mounting ring fixedly connected to the end of the connecting column away from the fixed plate, multiple sets of limiting holes being formed through the mounting ring, wherein the axis of the mounting ring and the fixed plate are on the same straight line, the connecting columns are evenly distributed between the mounting ring and the fixed plate, and a driving mechanism is provided on the side of the base near the fixed plate.

[0008] To facilitate chip placement and ensure accurate positioning, the drive mechanism further includes a drive motor fixedly connected to the base. A fixing plate is fixedly connected to the output end of the drive motor. A slider is fixedly connected to the side of the fixing plate closest to the fixing plate, and a sector plate is fixedly connected to the end of the fixing plate furthest from the slider. A groove matching the slider is provided on the connecting post. Multiple sets of positioning disks matching the sector plates are fixedly connected to the mounting ring. The drive motor is located between two adjacent sets of connecting posts, and the number of positioning disks is the same as the number of connecting posts, arranged in a staggered pattern.

[0009] To facilitate adjusting the height of the chip during transfer, the lifting unit further includes an adjusting shaft fixedly connected to the end of the support column away from the base. A limiting groove is formed on the outer wall of the adjusting shaft. An adjusting ring is provided on the outside of the adjusting shaft, and a shaft hole matching the adjusting shaft is formed on the adjusting ring. A protrusion matching the limiting groove is fixedly connected to the inner wall of the shaft hole. A bracket is fixedly connected to the side of the base near the adjusting shaft. A telescopic rod is fixedly connected between the bracket and the adjusting ring. An installation groove is formed on the side of the adjusting ring away from the telescopic rod. A rotating ring is fixedly connected inside the installation groove. Multiple sets of fixing sleeves matching the limiting holes are fixedly connected to the rotating ring. The rotating ring and the limiting groove are arranged in a W-shape, with the ends connected. During the rotation of the fixing sleeves to the next position, the protrusion drives the adjusting ring to move upward first, and then downward back to the initial position.

[0010] To facilitate chip adsorption and fixation while reducing damage to the chip when the movable suction cup contacts it, the adsorption unit further includes a movable suction cup slidably connected within a fixed sleeve. The movable suction cup has an air extraction channel communicating with the interior of the fixed sleeve. A pneumatic valve is provided between the fixed sleeve and the rotating ring. A compression cylinder and a first spring are fixedly connected between the inner wall of the fixed sleeve and the movable suction cup. The pneumatic valve communicates with the mounting groove and the interior of the fixed sleeve. The compression cylinder and the pneumatic valve are connected via a pipe. The first spring is sleeved outside the compression cylinder. A pressure relief mechanism is provided between the movable suction cup and the compression cylinder.

[0011] To facilitate the release of the chip onto the substrate, the pressure relief mechanism further includes a vent pipe connected to a compression cylinder. The end of the vent pipe away from the compression cylinder extends to the outside of the fixed sleeve. A pressure valve is provided on the vent pipe. A pressure rod is fixedly connected to the side of the movable suction cup near the pressure valve. When the pressure rod contacts the pressure valve, the pressure valve is in the open state.

[0012] To ensure the stability of gas adsorption, the system further includes a suction pipe fixedly connected to the adjusting ring. The suction pipe is connected to the mounting groove, and the end of the suction pipe away from the adjusting ring is connected to a suction device.

[0013] To prevent dust from falling onto the substrate when gas adsorption stops, the dustproof unit further includes a mounting cavity on the side of the movable suction cup near the air extraction channel. Multiple sets of second springs are fixedly connected to the side of the mounting cavity near the fixed sleeve. The ends of the second springs are fixedly connected to filter plates that fit tightly against the inner sidewall of the mounting cavity. Guide plates are symmetrically rotatably connected to the side of the mounting cavity away from the fixed sleeve. A bidirectional cylinder is provided between the two sets of guide plates. The ends of the bidirectional cylinder are rotatably connected to the guide plates. The bidirectional cylinder is connected to the compression cylinder through a pipe.

