Display panel, display device, and method for manufacturing display panel

Abstract

This application discloses a display panel, a display device, and a method for manufacturing the display panel. The display panel includes a substrate, an isolation layer, a light-emitting layer, a first electrode layer, an encapsulation layer, a conductive layer, and an antioxidant layer. An isolation opening formed by the isolation portion is used to house a light-emitting unit, enabling the display panel to emit light. The orthographic projection of the light-emitting unit onto the substrate is located within the orthographic projection of the first electrode onto the substrate; that is, the first electrode covers the light-emitting unit, serving as the electrode of the light-emitting unit. The encapsulation layer is disposed on the side of the first electrode layer facing away from the substrate. The orthographic projection of the conductive portion onto the substrate is located within the orthographic projection of the antioxidant portion onto the substrate. The conductive layer is located on the side of the first sublayer facing away from the substrate and includes a conductive portion. The conductive portion is electrically connected to the first electrode through a via, allowing the first electrode and the conductive portion to be arranged in parallel, reducing the overall resistance of the first electrode and the conductive portion, thereby reducing the power consumption of the first electrode and improving the display effect of the display panel.

Description

Technical Field

[0001] This application relates to the field of displays, specifically to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] With the rapid development of electronic devices, users have increasingly higher requirements for display effects, making the screen display of electronic devices receive more and more attention from the industry.

[0003] In related technologies, electronic devices use organic light-emitting diode (OLED) display panels for light emission and display. However, the metal layer in OLED display panels is prone to oxidation, which affects the performance of the display panel. Summary of the Invention

[0004] This application provides a display panel, a display device, and a method for manufacturing the display panel, aiming to improve the problem of easy oxidation of the metal layer.

[0005] A first aspect of this application provides a display panel, comprising: a substrate; an isolation layer located on the substrate, the isolation layer including an isolation portion and an isolation opening formed by the isolation portion; a light-emitting layer including light-emitting units located within each isolation opening; a first electrode layer located on the side of the light-emitting layer away from the substrate, the first electrode layer including a first electrode, the orthographic projection of the light-emitting unit on the substrate being located within the orthographic projection of the first electrode on the substrate; an encapsulation layer located on the side of the first electrode layer away from the substrate, the encapsulation layer including a first sublayer; a conductive layer located on the side of the first sublayer away from the substrate, the conductive layer including a conductive portion, the conductive portion being connected to a via of the first electrode; and an anti-oxidation layer located on the side of the conductive layer away from the substrate, the anti-oxidation layer including an anti-oxidation portion, the orthographic projection of the conductive portion on the substrate being located within the orthographic projection of the anti-oxidation portion on the substrate.

[0006] According to an embodiment of the first aspect of this application, the orthographic projection of the conductive portion onto the substrate is at least partially located within the orthographic projection of the insulating portion onto the substrate.

[0007] According to any of the foregoing embodiments of the first aspect of this application, the conductive portion is in the form of a mesh.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the conductive part includes a metallic conductive material or a transparent conductive material.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the encapsulation layer includes: a second sublayer located on the side of the first sublayer facing away from the substrate, and a conductive layer located between the first sublayer and the second sublayer.

[0010] According to any of the foregoing embodiments of the first aspect of this application, the first sublayer comprises an inorganic material.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the second sublayer comprises an organic material.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the encapsulation layer further includes a third sublayer located on the side of the second sublayer facing away from the substrate.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the third sublayer comprises an inorganic material.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the antioxidant layer comprises inorganic or organic materials.

[0015] According to any of the foregoing embodiments of the first aspect of this application, the antioxidant layer is made of the same material as the first sublayer.

[0016] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the conductive portion on the substrate and the orthographic projection of the antioxidant portion on the substrate coincide.

[0017] According to any of the foregoing embodiments of the first aspect of this application, the conductive portion includes a side facing the isolation opening, and the anti-oxidation portion is disposed covering at least a portion of the side of the conductive portion.

[0018] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a protective layer located between the first electrode layer and the encapsulation layer, wherein the protective layer covers at least a portion of the first electrode layer.

[0019] According to any of the foregoing embodiments of the first aspect of this application, the protective layer includes a light extraction material.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: an isolation structure located on a substrate and forming a plurality of isolation openings, the isolation structure including a first layer, each light-emitting unit and each first electrode located in the isolation opening, and the first electrode being electrically connected to the first layer.

[0021] According to any of the foregoing embodiments of the first aspect of this application, a plurality of mutually spaced first electrodes are all connected to conductive vias.

[0022] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure further includes a second layer located on the side of the first layer away from the substrate, wherein the orthographic projection of the first layer onto the substrate is located within the orthographic projection of the second layer onto the substrate.

[0023] According to any of the foregoing embodiments of the first aspect of this application, the isolation portion includes a pixel defining portion, and the isolation opening includes a pixel opening formed by the pixel defining portion.

[0024] According to any of the foregoing embodiments of the first aspect of this application, the isolation portion further includes an isolation structure located on the substrate. According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the isolation structure on the substrate and the orthographic projection of the conductive portion on the substrate are at least partially offset.

[0025] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure is located on the side of the isolation portion away from the substrate.

[0026] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the conductive portion on the substrate is located within the orthographic projection of the pixel limiting portion on the substrate.

