Detection circuit, display substrate, display screen and electronic device

Abstract

The application provides a detection circuit, a display substrate, a display screen and an electronic device, relates to the technical field of circuits, and is applied to a circuit substrate. The circuit substrate comprises a wiring area and a bending area. The wiring area comprises N metal wirings, and the bending area extends along a first direction and overlaps a first part of the wiring area. The detection circuit comprises: a first dummy line, which is distributed on a first side of the N metal wirings and extends along a second direction; a second dummy line, which is distributed on a second side of the N metal wirings and extends along the second direction; a first wiring, which is connected between the first dummy line and the second dummy line; a third dummy line, which is adjacent to the first dummy line; a fourth dummy line, which is adjacent to the second dummy line; and a second wiring, which is connected between the third dummy line and the fourth dummy line. Based on the scheme, when an output picture of a display substrate prepared based on a panel bending technology is abnormal, it is determined whether the display panel display abnormality is caused by the panel bending with a lower difficulty.

Description

Technical Field

[0001] This application relates to the field of circuit technology, and more specifically, to detection circuits, display substrates, displays, and electronic devices. Background Technology

[0002] Currently, to improve display quality, meet the demands for thinner and lighter products, optimize space utilization, and enhance design flexibility, panel bending technology is typically used in screen manufacturing. This involves bending circuit components such as drive signal lines and parts of the screen substrate directly to the back of the display substrate, significantly reducing screen bezel width, increasing screen-to-body ratio, and thus improving the visual experience. However, while panel bending technology offers these advantages, it also increases the possibility of screen circuitry abnormalities during the manufacturing process.

[0003] However, during the bending process, positive adhesive needs to be applied to the front of the bending area of ​​the panel, and the area above the bending area is also covered by ink applied to the surface of the flexible glass substrate. This makes it difficult to determine whether the screen malfunctions or other faults are caused by bending of the panel. Summary of the Invention

[0004] This application provides a detection circuit, a display substrate, a display screen, and an electronic device, which can determine with relatively low difficulty whether the display panel display abnormality originates from panel bending when there is an abnormality in the output image of the display substrate prepared based on panel bending technology.

[0005] In a first aspect, a detection circuit is provided, applied to a circuit board, the circuit board including a trace area and a bending area. N metal traces, where N is greater than 1, are arranged on the first surface of the trace area. The first ends of M of the N metal traces are connected to a first structural layer of the circuit board, where M is less than or equal to N. The bending area extends along a first direction and overlaps with a first portion of the trace area. The bending area is made of a flexible material and is used to bend the first portion along a second direction to connect the second ends of the M metal traces to a second structural layer of the circuit board. The detection circuit includes: a first dummy element. A line is distributed on the first side of N metal traces and extends along the second direction; a second dummy line is distributed on the second side of N metal traces and extends along the second direction, with the first side and the second side opposite each other; a first trace is located within the coverage area of ​​the bend area and is connected to the first dummy line and the second dummy line respectively; a third dummy line is adjacent to the first dummy line and extends along the second direction; a fourth dummy line is adjacent to the second dummy line and extends along the second direction; a second trace is located within the coverage area of ​​the bend area and is connected to the third dummy line and the fourth dummy line respectively.

[0006] In conjunction with the first aspect, in some implementations of the first aspect, the circuit board is a display board, the first trace and the second trace are located in the bottom shield metal (BSM) layer of the display board, the vertical distance between the BSM layer and the first surface is greater than 0, and the detection circuit further includes: a first via disposed in the trace area, the first via being used to connect the first node of the first dummy line to the first node of the first trace; a second via disposed in the trace area, the second via being used to connect the first node of the second dummy line to the first node of the first trace; a third via disposed in the trace area, the third via being used to connect the first node of the third dummy line to the first node of the second trace; and a fourth via disposed in the trace area, the fourth via being used to connect the first node of the fourth dummy line to the first node of the second trace.

[0007] In conjunction with the first aspect, in some implementations of the first aspect, when the trace area is in a bent state, the projection of the first trace and the top edge of the bent area in the third direction overlaps, and the projection of the second trace and the bottom edge of the bent area in the third direction overlaps, with the third direction being perpendicular to the circuit board.

[0008] In conjunction with the first aspect, in some implementations of the first aspect, the first via and the second via are located outside the bending zone.

[0009] In conjunction with the first aspect, in some implementations of the first aspect, the second node of the first dummy wire is used to connect to the first end of the test equipment, and the second node of the second dummy wire is used to connect to the second end of the test equipment; or, the second node of the third dummy wire is used to connect to the first end of the test equipment, and the second node of the fourth dummy wire is used to connect to the second end of the test equipment, and the test equipment is also used to detect whether the connected lines are conductive.

[0010] In conjunction with the first aspect, in some implementations of the first aspect, the second node of the first dummy line, the second node of the second dummy line, the second node of the third dummy line, and the second node of the fourth dummy line are located outside the bending region.

[0011] In conjunction with the first aspect, in some implementations of the first aspect, the circuit board is connected to the first circuit board, and the second node of the first dummy line, the second node of the second dummy line, the second node of the third dummy line and the second node of the fourth dummy line are soldered to the first circuit board.

[0012] In conjunction with the first aspect, in some implementations of the first aspect, each of the M metal traces is divided into multiple sub-metal traces located in the bending region, and the material and geometric parameters of at least one of the first dummy line, the second dummy line, the third dummy line, the fourth dummy line, the first trace, and the second trace are the same as those of the sub-metal traces.