[0014] To facilitate dust cleaning and prevent filter plate clogging, a dust collection channel is further included on the side of the movable suction cup near the guide plate. The dust collection channel is inclined and connected to the mounting cavity. A collection chamber is provided on the side of the movable suction cup near the dust collection channel. The collection chamber is connected to the dust collection channel and extends to the outside of the movable suction cup. A cap is provided on the side of the collection chamber near the outer wall of the movable suction cup.

[0015] A chip placement method for a chip placement machine includes the following steps:

[0016] Step 1: First, the tray containing the chips and the substrate are conveyed sequentially along the bottom of the adjacent adsorption units by the conveying equipment. The height of the adsorption units can be adjusted by the lifting unit to achieve chip adsorption.

[0017] Step 2: During the adsorption process, when the adsorption unit comes into contact with the substrate and there is a certain pressure, the pneumatic valve is triggered to open, and the dustproof unit is activated at the same time. At this time, the chip can be adsorbed. The lifting unit can separate the chip from the tray after adsorption is completed.

[0018] Step 3: The adsorption unit is driven by the transfer unit to rotate intermittently, transferring the adsorbed chip to the top of the substrate. Then, the chip is moved onto the substrate by the lifting unit, and the substrate and chip are pressed to ensure the quality and stability of the chip mounting.

[0019] Step 4: At this point, the pressure is released from the adsorption unit through the pressure relief mechanism, the pneumatic valve and the dustproof unit are closed, the adsorption of the chip is stopped, and the chip is attached to the substrate, thus completing the chip mounting.

[0020] Step 5: During the adsorption process, the dustproof unit will vibrate to reduce the adhesion of dust on the dustproof unit. After the dustproof unit is closed, the dust will fall into the collection chamber through the dust collection channel, preventing dust from falling onto the substrate when the chip is being adsorbed.

[0021] Step 6: Repeat the above process to continuously mount the chip.

[0022] Compared with the prior art, the present invention provides a chip placement machine and a chip placement method, which have the following beneficial effects:

[0023] 1. This chip placement machine, through its transfer unit and lifting unit, can adjust the height of the chip during the chip transfer process. This shortens the chip placement time, thereby improving the placement efficiency of new products. Furthermore, the fixed position during each transfer ensures the accuracy of chip placement.

[0024] 2. This chip placement machine uses an adsorption unit to apply pressure to the chip before it is adsorbed and fixed, preventing the chip from shifting during the adsorption process. This reduces the frequency of chip position adjustments and also acts as a buffer when the chip comes into contact with the adsorption unit, preventing damage to the chip.

[0025] 3. This chip placement machine, through a pressure relief mechanism, can release the chip onto the substrate when there is a certain pressure between the chip and the substrate, preventing the chip from shifting during placement, thus ensuring the quality and stability of chip placement. At the same time, it can also prevent excessive placement pressure from damaging components.

[0026] 4. This chip placement machine adjusts the opening and closing of the dustproof unit based on the working status of the adsorption unit. When adsorbing chips, it can filter dust from the air and drive the filter plate to vibrate through the second spring to prevent the filter plate from becoming clogged. When adsorbing chips stops, the dustproof unit is turned off, and the dust will fall into the collection chamber through the guide plate to prevent dust from falling onto the substrate and affecting the performance of the substrate.

[0027] The parts of this device not covered herein are the same as or can be implemented using existing technologies. This invention can overcome the problems of low chip mounting efficiency, easy misalignment, easy damage to the chip, and easy dust falling onto the substrate. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of a chip placement machine proposed in this invention.

[0029] Figure 2 This is a schematic diagram of the main structure of a chip placement machine proposed in this invention.

[0030] Figure 3 This is a partial structural diagram of a chip placement machine proposed in this invention. Figure 1 .

[0031] Figure 4 This is a partial structural diagram of a chip placement machine proposed in this invention. Figure 2 .

[0032] Figure 5 This is a partial cross-sectional structural diagram of the adjusting ring, fixing sleeve, and movable suction cup in a chip placement machine proposed in this invention.

[0033] Figure 6 This is a schematic diagram of the structure of the adjusting shaft in a chip placement machine proposed in this invention.

