Powder recoverable germanium wafer cylindrical grinding machine polishing mechanism

Abstract

This invention discloses a germanium wafer cylindrical grinding mechanism with recyclable powder, comprising a base, a clamping device, and a grinding device. The clamping device is located on the upper right side of the base, and the grinding device is located on the upper left side of the base. The clamping device further includes a swing arm device and a chuck device. The grinding device further includes a grinding base and a dust recovery device. The function of this invention is to adopt a vertical grinding method, shifting the dust diffusion range to the vertical direction, facilitating dust recovery; to collect dust using a spray method, while preventing excessive dust diffusion into the air environment; and to recover the dust carried out by the spray after separation, reducing the dust diffusion range and increasing the dust recovery efficiency. Furthermore, it incorporates a grinding structure that automatically adapts to the wafer surface size, ensuring effective grinding of wafers with different sizes.

Description

Technical Field

[0001] This invention belongs to the technical field of germanium wafer processing equipment, and particularly relates to a grinding mechanism for a germanium wafer cylindrical grinding machine with recyclable powder. Background Technology

[0002] In the production process of germanium wafers, after the wafers are cut, the edges need to be polished to be round and smooth. Polishing removes burrs and unevenness from the wafer edges to ensure that the edges of the germanium wafers will not break or crumble in subsequent processes.

[0003] The prior art is as follows: Reference document 1: Chinese Patent (CN219837550U) discloses a grinding mechanism for a germanium wafer external cylindrical grinding machine with recyclable powder, including a base, a mounting base, a central base, a rotary motor and a pressure chamber. The upper end of the base is fixedly connected to the mounting base, and the inner surface of the mounting base is rotatably connected to the central base. The rotary motor is fixedly installed inside the base. A side plate is fixedly provided on the side surface of the base, and a grinding hydraulic rod is fixedly installed on the upper end of the side plate. A grinding plate is fixedly installed on one end of the grinding hydraulic rod.

[0004] In this approach, when the grinding plate grinds the wafer, the dust generated at the outer edge of the wafer is affected by rotation and diffuses outward from both sides near the tangent of the rotation circle. The remaining kinetic energy of the dust then pushes it further away from the central dust collection point on the horizontal plane, increasing the dust diffusion range and making dust recovery more difficult. Secondly, the central dust collection point absorbs the dust generated by grinding through negative pressure. With such a large dust diffusion range, it is impossible to recover most of the dust, resulting in low dust recovery efficiency.

[0005] Comparative document 2: Chinese Patent (CN113579891A) discloses a disc stacking and grinding device and its stacking and grinding method. The discs obtained by stamping are automatically dropped onto the upper part of the first turntable after being conveyed by a conveyor belt. After stacking, the upper connecting plate moves downward, so that the upper limiting sleeve and the upper limiting post are in a limiting engagement. The limiting sleeve drives the limiting post to rotate 90 degrees, so that the abrasive layer of the limiting post faces inward. The second turntable clamps the stacked discs with the first turntable. By driving the second turntable to rotate, all the stacked discs can be driven to rotate together, so that the edge of the discs slides against the abrasive layer of the limiting post, thereby achieving the purpose of grinding the burrs on the edge of the discs.

[0006] In this method, the edges of the wafers are polished by limiting posts. However, in the actual process of germanium wafer production, the cutting dimensions of different germanium wafers will have a certain range of errors. Under such circumstances, the same polishing angle and polishing distance will lead to inconsistent polishing results between the wafers. Larger wafers are prone to excessive wear, resulting in material waste, while smaller wafers will not be polished properly. All of these situations will lead to a decrease in the yield of germanium wafers after processing.

[0007] The existing technology has the following drawbacks: First, the grinding plate grinds the edge of the wafer, creating a dust diffusion area in the horizontal direction. Furthermore, the rotation of the wafer increases the dust diffusion range, making dust recovery more difficult. Second, using negative pressure suction to recover dust makes it difficult to efficiently and quickly recover the dust given its large diffusion range. Third, different germanium wafers have different edge dimensions, and the grinding process cannot automatically adapt to fit the surface of different wafers, resulting in inconsistent grinding effects and affecting the yield of the processed germanium wafers.

[0008] Therefore, this paper provides a grinding mechanism for germanium wafers with recyclable powder. Summary of the Invention

[0009] To address the aforementioned technical problems, this invention discloses a grinding mechanism for a germanium wafer cylindrical grinding machine with recyclable powder. This device employs a vertically placed grinding method, shifting the dust diffusion range to the vertical direction, facilitating dust recovery. It uses a spray method to collect dust, preventing excessive dust diffusion into the air. The dust carried out by the spray is separated and recovered, reducing the dust diffusion range and increasing dust recovery efficiency. Furthermore, it incorporates a grinding structure that automatically adapts to the wafer surface size, ensuring effective grinding of wafers with varying dimensions.