[0013] In a second aspect, a display substrate is provided, comprising: a wiring region having N metal traces arranged on a first surface of the wiring region, where N is greater than 1; a first structural layer fixedly connected to the first ends of M of the N metal traces, where M is less than or equal to N; a bending region extending along a first direction and overlapping a first portion of the wiring region, the bending region being made of a flexible material for bending the first portion along a second direction; a second structural layer fixedly connected to the second ends of the bent M metal traces; and a detection circuit in any possible embodiment of the detection circuit design of the first aspect described above.

[0014] Thirdly, a display screen is provided, which includes a display substrate in any possible implementation of the display substrate design of the second aspect described above.

[0015] Fourthly, an electronic device is provided, which includes a display screen in any possible implementation of the display screen design of the third aspect described above. Attached Figure Description

[0016] Figure 1 This is a cross-sectional view of a bent display substrate 100 applicable to an embodiment of this application;

[0017] Figure 2 This is a schematic diagram of the structure of a detection circuit 200 proposed in an embodiment of this application;

[0018] Figure 3 This is a schematic diagram of the location of the dumb line of a display substrate applicable to an embodiment of this application;

[0019] Figure 4 This is a schematic diagram of another detection circuit 200 proposed in the embodiments of this application. Detailed Implementation

[0020] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0021] This application will present various aspects, embodiments, or features relating to a system comprising multiple devices, components, modules, etc. It should be understood and appreciated that individual systems may include additional devices, components, modules, etc., and / or may not include all the devices, components, modules, etc. discussed in conjunction with the accompanying drawings. Furthermore, combinations of these approaches are also possible.

[0022] Furthermore, in the embodiments of this application, the words "exemplary," "for example," etc., are used to indicate that they are examples, illustrations, or descriptions. Any embodiment or design scheme described as "exemplary" in the embodiments of this application should not be construed as being better or more advantageous than other embodiments or design schemes. Specifically, the use of the term "exemplary" is intended to present the concept in a concrete manner.

[0023] The business scenarios described in the embodiments of this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided in the embodiments of this application. As those skilled in the art will know, with the evolution of technology and the emergence of new business scenarios, the technical solutions provided in the embodiments of this application are also applicable to similar technical problems.

[0024] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0025] In this application embodiment, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0026] In the description of the embodiments of this application, the terms "upper," "lower," "left," "right," "inner," "outer," "vertical," and "horizontal," etc., indicate the orientation or positional relationship relative to the orientation or position of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and not to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. They can change accordingly depending on the orientation of the components in the accompanying drawings, and therefore should not be construed as limiting this application.

[0027] In the embodiments of this application, the same reference numerals are used to denote the same component or part. For the same part in the embodiments of this application, only one part or component may be labeled with reference numerals in the figures. It should be understood that the reference numerals also apply to other identical parts or components. In addition, the various parts in the figures are not drawn to scale, and the dimensions and sizes of the parts shown in the figures are only exemplary and should not be construed as limiting this application.

[0028] With the widespread use of portable electronic devices such as smartphones and tablets, consumers' demands for the appearance and performance of electronic products are constantly increasing, leading to increasingly fierce market competition for display products. Under this trend, narrow bezel designs for display devices have become a popular trend.

[0029] In view of this, panel bending technology was proposed. By bending the non-display area of ​​the display panel, panel bending technology can significantly reduce the bezel width, making the display module more compact and beautiful. It also provides users with a more immersive viewing experience, that is, within a limited device size, it can provide users with a larger display area, thereby enabling users to obtain wider and richer visual content, and meeting consumers' demands for high quality and high performance of display devices.

[0030] Panel bending technology primarily reduces bezel width by bending the non-display area of ​​the display module. This technology allows manufacturers to design more compact and stylish display products without sacrificing display area. However, during the panel bending process, critical structures such as the display module's wiring and circuitry must be properly protected to ensure they are not damaged.

[0031] To achieve this goal, manufacturers typically use one or more layers of protective materials, such as protective adhesives, in the relevant areas of the display module to cover and protect these critical structures. However, the bending process of the panel may also introduce some new problems, leading to abnormal product displays. In this application embodiment, these abnormalities are collectively referred to as bending abnormalities.

[0032] In some possible embodiments, these display anomalies may include: incomplete display, no display, dark lines on the screen, or bright lines on the screen.

[0033] Figure 1 This is a cross-sectional view of a bent display substrate 100 applicable to an embodiment of this application.

[0034] refer to Figure 1 As shown, the display substrate 100 includes:

[0035] Cover glass (CG) 110, with an ink layer 111 coated on the lower surface of cover glass 110.

[0036] The first adhesive layer 120 is located under the cover glass 110 and is made of optically clear adhesive (OCA).

[0037] The polarizer (Pol) layer 130, located below the first adhesive layer 120, is used to control the direction of light transmission inside the display substrate 100, thereby enabling image display.

[0038] The first structural layer 140, also known as the first panel (PNL) layer, is located below the polarization layer 130. The first structural layer 140 includes some core modules of the display substrate 100, such as gate on array (GOA) circuits, and the traces used for bending also include GOA traces.

[0039] The first thin film layer 150, located below the first structural layer 140, serves as a transparent electrode, allowing light to pass through while also conducting current. The first thin film layer 150 may be an indium tin oxide (ITO) thin film.

[0040] The screen cooling film (SCF) layer 155 is located below the first thin film layer 150 and is used to improve the heat dissipation performance of the display screen. The materials may include graphite, nano carbon, aluminum foil, etc.

