A SMD lamp bead and lamp bead packaging process

Abstract

This invention discloses a surface-mount LED chip and its encapsulation process, comprising the following steps: S1: First, complete the pre-processing of chip mounting and soldering, fixing the chip and mounting it on a carrier tray; S2: Store epoxy resin encapsulant inside a glue box, heat and insulate it to reduce viscosity and remove internal air bubbles, completing the pretreatment; S3: Place the carrier tray with the surface-mount LED chip on it at the input end of a first conveyor belt, and use the first conveyor belt to transfer the carrier tray from the input end to the middle of the first conveyor belt, preheating the carrier tray and the LED chip on it; the air bubbles will be more easily removed from it, and no air bubbles will be generated after the epoxy resin encapsulant is applied. In addition, the setting of the vibrating rod can vibrate the epoxy resin encapsulant stored inside the glue box, causing the internal air bubbles to be quickly removed, avoiding the subsequent application of air bubbles to the surface of the LED chip during dispensing, which would affect the quality and optical performance of the subsequent LED chip.

Description

Technical Field

[0001] The invention belongs to the technical field of SMD lamp beads, and in particular relates to a SMD lamp bead and a lamp bead packaging process. Background Art

[0002] In recent years, with the rapid development of new energy vehicles, car lighting design has become one of the prominent selling points, and SMD lamp beads are a type of LED lamp beads widely used in lighting and display technology and are widely used in the automotive field.

[0003] The packaging process of SMD LED involves multiple precision steps, such as chip installation, welding, packaging coating, curing, heat dissipation design, optical optimization, etc. The main purpose is to protect the LED chip, provide good heat dissipation, ensure the stability of electrical connections, and maintain optical performance.

[0004] In the encapsulation coating step, epoxy resin, silicone or photosensitive adhesive is usually coated on the surface of the LED chip by dripping, spraying or dipping to protect it and optimize the light effect. The drip coating process can accurately control the dripping amount to ensure the uniformity and thickness of the encapsulation adhesive layer, and is used in small batch production or situations with high material precision requirements.

[0005] In order to ensure the quality of the finished package of SMD lamp beads, it is necessary to ensure that the LED lamp beads have good light transmittance and optical properties after encapsulation and coating. However, due to the high viscosity of epoxy resin encapsulation glue, it is easy to cause the generation of bubbles, especially during the mixing process. If the mixing is not sufficient or the viscosity of the epoxy resin is too high, bubbles may be trapped in the resin, thereby affecting the quality and optical properties of the SMD lamp beads after encapsulation. Summary of the invention

[0006] The purpose of the present invention is to provide a SMD lamp bead and a lamp bead packaging process to solve the technical problem in the prior art that due to the high viscosity of the epoxy resin packaging glue, it is difficult to expel the bubbles inside the SMD lamp bead when dripping it, resulting in poor packaging effect and affecting product quality and optical performance.

[0007] The purpose of the present invention can be achieved through the following technical solutions:

[0008] A chip lamp bead and a lamp bead packaging process, comprising the following steps:

[0009] S1: First, complete the pre-process of chip installation and chip welding to fix and mount it on the carrier;

[0010] S2: Storing epoxy resin encapsulation glue inside the glue box, heating and keeping it warm to reduce viscosity and remove internal bubbles, thus completing pretreatment;

[0011] S3: placing the carrier plate with the SMD lamp beads on the input end of the first conveyor belt, and using the first conveyor belt to transfer the carrier plate from the input end to the middle of the first conveyor belt to preheat the carrier plate and the lamp beads on the carrier plate;

[0012] S4: The glue injection tube applies epoxy resin encapsulation glue drops on the surface of the lamp beads passing through one by one during the up and down movement, completing the encapsulation and coating steps of the SMD lamp beads;

[0013] S5: using the first conveyor belt to transfer the packaged and coated carrier to the output end of the first conveyor belt, cooling the packaged and coated lamp beads to increase the viscosity of the epoxy resin packaging glue applied thereto;

[0014] S6: Complete the subsequent UV curing, heat dissipation design, and optical optimization steps to complete the packaging of the SMD lamp beads.