[0027] According to any of the foregoing embodiments of the first aspect of this application, a clearance opening is provided on the isolation portion, and the isolation structure is located in the clearance opening.

[0028] An embodiment of the second aspect of this application provides a display device that includes a display panel of any of the above embodiments.

[0029] An embodiment of the third aspect of this application provides a method for manufacturing a display panel, comprising:

[0030] An isolation layer is prepared on a substrate, the isolation layer including an isolation portion and an isolation opening formed by the isolation portion;

[0031] A light-emitting layer is prepared on the side of the isolation layer away from the substrate, and the light-emitting layer includes light-emitting units located in each isolation opening;

[0032] A first electrode layer is prepared on the side of the light-emitting layer away from the substrate, and the orthogonal projection of the light-emitting unit onto the substrate is located within the orthogonal projection of the first electrode onto the substrate.

[0033] An encapsulation layer is prepared on the side of the first electrode layer away from the substrate, and the encapsulation layer includes a first sublayer;

[0034] A conductive layer is prepared on the side of the first sublayer away from the substrate. The conductive layer includes a conductive portion, which is connected to the first electrode via.

[0035] An antioxidant layer is prepared on the side of the conductive layer away from the substrate. The antioxidant layer includes an antioxidant portion, and the orthogonal projection of the conductive portion onto the substrate is located within the orthogonal projection of the antioxidant portion onto the substrate.

[0036] According to an embodiment of the third aspect of this application, after the step of fabricating the first electrode layer on the side of the light-emitting layer away from the substrate, the method further includes:

[0037] A first sub-material layer is prepared on the side of the first electrode layer away from the substrate, and the first sub-material layer is patterned to obtain the first sub-layer, the first sub-layer including vias;

[0038] A conductive layer is prepared on the side of the first sublayer facing away from the substrate. The conductive layer includes a conductive portion, which is connected to the first electrode through a via.

[0039] According to any of the foregoing embodiments of the third aspect of this application, after the step of preparing a conductive layer on the side of the first sublayer facing away from the substrate, the method further includes:

[0040] An antioxidant material layer is prepared on the side of the conductive layer away from the substrate. The antioxidant material layer and the conductive layer are etched sequentially using the same mask to form a conductive part and an antioxidant layer. The antioxidant layer includes an antioxidant part, and the orthogonal projection of the conductive part on the substrate and the orthogonal projection of the antioxidant part on the substrate coincide.

[0041] According to an embodiment of this application, the display panel includes a substrate, an isolation layer, a light-emitting layer, a first electrode layer, an encapsulation layer, a conductive layer, and an anti-oxidation layer. An isolation opening formed by the isolation portion is used to house a light-emitting unit, enabling the display panel to emit light. The orthogonal projection of the light-emitting unit onto the substrate is located within the orthogonal projection of the first electrode onto the substrate; that is, the first electrode covers the light-emitting unit, serving as the electrode of the light-emitting unit. The encapsulation layer is disposed on the side of the first electrode layer facing away from the substrate to encapsulate the first electrode layer and the light-emitting layer, reducing the possibility of water and oxygen intrusion and improving the lifespan of the display panel. The orthogonal projection of the conductive portion onto the substrate is located within the orthogonal projection of the anti-oxidation portion onto the substrate; that is, the anti-oxidation portion of the anti-oxidation layer covers at least a portion of the surface of the conductive portion. This mitigates the problem of water and oxygen entering the first electrode layer during the etching of vias in the first sublayer, thereby oxidizing and corroding the first electrode and reducing its conductivity, ensuring electrical connection between the first electrode and the conductive portion. The conductive layer is located on the side of the first sublayer away from the substrate and includes a conductive portion. The conductive portion is electrically connected to the first electrode through a via, so that the first electrode and the conductive portion are arranged in parallel, reducing the overall resistance of the first electrode and the conductive portion, thereby reducing the power consumption of the first electrode and improving the display effect of the display panel. Attached Figure Description

[0042] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals denote the same or similar features, and the drawings are not drawn to scale.

[0043] Figure 1 This is a partial cross-sectional view of a display panel provided in an embodiment of this application;

[0044] Figure 2 This is a partial top view of a display panel provided in an embodiment of this application;

[0045] Figure 3 This is a partial cross-sectional view of the display panel in another embodiment;

[0046] Figure 4 This is a partial cross-sectional view of the display panel in yet another embodiment;

[0047] Figure 5 This is a partial cross-sectional view of the display panel in another embodiment;

[0048] Figure 6 This is a partial cross-sectional view of the display panel in another embodiment;

[0049] Figure 7 This is a partial cross-sectional view of the display panel in another embodiment;

[0050] Figure 8 This is a partial cross-sectional view of the display panel in another embodiment;

[0051] Figure 9 This is a partial cross-sectional view of the display panel in another embodiment;

[0052] Figure 10 This is a schematic diagram of a method for manufacturing a display panel according to an embodiment of this application.