[0041] The spacer 160, located below the SCF layer 155, serves as a support for the upper and lower structural layers and maintains a uniform distribution of the electric field inside the display screen. Through uniform support, the spacer 160 can prevent the display screen from sinking during long-term use or under external pressure, thereby protecting the integrity and display effect of the display screen.

[0042] The second thin film layer 170 is located below the filler layer 160, and the physical parameters of the second thin film layer 170 are consistent with the physical parameters of the first thin film layer 150.

[0043] The second structural layer 180, also known as the second PNL layer, is located below the second thin film layer 170 and is used to connect some bent metal traces led out from the first structural layer 140.

[0044] The bending area can be made of a flexible material. Further, the bending area can include a flexible metal layer 190 for receiving some metal traces led out from the first structural layer 140. By bending itself, the metal traces are bent synchronously, so that the lead-out ends of the metal traces can be connected to the corresponding ports of the second structural layer 180. After the flexible metal layer 190 completes the bending, an adhesive, such as tape, PSA, or Foam, needs to be attached to the back of the flexible metal layer to fix the bent state of the flexible metal layer 190.

[0045] The thickness of the flexible metal layer 190 is typically less than that of the first structural layer 140 and the second structural layer 180. Therefore, a thickness difference exists at the connection surfaces of the flexible metal layer 190 with the first structural layer 140 and the second structural layer 180, respectively, to form a groove structure. In this embodiment, this groove structure is defined as a bending groove. Since there are two groove structures formed, when the display substrate 100 is in a bent state, the display substrate 100 includes a first bending groove (combined with...). Figure 1 As shown, it can also be called the upper bending slot) and the second bending slot (combined with Figure 1 As shown, this can also be called the lower bending groove. Most of the circuit breakage caused by panel bending occurs in the bending groove.

[0046] It should be understood that when the display substrate 100 is in the unfolded state, the first structural layer 140, the second structural layer 180 and the flexible metal layer 190 can be understood as belonging to the same metal layer.

[0047] During the panel bending process described above, the following two parameters need to be strictly controlled:

[0048] 1. Bending accuracy: This parameter measures whether the bending degree of the display panel meets the design requirements. Precise bending accuracy can ensure that the module can maintain stable electrical connection and mechanical strength during assembly and use.

[0049] 2. The radius of curvature, also known as the R-value, refers to the radius of the arc formed after the panel is bent. A reasonable R-value helps reduce stress concentration, lowers the risk of circuit breakage, and improves the overall reliability of the module.

[0050] The application of panel bending technology also introduces some possible bending anomalies, which can lead to malfunctions in the display module. For example, when parameter deviations or parameters do not meet design requirements occur during the bending process of the display panel, it may cause problems such as poor electrical connection, reduced mechanical strength, or even circuit breakage, thereby affecting the overall performance and reliability of the display module.

[0051] However, when display abnormalities are found on the display panel, it is not necessarily caused by panel bending; other reasons may also exist. However, determining whether the abnormality originates from panel bending is difficult to observe and analyze because the connection between the flexible metal layer 190 and the first structural layer 140 and the second structural layer 180 requires bonding with adhesive. The presence of this adhesive makes it impossible to directly observe the bending state of the flexible metal layer 190, or whether there are defects in the circuitry after bending. Furthermore, the curved surface formed by the bent flexible metal layer 190 is obscured by the ink layer 111 coated on the lower surface of the covering glass 110, further increasing the difficulty of observing the bending state of the flexible metal layer 190.

[0052] In order to visually observe whether there are any abnormalities such as breaks in the internal wiring of the flexible metal layer 190, the entire display substrate 100 after bending needs to be unfolded again. However, during the unfolding process, it is very easy to cause new cracks or damage to the unfolded structural parts, which increases the risk of defective products and further increases the difficulty of locating the cause of display abnormalities.

[0053] However, considering that the aforementioned bending anomalies typically occur in GOA-related circuits, this application proposes a detection circuit. The traces of this detection circuit cross the relevant GOA circuit lines, which are mainly distributed in the bending area of ​​the display substrate. The detection circuit also has test ports outside the bending area to test the continuity of the detection circuit, thereby indicating the continuity of the relevant GOA circuit lines traversed by the detection circuit traces. Therefore, after the display substrate completes bending, if a display anomaly is detected in the output image, connecting a testing device to the reserved test port of the detection circuit allows determination of whether the current detection circuit is conducting. If the detection circuit is open-circuited, it indicates that the traces of the detection circuit broke during the panel bending process. This suggests that there is a high probability of a circuit breakage caused by panel bending among the relevant lines traversed by the detection circuit traces, thus reducing the difficulty in determining whether the display panel's display anomaly originates from panel bending.

[0054] Figure 2 This is a schematic diagram of the structure of a detection circuit 200 proposed in an embodiment of this application. Figure 2 (a) is a schematic diagram of the unfolded structure of the circuit board before bending, which is a top view. Figure 2 (b) is a schematic diagram of the cross-sectional structure of the circuit board after bending, which is a side view.

[0055] refer to Figure 2 As shown in (a), the detection circuit 200 is applied to a circuit board 300, which includes:

[0056] Wiring area 310 and bending area 320;

[0057] In this circuit, the first surface of the wiring area 310 has N metal traces 311, where N is greater than 1. The first ends 3111 of M of these N metal traces 311 are connected to the first structural layer 330 of the circuit board 300, where M is less than or equal to N. (This is from a top view.) Figure 2 The structural surface presented in (a) includes the first surface of the trace area 310.

