A method for integrating photovoltaic cells with a circuit board and a photovoltaic power generation module thereof.

Abstract

This invention discloses a method for integrating photovoltaic cells with a circuit board and the fabricated photovoltaic power generation module. The method employs a composite material-based electrical connection to connect the lower electrode of the photovoltaic cell to the circuit pads. The composite material has a three-layer structure: metal-POE film-metal. Because the metal used is a series of conductive metals and alloys ranging from 1 to 100 micrometers in thickness, such as copper foil, aluminum, silver, and gold, it possesses excellent flexibility. Furthermore, due to the metal connection, its conductivity is excellent, and the connection strength is extremely high. This meets the requirements for flexible power systems in subsequent processes or applications.

Description

Technical Field

[0001] This invention belongs to the field of power supply technology, and particularly relates to a method for integrating and connecting photovoltaic cells with a circuit board and the photovoltaic power generation module prepared therefrom. Background Technology

[0002] In micro-photovoltaic systems, to achieve the electrical and structural connection between photovoltaic solar cells and management circuits, the photovoltaic cells need to be soldered onto flexible circuit boards. Currently, there are two main methods. The first is the method using interconnect strips, but because the devices and circuits are completely separate, the integration density is very low. The second method uses conductive adhesives or conductive silver paste to connect the photovoltaic solar cells and management circuits, achieving electrical and mechanical interconnection. While this method improves integration density, the conductivity, thickness, and flexibility of the conductive adhesive materials and processes are somewhat limited. Especially in flexible power generation systems that require large currents, the conductivity of the connections is highly sensitive. Therefore, a more advanced connection method is needed. Summary of the Invention

[0003] To address the technical problems existing in prior art, this invention provides a method for integrating photovoltaic cells with a circuit board and a fabricated photovoltaic power generation module. The method employs a composite material-based electrical connection to connect the lower electrode of the photovoltaic cell to the circuit pads. The composite material has a three-layer structure: metal-POE film-metal. Because the metal used is a series of conductive metals and alloys ranging from 1 to 100 micrometers in thickness, such as copper foil, aluminum, silver, and gold, it possesses excellent flexibility. Furthermore, due to the metal connection, its conductivity is excellent, and the connection strength is extremely high. This meets the requirements for flexible power systems in subsequent processes or applications.

[0004] The technical solution adopted in this invention is: a method for integrating and connecting photovoltaic cells with a circuit board, comprising the following steps:

[0005] (1) Ultrasonic cleaning of photovoltaic cells and circuit boards for more than 5 minutes to remove grease and dust;

[0006] (2) Preparation of three-layer composite material circuit board: The three-layer composite material structure consists of metal foil, POE film and metal foil from bottom to top. The POE film is long and strip-shaped. At least one pair of metal foils are arranged alternately along the length of the POE film. Each pair of metal foils passes through the POE film and is connected to each other. The outer edges of the metal foils are located inside the POE film. The cleaned circuit board is taken out and the three-layer composite material is placed on the circuit board of the same size as the POE film. The hot press is turned on and the circuit board with the three-layer composite material is placed in the hot press. After hot pressing, it is taken out.

[0007] (3) The lower surfaces of the cleaned photovoltaic cells are attached to the metal foil on the three-layer composite material structure of the three-layer composite material-circuit board. POE film and ETFE film are sequentially laid on the upper surface of the photovoltaic cells. They are then placed together in a laminator for lamination to obtain a photovoltaic power generation module.

[0008] In step (2), hot pressing is performed at 100℃-150℃ for 10min-20min.

[0009] In step (3), lamination is performed at a temperature of 130-150℃, a pressure of 1-1.5MPa, and a time of 0.5-1h.

[0010] In step (2), the metal foil in the three-layer composite material structure has a thickness of 1-100 micrometers and a length of 1-50 millimeters; the POE film has a thickness of 1-100 micrometers and a length and width of 1-100 millimeters.