[0015] Preferably, in the step S2, the epoxy resin is injected into the glue box for storage through the glue injection pipe, and the hot air or hot water is passed into one of the closed spaces formed by the guide plate and the side wall of the glue box through the air inlet pipe, and then passed into another closed space formed by the guide plate and the side wall of the glue box under the action of the circulation pipe, and finally discharged from the air outlet pipe to complete the cycle;

[0016] The guide plate is arranged in a multi-section folded wave shape, and the guide plate is utilized to exchange heat with the epoxy resin packaging glue, and the guide plate is gathered in the middle of the bottom of the glue box.

[0017] Preferably, in the step S2, the epoxy resin encapsulating glue stored in the glue box is vibrated by a vibrating rod so that the bubbles inside the epoxy resin encapsulating glue can be quickly released.

[0018] Preferably, in the step S3, hot air is evenly transported from the first air outlet to an upper position between the input end and the middle of the first conveyor belt through the first air pipe, and the carrier transferred thereon is preheated at this position.

[0019] Preferably, in the step S4, when the glue dispensing tube moves downward, the clamping plates are forced to move away from each other, so that the glue dispensing tube extends under the clamping plates to dispense the SMD lamp beads;

[0020] When the dispensing tube moves upward, the clamp is closed again under the action of the spring, causing the clamp to cut off the epoxy resin encapsulation glue at the output end of the dispensing tube.

[0021] Preferably, in the step S5, cold air is evenly transported from the second air outlet to an upper position between the middle of the first conveyor belt and the output end through the second air pipe, and the carrier transferred thereon is cooled at this position, so that the temperature of the epoxy resin encapsulation glue is quickly reduced and its viscosity is increased.

[0022] Preferably, the first air vents have the same shape and spacing as the protrusions, and the protrusions are intermittently inserted into the corresponding first air vents, so that when the first conveyor belt rotates, the second conveyor belt is synchronously carried to rotate.

[0023] Preferably, the bottom baffle of the glue box cooperates with the clamping plate and the fixing plate to form an internal space, and the hot air inside the first air pipe is transported to the internal space through the air distribution pipe, so as to maintain the temperature of the internal space and further maintain the temperature of the epoxy resin inside the glue injection pipe.

[0024] Beneficial effects of the present invention:

[0025] Before the lamp bead is packaged and coated, the present invention injects epoxy resin into the glue box through the glue injection tube for storage, and then passes hot air or hot water into one of the closed spaces formed by the guide plate and the side wall of the glue box through the air inlet pipe, and then under the action of the circulation pipe, passes into another one of the closed spaces formed by the guide plate and the side wall of the glue box, and finally is discharged from the air outlet pipe to complete the cycle. During this process, the epoxy resin packaging glue exchanges heat with the guide plate, thereby increasing its temperature and reducing its viscosity, and the bubbles therein can be more easily escaped from it. After the epoxy resin packaging glue is dripped, no bubbles will be generated. In addition, the epoxy resin packaging glue stored in the glue box can be vibrated by the setting of the vibrating rod, so that the bubbles inside it can be quickly escaped, thereby preventing the bubbles from being dripped on the surface of the lamp bead during subsequent glue dispensing by the glue dispensing tube, thereby affecting the quality and optical performance of the subsequent LED chip.

[0026] In the process of the glue dispensing tube moving up and down, when the glue dispensing tube moves down, due to the presence of the chamfer on the splint, the splints can be forced to move away from each other, so that the glue dispensing tube extends under the splint to drip the SMD lamp beads. When the glue dispensing tube moves up, since the outside of the splint is connected to the spring through the cooperation of the sliding rod, the circular plate and the limit plate, the splint will close again when the glue dispensing tube moves up, thereby causing the splint to cut off the epoxy resin packaging glue at the output end of the glue dispensing tube, avoiding the occurrence of wire drawing and affecting the packaging effect.

