Laser light source module and projection equipment with laser light source module

CN119376170APending Publication Date: 2025-01-28DELTA ELECTRONICS INC(CN)
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Patent Information

Application Number
CN202310916695.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-07-25
Publication Date
2025-01-28

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Abstract

A laser light source module comprises a laser wafer, a wedge-shaped structure, a plano-convex lens and an optical fiber. The laser wafer is configured to emit a first beam and a second beam. The wedge-shaped structure is configured to deflect and coincide the first light beam and the second light beam into a third light beam. The wedge-shaped structure is located between the laser wafer and the plano-convex lens. The plano-convex lens is located between the wedge-shaped structure and the optical fiber.
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Description

Technical Field

[0001] The present disclosure relates to a laser light source module and a projection device. Background Art

[0002] Common projector light sources include high-pressure mercury arc lamps, light-emitting diodes, fluorescent lasers, and pure lasers. Pure lasers have the advantages of long service life, high brightness, and color saturation. Due to breakthroughs in high-power semiconductor laser technology, pure lasers have gradually become the mainstream of the market as projector light sources.

[0003] Among the semiconductor laser technologies including red, blue and green, red laser has the disadvantage of lower power due to technological development and wavelength characteristics. If the number of red light sources is increased in order to increase the output power of red laser, the complexity of the optical path design will increase, and the light receiving area will need to be increased, resulting in a significant increase in costs.

[0004] In view of this, how to provide a laser light source module that can increase the output power of red laser without increasing the light receiving area is one of the problems that optical fiber light receiving needs to overcome. Summary of the invention

[0005] A technical embodiment of the present disclosure is a laser light source module.

[0006] In one embodiment, the laser light source module includes at least one laser chip, at least one wedge-shaped structure, a plano-convex lens, and an optical fiber. The laser chip is configured to emit a first light beam and a second light beam. The wedge-shaped structure is configured to deflect the first light beam and the second light beam and overlap them into a third light beam. The wedge-shaped structure is located between the laser chip and the plano-convex lens. The plano-convex lens is located between the wedge-shaped structure and the optical fiber.

[0007] Another technical embodiment of the present disclosure is a projection device.

[0008] In one embodiment, a projection device includes a laser light source module and a projection module. The projection module is connected to the laser light source module. The laser light source module includes a first laser chip, a second laser chip, a third laser chip, a wedge-shaped structure, and a plano-convex lens. The first laser chip is configured to emit a first light beam and a second light beam. The wedge-shaped structure is configured to deflect the first light beam and the second light beam and overlap them into a third light beam. The wedge-shaped structure is located between the first laser chip and the plano-convex lens.

[0009] In the above-mentioned embodiment, the wedge-shaped structure disclosed in the present invention can deflect and overlap the light beams from the dual resonant cavity (or multi-resonant cavity) of the laser chip into a single light beam. In this way, the light receiving range required by the optical fiber can be reduced and the cost can be reduced. Such a design enables the laser light source module to be applied to a projection system with a small light receiving area. The laser light source module disclosed in the present invention can reduce the laser light spot, reduce the light receiving area, reduce the cost and maintain the technical efficacy of light receiving efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a schematic diagram of a projection device according to an embodiment of the present disclosure;

[0011] Figure 2 for Figure 1 A schematic diagram of a laser light source module;

[0012] Figure 3 for Figure 2 A partial schematic diagram of a laser light source module;

[0013] Figure 4 for Figure 3 An enlarged view of the first laser array in FIG.

[0014] Figure 5 for Figure 3 A magnified view of the wedge array in FIG.

[0015] Figure 6 is a schematic diagram of a first laser chip and a wedge-shaped structure according to an embodiment of the present disclosure;

[0016] Figure 7 for Figure 6 A schematic diagram of an optical path of light from a first laser chip passing through a wedge-shaped structure;

[0017] Fig. 8A and Figure 8B is an imaging simulation diagram of the first light beam and the second light beam of the first laser chip;

[0018] Fig.9A and Fig. 9B Actual imaging of the first light beam and the second light beam of the first laser chip;

[0019] Fig.10 for Figure 4 A schematic diagram of light emission of a first laser array;

[0020] Fig.11 is a schematic diagram of a first laser chip and a wedge-shaped structure according to another embodiment of the present disclosure;

[0021] Fig.12 for Fig.11 A schematic diagram of an optical path of a light beam from a first laser chip passing through a wedge-shaped structure;

[0022] Fig.13A and Fig. 13B FIG. 4 is a schematic diagram of a laser light source module according to another embodiment of the present disclosure.