[0058] The bending area 320 extends along the first direction and overlaps with the first part of the trace area 310. The bending area 320 is made of flexible material and is used to bend the first part along the second direction to connect the second ends 3112 of the M metal traces to the second structural layer 340 of the circuit board 300.

[0059] refer to Figure 2 As shown in (a) of this application, the detection circuit 200 proposed in this embodiment includes:

[0060] The first dummy line 210 is distributed on the first side of the N metal traces 311 and extends along the second direction;

[0061] The second dummy line 220 is distributed on the second side of N metal traces 311 and extends along the second direction, with the first side and the second side opposite to each other;

[0062] The first trace 250 is located within the coverage area of ​​the bend area 320, and the first trace 250 is connected to the first dummy line 210 and the second dummy line 220 respectively.

[0063] The third dummy element line 230 is adjacent to the first dummy element line 210 and extends along the second direction;

[0064] The fourth dummy element line 240 is adjacent to the second dummy element line 220 and extends along the second direction;

[0065] The second routing line 260 is located within the coverage area of ​​the bend zone 320, and the second routing line 260 is connected to the third dummy line 230 and the fourth dummy line 240 respectively.

[0066] It should be noted that the aforementioned bending area 320 can be bent along the second direction, or it can be understood that the bending area 320 can be bent in a direction perpendicular to the circuit board. Figure 2 Taking (b) as an example, the direction perpendicular to the circuit board is the third direction shown in the figure.

[0067] In some possible embodiments, the bending region 320 may include a flexible metal layer made of a flexible metal material.

[0068] In some possible embodiments, the lines of the first dummy line 210 to the fourth dummy line 240 of this application can be of various line shapes, for example, referring to Figure 2 As shown in (a), the route from the first dummy line 210 to the fourth dummy line 240 can be L-shaped, that is, one end of the first dummy line 210 to the fourth dummy line 240 is led out from the side of the routing area 310. Alternatively, it can be other zigzag shapes, such that one end of the first dummy line 210 to the fourth dummy line 240 is led out from the side of the routing area 310. Alternatively, the first dummy line 210 to the fourth dummy line 240 passes through the bending area 320. It can also be understood that the entire dummy line passes through the bending area 320 or crosses the bending area 320. For example, the first dummy line 210 to the fourth dummy line 240 is a straight line extending along the second direction, such that one end of the first dummy line 210 to the fourth dummy line 240 is led out from below or above the routing area 310.

[0069] For example, see reference Figure 2 As shown in (a) above, the first direction is Figure 2 (a) shows the horizontal direction within the plane, and the second direction mentioned above is... Figure 2 (a) shows the vertical direction in the plane, that is, the first direction and the second direction. Figure 2 (a) shows mutually perpendicular planes.

[0070] In some possible embodiments, the directions referred to by the first and second directions described above can be adaptively adjusted for different circuit designs. Embodiments of this application use... Figure 2 The first and second directions shown are used as a reference for explanation.

[0071] In some possible embodiments, reference Figure 2 As shown in (a), the first side of the aforementioned N metal traces 311 refers to the left or right side of the overlapping area (hereinafter referred to as the overlapping area) formed by the region composed of the N metal traces 311 and the bending area 320. When the first side of the N metal traces 311 refers to the left side of the overlapping area, then the second side of the N metal traces 311 refers to the right side of the overlapping area, and vice versa.

[0072] In some possible embodiments, the circuit board 300 is a display board, and the N metal traces 311 are GOA circuit traces. The GOA circuit includes GOA traces and circuit traces for inputting GOA circuit-related signals. For example, it may include voltage source and sink (VSS) signal lines, positive power supply voltage (VDD) signal lines, or data signal lines. If the display screen also has touch functionality, it may also include touch sensor panel (TSP) signal lines. One end of the GOA trace is connected to the circuit trace layer of the display board (i.e., the first structural layer 330 mentioned above), and the other end of the GOA trace needs to be connected to another circuit trace layer of the display panel (i.e., the second structural layer 340 mentioned above) after the GOA circuit trace is bent. Some circuit traces for inputting GOA circuit-related signals also need to be bent accordingly. Therefore, the above M metal traces correspond to the GOA traces in the GOA circuit, and the remaining (NM) metal traces correspond to the circuit traces in the GOA circuit used to input signals related to the GOA circuit.

[0073] It should be understood that the first dummy line 210 to the fourth dummy line 240 mentioned above are also called dummy lines, and are located on both sides of the GOA circuit. For ease of understanding, the main functions of the dummy lines are explained below.

[0074] Adding dummy lines to circuits helps ensure consistency in circuit manufacturing. During semiconductor manufacturing, different areas may experience different exposure, etching, and deposition conditions. Adding dummy lines at the edges of circuits / chips or in specific blank areas ensures that the process conditions are as consistent as possible across the entire circuit / chip surface, thereby reducing manufacturing deviations caused by location differences.

[0075] Adding dummy lines to a circuit can also adjust the metal wiring density of the circuit / chip, which has a significant impact on the circuit manufacturing process: if the metal density in a certain area of ​​the circuit / chip is too high or too low, it may lead to problems such as uneven etching and difficulty in planarization. By adding dummy lines at the edges of the circuit / chip or in specific blank areas, the metal density distribution on the entire circuit / chip surface can be adjusted, making the metal density more uniform across the entire circuit / chip surface, which helps to reduce the difficulty of subsequent circuit manufacturing processes such as chemical mechanical polishing.