[0011] The circuit board is a flexible circuit board, using an FPC circuit board, with a temperature resistance of over 240℃; the photovoltaic cell is a flexible photovoltaic cell, including flexible and bendable III-V photovoltaic cells, ultra-thin silicon solar cells, copper indium gallium selenide solar cells, and perovskite solar cells, with a cell area of ​​1mm². 2 -60cm 2 .

[0012] In step (2), an object with a flat surface and a certain weight that will not damage the hot press is used to press it.

[0013] Each pair of metal foils passes through the POE film and connects with each other to form a "[" shape.

[0014] The metal foil is a conductive metal or alloy of copper, aluminum, silver, gold, etc.

[0015] The photovoltaic power generation module is prepared by the above method.

[0016] The advantages and positive effects of this invention are:

[0017] 1. The battery lower electrode is connected to the circuit pad using composite material-based electrical connection technology, which has excellent conductivity, high connection strength, good flexibility, and high temperature resistance.

[0018] 2. Using POE film to cover the circuit board to connect the two metal foil layers makes it easy to achieve uniform thickness and even stress distribution. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the electrical connection between the flexible photovoltaic cell and the FPC circuit board composite material structure of the present invention;

[0020] Figure 2This is an enlarged schematic diagram of the composite material structure layer of the present invention.

[0021] In the figure, 1-encapsulation layer; 101-ETFE film; 102-POE film; 2-photovoltaic cell; 201-top electrode of photovoltaic cell; 202-functional layer of photovoltaic cell; 203-bottom electrode of photovoltaic cell; 3-composite material structural layer; 301-ultra-thin metal foil; 302-POE film; 4-FPC circuit board. Detailed Implementation

[0022] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0023] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0024] Furthermore, the terms “first”, “second”, etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0025] Therefore, features specified with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0026] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0027] The electrical devices, controllers, etc., described in this invention are all conventional setups, and the electrical connections are also conventional connections.

[0028] like Figure 1-2As shown, the method for integrating photovoltaic cells with a circuit board according to the present invention includes the following steps:

[0029] (1) Ultrasonic cleaning of photovoltaic cell 2 and circuit board 4 for more than 5 minutes to remove grease and dust;

[0030] (2) Preparation of three-layer composite material circuit board: The three-layer composite material structure consists of metal foil 301, POE film 302 and metal foil 301 from bottom to top. The POE film 302 is long and strip-shaped. At least one pair of metal foils 301 are arranged alternately along the length of the POE film 302. Each pair of metal foils 301 passes through the POE film 302 and is connected to each other. The outer edges of the metal foils are located inside the POE film. The cleaned circuit board 4 is taken out and the three-layer composite material is placed on the circuit board 4, which is the same size as the POE film. The hot press is turned on and the circuit board 4 with the three-layer composite material is placed in the hot press. After the hot pressing is completed, it is taken out.

[0031] (3) The lower surfaces of the cleaned photovoltaic cells 2 are attached to the metal foil 301 on the three-layer composite material structure of the three-layer composite material-circuit board. POE film 302 and ETFE film 101 are sequentially laid on the upper surface of the photovoltaic cells 2 to form an encapsulation layer 1. They are then placed together in a laminator for lamination to obtain a photovoltaic power generation module.

[0032] In step (2), hot pressing is performed at 100℃-150℃ for 10min-20min.

[0033] In step (3), lamination is performed at a temperature of 130-150℃, a pressure of 1-1.5MPa, and a time of 0.5-1h.

[0034] In step (2), the metal 301 in the three-layer composite structure has a thickness of 1-100 micrometers and a length of 1-50 millimeters; the POE film 302 has a thickness of 1-100 micrometers and a length and width of 1-100 millimeters.

[0035] The circuit board 4 is a flexible circuit board, using an FPC circuit board, with a temperature resistance of over 240℃; the photovoltaic cell is a flexible photovoltaic cell, including flexible and bendable III-V photovoltaic cells, ultra-thin silicon solar cells, copper indium gallium selenide solar cells, and perovskite solar cells, with a cell area of ​​1mm². 2 -60cm 2 .