[0023] Description of Figure Numbers:

[0024] 10: Projection equipment

[0025] 100,300:Laser source module

[0026] 110,310A~310D: First laser array

[0027] 110S: Light emitting surface

[0028] 112, 112a: first laser chip

[0029] 114: Focusing lens

[0030] 1122,1122a: First resonance cavity

[0031] 1124,1124a: Second resonance cavity

[0032] 1126a: The third resonance cavity

[0033] 120,320A~320D: Second laser array

[0034] 122: Second laser chip

[0035] 130,330: The third laser array

[0036] 132: The third laser chip

[0037] 140,340A~340D: Wedge array

[0038] 142,142a: Wedge-shaped structure

[0039] 1422,1422a: First plane

[0040] 1424,1424a: first slope

[0041] 1426,1426a: Second slope

[0042] 1428a: Second Plane

[0043] 150,350A,350B: Plano-convex lens

[0044] 160: Fiber Optic

[0045] 162: Finishing surface

[0046] 164,166: Light receiving range

[0047] 170,370: First spectroscopic filter

[0048] 180,380: Second beam splitter filter

[0049] 200: Projection module

[0050] 390: Reflector

[0051] R: Red light

[0052] B: Blue light

[0053] G: Green light

[0054] A: Optical axis direction

[0055] D1: First direction

[0056] θ1,θ2: Angle

[0057] L1: First beam

[0058] L2: Second beam

[0059] L3, L3': The third beam

[0060] L4: The fourth beam

[0061] L5: The fifth beam

[0062] W1,W2,W3,W4: Width DETAILED DESCRIPTION

[0063] The following will disclose multiple embodiments of the present invention with the accompanying drawings. For the sake of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is, in some embodiments of the present invention, these practical details are not necessary. In addition, in order to simplify the drawings, some conventional structures and elements will be shown in the drawings in a simple schematic manner. And for the sake of clarity, the thickness of the layers and regions in the drawings may be exaggerated, and the same element symbols represent the same elements in the description of the drawings.

[0064] Figure 1 FIG. 1 is a schematic diagram of a projection device 10 according to an embodiment of the present disclosure. Figure 2 for Figure 1 Schematic diagram of the laser light source module 100. Figure 1 and Figure 2 The projection device 10 includes a laser light source module 100 and a projection module 200. The laser light source module 100 includes a first laser array 110, a second laser array 120, a third laser array 130, a wedge array 140, a plano-convex lens 150, and an optical fiber 160. The laser light source module 100 is connected to the projection module 200 via the optical fiber 160 to transmit optical signals.

[0065] Reference Figure 2In this embodiment, the laser light source module 100 is a semiconductor laser. The first laser array 110 includes a plurality of first laser chips 112. The second laser array 120 includes a plurality of second laser chips 122. The third laser array 130 includes a plurality of third laser chips 132. The first laser chip 112, the second laser chip 122, and the third laser chip 132 are configured to emit laser light of different wavelengths.

[0066] In this embodiment, the first laser array 110 is a red semiconductor laser, the second laser array 120 is a green semiconductor laser, and the third laser array 130 is a blue semiconductor laser. The wedge array 140 is located between the first laser array 110 and the plano-convex lens 150. The wedge array 140 is configured to deflect the red light R from the first laser array 110, and the plano-convex lens 150 is used to overlap the light spots of the first light beam L1 and the second light beam L2 emitted from the first laser chip 112, so as to reduce the light spots and increase the light collection efficiency of the optical fiber 160 for the red light R. In this way, the output power of the red laser fiber outlet can be increased, and the power of the laser light sources of different colors in the laser light source module 100 can be balanced.

[0067] The laser light source module 100 further includes a first spectroscopic filter 170 and a second spectroscopic filter 180. The first spectroscopic filter 170 is located between the second laser array 120 and the third laser array 130. The first spectroscopic filter 170 reflects the green light G from the second laser array 120 and allows the blue light B from the third laser array 130 to pass through. The second spectroscopic filter 180 is located between the wedge array 140 and the plano-convex lens 150. The second spectroscopic filter 180 reflects the green light G from the second laser array 120 and the blue light B from the third laser array 130, and allows the red light R from the first laser array 110 and deflected by the wedge array 140 to pass through.

[0068] exist Figure 2 In the embodiment, the relative positions of the first laser array 110 , the second laser array 120 , the third laser array 130 , the first spectroscopic filter 170 and the second spectroscopic filter 180 are not limited thereto, as long as the laser light of each color can enter the optical fiber 160 .