[0076] In addition, dummy lines in the circuit can control the stress distribution of the circuit. If the stress distribution on the surface of the circuit / chip is uneven, it may cause damage to the circuit / chip or performance degradation. Dummy lines can act as stress absorption layers or balancing layers to control the stress distribution on the surface of the circuit / chip and prevent damage to the circuit / chip due to stress concentration.

[0077] Furthermore, by adding dummy lines to the circuit, manufacturers can optimize the process conditions of the entire circuit / chip surface, reducing damage caused by manufacturing deviations.

[0078] Figure 3 This is a schematic diagram showing the location of the dumb line of a display substrate applicable to an embodiment of this application.

[0079] Taking a display substrate as an example, refer to Figure 3 As shown, some dummy lines are usually placed in the GOA circuit (e.g., on both sides of the GOA line) to achieve the beneficial effects mentioned above regarding circuit fabrication.

[0080] Therefore, the first dummy line 210 to the fourth dummy line 240 can be dummy lines located on both sides of the GOA line. Thus, the implementation of this solution does not require significant changes to the circuit structure; the detection circuit 200 proposed in this application embodiment can be constructed by reusing a conventionally designed circuit board. Based on this solution, the detection circuit 200 proposed in this application embodiment can be introduced into the display substrate without significant changes to the circuit design.

[0081] In some possible embodiments, the first node of the first dummy line 210 is connected to the first node of the first trace 250, the first node of the second dummy line 220 is connected to the second node of the first trace 250, the first end of the third dummy line 230 is connected to the first node of the second trace 260, and the first node of the fourth dummy line 240 is connected to the second node of the second trace 260.

[0082] In addition, the second node of the first dummy line 210 is used to connect to the first end of the test equipment, and the second node of the second dummy line 220 is used to connect to the second end of the test equipment; or, the second node of the third dummy line 230 is used to connect to the first end of the test equipment, and the second node of the fourth dummy line 240 is used to connect to the second end of the test equipment. The test equipment is also used to detect whether the connected lines are conductive.

[0083] In some possible embodiments, taking the first dummy line 210 as an example, the first node of the first dummy line 210 can be located at either an endpoint or a non-endpoint of the first dummy line 210; the second node of the first dummy line 210 can also be located at either an endpoint or a non-endpoint of the first dummy line 210, provided that the first and second nodes of the first dummy line 210 do not coincide. The node settings for the second dummy line 220, the third dummy line 230, the fourth dummy line 240, the first trace 250, and the second trace 260 are similar and will not be repeated here.

[0084] In some possible embodiments, for a loop, the dummy wires used to connect the two ports of the test equipment can be interchanged. For example, the second node of the first dummy wire 210 described above can also be used to connect the second end of the test equipment, and the second node of the second dummy wire 220 can also be used to connect the first end of the test equipment.

[0085] In some possible embodiments, the above-mentioned test equipment can be an electronic parameter measurement (EPM) device. The EPM device is used to detect circuit characteristics by inputting an electrical signal and outputting a signal based on the feedback signal from the loop. During the test, if the loop is in an open circuit state, it means that there is a problem of open circuit or poor connection in the loop, which causes the signal to be unable to be transmitted normally; if the loop is in a closed circuit state, it means that there is no problem of open circuit or poor connection in the loop.

[0086] In some possible embodiments, the above-mentioned testing equipment can also be other equipment that can be used to detect the continuity of a circuit, such as an automatic resistance testing (ART) device. The ART device is used to detect the resistance value of the circuit connected to both ends of the device. During the test, if the detected circuit resistance value is infinite, it means that there is an open circuit or poor connection in the circuit, resulting in an infinitely large detected circuit resistance value; if the detected circuit resistance value is a specific value, it means that there is no open circuit or poor connection in the circuit.

[0087] It should be understood that, based on existing circuit board manufacturing technology, the thickness difference between the metal layer where the first trace 250 or the second trace 260 is located and the metal layer where the N metal traces 311 are located can be less than 1 μm. Therefore, when there is a trace break in the N metal traces 311 of the circuit board 300, it is usually accompanied by the breakage of the corresponding first trace 250 or the second trace 260, and vice versa.

[0088] Therefore, the first dummy line 210, the first trace 250 and the second dummy line 220 are used to form a loop, and the third dummy line 230, the second trace 260 and the fourth dummy line 240 are used to form a loop. By detecting the continuity of these two loops, it can be determined whether the N metal traces 311 through which these two loops pass have broken.

[0089] For example, when the circuit board 300 is a display board, the first trace 250 and the second trace 260 cross the portion of the N metal traces 311 in the overlapping area. If the display board outputs an abnormal image after bending in the bending area 320, the first end of the test device can be connected to the second node of the first dummy line 210, and the second end of the test device can be connected to the second node of the second dummy line 220 to detect whether the line from the first dummy line 210 to the first trace 250 and then to the second dummy line 220 is continuous. If a break in the line is detected, it indicates that at least one of the N metal traces 311 broke during the bending process. If the line is normal, the first end of the test device can be connected to the second node of the third dummy line 230, and the second end of the test device can be connected to the second node of the fourth dummy line 240 to detect whether the line from the third dummy line 230 to the second trace 260 and then to the fourth dummy line 240 is continuous. If a break in the line is detected, it indicates that at least one of the N metal traces 311 broke during the bending process. If the line is normal, it indicates that the abnormal image output by the display board is not caused by the panel bending operation. Throughout the entire testing phase, it was not necessary to re-unfold the bent panel, thus avoiding the possibility of circuit breakage caused by the panel unfolding operation.