[0027] The setting of the first air pipe of the present invention can evenly transport hot air from the first air outlet to the upper position between the input end and the middle part of the frame. The carrier plate transferred at this position can be preheated in advance, and the effect of subsequently using the glue injection tube to drip-coat the SMD lamp beads is better, and the dripping effect will not be reduced due to the sudden contact between hot and cold. The setting of the second air pipe can evenly transport cold air from the second air outlet to the upper position between the output end and the middle part of the frame. The carrier plate transferred at this position can cool the SMD lamp beads after the epoxy resin encapsulation glue is dripped, so that the temperature of the epoxy resin encapsulation glue is quickly reduced, the viscosity is increased, and the curing is completed as soon as possible, thereby avoiding the epoxy resin encapsulation glue being unable to cover the SMD lamp beads due to high fluidity, affecting the packaging effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The present invention will be further described below in conjunction with the accompanying drawings.

[0029] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0030] Figure 2 is a cross-sectional view of the present invention in the length direction;

[0031] Figure 3 yes Figure 2 A partial enlarged view of the middle A;

[0032] Figure 4 is a cross-sectional view of the present invention in the width direction;

[0033] Figure 5 It is a schematic diagram of the structure of the guide plate in the present invention;

[0034] Figure 6 is an exploded view of the first conveyor belt and the second conveyor belt in the present invention;

[0035] In the figure: 1, frame; 101, first shaft; 102, second shaft; 103, first conveyor belt; 104, first air outlet; 105, second conveyor belt; 106, bump; 107, second air outlet; 108, first air pipe; 109, second air pipe; 2, fixed plate; 201, dispensing tube; 202, telescopic tube; 203, movable plate; 2031, blocking plate; 2032, movable slot; 204, electric push rod; 205, splint; 2051, chamfer; 2052, slide bar; 2053, round plate; 2054, spring; 2055, limit plate; 2056, slide groove; 206, air distribution pipe; 3, glue box; 301, glue hole; 302, baffle; 303, sealing plate; 304, guide plate; 305, air outlet pipe; 306, air inlet pipe; 307, circulation pipe; 308, glue injection pipe; 309, air pressure pipe; 310, vibrating rod. DETAILED DESCRIPTION

[0036] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] See also Figure 1 and Figure 6As shown, a SMD lamp bead and a lamp bead packaging process include a frame 1, which is composed of a horizontal plate and two vertical plates fixed on both sides of the horizontal plate; the first shaft rod 101 is rotatably connected to both ends of the frame 1; the first shaft rod 101 is rotatably connected to the first conveyor belt 103, and the first conveyor belt 103 is used to carry and transport a carrier plate with lamp beads; the first conveyor belt 103 is provided with uniformly distributed first air holes 104, and the first air holes 104 are in a straight groove structure; a first air pipe 108 connected to the inside of the frame 1 is arranged on the side of the frame 1, and the first air pipe 108 is connected to the side of the frame 1 close to the input end, and is used to transport hot air to the inside of the frame 1.

[0038] Please refer again Figure 6 As shown, the middle part of the frame 1 and the position near the output end are rotatably connected to the second shaft rod 102; the second shaft rod 102 is rotatably connected to the second conveyor belt 105; the outer surface of the second conveyor belt 105 is fixed with evenly distributed protrusions 106, and the protrusions 106 fit with the first air vents 104; the protrusions 106 are provided with penetrating second air vents 107, and the arrangement spacing of the second air vents 107 and the first air vents 104 is the same; a second air pipe 109 connected to the inside of the frame 1 is provided on the side of the frame 1, and the second air pipe 109 is connected to the side of the frame 1 near the output end, and is used to transport cold air to the inside of the frame 1.

[0039] Please refer again Figure 3 , Figure 4 as well as Figure 5 As shown, a symmetrically arranged fixed plate 2 is fixedly connected to the middle of the upper vertical plate of the frame 1, and the fixed plate 2 presents an inverted L-shaped structure; a movable plate 203 is arranged between the fixed plates 2; and a plurality of dispensing tubes 201 are fixedly connected to the movable plate 203, which are used to carry the dispensing tubes 201 and move up and down to dispense glue and package the lamp beads.