[0069] Figure 3 for Figure 2A partial schematic diagram of a laser light source module 100. In the present embodiment, the first laser array 110, the wedge array 140, the plano-convex lens 150 and the optical fiber 160 are sequentially arranged in the optical axis direction A, but the present disclosure is not limited thereto. The plano-convex lens 150 is located between the wedge array 140 and the optical fiber 160. The first laser array 110 has a light emitting surface 110S. The light emitting surface 110S faces the wedge array 140. In other words, the normal direction of the light emitting surface 110S is parallel to the optical axis direction A. In other embodiments, the normal direction of the light emitting surface 110S may not be parallel to the optical axis direction A, and the light after passing through the wedge array 140 may be transmitted to the plano-convex lens 150 through other optical elements. The optical fiber 160 has a light receiving surface 162. The light receiving surface 162 faces the plano-convex lens 150.

[0070] Figure 4 for Figure 3 The first laser array 110 is an enlarged view of the first laser array 110 in FIG. The first laser chips 112 in this embodiment form a first laser array 110 with seven columns and four rows, but the present disclosure is not limited thereto. The specific structure of the first laser chip 112 will be described in the following paragraphs. Figure 3 and Figure 4 As shown, the first laser array 110 has a focusing lens 114 facing the wedge array 140. Each first laser chip 112 corresponds to a focusing lens 114. In this embodiment, there are 28 focusing lenses 114, which together constitute the lens array of the first laser array 110.

[0071] Figure 5 for Figure 3 FIG. 1 is an enlarged view of the wedge array 140 in FIG. The wedge array 140 includes a plurality of wedge structures 142 (the area indicated by the dashed box). Figure 5 Each wedge-shaped structure 142 corresponds to Figure 4 Each of the first laser chips 112. Specifically, Figure 5 There are a total of 28 wedge-shaped structures 142 forming a wedge-shaped array 140 with seven columns and four rows.

[0072] In this embodiment, the wedge-shaped structures 142 in the same row are connected to each other. In other words, the wedge-shaped array 140 in this embodiment can also be regarded as seven long wedge-shaped structures formed by four wedge-shaped structures 142 in the same row, and the wedge-shaped array 140 is composed of seven long wedge-shaped structures arranged in the first direction D1 and connected.

[0073] In other embodiments, the first laser array 110 may be only a single first laser chip 112, and the wedge array 140 may be a single wedge structure 142. For the sake of clarity, the embodiment of a single first laser chip 112 and a single wedge structure 142 will be described in detail below.

[0074] Figure 6 FIG. 1 is a schematic diagram of a first laser chip 112 and a wedge-shaped structure 142 according to an embodiment of the present disclosure. Figure 7 for Figure 6 Schematic diagram of the optical path of the light from the first laser chip 112 passing through the wedge-shaped structure 142. Figure 6 and Figure 7 , wherein the focusing lens 114 is Figure 6 omitted in, Figure 7 It is a side view.

[0075] The first laser chip 112 in this embodiment is a dual-resonance (dual emitter) semiconductor laser chip. The first laser chip 112 has a first resonant cavity 1122 and a second resonant cavity 1124 arranged in a first direction D1. The first direction D1 is perpendicular to the optical axis direction A, and the first direction D1 is also perpendicular to the normal direction of the light-emitting surface 110S. In this embodiment, the first direction D1 is taken as an example of a vertical direction. In other embodiments, the first resonant cavity 1122 and the second resonant cavity 1124 can also be arranged in a horizontal direction.

[0076] In this embodiment, the width W1 between the first resonant cavity 1122 and the second resonant cavity 1124 is approximately 270 micrometers, and the opening width W2 between the first resonant cavity 1122 and the second resonant cavity 1124 is approximately 75 micrometers, but the present disclosure is not limited thereto.

[0077] The wedge-shaped structure 142 includes a first plane 1422, a first inclined surface 1424, and a second inclined surface 1426. The first plane 1422 faces the light-emitting surface 110S of the first laser chip 112. The first inclined surface 1424 and the second inclined surface 1426 face away from the first plane 1422 and face the plano-convex lens 150 (see FIG. Figure 3 The first inclined surface 1424 is connected to the second inclined surface 1426 and has an included angle θ1.

