Semiconductor device and method of forming packaged antenna structure

Abstract

A semiconductor device has a substrate including an antenna formed in a first region of the substrate. A first electrical component is disposed over the second region of the substrate. A conductive pillar is disposed on the substrate adjacent the first electrical component. A second electrical component is disposed on the conductive pillar and over the first electrical component. An interconnect structure is disposed over the third region of the substrate. A first encapsulant is deposited over the first electrical component and the interconnect structure. A second encapsulant is deposited over the second electrical component. A third encapsulant is disposed over the antenna. The third sealant includes a higher dielectric constant than the first sealant and the second sealant.

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