[0040] Please refer again Figure 4 As shown, a movable groove 2032 is opened on the fixed plate 2 on one side, and the movable groove 2032 is composed of two parts: a groove body penetrating the fixed plate 2 and a groove body recessed into the fixed plate 2; one end of the movable plate 203 close to the movable groove 2032 penetrates to the outside of the fixed plate 2; the movable plate 203 is fixedly connected with a blocking plate 2031 at a position corresponding to the middle of the movable groove 2032, and the movable plate 203 and the blocking plate 2031 are both slidably connected inside the movable groove 2032; an electric push rod 204 is arranged on the outside of the fixed plate 2, and the output end of the electric push rod 204 is connected to the movable plate 203.

[0041] Please refer again Figure 4 and Figure 5As shown, a glue box 3 is fixedly arranged above the fixed plate 2, and the glue box 3 is used to store epoxy resin; a glue hole 301 is opened in the middle of the bottom of the glue box 3 corresponding to the position of the glue dispensing tube 201; the upper end of the glue dispensing tube 201 is fixedly connected to a telescopic tube 202, and the upper end of the telescopic tube 202 is connected to the bottom of the glue box 3 and is connected to the corresponding glue hole 301.

[0042] Please refer again Figure 5 As shown, a symmetrically arranged guide plate 304 is fixed inside the glue box 3. The guide plate 304 is a multi-section curved wave-shaped structure and cooperates with the side wall of the glue box 3 to form two symmetrically arranged closed spaces. The guide plate 304 is used to concentrate the epoxy resin encapsulation glue in the middle of the bottom of the glue box 3.

[0043] Please refer again Figure 4 and Figure 5 As shown, an air inlet pipe 306 and an air outlet pipe 305 are fixedly connected to the side of the rubber box 3 at positions corresponding to the two closed spaces formed by the guide plate 304 and the side wall of the rubber box 3, and a circulation pipe 307 is fixedly connected to one end of the rubber box 3 away from the air inlet pipe 306 and the air outlet pipe 305. The circulation pipe 307 is connected to the two closed spaces formed by the guide plate 304 and the side wall of the rubber box 3 at the head and tail, respectively.

[0044] Please refer again Figure 4 As shown, a sealing plate 303 is provided on the top of the glue box 3, and a connected glue injection tube 308 and an air pressure tube 309 are fixedly connected to the sealing plate 303. The glue injection tube 308 is used to add epoxy resin packaging glue into the glue box 3, and the air pressure tube 309 is used to connect a pressure source device, such as an air compressor, to facilitate the glue dispensing tube 201 to discharge glue.

[0045] Please refer again Figure 3 and Figure 5 As shown, symmetrically arranged clamps 205 are provided inside the fixed plate 2 at positions corresponding to both sides of the dispensing tube 201; chamfers 2051 are provided at the upper corners of the sides where the clamps 205 are close to each other; sliding rods 2052 are fixedly connected at both ends of the clamps 205; sliding grooves 2056 are provided at positions of the fixed rods corresponding to the sliding rods 2052, and the sliding rods 2052 are slidably connected inside the sliding grooves 2056; circular plates 2053 are fixedly connected to the outer ends of the sliding rods 2052; limiting plates 2055 are fixedly connected to the positions of the fixed plate 2 corresponding to the outer sides of the circular plate 2053; springs 2054 are provided between the limiting plates 2055 and the circular plates 2053 corresponding to each other, and the two ends of the spring 2054 are respectively connected to the circular plate 2053 and the limiting plate 2055.

[0046] In order to facilitate understanding of the above technical solution of the present invention, the working principle or operation mode of the present invention in the actual process is described in detail below:

[0047] Place the carrier with the SMD lamp beads at the input end of the first conveyor belt 103, and use the first conveyor belt 103 to transfer the carrier to the middle of the first conveyor belt 103. At this point, the electric push rod 204 and the movable plate 203 are used to drive the glue injection tube 308 to move up and down. The glue injection tube 308 drips the epoxy resin encapsulation glue on the surface of the lamp beads one by one during the movement, completing the encapsulation and coating steps of the lamp beads, and then continue to use the first conveyor belt 103 to move the carrier to the output end of the first conveyor belt 103, and complete the subsequent encapsulation.