[0078] like Figure 6 and Figure 7 As shown, the first resonant cavity 1122 of the first laser chip 112 is configured to emit a first light beam L1, and the second resonant cavity 1124 is configured to emit a second light beam L2. The first light beam L1 and the second light beam L2 are red light. After passing through the focusing lens 114, the first light beam L1 and the second light beam L2 travel toward the wedge-shaped structure 142.

[0079] After passing through the first plane 1422, the first light beam L1 and the second light beam L2 pass through the first inclined surface 1424 and the second inclined surface 1426 respectively. Specifically, when the first light beam L1 and the second light beam L2 penetrate the wedge-shaped structure 142, they are deflected due to the angle θ1 and the refractive index characteristics. Figure 7In the perspective of FIG. 1 , the first light beam L1 is deflected upward after passing through the first inclined surface 1424, and the second light beam L2 is deflected downward after passing through the second inclined surface 1426. In other words, the first light beam L1 is deflected along the first direction D1 after passing through the first inclined surface 1424, and the second light beam L2 is deflected in the opposite direction of the first direction D1 after passing through the second inclined surface 1426. It can be seen that the first inclined surface 1424 and the second inclined surface 1426 of the wedge-shaped structure 142 are configured to deflect the first light beam L1 and the second light beam L2 from the first laser chip 112 and overlap them into the third light beam L3.

[0080] The material of the wedge-shaped structure 142 can be any transparent material that can bend light, such as glass. The size of the wedge-shaped structure 142 can be determined according to the size of the first laser chip 112. The angle θ1 of the wedge-shaped structure 142 can be changed according to the refractive index difference and the distance between the wedge-shaped structure 142 and the adjacent element.

[0081] Fig. 8A and Figure 8B FIG. 4 is an imaging simulation diagram of the first light beam L1 and the second light beam L2 of the first laser chip 112 . Fig. 8A It is shown in Figure 7 The imaging simulation diagram when the first light beam L1 and the second light beam L2 do not pass through the wedge-shaped structure 142. The circular dotted line shows the light receiving range 164 required for the light receiving surface 162 of the optical fiber 160 to receive the first light beam L1 and the second light beam L2 under this condition. Figure 8B It is shown in Figure 7 The first light beam L1 and the second light beam L2 in the image are overlapped to form the third light beam L3 after passing through the wedge-shaped structure 142. The circular dotted line shows the light receiving range 166 required for the light receiving surface 162 of the optical fiber 160 to receive the third light beam L3 under this condition.

[0082] like Fig. 8A As shown, the first light beam L1 and the second light beam L2 travel to the light receiving surface 162 of the optical fiber 160 to generate two light spots. The length of the two light spots in the first direction D1 is approximately in the range of 0.9 mm to 1.0 mm, and the two light spots are approximately 1.0 mm apart in the first direction D1. The diameter of the light receiving range 164 required by the light receiving surface 162 of the optical fiber 160 is approximately 2.9 mm.

[0083] like Figure 8B As shown, the first inclined surface 1424 and the second inclined surface 1426 of the wedge-shaped structure 142 can deflect the first light beam L1 and the second light beam L2 and overlap them into a third light beam L3. The third light beam L3 travels to the light receiving surface 162 of the optical fiber 160 to generate a single light spot. The length of this light spot in the first direction D1 is approximately less than 1.6 mm. Therefore, the diameter of the light receiving range 166 required by the light receiving surface 162 of the optical fiber 160 can be reduced to approximately 1.6 mm.

[0084] Fig.9A and Fig. 9B It is the actual imaging of the first light beam L1 and the second light beam L2 of the first laser chip 112 . Fig.9A It is shown in Figure 7 The first light beam L1 and the second light beam L2 in the image do not have actual imaging when passing through the wedge-shaped structure 142. The first light beam L1 and the second light beam L2 generate two light spots. Fig.9A The distance between the two dotted lines is approximately 3.6 mm. Fig. 9B It is shown in Figure 7 The first light beam L1 and the second light beam L2 in the image are overlapped to form the actual imaging of the third light beam L3 after passing through the wedge-shaped structure 142. The third light beam L3 generates a single light spot. Fig. 9B The distance between the two dotted lines is reduced to about 1.6 mm.

[0085] According to the above FIG. 8A to FIG. 9B It can be seen that the first inclined surface 1424 and the second inclined surface 1426 of the wedge-shaped structure 142 can deflect the light beams from the dual resonant cavity of a single laser chip and overlap them into a single light beam. In this way, the light collection range 166 required by the light collection surface 162 can be reduced and the cost can be reduced. Such a design allows the laser light source module 100 to be applied to a projection system with a small light collection area, such as a system using a fused fiber bundle or an integration rod with a small opening.