[0053] Explanation of reference numerals in the attached figures:

[0054] 10. Display panel;

[0055] 100. Substrate;

[0056] 200. Isolation layer; 210. Isolation section; 220. Isolation opening;

[0057] 300, Light-emitting layer; 310, Light-emitting unit;

[0058] 400, First electrode layer; 410, First electrode;

[0059] 500, conductive layer; 510, conductive part;

[0060] 600, Encapsulation layer; 610, First sublayer; 620, Second sublayer; 630, Third sublayer;

[0061] 700, Antioxidant layer; 710, Antioxidant section;

[0062] 800, protective layer;

[0063] 900, Isolation structure; 910, First layer; 920, Second layer; 930, Pixel limiting part; 940, Pixel opening; 950, Clearance opening; 960, Pixel electrode. Detailed Implementation

[0064] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0065] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0066] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0067] This application provides a display panel, a display device, and a method for manufacturing a display panel. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel, the display device, and the method for manufacturing a display panel.

[0068] This application provides a display panel, which may be an organic light-emitting diode (OLED) display panel.

[0069] Please see Figure 1 , Figure 1 This is a partial cross-sectional view of a display panel provided in an embodiment of this application.

[0070] like Figure 1As shown, a first aspect of this application provides a display panel 10, which includes a substrate 100, an isolation layer 200, a light-emitting layer 300, a first electrode layer 400, an encapsulation layer 600, a conductive layer 500, and an antioxidant layer 700. The isolation layer 200 is located on the substrate 100 and includes an isolation portion 210 and an isolation opening 220 formed by the isolation portion 210. The light-emitting layer 300 includes light-emitting units 310 located within each isolation opening 220. The first electrode layer 400 is located on the side of the light-emitting layer 300 away from the substrate 100 and includes a first electrode 410. The light-emitting units 310 are located on the side of the light-emitting layer 300 away from the substrate 100. The orthographic projection of substrate 100 is located within the orthographic projection of first electrode 410 on substrate 100; encapsulation layer 600 is located on the side of first electrode layer 400 away from substrate 100, and encapsulation layer 600 includes first sublayer 610; conductive layer 500 is located on the side of first sublayer 610 away from substrate 100, and conductive layer 500 includes conductive portion 510, and conductive portion 510 is connected to first electrode 410 via; anti-oxidation layer 700 is located on the side of conductive layer 500 away from substrate 100, and anti-oxidation layer 700 includes anti-oxidation portion 710, and the orthographic projection of conductive portion 510 on substrate 100 is located within the orthographic projection of anti-oxidation portion 710 on substrate 100.

[0071] According to an embodiment of this application, the display panel 10 includes a substrate 100, an insulating layer 200, a light-emitting layer 300, a first electrode layer 400, and a conductive layer 500. An insulating opening 220 formed by the insulating portion 210 is used to provide a light-emitting unit 310, enabling the display panel 10 to emit light. The orthographic projection of the light-emitting unit 310 onto the substrate 100 is located within the orthographic projection of the first electrode 410 onto the substrate 100; that is, the first electrode 410 covers the light-emitting unit 310, serving as the electrode of the light-emitting unit 310. An encapsulation layer 600 is disposed on the side of the first electrode layer 400 facing away from the substrate 100 to encapsulate the first electrode layer 400 and the light-emitting layer 300, reducing the possibility of water and oxygen intrusion and improving the service life of the display panel 10. An anti-oxidation layer 700 is disposed on the side of the conductive portion 510 facing away from the substrate 100. The orthographic projection of the conductive portion 510 onto the substrate 100 is located within the orthographic projection of the anti-oxidation layer 700 onto the substrate 100. The conductive layer 500 is located on the side of the first sublayer 610 facing away from the substrate 100 and includes a conductive portion 510. The conductive portion 510 is electrically connected to the first electrode 410 through a via, so that the first electrode 410 and the conductive portion 510 are arranged in parallel, reducing the overall resistance of the first electrode 410 and the conductive portion 510, thereby reducing the power consumption of the first electrode 410 and improving the display effect of the display panel 10. That is, the antioxidant portion 710 of the antioxidant layer 700 covers at least a portion of the surface of the conductive portion 510, so as to improve the problem that the conductive portion 510 is easily oxidized after the conductive layer 500 is formed or during the patterning process, reducing the conductivity of the conductive portion 510, ensuring the electrical connection between the first electrode 410 and the conductive portion 510, and improving the performance of the display panel 10.

[0072] There are many other ways to arrange the substrate 100. For example, the substrate 100 may include a substrate and an array substrate disposed on the substrate. Alternatively, the substrate 100 may be the substrate itself. Or the substrate 100 may include a buffer layer and a support plate on the side facing away from the substrate.

[0073] Please refer to the following: Figure 1 and Figure 2 , Figure 2 This is a partial top view of a display panel provided in an embodiment of this application.

[0074] like Figure 1 and Figure 2 As shown, in some alternative embodiments, the orthographic projection of the conductive portion 510 onto the substrate 100 is at least partially located within the orthographic projection of the isolation portion 210 onto the substrate 100.

[0075] In these optional embodiments, the orthographic projection of the conductive portion 510 onto the substrate 100 is at least within the orthographic projection of the isolation portion 210 onto the substrate 100, that is, the conductive portion 510 is at least partially disposed in the area where the isolation portion 210 is located, thereby reducing the influence of the conductive portion 510 on the light emission of the light-emitting unit 310 and ensuring the display effect of the display panel 10.