[0090] Based on the above technical solution, by introducing a detection circuit inside the bendable display substrate, when there is an abnormality in the image output from the display substrate, even if the circuit substrate is bent, the continuity of the circuit can be tested using testing equipment. This indirectly indicates whether there is a circuit break in the display substrate's wiring area through which the circuit passes. Therefore, it is possible to determine whether the abnormal image output from the display substrate is due to a circuit break in the wiring area, reducing the difficulty of detection. Furthermore, it eliminates the need to re-unfold the bent display substrate, avoiding the possibility of new circuit breaks during the unfolding process. Moreover, this detection circuit can be implemented directly based on the dummy lines set within the conventionally designed circuit substrate, without significantly altering the basic structure of the circuit substrate, greatly reducing the difficulty of implementation.

[0091] In some possible embodiments, considering that it is difficult to directly span N metal traces 311 within the trace area 310 during circuit fabrication, this application proposes a circuit structure in which the first trace 250 and the second trace 260 are disposed on a different layer from the first surface of the trace area 310. Taking the circuit substrate 300 as a display substrate as an example, the first trace 250 and the second trace 260 are located in the bottom shielding metal BSM layer of the display substrate, and the vertical distance between the BSM layer and the first surface of the trace area 310 is greater than 0.

[0092] In some possible embodiments, reference Figure 2 As shown in (a), since the first trace 250 and the second trace 260 are on different layers from the first dummy line 210 to the fourth dummy line 240, and cannot be directly connected, the detection circuit 200 further includes:

[0093] A first via 270 is provided in the routing area 310. The first via 270 is used to connect the first node of the first dummy line 210 to the first node of the first trace 250.

[0094] The second via 280 is disposed in the routing area 310. The second via 280 is used to connect the first node of the second dummy line 220 to the second node of the first routing line 250.

[0095] The third via 275 is provided in the routing area 310. The third via 275 is used to connect the first node of the third dummy line 230 to the first node of the second routing line 260.

[0096] The fourth via 285 is provided in the routing area 310. The fourth via 285 is used to connect the first node of the fourth dummy line 240 to the second node of the second routing line 260.

[0097] It should be understood that the BSM layer is typically located at the bottom of the display panel, primarily used to shield against electromagnetic interference from the bottom or other directions, ensuring the stability of the internal circuitry and the accuracy of signal transmission. On one hand, the routing design on the surface of the BSM layer is relatively simple, making it easier to implement the aforementioned first trace 250 and second trace 260, used to form a loop with the dummy line, in the manufacturing process. On the other hand, the BSM layer has good conductivity, ensuring the normal transmission of electrical signals in the first trace 250 and second trace 260.

[0098] In some possible embodiments, and of course for different display panel designs, the first trace 250 or the second trace 260 may also be disposed in other conductive layers of the display panel.

[0099] Similarly, when the circuit board 300 is for other circuits, the first trace 250 and the second trace 260 can be disposed in other conductive layers in the circuit board 300 where the vertical distance between them and the first surface of the trace area 310 is greater than 0.

[0100] In some possible embodiments, the first via 270, the second via 280, the third via 275 and the fourth via 285 are located outside the bending area 320. Based on this scheme, it is possible to effectively avoid the via deformation caused by the bending area 320 during the bending process, which would lead to abnormal connection between the dummy line passing through the via and the first trace 250 or the second trace 260.

[0101] In some possible embodiments, the second nodes of the first dummy line 210, the second dummy line 220, the third dummy line 230, and the fourth dummy line 240 may also be located outside the bending zone 320. Based on this scheme, the problem of the second ends of each dummy line being obscured due to the bending in the bending zone 320 can be effectively avoided, making it easier for the testing equipment to connect to the corresponding dummy lines.

[0102] In some possible embodiments, the circuit board 300 can be connected to the first circuit board, and the second nodes of the first dummy line 210, the second dummy line 220, the third dummy line 230, and the fourth dummy line 240 can be soldered to the first circuit board.

[0103] In some possible embodiments, the first circuit board and the circuit board 300 described above are independent of each other.

[0104] In some possible embodiments, when the circuit board 300 is a display substrate, the first circuit board can be a flexible printed circuit (FPC), and the circuit board 300 and the first circuit board can be connected through the pad area of ​​the panel.

[0105] Based on the above technical solution, it is not necessary to separately bring out the second end of each dummy element line, which simplifies the circuit design.

[0106] In some possible embodiments, as described above Figure 2 Taking the detection circuit 200 shown as an example, when the trace area 310 is in a bent state, the projection of the first trace 250 and the top edge 321 of the bent area 320 in the third direction overlaps, and the projection of the second trace 260 and the bottom edge 322 of the bent area 320 in the third direction overlaps, wherein the third direction is perpendicular to the circuit board 300.

[0107] It should be understood that, with Figure 1The structure of the display substrate 100 shown is similar, see reference. Figure 2 As shown in (b), when the trace area 310 is in a bent state, the connection points between the two ends of the trace area 310 and the circuit board 300 can also be defined as bending grooves. Since most circuit breaks caused by panel bending occur at the bending groove location, it is advisable to place the first trace 250 near the first bending groove of the circuit board 300 and the second trace 260 near the second bending groove of the circuit board 300. When the trace area 310 is in a bent state, the projection of the first trace 250 and the top edge 321 of the bent area 320 in the third direction overlaps, meaning that the first trace 250 is located near the first bending groove; similarly, the projection of the second trace 260 and the bottom edge 322 of the bent area 320 in the third direction overlaps, meaning that the second trace 260 is located near the second bending groove.