[0086] In addition, since the first laser array 110 is a dual-resonance (or multi-resonance) semiconductor laser, the output power of the red laser can be increased. Therefore, the red light collection efficiency of the laser light source module 100 will not decrease due to the reduction of the light collection surface 162. The laser light source module 100 disclosed in the present invention can simultaneously achieve the technical effects of reducing the light collection area, reducing costs, and maintaining light collection efficiency.

[0087] Reference Figure 2 In other embodiments, the second laser array 120 may be a single second laser chip 122, which is a single-resonance-cavity semiconductor laser chip. In other embodiments, the third laser array 130 may be a single third laser chip 132, which is a single-resonance-cavity semiconductor laser chip. In other words, laser chips of different colors can adjust their states according to the required luminous efficacy.

[0088] Fig.10 for Figure 4 Schematic diagram of the light emission of the first laser array 110. Figure 4 and Fig.10 . Fig.10 The first laser chip 112 ( Figure 6 Embodiment) is applied in Figure 4 The beam distribution of the first laser array 110 is shown in FIG. Fig.10 Two beam cross sections are obtained and illustrated with the light spots of the beams.

[0089] Each of the first laser chips 112 in the first laser array 110 emits a first light beam L1 and a second light beam L2 arranged in the first direction D1. The light spot distribution in this embodiment is four rows and fourteen columns in total. The first light beam L1 and the second light beam L2 travel along the optical axis direction A, and the first light beam L1 and the second light beam L2 gradually diffuse and the light spot size gradually increases.

[0090] Also refer to Figure 5 and Fig.10 The wedge array 140 is repeatedly arranged in the first direction D1. There are seven rectangular first inclined surfaces 1424 and seven rectangular second inclined surfaces 1426 arranged alternately in the first direction D1. In this embodiment, each first inclined surface 1424 can deflect four first light beams L1 on the same column, and each second inclined surface 1426 can deflect four second light beams L2 on the same column. Therefore, the 56 light beams (28 first light beams L1 plus 28 second light beams L2) from the first laser array 110 can be overlapped by the wedge array 140 into 28 third light beams L3. Refer to Figure 3 The 28 third light beams L3 can be integrated into a single fifth light beam L5 through the plano-convex lens 150 and enter the optical fiber 160 .

[0091] Also refer to Figure 4 and Figure 5 The specific structure of each first laser chip 112 in this embodiment is the same, so the angle θ1 between the first inclined surface 1424 and the second inclined surface 1426 of each wedge-shaped structure 142 is the same. In other words, the angle θ1 of the wedge-shaped structure 142 is independent of the position of the wedge-shaped structure 142 relative to the entire wedge array 140.

[0092] The angle θ1 of the wedge-shaped structure 142 is related to the curvature radius of the plano-convex lens 150. Figure 3 In the embodiment of FIG. 1 , the numerical aperture (NA) value of the optical fiber 160 is 0.12. The maximum light receiving angle of the optical fiber 160 is approximately + / -12.7 degrees as shown in the relationship NA=nsinθ. Assuming that the distance between the plano-convex lens 150 and the optical fiber 160 is 113.4 mm, the maximum light receiving angle of the optical fiber 160 is approximately + / -12.7 degrees as shown in the relationship It turns out that the radius of curvature of the plano-convex lens 150 is about 85 mm.

[0093] The distance between the wedge-shaped structure 142 and the first laser array 110 can be determined according to the requirements or laser specifications. In this embodiment, the distance between the wedge-shaped structure 142 and the first laser array 110 is about 50 mm, and the distance between the plano-convex lens 150 and the wedge-shaped structure 142 is about 46 mm. Assuming that the distance between the center of the first light beam L1 and the center of the second light beam L2 is 1.5 mm, it can be obtained from Snell's Law that the angle θ1 of the wedge-shaped structure 142 made of glass is about 1.8682 degrees.

[0094] According to the above, when the refractive index of the wedge-shaped structure 142 is fixed, the larger the angle θ1 of the wedge-shaped structure 142 is, the larger the deflection angle of the first light beam L1 and the second light beam L2 is, and the closer the position where the light spots overlap is. When the angle θ1 of the wedge-shaped structure 142 is fixed, the larger the refractive index of the wedge-shaped structure 142 is, the larger the deflection angle of the first light beam L1 and the second light beam L2 is, and the closer the position where the light spots overlap is.