[0010] To achieve the above-mentioned technical effects, the present invention provides a grinding mechanism for germanium wafers with recyclable powder, comprising a device base, a clamping device, and a grinding device. The clamping device is located on the upper right side of the device base, and the grinding device is located on the upper left side of the device base. The clamping device further comprises a swing arm device and a chuck device. The swing arm device is respectively located on the front and rear sides of the germanium wafer above the device base, and the chuck device is respectively located on the left front end of the swing arm device. The grinding device further comprises a grinding base and a dust collection device. The grinding base, which automatically adapts to the size of the germanium wafer, is located below the germanium wafer, and the dust collection device is located on the left side of the grinding base.

[0011] Preferably, the swing arm device further includes a telescopic cylinder, a connecting rod, a mounting base, and a slide cylinder. The connecting rod is located above the device base and its right end is hinged to the device base. The telescopic cylinder is located above the connecting rod and its left end is hinged to the middle of the connecting rod. The right end of the connecting rod is hinged to the right end of the device base. The mounting base is located at the left end of the connecting rod. The slide cylinder is located above the mounting base. The telescopic cylinder and the slide cylinder are connected to the control air pipe of the workshop via flexible hoses.

[0012] Preferably, the clamping device further includes a suction cup base, a sponge suction cup, a rack, a drive motor, and a gear. The suction cup base is positioned above the slide cylinder, the sponge suction cup is positioned behind the suction cup base and is slidably connected to the suction cup base in a sealed manner, the rack is positioned on the front side of the sponge suction cup, the drive motor is positioned on the right side of the suction cup base, the gear is positioned at the rear output end of the drive motor and meshes with the rack, the suction cup base and the sponge suction cup are internally connected by a cavity, and the suction cup base is connected to the control branch pipe of the workshop through a flexible hose.

[0013] Preferably, the grinding base further includes a grinding layer, a porous base, an air chamber, and an exhaust valve. The grinding layer is disposed above the porous base, the air chamber is disposed on the right side of the porous base, the exhaust valve is disposed on the right side of the air chamber and is connected to the air chamber via a hose, and the right side of the exhaust valve is connected to the workshop control air pipe via a hose.

[0014] Preferably, the porous base is provided with flexible pores distributed parallel to the germanium wafer.

[0015] Preferably, the dust recovery device further includes a spraying device, a water inlet bucket, a water retainer bucket, a water storage tank, a recovery base, a wastewater tank, and a cleaning plate. The spraying device is respectively located on the upper two sides of the grinding base, the water inlet bucket is located on the left side of the grinding base, the water retainer bucket is located on the right side of the grinding base, the water storage tank is located on the left side of the water inlet bucket, the recovery base is located on the left side of the water inlet bucket, the wastewater tank is located on the left side of the recovery base, and the cleaning plates are respectively located on the left and right sides of the germanium wafer. The right end of the spraying device is connected to the water supply branch pipe of the workshop.

[0016] Preferably, the right side of the water-blocking hopper is raised upwards.

[0017] Preferably, the recycling base further includes a mounting base, an adsorption plate, and a gripping plate. The adsorption plate is respectively disposed above the mounting base and is slidably connected to the mounting base via a sliding groove. The gripping plates are respectively disposed on the front and rear sides of the adsorption plate.

[0018] Preferably, the surface of the adsorption plate is composed of a porous silicone plate material.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows: The device includes a base, a clamping device, and a polishing device. The clamping device vertically holds the wafer, and the polishing device below polishes the edges. By using a vertical placement for polishing, the range of dust diffusion is shifted vertically, facilitating dust collection. During polishing, a spraying device sprays water mist above the polishing base, adsorbing and degrading the dust generated during polishing onto the polishing device. The dust is then separated and collected to the left along the collection device, preventing excessive dust diffusion into the air environment, reducing the dust diffusion range, and increasing dust collection efficiency. When changing wafers to be polished, the polishing base can repeatedly reset its contact state, automatically adapting to the polishing structure that fits the wafer surface size, ensuring the device's polishing effect on wafers of different sizes. Attached Figure Description