[0076] Optionally, the conductive portion 510 and the first electrode 410 are at least partially overlapped in their orthographic projections on the substrate 100, to ensure that the conductive portion 510 can be electrically connected to the first electrode 410 through a via. Alternatively, as... Figure 2 As shown, the conductive part 510 is mesh-shaped, and the mesh-shaped conductive part 510 is aligned with the isolation part 210, which reduces the impact on the light emission of the light-emitting unit 310. In addition, the conductive part 510 is mesh-shaped and has a large area, which can effectively reduce the overall resistance of the first electrode 410 and the conductive part 510, and improve the display effect.

[0077] Optionally, the conductive portion 510 may include a metallic conductive material or a transparent conductive material. When the conductive portion 510 is a metallic conductive material, its transmittance is low, therefore it must be positioned away from the light-emitting unit 310 to emit light. That is, the orthogonal projection of the conductive portion 510 onto the substrate 100 is located within the orthogonal projection of the isolation portion 210 onto the substrate 100. The material of the conductive portion 510 may include, for example, metallic silver, aluminum, magnesium, copper, etc., or the material of the conductive portion 510 may include transparent conductive materials such as indium tin oxide and indium zinc oxide.

[0078] Please see Figure 3 , Figure 3 This is a partial cross-sectional view of the display panel in another embodiment.

[0079] like Figure 3 As shown, when the material of the conductive part 510 includes a transparent conductive material, there is no need to pattern the conductive layer 500 to obtain a mesh-like conductive part 510. The entire continuous conductive layer 500 can be directly prepared and electrically connected to the first electrode 410 through a via.

[0080] Please see Figure 4 , Figure 4 This is a partial cross-sectional view of the display panel in yet another embodiment.

[0081] like Figure 4 As shown, in some optional embodiments, the encapsulation layer 600 includes a second sublayer 620 located on the side of the first sublayer 610 away from the substrate 100, and the conductive layer 500 is located between the first sublayer 610 and the second sublayer 620.

[0082] In these optional embodiments, the encapsulation layer 600 includes a first sublayer 610 and a second sublayer 620. Multilayer encapsulation using the first sublayer 610 and the second sublayer 620 further improves the encapsulation performance of the encapsulation layer 600. A conductive layer 500 is located between the first sublayer 610 and the second sublayer 620. The first sublayer 610 is disposed between the conductive layer 500 and the first electrode layer 400, facilitating patterning of the conductive layer 500 and reducing the impact of etching of the conductive layer 500 on the first electrode layer 400.

[0083] Optionally, the first sublayer 610 may include inorganic materials. Using inorganic materials for encapsulation makes it easier to etch vias and reduces the difficulty of via etching. Inorganic materials have good density and good barrier properties against water vapor and oxygen.

[0084] Optionally, the second sub-layer 620 includes an organic material, and the second sub-layer 620 is encapsulated using an organic material to further improve the encapsulation performance of the encapsulation layer 600.

[0085] Optionally, the encapsulation layer 600 also includes a third sub-layer 630, which is located on the side of the second sub-layer 620 away from the substrate 100. The encapsulation layer 600 adopts a three-layer encapsulation, which has better encapsulation performance and reduces the possibility of water and oxygen intrusion.

[0086] Optionally, the third sublayer 630 includes inorganic materials. The first sublayer 610, the second sublayer 620, and the third sublayer 630 are encapsulated using inorganic materials, organic materials, and inorganic materials, respectively, to form a TFE (Thin Film Encapsulation) encapsulation structure, further improving the encapsulation performance of the encapsulation layer 600.

[0087] In some alternative embodiments, the antioxidant layer 700 comprises inorganic or organic materials.

[0088] In these alternative embodiments, the antioxidant layer 700 comprises an inorganic material, such as silicon nitride (SiN) or silicon oxide (SiO). Alternatively, the antioxidant layer 700 comprises an organic material, such as polyimide.

[0089] Optionally, the antioxidant layer 700 and the first sub-layer 610 are made of the same material. When the antioxidant layer 700 and the first sub-layer 610 are made of the same material, the antioxidant layer 700 and the first sub-layer 610 can be prepared using the same film-forming method, that is, the same equipment can be used, reducing equipment investment and reducing preparation costs.

[0090] like Figure 4 As shown, in some optional embodiments, the orthographic projection of the conductive portion 510 on the substrate 100 and the orthographic projection of the anti-oxidation portion 710 on the substrate 100 coincide.

[0091] In these alternative embodiments, the conductive portion 510 and the antioxidant portion 710 are arranged to overlap, so that the conductive portion 510 and the antioxidant portion 710 can be fabricated using the same mask, reducing the number of mask developments and lowering the fabrication cost.

[0092] Please see Figure 5 , Figure 5 This is a partial cross-sectional view of the display panel in another embodiment.

[0093] like Figure 5 As shown, optionally, the conductive portion 510 includes a side facing the isolation opening 220, and the anti-oxidation portion 710 is provided to cover at least a portion of the side of the conductive portion 510, so that more of the surface of the conductive portion 510 is protected by the anti-oxidation portion 710, reducing the possibility of the conductive portion 510 being oxidized and ensuring the conductivity of the conductive portion 510.

[0094] Please see Figure 6 , Figure 6 This is a partial cross-sectional view of the display panel in another embodiment.

[0095] like Figure 6 As shown, in some optional embodiments, the display panel 10 further includes a protective layer 800 located between the first electrode layer 400 and the encapsulation layer 600, the protective layer 800 covering at least a portion of the first electrode layer 400.