[0036] In step (2), an object with a flat surface and a certain weight that will not damage the hot press is used to press it.

[0037] Each pair of metal foils 301 passes through the POE film 302 and is connected to each other to form a "[" shape.

[0038] The metal foil is a conductive metal or alloy of copper, aluminum, silver, gold, etc.

[0039] The photovoltaic power generation module is prepared by the above method.

[0040] To further understand the invention's content, features, and effects, the following embodiments are provided, and detailed descriptions are given below in conjunction with the accompanying drawings:

[0041] To achieve the composite material structure connection process, it is necessary to simultaneously bond the composite material metal foil structure to the lower electrode of the photovoltaic cell and the pad of the FPC circuit board. The thickness of the metal foil structure in the composite material layer is 1 to 100 micrometers, and the length is 1 to 50 millimeters; the POE film has a thickness of 1 to 100 micrometers and a length and width of 1 to 100 millimeters.

[0042] The photovoltaic cells used are flexible and bendable solar cells, including III-V group photovoltaic cells, ultra-thin silicon solar cells, copper indium gallium selenide solar cells, and perovskite solar cells. The lower electrode of the photovoltaic cell is a highly conductive metal layer.

[0043] The FPC circuit board used is made of high-temperature resistant material, with a temperature resistance of over 240 degrees Celsius. The solder pads on the circuit are made of copper, with an area slightly larger than that of the photovoltaic cell, and the boundary extends outward by 0.01-2mm.

[0044] The specific manufacturing steps are as follows:

[0045] (1) Place the photovoltaic cells and circuit board in acetone for ultrasonic cleaning for more than 5 minutes to remove grease and dust;

[0046] (2) Prepare a three-layer composite material structure according to the circuit board size: metal foil-POE film-metal foil (metal foil includes but is not limited to copper foil, aluminum, silver, gold and other conductive metals and alloys). The thickness of the metal foil structure is 1 to 100 micrometers and the length is 1 to 50 millimeters. The POE film is 1 to 100 micrometers and the length and width are both 1 to 100 millimeters. The three-layer composite material structure consists of metal foil, POE film and metal foil from bottom to top. The two metal foils are connected to each other through the film. Take out the cleaned circuit board and place the three-layer composite material on the circuit board.

[0047] (3) Open the hot press, place the circuit board with the three-layer composite material inside the hot press, and press it with a series of objects such as metal plates that will not damage the hot press and have a flat surface and a certain weight. Set the hot press to a temperature of 100℃-150℃ and a time of 10min-20min for hot pressing. After hot pressing is completed, take it out.

[0048] (4) The cleaned photovoltaic cells are mounted on the three-layer composite material structure of the circuit board and then laminated and encapsulated. POE film and ETFE film are sequentially laid on the upper surface of the flexible photovoltaic cells and then placed together in a laminator for lamination: lamination is performed at a temperature of 130-150℃, a pressure of 1-1.5MPa, and a time of 0.5-1h. After lamination, the cells are removed to obtain a flexible photovoltaic power generation module.

[0049] Example 1

[0050] (1) Place the rigid photovoltaic cell and PCB circuit board that meet the requirements into acetone for ultrasonic cleaning for 5 minutes to remove grease and dust;

[0051] (2) Prepare a three-layer composite material structure according to the circuit board size: metal foil - POE film - metal foil (metal foil includes, but is not limited to, copper foil, aluminum, silver, gold, and other conductive metals and alloys). The metal foil structure is 60 micrometers thick and 20 millimeters long. The POE film is 40 micrometers thick and 80 millimeters long and wide. The three-layer composite material structure, from bottom to top, consists of metal foil, POE film, and metal foil, with the two metal foils connected to each other through the film. Take out the cleaned circuit board and place the three-layer composite material on the circuit board.