[0020] Figure 1 This is a front view of the present invention; Figure 2 This is the left view of the present invention; Figure 3 yes Figure 2 A sectional view of section a. Figure 4 yes Figure 3 A partial schematic diagram of b in the middle; Figure 5 This is the isometric drawing of the present invention; Figure 6 yes Figure 5 A partial schematic diagram of c in the middle; Figure 7 yes Figure 5 A partial schematic diagram of d in the middle; Figure 8 This is a schematic diagram of the internal structure of the porous base in this invention; The attached diagram lists the components represented by each number as follows: 1. Device base; 2. Swing arm device; 3. Clamping device; 4. Grinding base; 5. Dust recovery device; 6. Telescopic cylinder; 7. Connecting rod; 8. Mounting base; 9. Slide cylinder; 10. Suction cup base; 11. Sponge suction cup; 12. Rack; 13. Drive motor; 14. Gear; 15. Grinding layer; 16. Perforated base; 17. Air chamber; 18. Exhaust valve; 19. Air hole; 20. Spraying device; 21. Water inlet bucket; 22. Water retainer bucket; 23. Water storage tank; 24. Recovery base; 25. Wastewater tank; 26. Cleaning plate; 27. Mounting base; 28. Adsorption plate; 29. ​​Grip plate; 30. Germanium wafer. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0022] Therefore, the inventor provides a grinding mechanism for germanium wafers with recyclable powder, including a device base 1, a clamping device, and a grinding device. The clamping device is located on the upper right side of the device base 1, and the grinding device is located on the upper left side of the device base 1. The clamping device also includes a swing arm device 2 and a chuck device 3. The swing arm device 2 is located on the front and rear sides of the germanium wafer 30 above the device base 1, and the chuck device 3 is located on the left front end of the swing arm device 2. The grinding device also includes a grinding base 4 and a dust collection device 5. The grinding base 4, which automatically adapts to the size of the germanium wafer 30, is located below the germanium wafer 30, and the dust collection device 5 is located on the left side of the grinding base 4.

[0023] Using the above scheme, the clamping device vertically clamps the germanium wafer 30 to be polished from both sides, and presses the germanium wafer 30 downward to fix it above the polishing device. The germanium wafer 30 presses downward to the polishing base 4, and the air cavity 17 in the polishing base 4 is squeezed out by the germanium wafer 30, so that the polishing layer 15 above the air cavity 17 can automatically adapt to and adhere to the germanium wafer 30. Then, the chuck device 3 on the clamping device drives the germanium wafer 30 to rotate, so that the edge of the germanium wafer 30 is polished on the polishing device below. This vertical placement polishing method changes the range of dust diffusion to the vertical direction. The dust generated during polishing is deposited downward in the vertical direction under the action of initial force and gravity, reducing the diffusion range of dust and facilitating the device to recover the dust. While the polishing device drives the germanium wafer 30 to polish, the dust recovery device 5 sprays water mist at the position where the germanium wafer 30 contacts the polishing base 4 to generate dust, causing the dust that is about to diffuse to settle down. The dust carried by the water mist flows downward along the germanium wafer 30. The wastewater converges and flows to the left into the water storage tank 23. After its kinetic energy is reduced, it slowly flows out and flows to the right through the recycling base 24. The wastewater is separated into dust and wastewater by the recycling base 24. The dust remains on the recycling base 24, and the wastewater flows into the wastewater tank 25. The dust accumulated on the recycling base 24 can be replaced and cleaned after a period of time. This dust recycling method uses a spray method to collect dust, while preventing excessive dust from spreading into the air environment. The dust carried out by the spray is separated and recycled, reducing the dust diffusion range and increasing the dust recycling efficiency. After the germanium wafer 30 is polished, the clamping device is lifted upward, and the operator opens and replaces it with a new germanium wafer 30 that needs to be polished. At the same time, the air chamber 17 in the polishing base 4 is automatically inflated, restoring the polishing base 4 to its initial state. Then, following the same steps, a new germanium wafer 30 is attached and polished. In this way, during each polishing process, the polishing base 4 can automatically adapt to the surface size of the wafer, ensuring the polishing effect of the device on wafers with different sizes.

[0024] Furthermore, the swing arm device 2 also includes a telescopic cylinder 6, a connecting rod 7, a mounting base 8, and a sliding cylinder 9. The connecting rod 7 is located above the device base 1 and its right end is hinged to the device base 1. The telescopic cylinder 6 is located above the connecting rod 7 and its left end is hinged to the middle of the connecting rod 7. The right end of the connecting rod 7 is hinged to the right end of the device base 1. The mounting base 8 is located at the left end of the connecting rod 7. The sliding cylinder 9 is located above the mounting base 8. The telescopic cylinder 6 and the sliding cylinder 9 are connected to the control air pipe (not shown in the figure) of the workshop through a flexible hose (not shown in the figure). The telescopic cylinder 6 is raised up and down via the telescopic control link 7 with the connection between the link 7 and the device base 1 as the axis. The link 7 drives the telescopic cylinder 6 on the mounting base 8 to perform lifting and lowering movements. The telescopic cylinder 6 is used to control the extension and retraction of the front clamping device 3 to clamp and release the germanium wafer 30.