[0096] In these optional embodiments, the protective layer 800 is located on the side of the first electrode layer 400 facing away from the substrate 100, and the protective layer 800 covers at least a portion of the first electrode layer 400 to reduce water and oxygen intrusion, making the first electrode 410 difficult to oxidize and ensuring the conductivity of the first electrode 410. When the display panel 10 includes the protective layer 800, when etching vias in the first sub-layer 610, the protective layer 800 needs to be etched so that the first electrode 410 is exposed from the protective layer 800 and can contact the conductive part 510, ensuring the electrical connection between the first electrode 410 and the conductive part 510.

[0097] Optionally, the protective layer 800 includes a light extraction material with a high refractive index, which can effectively improve the coupling efficiency of the protective layer 800 and thus improve the luminous efficiency of the display panel 10.

[0098] Please refer to the following: Figure 7 , Figure 7 This is a partial cross-sectional view of the display panel in another embodiment.

[0099] like Figure 7As shown, in some optional embodiments, the isolation portion 210 includes an isolation structure 900, which is located on the substrate 100 and encloses a plurality of isolation openings 930. The isolation structure 900 includes a first layer 910, and each light-emitting unit 310 and each first electrode 410 are located in the isolation openings 930. The first electrode 410 is electrically connected to the first layer 910.

[0100] In these optional embodiments, the isolation structure 900 is disposed on the substrate 100 and encloses a plurality of isolation openings 930 to isolate the light-emitting layer 300 and form mutually disconnected light-emitting units 310, thereby reducing crosstalk of charge carriers in the light-emitting layer 300 and improving the display effect of the display panel 10. Furthermore, the fabrication of the light-emitting units 310 does not require the use of precision photomasks, reducing the development and use of precision photomasks and lowering fabrication costs. The mutually spaced first electrodes 410 are electrically connected through the first layer 910 to form a full-surface electrode, making it easier for the first electrodes 410 and the first layer 910 to overlap, thus improving the overlap efficiency of the first electrodes 410.

[0101] Optionally, multiple spaced-apart first electrodes 410 are connected to the conductive portion 510 via holes. Each first electrode 410 is electrically connected to the conductive portion 510, so that each first electrode 410 is interconnected to form a full-surface electrode.

[0102] In some alternative embodiments, the isolation structure 900 further includes a second layer 920 located on the side of the first layer 910 opposite to the substrate 100, wherein the orthographic projection of the first layer 910 onto the substrate 100 lies within the orthographic projection of the second layer 920 onto the substrate 100.

[0103] In these optional embodiments, the first layer 910 and the second layer 920 are configured to form an isolation structure 900. The first layer 910, which is disposed close to the substrate 100, has its orthographic projection on the substrate 100 located within the orthographic projection of the second layer 920 on the substrate 100. The area of ​​the second layer 920 is larger than that of the first layer 910. The second layer 920 covers the surface of the first layer 910 that is close to the first layer 920. At this time, the first layer 910 is recessed relative to the second layer 920 in a direction away from the isolation opening 220. When the light-emitting layer 300 is fabricated, the light-emitting layer 300 has a large drop at the edge of the isolation structure 900, and the first layer 910 is recessed relative to the second layer 920. The light-emitting layer 300 is difficult to connect at the edge of the isolation structure 900, resulting in breakage. The breakage of the light-emitting layer 300 forms mutually disconnected light-emitting units 310.

[0104] In some alternative embodiments, both the first layer 910 and the second layer 920 are made of metallic materials, and the materials of the first layer 910 and the second layer 920 are different.

[0105] In these optional embodiments, when both the first layer 910 and the second layer 920 are metallic materials, the first layer 910 can be wet-etched using an etching solution. By adjusting the etching solution, the etching rate of the second layer 920 can be made lower than that of the first layer 910. Because the etching rate of the first layer 910 is higher, even if the second layer 920 is etched to some extent during wet etching, the first layer 910 is etched faster, resulting in the first layer 910 being recessed relative to the second layer 920.

[0106] Optionally, the second layer 920 may include a non-metallic material, such as a non-metallic conductive or insulating material. When the second layer 920 is a non-metallic material, it is difficult to etch the second layer 920 during the wet etching process of the first layer 910 using an etching solution, thereby making it easier for the first layer 910 to be recessed relative to the second layer 920.

[0107] Optionally, the cross-sectional shape of the first layer 910 along the thickness direction includes a trapezoid. When the cross-sectional shape of the first layer 910 is trapezoidal, it can stably support the second layer 920 on the one hand, and on the other hand, it realizes that the first layer 910 is equivalent to the concave setting of the second layer 920, which facilitates the disconnection of the light-emitting layer 300 at the position of the isolation structure 900.

[0108] Please refer to the following: Figure 8 and Figure 9 , Figure 8 This is a partial cross-sectional view of the display panel in another embodiment; Figure 9 This is a partial cross-sectional view of the display panel in another embodiment.

[0109] like Figure 8 and Figure 9 As shown, optionally, the isolation portion 210 includes a pixel limiting portion 930, and the isolation opening 220 includes a pixel opening 940 formed by the pixel limiting portion 930. The pixel limiting portion 930 defines the light-emitting area of ​​the display panel 10, and the pixel opening 940 is used to set the light-emitting unit 310 to realize the light emission of the display panel 10.