[0095] Reference Figure 3 It should be understood that if the light beam is simply focused by the plano-convex lens 150 without the wedge array 140, only Fig.10 The 28 first light beams L1 shown in the figure are integrated into another first light beam, and the 28 second light beams L2 are integrated into another second light beam. In other words, simply converging the light beams through the plano-convex lens 150 will still produce two separate light spots. In other words, the plano-convex lens 150 does not have the effect of overlapping the light beams from the dual resonant cavities of the same laser chip. Therefore, simply using the plano-convex lens 150 as a light converging element is still not enough to produce a single light beam with a light spot small enough to enter the light receiving surface 162 of the optical fiber 160.

[0096] In addition, if the positions of the plano-convex lens 150 and the wedge array 140 are swapped, Fig.10 The 28 first light beams L1 shown in the figure will first be converged into a light beam with a larger light spot through the plano-convex lens 150, and the 28 second light beams L2 will first be converged into another light beam with a larger light spot through the plano-convex lens 150, and the above two light beams are separated from each other. In this case, the effect of deflecting the light beam after integrating the 28 first light beams L1 through a single first inclined surface 1424 and deflecting the light beam after integrating the 28 second light beams L2 through a single second inclined surface 1426 is not good. In other words, since each wedge-shaped structure 142 in the present disclosure directly deflects the first light beam L1 and the second light beam L2 from the dual resonant cavity of a single laser chip, the light spots overlap and the light collection efficiency is improved.

[0097] Fig.11 FIG. 1 is a schematic diagram of a first laser chip 112 a and a wedge-shaped structure 142 a according to another embodiment of the present disclosure. Fig.12 for Fig.11 Schematic diagram of the optical path of the light beam of the first laser chip 112a passing through the wedge-shaped structure 142a. Fig.11 and Fig.12 , wherein the focusing lens 114 is omitted in FIG. 9 , Fig.12 It is a side view.

[0098] The first laser chip 112a in this embodiment is a three-cavity semiconductor laser chip having a first cavity 1122a, a third cavity 1126a and a second cavity 1124a arranged in a first direction D1.

[0099] The wedge-shaped structure 142a and Figure 6 The wedge-shaped structure 142a is similar to the wedge-shaped structure 142 in FIG. 1 , and the difference is that the wedge-shaped structure 142a further includes a second plane 1428a. The second plane 1428a connects the first inclined plane 1424a and the second inclined plane 1426a and faces away from the first plane 1422a. The first inclined plane 1424a is connected to the second plane 1428a and has an included angle θ2, and the second inclined plane 1426a is connected to the second plane 1428a and has an included angle θ2. The second plane 1428a faces the plano-convex lens 150 (see FIG. 1 ). Figure 3 ).

[0100] like Fig.11 and Fig.12 As shown, the third resonant cavity 1126a emits a fourth light beam L4. The fourth light beam L4 passes through the second plane 1428a. When the first light beam L1 and the second light beam L2 penetrate the wedge-shaped structure 142a, they are deflected due to the angle θ2 and the refractive index characteristics and overlap to form another third light beam L3'. The first inclined surface 1424a of the wedge-shaped structure 142a is configured to deflect the first light beam L1 along the first direction D1, and the second inclined surface 1426a is configured to deflect the second light beam L2 along the opposite direction of the first direction D1. Specifically, the second plane 1428a is parallel to the first plane 1422a. The traveling direction of the fourth light beam L4 is parallel to the optical axis direction A, and the fourth light beam L4 is not deflected after passing through the wedge-shaped structure 142a.

[0101] In this embodiment, the width W3 between the first resonant cavity 1122 and the second resonant cavity 1124 is approximately 270 micrometers, and the opening widths W4 of the first resonant cavity 1122a, the second resonant cavity 1124a, and the third resonant cavity 1126a are approximately 75 micrometers, but the present disclosure is not limited thereto.

[0102] Fig.13A and Fig. 13B FIG. 3 is a schematic diagram of a laser light source module 300 according to another embodiment of the present disclosure. Fig. 13BIn the present embodiment, the laser light source module 300 has four first laser arrays 310A, 310B, 310C, and 310D, four second laser arrays 320A, 320B, 320C, and 320D, and a third laser array 330. As mentioned above, the first laser arrays 310A to 310D are red light semiconductor lasers and have a double resonant cavity or a triple resonant cavity. The laser light source module 300 also includes four wedge arrays 340A, 340B, 340C, and 340D, which correspond to the four first laser arrays 310A to 310D, respectively. The wedge arrays 340A to 340D deflect and overlap the light beams emitted by the double resonant cavities (or triple resonant cavities) in the first laser arrays 310A to 310D.