[0034] Figure 7 This invention proposes a chip placement machine. Figure 5 A schematic diagram of the structure of part A.

[0035] Figure 8 This invention proposes a chip placement machine. Figure 5 A schematic diagram of the structure of part B.

[0036] In the diagram: 1. Base; 2. Support column; 3. Fixing plate; 4. Connecting column; 5. Mounting ring; 6. Slide groove; 7. Positioning plate; 8. Drive motor; 9. Fixing plate; 10. Slider; 11. Sector plate; 12. Limiting hole; 13. Bracket; 14. Telescopic rod; 15. Adjusting ring; 16. Adjusting shaft; 17. Limiting groove; 18. Shaft hole; 19. Protrusion; 20. Mounting groove; 21. Rotating ring; 22. Fixing sleeve; 23. Movable suction cup; 24. Suction pipe; 25. Pneumatic valve; 26. Compressed cylinder; 27. First spring; 28. Vent pipe; 29. ​​Press valve; 30. Press rod; 31. Suction channel; 32. Mounting cavity; 33. Second spring; 34. Filter plate; 35. Guide plate; 36. Two-way cylinder; 37. Dust collection channel; 38. Collection cavity. Detailed Implementation

[0037] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0038] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0039] Example 1:

[0040] Reference Figures 1-8 A chip placement machine includes a base 1, and further includes: a transfer unit disposed on the base 1 for intermittently transferring chips to a substrate; a lifting unit disposed between the base 1 and the transfer unit, the transfer unit being capable of driving the lifting unit to rotate, for detaching the chip from the chip tray and pressing the chip onto the substrate; an adsorption unit disposed on the lifting unit for adsorbing the chip in the chip tray, wherein when the pressure threshold between the adsorption unit and the substrate is reached, the adsorption unit releases the chip onto the substrate; and a dustproof unit disposed on the adsorption unit, the adsorption unit and the dustproof unit being connected by a pipe, for preventing dust from falling onto the substrate after adsorption and for collecting the dust.

[0041] Reference Figures 1-3 The transfer unit includes a support column 2 rotatably connected to the base 1. A fixed plate 3 is fixedly connected to the end of the support column 2. Multiple sets of connecting columns 4 are fixedly connected to the outer side wall of the fixed plate 3. An installation ring 5 is fixedly connected to the end of the connecting column 4 away from the fixed plate 3. Multiple sets of limiting holes 12 are opened through the installation ring 5. The axis of the installation ring 5 and the fixed plate 3 are on the same straight line. The connecting columns 4 are evenly distributed between the installation ring 5 and the fixed plate 3. A drive mechanism is provided on the side of the base 1 near the fixed plate 3.

[0042] The number of limiting holes 12 is not limited here, but four sets are preferred, which are used for chip adsorption and mounting respectively. A corresponding chip conveying device and substrate conveying device are provided below the limiting holes 12. This is a conventional method in the prior art, so it will not be described in detail. During the chip transfer process, the limiting holes 12 can position the fixing sleeve 22 to ensure the accuracy of chip adsorption and mounting position.

[0043] Reference Figure 3The driving mechanism includes a drive motor 8 fixedly connected to the base 1. A fixed plate 9 is fixedly connected to the output end of the drive motor 8. A slider 10 is fixedly connected to the side of the fixed plate 9 near the fixed disk 3. A sector plate 11 is fixedly connected to the end of the fixed plate 9 away from the slider 10. A groove 6 matching the slider 10 is opened on the connecting column 4. Multiple sets of positioning disks 7 matching the sector plate 11 are fixedly connected to the mounting ring 5. The drive motor 8 is located between two adjacent sets of connecting columns 4. The number of positioning disks 7 is the same as that of the connecting columns 4, and they are arranged in an alternating pattern.

[0044] It should be explained that the number of connecting posts 4 and positioning disks 7 is the same as the number of limiting holes 12, and when the sector plate 11 drives the mounting ring 5 to rotate, the angle of a single rotation is the same as the angle between two adjacent sets of limiting holes 12, that is, the upper fixing sleeve 22 will rotate to the position of the lower fixing sleeve 22, thereby improving the accuracy of the chip mounting position, realizing the simultaneous mounting of chips from multiple directions, and greatly improving the chip mounting efficiency.