[0110] Optionally, the isolation portion 210 further includes an isolation structure 900 located on the substrate 100. The isolation portion 210 includes both the pixel limiting portion 930 and the isolation structure 900, so that the light-emitting layer 300 is isolated by the isolation structure 900 and falls into the pixel opening 940, thereby realizing the light-emitting display of the display panel 10. The light-emitting units 310 are spaced apart from each other, reducing crosstalk of charge carriers in the light-emitting layer 300.

[0111] Optionally, the orthographic projection of the isolation structure 900 on the substrate 100 and the orthographic projection of the conductive portion 510 on the substrate 100 are at least partially offset, so that the portion of the conductive portion 510 that is offset from the isolation structure 900 can be connected to the first electrode 410 through a via, so that the first electrode 410 is electrically connected to the conductive portion 510, reducing the overall resistance of the first electrode 410 and the conductive portion 510, thereby reducing the power consumption of the first electrode 410 and improving the display effect of the display panel 10.

[0112] like Figure 8 As shown, in some optional embodiments, the isolation structure 900 is located on the side of the pixel limiting portion 930 away from the substrate 100.

[0113] In these optional embodiments, the isolation structure 900 is disposed on the pixel limiting portion 930, and the isolation structure 900 has a large height difference corresponding to the pixel opening 220. When the light-emitting layer 300 is fabricated, due to the large height difference, the light-emitting layer 300 is more easily broken at the location of the isolation structure 900, reducing the fabrication difficulty of the light-emitting layer 300.

[0114] Optionally, the conductive part 510 is projected onto the substrate 100 within the projection of the pixel limiting part 930 onto the substrate 100. That is, the conductive part 510 is disposed in the area where the pixel limiting part 930 is located, thereby reducing the influence of the conductive part 510 on the light emission of the light-emitting unit 310 and ensuring the display effect of the display panel 10.

[0115] like Figure 9 As shown, in some optional embodiments, a clearance opening 950 is provided on the pixel limiting portion 930, and the isolation structure 900 is located in the clearance opening 950.

[0116] In these optional embodiments, the isolation structure 900 is disposed within the clearance opening 950 on the pixel limiting portion 930. During the fabrication process, the isolation structure 900 fabrication step is performed before the pixel electrode 960 fabrication, that is, after the isolation structure 900 is fabricated on the substrate 100, the pixel electrode 960 is fabricated on the substrate 100, so as to reduce the impact of the isolation structure 900 fabrication on the pixel electrode 960 and ensure that the pixel electrode 960 is not damaged.

[0117] Optionally, the light-emitting unit 310 and the isolation structure 900 are spaced apart, and the light-emitting layer 300 and the isolation structure 900 are spaced apart, that is, each light-emitting unit 310 is spaced apart from each other, reducing crosstalk of charge carriers between each light-emitting unit 310 and improving the color crosstalk problem of the light-emitting unit 310.

[0118] Optionally, the display panel 10 further includes a pixel electrode 960 exposed through the pixel opening 940. One of the pixel electrode 960 and the first electrode 410 serves as the anode of the light-emitting unit 310, and the other serves as the cathode of the light-emitting unit 310. In this embodiment, the pixel electrode 960 is used as the anode of the light-emitting unit 310, and the first electrode 410 serves as the cathode of the light-emitting unit 310 for illustrative purposes.

[0119] Optionally, the light-emitting layer 300 includes an electron injection layer (EIL), an electron transport layer (ETL), a light-emitting material layer, a hole injection layer (HIL), and a hole transport layer (HTL).

[0120] The structural design in this embodiment can be applied to other display panels 10. The specific choice can be made according to the actual situation, and this application does not impose any specific restrictions on it.

[0121] The second aspect of this application also provides a display device, including the display panel 10 of any of the first aspect embodiments described above. Since the display device provided in the second aspect of this application includes the display panel 10 of any of the first aspect embodiments described above, it has the beneficial effects of the display panel 10 of any of the first aspect embodiments described above, which will not be elaborated further here.

[0122] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0123] The third aspect of this application also provides a method for manufacturing a display panel 10. The display panel 10 can be any of the display panels 10 provided in the first aspect of the application described above. Please refer to both methods. Figures 1 to 9 And see Figure 10 , Figure 10 This is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of this application. The manufacturing method includes:

[0124] Step S01: An isolation layer is prepared on the substrate. The isolation layer includes an isolation portion and an isolation opening formed by the isolation portion.

[0125] Step S02: Prepare a light-emitting layer on the side of the isolation layer away from the substrate. The light-emitting layer includes light-emitting units located in each isolation opening.

[0126] Step S03: A first electrode layer is prepared on the side of the light-emitting layer away from the substrate, and the orthogonal projection of the light-emitting unit on the substrate is located within the orthogonal projection of the first electrode on the substrate.

[0127] Step S04: Prepare an encapsulation layer on the side of the first electrode layer away from the substrate. The encapsulation layer includes a first sublayer.

[0128] Step S05: A conductive layer is prepared on the side of the first sublayer away from the substrate. The conductive layer includes a conductive portion, which is connected to the first electrode via.

[0129] Step S06: An antioxidant layer is prepared on the side of the conductive layer away from the substrate. The antioxidant layer includes an antioxidant portion, and the orthogonal projection of the conductive portion onto the substrate is located within the orthogonal projection of the antioxidant portion onto the substrate.