[0103] The laser light source module 300 further includes two plano-convex lenses 350A and 350B, an optical fiber 160, a first spectroscopic filter 370, a second spectroscopic filter 380, and a plurality of reflectors 390. The plano-convex lens 350A converges the blue light B from the third laser array 330. The plano-convex lens 350B converges the red light R from the first laser array 310A-310D and passing through the wedge arrays 340A-340D. The first spectroscopic filter 370 reflects the red light R and allows the blue light B and the green light G to pass through. The second spectroscopic filter 380 reflects the green light G and allows the blue light B to pass through.

[0104] Generally speaking, blue laser technology is more developed, so blue laser chips have higher power, while red laser chips have the lowest power. Therefore, the number of third laser arrays 330 in the laser light source module 300 can be less than the number of first laser arrays 310A-310D, and also less than the number of second laser arrays 320A-320D. The first laser arrays 310A-310D adopt Figure 6 The first laser chip 112 with multiple resonant cavities is used to increase the red light power. Thus, the power of laser light sources of different colors in the laser light source module 300 can be balanced.

[0105] According to the above embodiments, the laser light source disclosed herein can be a single laser chip or a laser array, and the arrangement is not limited. A single laser chip can be equipped with a single wedge-shaped structure, and a laser array can be equipped with a wedge-shaped array, but the arrangement is not limited.

[0106] In summary, the first inclined surface and the second inclined surface of the wedge-shaped structure disclosed in the present invention can deflect the light beams from the dual-resonance cavity (or triple-resonance cavity) of a single laser chip and overlap them into a single light beam. In this way, the light-collecting range required for the light-collecting surface can be reduced and the cost can be reduced. Such a design allows the laser light source module to be applied to projection systems with a small light-collecting area. In addition, since the first laser array is a dual-resonance cavity (or multi-resonance cavity) semiconductor laser, the output power of the red laser can be increased. Therefore, the red light collection efficiency of the laser light source module will not decrease due to the reduction of the light-collecting surface. The laser light source module disclosed in the present invention can simultaneously achieve the technical effects of reducing the light-collecting area, maintaining the light-collecting efficiency and reducing costs.

Claims

1. A laser light source module, comprising: At least one laser chip configured to emit a first light beam and a second light beam; at least one wedge-shaped structure configured to deflect the first light beam and the second light beam and overlap them into a third light beam; a plano-convex lens, wherein the wedge-shaped structure is located between the laser wafer and the plano-convex lens; and The optical fiber, wherein the plano-convex lens is located between the wedge-shaped structure and the optical fiber. 2 . The laser light source module according to claim 1 , wherein the laser chip is a multi-resonance cavity red light semiconductor laser chip.

3. The laser light source module according to claim 1, wherein the optical fiber has a light-collecting surface, the plano-convex lens is configured to converge the third light beam from the wedge-shaped structure to form a fifth light beam, and the light-collecting surface is configured to receive the fifth light beam.

4. The laser light source module according to claim 1, wherein the laser chip has a light-emitting surface and includes a first resonant cavity and a second resonant cavity, the first resonant cavity emits the first light beam, and the second resonant cavity emits the second light beam, the wedge-shaped structure includes a first plane, a first inclined surface, and a second inclined surface, the first plane faces the light-emitting surface of the laser chip, the first inclined surface and the second inclined surface face the plano-convex lens and are opposite to the first plane, and the first light beam and the second light beam pass through the first inclined surface and the second inclined surface respectively.

5. The laser light source module according to claim 4, wherein the laser chip further comprises a third resonant cavity located between the first resonant cavity and the second resonant cavity, the third resonant cavity emits a fourth light beam, the wedge-shaped structure further comprises a second plane, the second plane connects the first inclined plane and the second inclined plane and faces away from the first plane, the fourth light beam passes through the second plane, and the first inclined plane and the second inclined plane of the wedge-shaped structure are configured to respectively deflect the first light beam and the second light beam toward the fourth light beam and overlap them.

6. The laser light source module according to claim 4, wherein the number of the at least one laser chip is multiple, the number of the at least one wedge-shaped structure is multiple, the multiple wedge-shaped structures correspond to the multiple laser chips respectively, the multiple laser chips constitute at least one laser array, and the multiple wedge-shaped structures constitute at least one wedge-shaped array. 7 . The laser light source module according to claim 6 , wherein the plurality of wedge-shaped structures of the wedge-shaped array are connected.