[0052] (3) Open the hot press, place the circuit board containing the three-layer composite material into the hot press, and press it with a series of objects such as metal plates that will not damage the hot press and have a flat surface and a certain weight. Set the hot press to a temperature of 130℃ and a time of 15 minutes for hot pressing. After hot pressing is completed, take it out.

[0053] (4) The cleaned photovoltaic cells are mounted on the three-layer composite material structure of the circuit board and then laminated and encapsulated. POE film and ETFE film are sequentially laid on the upper surface of the flexible photovoltaic cells and then laminated together in a laminator: lamination is performed at a temperature of 150℃, a pressure of 1.5MPa, and a time of -1h. After lamination, the cells are removed to obtain a flexible photovoltaic power generation module.

[0054] Example 2

[0055] (1) Place the flexible photovoltaic cell and PCB circuit board that meet the requirements into acetone for ultrasonic cleaning for 5 minutes to remove grease and dust;

[0056] (2) Prepare a three-layer composite material structure according to the circuit board size: metal foil - POE film - metal foil (metal foil includes, but is not limited to, copper foil, aluminum, silver, gold, and other conductive metals). The metal foil structure is 60 micrometers thick and 20 millimeters long. The POE film is 40 micrometers thick and 80 millimeters long and wide. The three-layer composite material structure, from bottom to top, consists of metal foil, POE film, and metal foil, with the two metal foils connected to each other through the film. Take out the cleaned circuit board and place the three-layer composite material on the circuit board.

[0057] (3) Open the hot press, place the circuit board containing the three-layer composite material into the hot press, and press it with a series of objects such as metal plates that will not damage the hot press and have a flat surface and a certain weight. Set the hot press to a temperature of 130℃ and a time of 15 minutes for hot pressing. After hot pressing is completed, take it out.

[0058] (4) The cleaned photovoltaic cells are mounted on the three-layer composite material structure of the circuit board and then laminated and encapsulated. POE film and ETFE film are sequentially laid on the upper surface of the flexible photovoltaic cells and then laminated together in a laminator: lamination is performed at a temperature of 150℃, a pressure of 1.5MPa, and a time of 1h. After lamination, the cells are removed to obtain a flexible photovoltaic power generation module.

[0059] Example 3

[0060] (1) Place the rigid photovoltaic cell and FPC circuit board that meet the requirements into acetone for ultrasonic cleaning for 5 minutes to remove grease and dust;

[0061] (2) Prepare a three-layer composite material structure according to the circuit board size: metal foil - POE film - metal foil (metal foil includes, but is not limited to, copper foil, aluminum, silver, gold, and other conductive metals). The metal foil structure is 60 micrometers thick and 20 millimeters long. The POE film is 40 micrometers thick and 80 millimeters long and wide. The three-layer composite material structure, from bottom to top, consists of metal foil, POE film, and metal foil, with the two metal foils connected to each other through the film. Take out the cleaned circuit board and place the three-layer composite material on the circuit board.

[0062] (3) Open the hot press, place the circuit board containing the three-layer composite material into the hot press, and press it with a series of objects such as metal plates that will not damage the hot press and have a flat surface and a certain weight. Set the hot press to a temperature of 130℃ and a time of 15 minutes for hot pressing. After hot pressing is completed, take it out.

[0063] (4) The cleaned photovoltaic cells are mounted on the three-layer composite material structure of the circuit board and then laminated and encapsulated. POE film and ETFE film are sequentially laid on the upper surface of the flexible photovoltaic cells and then laminated together in a laminator: lamination is performed at a temperature of 150℃, a pressure of 1.5MPa, and a time of 1h. After lamination, the cells are removed to obtain a flexible photovoltaic power generation module.

[0064] Example 4

[0065] (1) Place the flexible photovoltaic cells and FPC circuit boards that meet the requirements into acetone for ultrasonic cleaning for 5 minutes to remove grease and dust;

[0066] (2) Prepare a three-layer composite material structure according to the circuit board size: metal foil - POE film - metal foil (metal foil includes, but is not limited to, copper foil, aluminum, silver, gold, and other conductive metals). The metal foil structure is 60 micrometers thick and 20 millimeters long. The POE film is 40 micrometers thick and 80 millimeters long and wide. The three-layer composite material structure, from bottom to top, consists of metal foil, POE film, and metal foil, with the two metal foils connected to each other through the film. Take out the cleaned circuit board and place the three-layer composite material on the circuit board.