[0130] According to the preparation method of the third aspect of this application, in step S01, an isolation layer 200 is prepared on the substrate 100, and an isolation opening 220 formed by the isolation portion 210 is used to set the light-emitting unit 310 to realize the light-emitting display of the display panel 10. Then, in step S02, a light-emitting layer 300 is prepared. In step S03, a first electrode layer 400 is prepared, and the orthographic projection of the light-emitting unit 310 on the substrate 100 is located within the orthographic projection of the first electrode 410 on the substrate 100, that is, the first electrode 410 is provided to cover the light-emitting unit 310, so as to serve as the electrode of the light-emitting unit 310. In step S04, an encapsulation layer 600 is prepared, and the encapsulation layer 600 is disposed on the side of the first electrode layer 400 away from the substrate 100, so as to encapsulate the first electrode layer 400 and the light-emitting layer 300, reduce the possibility of water and oxygen intrusion, and improve the service life of the display panel 10. In step S05, a conductive layer 500 is prepared. The conductive layer 500 is located on the side of the first sub-layer 610 facing away from the substrate 100 and includes a conductive portion 510. The conductive portion 510 is electrically connected to the first electrode 410 through a via, so that the first electrode 410 and the conductive portion 510 are arranged in parallel, reducing the overall resistance of the first electrode 410 and the conductive portion 510, thereby reducing the power consumption of the first electrode 410 and improving the display effect of the display panel 10. Finally, in step S06, an anti-oxidation layer 700 is prepared. The orthogonal projection of the conductive portion 510 onto the substrate 100 is located within the orthogonal projection of the anti-oxidation portion 710 onto the substrate 100. That is, the anti-oxidation portion 710 of the anti-oxidation layer 700 covers at least part of the surface of the conductive portion 510, so as to improve the problem that water and oxygen enter the first electrode layer 400 during the etching of vias in the first sub-layer 610, thereby oxidizing and corroding the first electrode 410 and reducing the conductivity of the first electrode 410, and ensuring the electrical connection between the first electrode 410 and the conductive portion 510.

[0131] In some optional embodiments, after the step of fabricating the first electrode layer 400 on the side of the light-emitting layer 300 facing away from the substrate 100, the method further includes:

[0132] A first sub-material layer is prepared on the side of the first electrode layer 400 away from the substrate 100, and the first sub-material layer is patterned to obtain a first sub-layer 610, the first sub-layer 610 including vias.

[0133] A conductive layer 500 is prepared on the side of the first sublayer 610 away from the substrate 100. The conductive layer 500 includes a conductive portion 510, which is connected to the first electrode 410 through a via.

[0134] In these optional embodiments, after fabricating the first sublayer 610, the first sublayer 610 is etched to obtain vias, and then the conductive layer 500 is fabricated. The conductive portion 510 of the conductive layer 500 can then be electrically connected to the first electrode 410 through the vias. The presence of the first sublayer 610 between the conductive layer 500 and the first electrode layer 400 facilitates patterning of the conductive layer 500 and reduces the impact of etching of the conductive layer 500 on the first electrode layer 400.

[0135] In some alternative embodiments, after the step of fabricating the conductive layer 500 on the side of the first sublayer 610 facing away from the substrate 100, the method further includes:

[0136] An antioxidant material layer is prepared on the side of the conductive layer 500 away from the substrate 100. The antioxidant material layer and the conductive layer 500 are etched sequentially using the same mask to form a conductive portion 510 and an antioxidant layer 700. The antioxidant layer 700 includes an antioxidant portion 710. The orthographic projection of the conductive portion 510 on the substrate 100 and the orthographic projection of the antioxidant portion 710 on the substrate 100 coincide.

[0137] In these alternative embodiments, after the conductive layer 500 and the antioxidant layer 700 are fabricated, the antioxidant material layer is etched first, and then the conductive layer 500 is etched, and so on, but the same mask is used to reduce the number of times the mask is developed and reduce the fabrication cost.

[0138] The embodiments described above are not exhaustive, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized by, The display panel includes: substrate; An isolation layer is located on the substrate, the isolation layer including an isolation portion and an isolation opening formed by the isolation portion; A light-emitting layer, the light-emitting layer comprising light-emitting units located within each of the isolation openings; A first electrode layer is located on the side of the light-emitting layer opposite to the substrate. The first electrode layer includes a first electrode, and the orthogonal projection of the light-emitting unit on the substrate is located within the orthogonal projection of the first electrode on the substrate. An encapsulation layer is located on the side of the first electrode layer opposite to the substrate, and the encapsulation layer includes a first sublayer; A conductive layer is located on the side of the first sublayer facing away from the substrate. The conductive layer includes a conductive portion, which is connected to the first electrode via. An antioxidant layer is located on the side of the conductive layer opposite to the substrate. The antioxidant layer includes an antioxidant portion, and the orthogonal projection of the conductive portion onto the substrate is located within the orthogonal projection of the antioxidant portion onto the substrate. The isolation portion includes an isolation structure located on the substrate and enclosing a plurality of isolation openings. The isolation structure includes a first layer and a second layer located on the side of the first layer facing away from the substrate. The orthographic projection of the first layer on the substrate is located within the orthographic projection of the second layer on the substrate. The orthographic projection of the isolation structure on the substrate and the orthographic projection of the conductive part on the substrate are at least partially offset.