[0045] Reference Figure 1 , Figure 4 , Figure 5 and Figure 6 The lifting unit includes an adjusting shaft 16 fixedly connected to the end of the support column 2 away from the base 1. A limiting groove 17 is provided on the outer wall of the adjusting shaft 16. An adjusting ring 15 is provided on the outside of the adjusting shaft 16. A shaft hole 18 matching the adjusting shaft 16 is provided on the adjusting ring 15. A protrusion 19 matching the limiting groove 17 is fixedly connected to the inner wall of the shaft hole 18. A bracket 13 is fixedly connected to the side of the base 1 near the adjusting shaft 16. A telescopic rod 14 is fixedly connected between the bracket 13 and the adjusting ring 15. An installation groove 20 is provided on the side of the adjusting ring 15 away from the telescopic rod 14. A rotating ring 21 is fixedly connected inside the installation groove 20. Multiple sets of fixing sleeves 22 matching the limiting holes 12 are fixedly connected to the rotating ring 21. The rotating ring 21 and the limiting groove 17 are arranged in a W shape with the ends connected. During the process of the fixing sleeves 22 rotating to the next position, the protrusion 19 drives the adjusting ring 15 to move upward first and then downward to the initial position.

[0046] It should be explained that when the adjusting shaft 16 rotates, under the action of the limiting groove 17 and the protrusion 19, it will drive the rotating ring 21 to rotate between the two adjacent sets of limiting holes 12. It will first move upward and then downward, thereby realizing the chip detachment after adsorption and the chip mounting on the substrate. During this process, the telescopic rod 14 can play a limiting role to prevent the rotating ring 21 from rotating.

[0047] Reference Figures 4-5The adsorption unit includes a movable suction cup 23 slidably connected within a fixed sleeve 22. The movable suction cup 23 has an air extraction channel 31 that communicates with the inside of the fixed sleeve 22. A pneumatic valve 25 is provided between the fixed sleeve 22 and the rotating ring 21. A compression cylinder 26 and a first spring 27 are fixedly connected between the inner wall of the fixed sleeve 22 and the movable suction cup 23. The pneumatic valve 25 is connected to the mounting groove 20 and the inside of the fixed sleeve 22. The compression cylinder 26 is connected to the pneumatic valve 25 through a pipe. The first spring 27 is sleeved on the outside of the compression cylinder 26. A pressure relief mechanism is provided between the movable suction cup 23 and the compression cylinder 26. The unit also includes an air extraction pipe 24 fixedly connected to an adjusting ring 15. The air extraction pipe 24 is connected to the mounting groove 20. The end of the air extraction pipe 24 away from the adjusting ring 15 is connected to an air extraction device.

[0048] The specific structure of the pneumatic valve 25 can be referred to in the existing technical solutions, which are known to those skilled in the art. In addition, connecting through pipes is a conventional method in the prior art, so it will not be described in detail. During the chip adsorption and mounting process, the first spring 27 can buffer the movable suction cup 23 to prevent it from damaging the chip. It should be explained that during the chip transfer process, under the action of gas suction, the first spring 27 and the compression cylinder 26 will maintain their current state. That is, when the chip is separated from the tray, the compression cylinder 26 will not extend to the initial length under the action of the first spring 27, and the pneumatic valve 25 will always remain open.

[0049] Reference Figure 5 and Figure 7 The pressure relief mechanism includes a vent pipe 28 connected to the compression cylinder 26. One end of the vent pipe 28 away from the compression cylinder 26 extends to the outside of the fixed sleeve 22. A press valve 29 is provided on the vent pipe 28. A press rod 30 is fixedly connected to the side of the movable suction cup 23 near the press valve 29. When the press rod 30 contacts the press valve 29, the press valve 29 is in the open state.