[0108] In some possible embodiments, as described above Figure 2 Taking the detection circuit 200 shown as an example, when the trace area 310 is in a bent state, the distance between the end face where the first trace 250 intersects with the bend area 320 and the first structural layer 330 is less than or equal to a first preset distance, and the distance between the end face where the second trace 260 intersects with the bend area 320 and the second structural layer 340 is less than or equal to a second preset distance, wherein the first preset distance and the second preset distance can be equal. Under the condition that the above distance conditions are met, it is possible to ensure that, when the trace area 310 is in a bent state, the first trace 250 is located near the first bending slot, and the second trace 260 is located near the second bending slot.

[0109] Based on the above technical solution, by placing the first trace 250 and the second trace 260 near the bending groove between the bending area and the non-bending area of ​​the circuit board 300, it can help increase the performance of the first trace 250 and the second trace 260 in detecting line breakage in the bending area 320.

[0110] Figure 4 This is a schematic diagram of another detection circuit 200 proposed in the embodiments of this application.

[0111] Compared to Figure 2 The detection circuit 200 shown, Figure 4 The detection circuit 200 shown also includes:

[0112] The fifth dummy element line 410 is adjacent to the third dummy element line 230 and extends along the second direction;

[0113] The sixth dummy element line 420 is adjacent to the fourth dummy element line 240 and extends along the second direction;

[0114] The third line 430 is located within the coverage area of ​​the bend zone 320, and the third line 430 is connected to the fifth dummy line 410 and the sixth dummy line 420 respectively.

[0115] In addition, the detection circuit 200 also includes:

[0116] The fifth via 440 is provided in the routing area 310. The fifth via 440 is used to connect the first node of the fifth dummy line 410 with the first node of the third routing line 430.

[0117] A sixth via 450 is provided in the routing area 310. The sixth via 450 is used to connect the first node of the sixth dummy line 420 with the second node of the third routing line 430.

[0118] The second node of the fifth dummy line 410 is used to connect to the first end of the test equipment, and the second node of the sixth dummy line 420 is used to connect to the second end of the test equipment.

[0119] The aforementioned third trace 430 can be located at the middle position of the first trace 250 and the second trace 260, and extends along the first direction, so that the formed detection loop passes through the metal trace deployed at the middle position of the bending area, thereby increasing the detection points of the detection circuit 200 for N metal traces 311, so that the detection circuit 200 can detect the fault of metal trace breakage occurring at the middle position of the bending area.

[0120] In some possible embodiments, more detection loops can be added on the basis of the detection circuit 200 described above. The configuration of each detection loop is similar, that is, it includes two dummy lines distributed on both sides of the N metal traces 311 and a trace extending along the first direction. This application embodiment will not list them.

[0121] Based on the above technical solution, the detection points of the detection circuit 200 within the bending area 320 can be increased, enabling more accurate detection of circuit breakage caused by bending operations.

[0122] In some possible embodiments, with Figure 2 Taking the detection circuit 200 shown as an example, each of the M metal traces is divided into multiple sub-metal traces located in the bending region 320. At least one of the following: the first dummy line 210, the second dummy line 220, the third dummy line 230, the fourth dummy line 240, the first trace 250, and the second trace 260 has the same material and geometric parameters as the sub-metal traces. Similarly, when the detection circuit 200 is designed with other structures, the dummy lines and traces used can also be designed with the same material and geometric parameters as the sub-metal traces.

[0123] It should be understood that since each metal trace is divided into multiple sub-metal traces, the diameter or cross-sectional width of the sub-metal traces should be smaller than that of the metal trace. In circuit design, the purpose of dividing each metal trace into multiple sub-metal traces is as follows: because a single metal trace has a larger diameter or cross-sectional width, it is less prone to deformation during bending, has poor toughness, and is easily broken; while dividing a metal trace into multiple sub-metal traces results in a smaller diameter or cross-sectional width for each sub-metal trace, making it easier to deform during bending, more tough, and less prone to breakage.

[0124] Based on the above technical solution, during the fabrication of the circuit board 300, the detection circuit 200 proposed in the embodiments of this application can be fabricated simultaneously without changing the fabrication process, so that the final circuit board 300 directly includes the detection circuit 200, thereby reducing the fabrication difficulty.

[0125] Furthermore, this application also proposes a display substrate, the structure of which is similar to that of the circuit substrate mentioned in the previous embodiments. The display substrate includes: a wiring area 310, on the first surface of which N metal traces 311 are arranged, where N is greater than 1; a first structural layer 330, fixedly connected to the first ends 3111 of M of the N metal traces 311, where M is less than or equal to N; a bending area 320 extending along a first direction and overlapping with the first portion of the wiring area 310, the bending area 320 being made of a flexible material for bending the first portion along a second direction; a second structural layer 340, fixedly connected to the second ends 3112 of the bent M metal traces; and any of the detection circuits 200 proposed in this application.

[0126] In some possible embodiments, the bending region 320 may include a flexible metal material, which can be understood as the flexible metal layer in the foregoing embodiments.

[0127] In some possible embodiments, the above-mentioned wiring fixing connection method can be welding, bonding, crimping, or other alternative fixing connection methods.