[0048] Among them, before the lamp bead is packaged and coated, epoxy resin is injected into the glue box 3 for storage through the glue injection tube 308, and then hot air or hot water is passed into one of the closed spaces formed by the guide plate 304 and the side wall of the glue box 3 through the air inlet pipe 306, and then, under the action of the circulation pipe 307, it is passed into another closed space formed by the guide plate 304 and the side wall of the glue box 3, and finally discharged from the air outlet pipe 305 to complete the cycle. During this process, the epoxy resin packaging glue exchanges heat with the guide plate 304, thereby increasing its temperature and reducing its viscosity, and the bubbles therein will be more easily escaped from it. After the epoxy resin packaging glue is dripped, no bubbles will be generated. In addition, the epoxy resin packaging glue stored in the glue box 3 can be vibrated by the setting of the vibrating rod 310, so that the bubbles inside it can be quickly escaped, thereby preventing the bubbles from being dripped on the surface of the lamp bead during the subsequent glue dispensing tube 201, thereby affecting the quality and optical performance of the subsequent LED chip.

[0049] It is worth noting here that: since the guide plate 304 is configured as a multi-stage folded wave shape, the heat exchange area of ​​the epoxy resin can be increased, thereby improving the heating efficiency and heat preservation effect of the epoxy resin.

[0050] Among them, in the process of the glue dispensing tube 201 moving up and down, when the glue dispensing tube 201 moves down, the tapered part at the lower end of the glue dispensing tube 201 cooperates with the chamfer 2051 on the splint 205, so that the splints 205 can be forced to move away from each other, so that the glue dispensing tube 201 extends to the bottom of the splint 205 to drip the SMD lamp beads. When the glue dispensing tube 201 moves up, since the outside of the splint 205 is connected to the spring 2054 through the cooperation of the slide rod 2052, the circular plate 2053 and the limit plate 2055, when the glue dispensing tube 201 moves up, the splint 205 will close again, thereby causing the splint 205 to cut off the epoxy resin packaging glue at the output end of the glue dispensing tube 201, avoiding wire drawing and affecting the packaging effect.

[0051] Among them, when the carrier carrying the SMD lamp beads is transferred on the first conveyor belt 103, the first air pipe 108 can be used to evenly transport hot air from the first air outlet 104 to the upper position between the input end and the middle of the frame 1. The carrier transferred at this position can be preheated in advance, and the effect of subsequently dripping the SMD lamp beads using the injection tube 308 will be better, and the dripping effect will not be reduced due to the sudden contact between hot and cold. When the SMD lamp beads continue to move toward the output end of the frame 1 with the cooperation of the carrier after dripping, the second air pipe 109 can be used to evenly transport cold air from the second air outlet 107 to the upper position between the output end and the middle of the frame 1. The carrier transferred at this position can cool the SMD lamp beads after the epoxy resin encapsulation glue is dripped, so that the temperature of the epoxy resin encapsulation glue is quickly reduced, its viscosity is increased, and the curing is completed as soon as possible, so as to avoid the epoxy resin encapsulation glue being unable to cover the SMD lamp beads due to high fluidity, thereby affecting the packaging effect.

[0052] It is worth noting here that: since the first air vents 104 and the bumps 106 have the same shape and the same spacing, and the bumps 106 are intermittently inserted into the corresponding first air vents 104, when the first conveyor belt 103 rotates, the second conveyor belt 105 can be rotated synchronously, and the second air vents 107 will not be blocked, which will affect the cooling effect of the SMD lamp beads after the coating is completed, thereby affecting the packaging effect.