[0050] It should be explained that during the transport process, the substrate is slightly higher than the chip tray position. This results in greater pressure between the movable suction cup 23 and the chip when the chip is transferred to the substrate and moves downwards by the same distance. On the one hand, this ensures the quality and stability of chip mounting. On the other hand, the gas in the compressed cylinder 26 can be released by the pressing valve 29 to close the pneumatic valve 25, thereby stopping the adsorption of the chip. The pressing valve 29 is a conventional method in the prior art, so it will not be described in detail.

[0051] Reference Figure 5 and Figure 8The dustproof unit includes a mounting cavity 32 located on the side of the movable suction cup 23 near the air extraction channel 31. Multiple sets of second springs 33 are fixedly connected to the side of the mounting cavity 32 near the fixing sleeve 22. A filter plate 34, which fits tightly against the inner wall of the mounting cavity 32, is fixedly connected to the end of each second spring 33. Guide plates 35 are symmetrically rotatably connected to the side of the mounting cavity 32 away from the fixing sleeve 22. A bidirectional cylinder 36 is positioned between the two sets of guide plates 35. The end of the bidirectional cylinder 36 is connected to the guide plate 35... The system includes a rotating connection between the bidirectional cylinder 36 and the compression cylinder 26 via a pipe. It also includes a dust collection channel 37 located on the side of the movable suction cup 23 near the guide plate 35. The dust collection channel 37 is inclined and connected to the mounting cavity 32. A collection cavity 38 is provided on the side of the movable suction cup 23 near the dust collection channel 37. The collection cavity 38 is connected to the dust collection channel 37 and extends to the outside of the movable suction cup 23. A cap is provided on the side of the collection cavity 38 near the outer wall of the movable suction cup 23.

[0052] When the chip is adsorbed, the guide plate 35 is also in the open state under the action of the bidirectional cylinder 36. Dust and other impurities in the adsorption process will be adsorbed onto the filter plate 34. As the dust on the filter plate 34 changes, the filter plate 34 will vibrate under the action of the second spring 33 to prevent dust from clogging the filter plate 34, thereby ensuring the stability of the chip adsorption process. When the chip adsorption stops, the guide plate 35 is in the closed state, and the dust and other impurities on the filter plate 34 will fall along the guide plate 35 into the dust collection channel 37 and finally be collected in the collection chamber 38. When the guide plate 35 is open, it will block the dust collection channel 37 to prevent the dust in the collection chamber 38 from being re-adsorbed onto the filter plate 34.

[0053] Example 2:

[0054] A chip placement method for a chip placement machine includes the following steps:

[0055] Step 1: First, the tray containing the chips and the substrate are conveyed sequentially along the bottom of the adjacent adsorption units by the conveying equipment. The height of the adsorption units can be adjusted by the lifting unit to achieve chip adsorption.

[0056] The conveying equipment is a conventional method in the existing technology, so it will not be described in detail. By repeatedly adjusting the height of the chip by the lifting unit, the chip placement time can be shortened, thereby improving the chip placement efficiency.

[0057] Step 2: During the adsorption process, when the adsorption unit comes into contact with the substrate and there is a certain pressure, the pneumatic valve 25 is triggered to open, and the dustproof unit is activated at the same time. At this time, the chip can be adsorbed. The lifting unit can separate the chip from the tray after adsorption is completed.

[0058] This not only ensures the accuracy of the chip adsorption position, but also reduces the amount of dust and other impurities entering during the adsorption process, thereby improving the chip mounting quality and stability.

[0059] Step 3: The adsorption unit is driven by the transfer unit to rotate intermittently, transferring the adsorbed chip to the top of the substrate. Then, the chip is moved onto the substrate by the lifting unit, and the substrate and chip are pressed to ensure the quality and stability of the chip mounting.

[0060] Step 4: At this point, the pressure is released from the adsorption unit through the pressure relief mechanism, the pneumatic valve 25 and the dustproof unit are closed, the adsorption of the chip is stopped, and the chip is attached to the substrate, thus completing the chip mounting.

