Efficient liquid cooling plate and heat dissipation device

CN119364720APending Publication Date: 2025-01-24CHONGQING TSINGSHAN IND
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Patent Information

Application Number
CN202411559708.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-04
Publication Date
2025-01-24

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Abstract

The invention discloses an efficient liquid cooling plate and a heat dissipation device, the efficient liquid cooling plate comprises a liquid cooling plate body and a liquid cooling shell, one end of the liquid cooling shell is provided with a liquid inlet pipe, and the other end of the liquid cooling shell is provided with a liquid outlet pipe; a plurality of heat conduction fin columns are arranged on one side, connected with the liquid cooling shell, of the liquid cooling plate body, and one side, deviating from the liquid cooling shell, of the liquid cooling plate body is used for mounting a power module of a motor controller; a liquid guide groove is formed in the heat conduction fin column, the liquid guide groove is formed in the direction from the liquid inlet pipe to the liquid outlet pipe and penetrates through the two opposite sides of the heat conduction fin column, and the liquid guide groove at least penetrates through the end, away from the liquid cooling plate body, of the heat conduction fin column; the heat dissipation device comprises a power module and the high-efficiency liquid cooling plate, wherein the power module is attached to the liquid cooling plate body. According to the invention, a low-speed wake flow or vortex stagnant water area can be reduced, the heat dissipation efficiency of the liquid cooling plate is improved, and the flow resistance of the cooling liquid is reduced, so that the thermal reliability and thermal safety of the operation of the power module of the electronic equipment are improved.
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Cited By

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