2. The display panel of claim 1, wherein, The conductive portion is at least partially located within the orthographic projection of the insulating portion onto the substrate.

3. The display panel of claim 1, wherein, The conductive part is in the form of a mesh.

4. The display panel of claim 1, wherein, The conductive part includes a metallic conductive material or a transparent conductive material.

5. The display panel of claim 1, wherein, The encapsulation layer further includes: The second sublayer is located on the side of the first sublayer facing away from the substrate, and the conductive layer is located between the first sublayer and the second sublayer.

6. The display panel of claim 1, wherein, The first sublayer consists of inorganic materials.

7. The display panel of claim 5, wherein, The second sublayer includes organic materials.

8. The display panel of claim 5, wherein, The encapsulation layer further includes a third sublayer located on the side of the second sublayer facing away from the substrate.

9. The display panel of claim 8, wherein, The third sublayer comprises inorganic materials.

10. The display panel of claim 1, wherein, The antioxidant layer comprises inorganic or organic materials.

11. The display panel of claim 1, wherein, The antioxidant layer is made of the same material as the first sublayer.

12. The display panel of claim 1, wherein, The orthographic projection of the conductive part on the substrate and the orthographic projection of the antioxidant part on the substrate coincide.

13. The display panel of claim 1, wherein, The conductive portion includes a side facing the isolation opening, and the antioxidant portion covers at least a portion of the side of the conductive portion.

14. The display panel according to claim 1, characterized in that, The display panel also includes: A protective layer is located between the first electrode layer and the encapsulation layer, the protective layer covering at least a portion of the first electrode layer.

15. The display panel according to claim 14, characterized in that, The protective layer includes a light extraction material.

16. The display panel according to claim 1, characterized in that, Each of the light-emitting units and each of the first electrodes are located in the isolation opening, and the first electrode is electrically connected to the first layer.

17. The display panel according to claim 1, characterized in that, Multiple first electrodes spaced apart from each other are connected to the conductive vias.

18. The display panel according to claim 1, characterized in that, The isolation portion includes a pixel defining portion, and the isolation opening includes a pixel opening formed by the pixel defining portion.

19. The display panel according to claim 18, characterized in that, The isolation structure is located on the side of the pixel defining portion opposite to the substrate.

20. The display panel according to claim 18, characterized in that, The conductive portion is projected onto the substrate in a direction that is within the projection of the pixel defining portion onto the substrate.

21. The display panel according to claim 18, characterized in that, The pixel limiting portion has a clearance opening, and the isolation structure is located in the clearance opening.

22. The display panel according to claim 1, characterized in that, The light-emitting unit and the isolation structure are spaced apart.

23. A display device, characterized in that, Includes the display panel as described in any one of claims 1-22.

24. A method for manufacturing a display panel, characterized in that, include: An isolation layer is prepared on a substrate. The isolation layer includes an isolation portion and an isolation opening formed by the isolation portion. The isolation portion includes an isolation structure. The isolation structure is located on the substrate and forms a plurality of the isolation openings. The isolation structure includes a first layer and a second layer located on the side of the first layer away from the substrate. The orthographic projection of the first layer on the substrate is located within the orthographic projection of the second layer on the substrate. A light-emitting layer is prepared on the side of the isolation layer opposite to the substrate, the light-emitting layer including light-emitting units located within each of the isolation openings; A first electrode layer is formed on the side of the light-emitting layer opposite to the substrate, and the orthogonal projection of the light-emitting unit on the substrate is located within the orthogonal projection of the first electrode on the substrate; An encapsulation layer is prepared on the side of the first electrode layer opposite to the substrate, the encapsulation layer including a first sublayer; A conductive layer is prepared on the side of the first sublayer facing away from the substrate. The conductive layer includes a conductive portion, which is connected to the first electrode via. The orthographic projection of the isolation structure on the substrate and the orthographic projection of the conductive portion on the substrate are at least partially offset. An antioxidant layer is prepared on the side of the conductive layer opposite to the substrate. The antioxidant layer includes an antioxidant portion, and the orthogonal projection of the conductive portion onto the substrate is located within the orthogonal projection of the antioxidant portion onto the substrate.

25. The preparation method according to claim 24, characterized in that, After the step of fabricating the first electrode layer on the side of the light-emitting layer opposite to the substrate, the method further includes: A first sub-material layer is prepared on the side of the first electrode layer away from the substrate, and the first sub-material layer is patterned to obtain a first sub-layer, the first sub-layer including vias; A conductive layer is formed on the side of the first sublayer facing away from the substrate. The conductive layer includes the conductive portion, which is connected to the first electrode through the via.

26. The preparation method according to claim 25, characterized in that, After the step of fabricating the conductive layer on the side of the first sublayer facing away from the substrate, the method further includes: An antioxidant material layer is prepared on the side of the conductive layer opposite to the substrate. The antioxidant material layer and the conductive layer are etched sequentially using the same mask to form the conductive portion and the antioxidant layer. The antioxidant layer includes an antioxidant portion, and the orthographic projection of the conductive portion on the substrate and the orthographic projection of the antioxidant portion on the substrate coincide.

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