[0061] By monitoring the position of the chip on the substrate mechanically, we can not only improve the stability of equipment operation, but also reduce the construction cost of the equipment and reduce the equipment stability maintenance rate.

[0062] Step 5: During the adsorption process, the dustproof unit will vibrate to reduce the adhesion of dust on the dustproof unit. After the dustproof unit is closed, the dust will fall into the collection chamber 38 through the dust collection channel 37, preventing dust from falling onto the substrate when the chip is being adsorbed.

[0063] As dust and other impurities accumulate on the filter plate 34, the force acting on the filter plate 34 during the adsorption process changes, thereby causing the filter plate 34 to vibrate under the action of the second spring 33.

[0064] Step 6: Repeat the above process to continuously mount the chip.

[0065] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A chip placement machine, comprising a base (1), characterized in that, Also includes: The transfer unit disposed on the base (1) is used to intermittently transfer the chip to the substrate; The lifting unit is disposed between the base (1) and the transfer unit. The transfer unit can drive the lifting unit to rotate, which is used to separate the chip from the chip tray and press the chip onto the substrate. The adsorption unit installed on the lifting unit is used to adsorb the chips in the chip tray. When the pressure threshold between the adsorption unit and the substrate is reached, the adsorption unit releases the chip onto the substrate. A dustproof unit is installed on the adsorption unit, and the adsorption unit and the dustproof unit are connected by a pipe to prevent dust from falling onto the substrate after adsorption and to collect the dust. The transfer unit includes a support column (2) rotatably connected to the base (1). A fixed plate (3) is fixedly connected to the end of the support column (2). Multiple sets of connecting columns (4) are fixedly connected to the outer side wall of the fixed plate (3). An installation ring (5) is fixedly connected to the end of the connecting column (4) away from the fixed plate (3). Multiple sets of limiting holes (12) are opened through the installation ring (5). The axis of the installation ring (5) and the fixed plate (3) are on the same straight line. The connecting columns (4) are evenly distributed between the installation ring (5) and the fixed plate (3). A drive mechanism is provided on the side of the base (1) near the fixed plate (3). The lifting unit includes an adjusting shaft (16) fixedly connected to the end of the support column (2) away from the base (1). A limiting groove (17) is provided on the outer side wall of the adjusting shaft (16). An adjusting ring (15) is provided on the outside of the adjusting shaft (16). A shaft hole (18) matching the adjusting shaft (16) is provided on the adjusting ring (15). A protrusion (19) matching the limiting groove (17) is fixedly connected to the inner side wall of the shaft hole (18). A bracket (13) is fixedly connected to the side of the base (1) near the adjusting shaft (16). The bracket (13) and the adjusting ring (15) are connected to each other. A telescopic rod (14) is fixedly connected between the two. An installation groove (20) is provided on the side of the adjusting ring (15) away from the telescopic rod (14). A rotating ring (21) is fixedly connected inside the installation groove (20). Multiple sets of fixing sleeves (22) that match the limiting hole (12) are fixedly connected on the rotating ring (21). The limiting groove (17) of the rotating ring (21) is W-shaped and connected end to end. It is used to drive the adjusting ring (15) to move upward first and then downward to the initial position through the protrusion (19) during the rotation of the fixing sleeve (22) to the next position. The adsorption unit includes a movable suction cup (23) slidably connected inside a fixed sleeve (22). The movable suction cup (23) has an air extraction channel (31) communicating with the inside of the fixed sleeve (22). A pneumatic valve (25) is provided between the fixed sleeve (22) and the rotating ring (21). A compression cylinder (26) and a first spring (27) are fixedly connected between the inner wall of the fixed sleeve (22) and the movable suction cup (23). The pneumatic valve (25) is connected to the mounting groove (20) and the inside of the fixed sleeve (22). The compression cylinder (26) is connected to the pneumatic valve (25) through a pipe. The first spring (27) is sleeved on the outside of the compression cylinder (26). A pressure relief mechanism is provided between the movable suction cup (23) and the compression cylinder (26). The pressure relief mechanism includes a vent pipe (28) connected to the compression cylinder (26). One end of the vent pipe (28) away from the compression cylinder (26) extends to the outside of the fixed sleeve (22). A pressure valve (29) is provided on the vent pipe (28). A pressure rod (30) is fixedly connected to the side of the movable suction cup (23) near the pressure valve (29). When the pressure rod (30) contacts the pressure valve (29), the pressure valve (29) is in the open state. The dustproof unit includes an installation cavity (32) opened on the side of the movable suction cup (23) near the air extraction channel (31). Multiple sets of second springs (33) are fixedly connected to the side of the installation cavity (32) near the fixed sleeve (22). The ends of the second springs (33) are fixedly connected to a filter plate (34) that fits tightly against the inner wall of the installation cavity (32). The side of the installation cavity (32) away from the fixed sleeve (22) is symmetrically rotatably connected to a guide plate (35). A bidirectional cylinder (36) is provided between the two sets of guide plates (35). The end of the bidirectional cylinder (36) is rotatably connected to the guide plate (35). The bidirectional cylinder (36) is connected to the compression cylinder (26) through a pipe.