[0067] (3) Open the hot press, place the circuit board containing the three-layer composite material into the hot press, and press it with a series of objects such as metal plates that will not damage the hot press and have a flat surface and a certain weight. Set the hot press to a temperature of 130℃ and a time of 15 minutes for hot pressing. After hot pressing is completed, take it out.

[0068] (4) The cleaned photovoltaic cells are mounted on the three-layer composite material structure of the circuit board and then laminated and encapsulated. POE film and ETFE film are sequentially laid on the upper surface of the flexible photovoltaic cells and then laminated together in a laminator: lamination is performed at a temperature of 150℃, a pressure of 1.5MPa, and a time of 1h. After lamination, the cells are removed to obtain a flexible photovoltaic power generation module.

[0069] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for integrating and connecting a photovoltaic cell with a circuit board, characterized in that, Includes the following steps: (1) Ultrasonic cleaning of photovoltaic cells and circuit boards for more than 5 minutes to remove grease and dust; (2) Preparation of three-layer composite material circuit board: The three-layer composite material structure consists of metal foil, POE film and metal foil from bottom to top. The POE film is long and strip-shaped. At least one pair of metal foils are arranged alternately along the length of the POE film. Each pair of metal foils passes through the POE film and is connected to each other. The outer edges of the metal foils are located inside the POE film. The cleaned circuit board is taken out and the three-layer composite material is placed on the circuit board of the same size as the POE film. The hot press is turned on and the circuit board with the three-layer composite material is placed in the hot press. After hot pressing, it is taken out. (3) The lower surfaces of the cleaned photovoltaic cells are attached to the metal foil on the three-layer composite material structure of the three-layer composite material-circuit board. POE film and ETFE film are sequentially laid on the upper surface of the photovoltaic cells. They are then placed together in a laminator for lamination to obtain a photovoltaic power generation module.

2. The method for integrating and connecting photovoltaic cells and circuit boards according to claim 1, characterized in that, In step (2), hot pressing is performed at 100℃-150℃ for 10min-20min.

3. The method for integrating and connecting photovoltaic cells and circuit boards according to claim 1, characterized in that, In step (3), lamination is performed at a temperature of 130-150℃, a pressure of 1-1.5MPa, and a time of 0.5-1h.

4. The method for integrating and connecting photovoltaic cells and circuit boards according to claim 1, characterized in that, In step (2), the metal foil in the three-layer composite material structure has a thickness of 1-100 micrometers and a length of 1-50 millimeters; the POE film has a thickness of 1-100 micrometers and a length and width of 1-100 millimeters.

5. The method for integrating and connecting photovoltaic cells and circuit boards according to claim 1, characterized in that, The circuit board is a flexible circuit board, using an FPC circuit board, with a temperature resistance of over 240℃; the photovoltaic cell is a flexible photovoltaic cell, including flexible and bendable III-V photovoltaic cells, ultra-thin silicon solar cells, copper indium gallium selenide solar cells, and perovskite solar cells, with a cell area of ​​1mm². 2 -60cm 2 .

6. The method for integrating and connecting photovoltaic cells and circuit boards according to claim 2, characterized in that, In step (2), an object with a flat surface and a certain weight that will not damage the hot press is used to press it.

7. The method for integrating and connecting photovoltaic cells and circuit boards according to claim 1, characterized in that, Each pair of metal foils passes through the POE film and connects with each other to form a "[" shape.

8. The method for integrating and connecting photovoltaic cells and circuit boards according to claim 1, characterized in that, The metal foil is a conductive metal or alloy of copper, aluminum, silver, gold, etc.

9. A photovoltaic power generation module prepared by the method according to any one of claims 1-7.

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