[0128] In some possible embodiments, the first structural layer 330 and the second structural layer 340 can also be understood as the panel (PNL) layer of the display substrate. The PNL layer integrates the main functional components of the display panel, such as the GOA (Graphical Object Assembly). The wiring area 310 consists of metal traces led out from the PNL layer, such as GOA traces, and traces used to input relevant signals to the GOA. When the bending area 320 is in the unfolded state, the first structural layer 330 and the second structural layer 340 can be located at the same level.

[0129] It should be understood that, due to the introduction of the detection circuit 200, when a display panel experiences a display abnormality, the connection ports of the two dumb wires connected to the detection circuit 200 can be used to test whether the loop formed by the two dumb wires and the connecting traces between them is conductive. If it is not conductive, it indicates that the current display abnormality may be caused by at least one metal trace located in the bending area being broken due to panel bending; if it is conductive, it indicates that the current display abnormality may not be caused by panel bending operation.

[0130] This application also provides a display screen, which includes the display panel described in the above embodiments. Furthermore, this application also provides an electronic device that includes the display screen.

[0131] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0132] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0133] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0134] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0135] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0136] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0137] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A detection circuit, characterized in that, An application is made to a display substrate, the display substrate including a trace area and a bending area. The first surface of the trace area is provided with N metal traces, where N is greater than 1. The first ends of M of the N metal traces are connected to a first structural layer of the display substrate, where M is less than or equal to N. The bending area extends along a first direction and overlaps with a first portion of the trace area. The bending area is made of a flexible material and is used to bend the first portion along a second direction to connect the second ends of the M metal traces to a second structural layer of the display substrate. The detection circuit includes: The first dummy line is distributed on the first side of the N metal traces and extends along the second direction; The second dummy line is distributed on the second side of the N metal traces and extends along the second direction, with the first side and the second side opposite to each other; The first trace is located within the coverage area of ​​the bending area. The first trace is connected to the first dummy line and the second dummy line respectively, so as to pass through the N metal traces. The third dummy line is adjacent to the first dummy line and extends along the second direction; The fourth dummy line is adjacent to the second dummy line and extends along the second direction; The second trace is located within the coverage area of ​​the bending area. The second trace is connected to the third dummy trace and the fourth dummy trace respectively, so as to pass through the N metal traces. A first via is disposed in the routing area, and the first via is used to connect the first node of the first dummy line to the first node of the first routing line. A second via is provided in the routing area, and the second via is used to connect the first node of the second dummy wire to the second node of the first routing wire. A third via is provided in the routing area, and the third via is used to connect the first node of the third dummy line to the first node of the second routing line. A fourth via is provided in the routing area, and the fourth via is used to connect the first node of the fourth dummy line to the second node of the second routing line; Wherein, when the trace area is in a bent state, the distance between the end face of the first trace and the intersection between the bent area and the first structural layer is less than or equal to a first preset distance, and the projection of the first trace and the top edge of the bent area in a third direction overlaps; the distance between the second trace and the end face of the intersection between the bent area and the second structural layer is less than or equal to a second preset distance, and the projection of the second trace and the bottom edge of the bent area in a third direction overlaps; the third direction is perpendicular to the display substrate. The second node of the first dummy wire is used to connect to the first end of the test equipment, and the second node of the second dummy wire is used to connect to the second end of the test equipment. Alternatively, the second node of the third dummy wire is used to connect to the first end of the test equipment, and the second node of the fourth dummy wire is used to connect to the second end of the test equipment. The test equipment is used to determine whether there is a broken metal trace among the N metal traces by detecting the continuity of the loop in which the first trace or the second trace is located, and to determine the location of the broken metal trace near the top or bottom edge of the bending area.

2. The detection circuit according to claim 1, characterized in that, The first trace and the second trace are located in the bottom shielding metal BSM layer of the display substrate, and the vertical distance between the BSM layer and the first surface is greater than 0.

3. The detection circuit according to claim 2, characterized in that, The first via, the second via, the third via, and the fourth via are located outside the bending area.

4. The detection circuit according to claim 1, characterized in that, The second node of the first dummy line, the second node of the second dummy line, the second node of the third dummy line, and the second node of the fourth dummy line are located outside the bending zone.

5. The detection circuit according to claim 4, characterized in that, The display substrate is connected to the first circuit board, and the second node of the first dumb wire, the second node of the second dumb wire, the second node of the third dumb wire, and the second node of the fourth dumb wire are soldered to the first circuit board.

6. The detection circuit according to any one of claims 1 to 5, characterized in that, Each of the M metal traces is divided into multiple sub-metal traces, which are located in the bending area. The material and geometric parameters of at least one of the first dummy line, the second dummy line, the third dummy line, the fourth dummy line, the first trace, and the second trace are the same as those of the sub-metal traces.

7. A display substrate, characterized in that, The display substrate includes: A routing area, wherein N metal traces are arranged on the first surface of the routing area, and N is greater than 1; The first structural layer is fixedly connected to the first ends of M metal traces out of the N metal traces, wherein M is less than or equal to N; The bending area extends along a first direction and overlaps with a first part of the wiring area. The bending area is made of a flexible material and is used to bend the first part along a second direction. The second structural layer is fixedly connected to the second end of the bent M metal traces; The detection circuit as described in any one of claims 1 to 6.

8. A display screen, characterized in that, The display screen includes the display substrate as described in claim 7.

9. An electronic device, characterized in that, The electronic device includes the display screen as described in claim 8.

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