2. A chip placement machine according to claim 1, characterized in that, The driving mechanism includes a drive motor (8) fixedly connected to the base (1), a fixed plate (9) fixedly connected to the output end of the drive motor (8), a slider (10) fixedly connected to the side of the fixed plate (9) near the fixed disk (3), a fan-shaped plate (11) fixedly connected to the end of the fixed plate (9) away from the slider (10), a groove (6) matching the slider (10) is provided on the connecting column (4), and multiple sets of positioning disks (7) matching the fan-shaped plate (11) are fixedly connected to the mounting ring (5). The drive motor (8) is located between two adjacent sets of connecting columns (4), and the number of positioning disks (7) is the same as that of connecting columns (4), and they are arranged in an alternating pattern.

3. A chip placement machine according to claim 1, characterized in that, It also includes a suction pipe (24) fixedly connected to the adjusting ring (15), the suction pipe (24) being connected to the mounting groove (20), and the end of the suction pipe (24) away from the adjusting ring (15) being connected to the suction device.

4. A chip placement machine according to claim 1, characterized in that, It also includes a dust collection channel (37) opened on the side of the movable suction cup (23) near the guide plate (35). The dust collection channel (37) is inclined and connected to the mounting cavity (32). A collection cavity (38) is opened on the side of the movable suction cup (23) near the dust collection channel (37). The collection cavity (38) is connected to the dust collection channel (37) and extends to the outside of the movable suction cup (23). A cap is provided on the side of the collection cavity (38) near the outer wall of the movable suction cup (23).

5. A chip placement method comprising the chip placement machine according to any one of claims 1-4, characterized in that, It also includes the following steps: Step 1: First, the tray containing the chips and the substrate are conveyed sequentially along the bottom of the adjacent adsorption units by the conveying equipment. The height of the adsorption units can be adjusted by the lifting unit to achieve chip adsorption. Step 2: During the adsorption process, when the adsorption unit comes into contact with the substrate and there is a certain pressure, the pneumatic valve (25) is triggered to open, and the dustproof unit is opened at the same time. At this time, the chip can be adsorbed. The chip after adsorption can be separated from the tray by the lifting unit. Step 3: The adsorption unit is driven by the transfer unit to rotate intermittently, transferring the adsorbed chip to the top of the substrate. Then, the chip is moved onto the substrate by the lifting unit, and the substrate and chip are pressed to ensure the quality and stability of the chip mounting. Step 4: At this time, the pressure is released by the pressure relief mechanism to release the pressure of the adsorption unit, close the pneumatic valve (25) and the dustproof unit, stop the adsorption of the chip, and make the chip attach to the substrate to complete the chip mounting. Step 5: During the adsorption process, the dustproof unit will be driven to vibrate, reducing the adhesion of dust on the dustproof unit. After the dustproof unit is closed, the dust will fall into the collection chamber (38) through the dustproof unit along the dust collection channel (37), preventing dust from falling onto the substrate when the chip is being adsorbed. Step 6: Repeat the above process to continuously mount the chip.

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