8. The laser light source module according to claim 6, wherein each of the plurality of laser chips comprises a first resonant cavity and a second resonant cavity arranged in a first direction, the plurality of first inclined surfaces and the plurality of second inclined surfaces of the plurality of wedge-shaped structures are alternately arranged in the first direction, and each of the plurality of first inclined surfaces of the plurality of wedge-shaped structures is configured to deflect more than one of the plurality of first light beams, and each of the plurality of second inclined surfaces of the plurality of wedge-shaped structures is configured to deflect more than one of the plurality of second light beams. 9 . The laser light source module according to claim 8 , wherein an angle is formed between the first inclined surface and the second inclined surface of each of the plurality of wedge-shaped structures, and the plurality of angles of the plurality of wedge-shaped structures are the same.

10. A projection device, comprising: Laser light source module, including: at least one first laser chip, at least one second laser chip, and at least one third laser chip, wherein the first laser chip is configured to emit a first light beam and a second light beam; at least one wedge-shaped structure configured to deflect the first light beam and the second light beam and overlap them into a third light beam; and a plano-convex lens, wherein the wedge-shaped structure is located between the first laser chip and the plano-convex lens; and The projection module is connected to the laser light source module. 11 . The projection device according to claim 10 , wherein the laser light source module further comprises an optical fiber, and the plano-convex lens is located between the wedge-shaped structure and the optical fiber. 12 . The projection apparatus according to claim 10 , wherein the first laser chip, the second laser chip, and the third laser chip are semiconductor lasers and are configured to emit laser lights of different wavelengths. 13 . The projection device according to claim 10 , wherein the first laser chip is a multi-cavity semiconductor laser chip, and the second laser chip and the third laser chip are single-cavity semiconductor laser chips.

14. The projection device according to claim 10, wherein the first laser chip is a red light semiconductor laser chip, and the first laser chip has a light-emitting surface and includes a first resonant cavity and a second resonant cavity, the first resonant cavity emits the first light beam, and the second resonant cavity emits the second light beam, the wedge-shaped structure includes a first plane, a first inclined surface, and a second inclined surface, the first plane faces the light-emitting surface of the first laser chip, the first inclined surface and the second inclined surface face the plano-convex lens and are opposite to the first plane, and the first light beam and the second light beam pass through the first inclined surface and the second inclined surface respectively.

15. The projection device according to claim 14, wherein the first laser chip further includes a third resonant cavity located between the first resonant cavity and the second resonant cavity, the third resonant cavity emits a fourth light beam, the wedge-shaped structure further includes a second plane, the second plane connects the first inclined plane and the second inclined plane and faces away from the first plane, the fourth light beam passes through the second plane, and the first inclined plane and the second inclined plane of the wedge-shaped structure are configured to respectively deflect the first light beam and the second light beam toward the fourth light beam and overlap them.

16. The projection device according to claim 14, wherein the number of the at least one first laser chip is multiple, the number of the at least one wedge-shaped structure is multiple, the multiple wedge-shaped structures respectively correspond to the multiple first laser chips, the multiple first laser chips constitute at least one first laser array, and the multiple wedge-shaped structures constitute at least one wedge-shaped array.

17. The projection apparatus according to claim 16, wherein each of the plurality of first laser chips comprises a first resonant cavity and a second resonant cavity arranged in a first direction, the plurality of first inclined surfaces and the plurality of second inclined surfaces of the plurality of wedge-shaped structures are alternately arranged in the first direction, and each of the plurality of first inclined surfaces of the plurality of wedge-shaped structures is configured to deflect more than one of the plurality of first light beams, and each of the plurality of second inclined surfaces of the plurality of wedge-shaped structures is configured to deflect more than one of the plurality of second light beams. 18 . The projection device according to claim 17 , wherein an angle is formed between the first inclined surface and the second inclined surface of each of the plurality of wedge-shaped structures, and the plurality of angles of the plurality of wedge-shaped structures are the same.

19. The projection device according to claim 17, wherein the number of the at least one second laser chip is multiple, the multiple second laser chips constitute multiple second laser arrays, the number of the at least one third laser chip is multiple, the multiple laser chips constitute a third laser array, the multiple first laser chips are red light semiconductor laser chips, the multiple second laser chips are green light semiconductor laser chips, and the multiple third laser chips are blue light semiconductor laser chips.