[0053] Furthermore, since a baffle 302 is provided at the bottom of the glue box 3, an internal space can be formed in conjunction with the splint 205 and the fixed plate 2. At this time, the hot air inside the first air pipe 108 is transported to the internal space through the air distribution pipe 206 to maintain the temperature of the internal space. At this time, since the glue injection pipe 308 is provided in the internal space, the temperature of the epoxy resin inside the glue injection pipe 308 can always be maintained, and will not deteriorate after the shutdown operation, thereby affecting the packaging effect.

[0054] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0055] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A SMD lamp bead packaging process, characterized in that: The following steps are involved: S1: First, complete the pre-process of chip installation and chip welding to fix and mount it on the carrier; S2: storing epoxy resin encapsulation glue in the glue box (3), heating and keeping it warm to reduce viscosity and remove internal bubbles, thereby completing pretreatment; The guide plate (304) is configured to be a multi-segment folded wave shape, and the guide plate (304) is utilized to exchange heat with the epoxy resin encapsulation glue, and is gathered in the middle of the bottom of the glue box (3); The bottom baffle (302) of the glue box (3) cooperates with the clamping plate (205) and the fixing plate (2) to form an internal space, and the hot air inside the first air pipe (108) is transported to the internal space through the air distribution pipe (206), so as to maintain the temperature of the internal space, and further maintain the temperature of the epoxy resin inside the glue injection pipe (308); S3: placing a carrier plate carrying SMD lamp beads at the input end of the first conveyor belt (103), and using the first conveyor belt (103) to transfer the carrier plate from the input end to the middle of the first conveyor belt (103), so as to preheat the carrier plate and the SMD lamp beads on the carrier plate; The hot air is evenly transported from the first air outlet (104) to an upper position between the input end and the middle of the first conveyor belt (103) through the first air pipe (108), and the carrier transferred thereon is preheated at this position; S4: The glue injection tube (308) applies epoxy resin encapsulation glue drops on the surfaces of the lamp beads passing through one by one during the upward and downward movement, thereby completing the encapsulation and coating steps of the SMD lamp beads; S5: using the first conveyor belt (103) to transfer the packaged and coated carrier to the output end of the first conveyor belt (103), cooling the packaged and coated lamp beads to increase the viscosity of the epoxy resin packaging glue applied thereto; The cold air is evenly transported from the second air outlet (107) to the upper position between the middle of the first conveyor belt (103) and the output end through the second air pipe (109), and the carrier transferred thereon is cooled at this position, so that the temperature of the epoxy resin encapsulation glue is quickly reduced, thereby increasing its viscosity; The first air vents (104) and the protrusions (106) have the same shape and the same spacing, and the protrusions (106) are intermittently inserted into the corresponding first air vents (104), and when the first conveyor belt (103) rotates, the second conveyor belt (105) is synchronously rotated; S6: Complete the subsequent UV curing, heat dissipation design, and optical optimization steps to complete the packaging of the SMD lamp beads.

2. A SMD lamp bead packaging process according to claim 1, characterized in that: In step S2, epoxy resin is injected into the glue box (3) through the glue injection pipe (308), and hot air or hot water is introduced into one of the closed spaces formed by the guide plate (304) and the side wall of the glue box (3) through the air inlet pipe (306). Then, under the action of the circulation pipe (307), the hot air or hot water is introduced into another closed space formed by the guide plate (304) and the side wall of the glue box (3), and finally discharged from the air outlet pipe (305), completing the cycle.

3. A SMD lamp bead packaging process according to claim 1, characterized in that: In the step S2, the epoxy resin encapsulating glue stored in the glue box (3) is vibrated by a vibrating rod (310) so that bubbles inside the epoxy resin encapsulating glue are quickly released.

4. The SMD lamp bead packaging process according to claim 1, characterized in that: In the step S4, when the glue dispensing tube (201) moves downward, the tapered portion at the lower end of the glue dispensing tube (201) is used to force the clamping plates (205) to move away from each other, so that the glue dispensing tube (201) extends below the clamping plates (205) to perform drip coating on the SMD lamp beads; When the dispensing tube (201) moves upward, the clamping plate (205) is closed again under the action of the spring (2054), so that the clamping plate (205) cuts off the epoxy resin encapsulation glue at the output end of the dispensing tube (201).

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