[0025] Furthermore, the chuck device 3 also includes a suction cup base 10, a sponge suction cup 11, a rack 12, a drive motor 13, and a gear 14. The suction cup base 10 is positioned above the slide cylinder 9. The sponge suction cup 11 is positioned behind the suction cup base 10 and is in a sealed sliding connection with the suction cup base 10. The rack 12 is positioned on the front side of the sponge suction cup 11. The drive motor 13 is positioned on the right side of the suction cup base 10. The gear 14 is positioned at the output end of the drive motor 13 and meshes with the rack 12. The suction cup base 10 and the sponge suction cup 11 are internally connected by a cavity, and the suction cup base 10 is connected to the control branch pipe (not shown in the figure) of the workshop through a flexible hose (not shown in the figure). The suction cup base 10 receives a gas control signal and is evacuated by a vacuum generator (not shown in the figure) in the device control system. The vacuum generator connects to the internal cavity of the suction cup base 10 and evacuates the contact surface between the sponge suction cup 11 and the germanium wafer 30, so that the sponge suction cups 11 on both sides of the germanium wafer 30 can hold the germanium wafer 30. Then, the drive motor 13 drives the gear 14 at the output end to rotate, so that the rack 12 can drive the sponge suction cup 11 to rotate on the suction cup base 10, thereby providing power for polishing the germanium wafer 30.

[0026] Furthermore, the grinding base 4 also includes a grinding layer 15, a porous base 16, an air chamber 17, and an exhaust valve 18. The grinding layer 15 is disposed above the porous base 16, the air chamber 17 is disposed on the right side of the porous base 16, the exhaust valve 18 is disposed on the right side of the air chamber 17 and is connected to the air chamber 17 by a hose, and the right side of the exhaust valve 18 is connected to the workshop control bronchus by a hose. The polishing layer 15 can be shaped by the gas injected into the air chamber 17 by the exhaust valve 18, which then inflates the porous base 16. When the polishing layer 15 is under pressure from the germanium wafer 30, the exhaust valve 18 stops the air intake, and the gas squeezed out of the porous base 16 is discharged through the air chamber 17 to the side of the exhaust valve 18, causing the polishing layer 15 to deform and adhere to the edge surface of the germanium wafer 30. After polishing is completed and the polishing layer 15 is no longer under pressure from the germanium wafer 30, the exhaust valve 18 is opened to re-inflate the cavity, causing the porous base 16 to move the polishing layer 15 back to its initial unpressurized state. After replacing the germanium wafer 30, the above steps are repeated to achieve an automatic polishing structure that adapts to the surface size of the wafer, ensuring the polishing effect of the device on wafers with different sizes.

[0027] Furthermore, the porous base 16 is provided with flexible pores 19 distributed parallel to the germanium wafer 30; When subjected to pressure, the flexible vent 19 contracts and releases gas. The gas is discharged into the air chamber 17 and then discharged through the exhaust valve 18. During the replacement of the germanium wafer 30, the air chamber 17 refills the flexible vent 19 with gas, and the flexible vent 19 rebounds and returns to its initial state.

[0028] Furthermore, the dust recovery device 5 also includes a spray device 20, a water hopper 21, a water baffle 22, a water storage tank 23, a recovery base 24, a wastewater tank 25, and a cleaning plate 26. The spray device 20 is respectively located on the upper two sides of the grinding base 4, the water hopper 21 is located on the left side of the grinding base 4, the water baffle 22 is located on the right side of the grinding base 4, the water storage tank 23 is located on the left side of the water hopper 21, the recovery base 24 is located on the left side of the water hopper 21, the wastewater tank 25 is located on the left side of the recovery base 24, and the cleaning plate 26 is respectively located on the left and right sides of the germanium wafer 30. The right end of the spray device 20 is connected to the water supply branch pipe of the workshop. In this process, the spray device 20 sprays water mist onto the grinding area when the germanium wafer 30 is rotated and polished. The water mist adsorbs and settles the dust generated by the rotation and polishing of the germanium wafer 30, creating a water mist barrier along the dust diffusion path to prevent further dust diffusion. The wastewater generated by the water mist dust removal is blocked and collected by the polishing layer 15 and the water baffle 22, and introduced into the water storage tank 23 through the water inlet 21. After the wastewater is collected in the water storage tank 23, it slowly flows out from the outlet on the left side of the water storage tank 23. After being separated by the recycling base 24, the dust in the wastewater remains above the recycling base 24, and the wastewater flows into the wastewater tank 25. During the dust recovery process, the cleaning plate 26 cleans the residual moisture on the wetted germanium wafer 30. In this way, dust is collected by spraying, while preventing excessive dust from spreading into the air environment. The dust carried out by the spraying is recovered after separation, reducing the dust diffusion range and increasing the dust recovery efficiency.

[0029] Furthermore, the right side of the water-blocking hopper 22 is raised upwards; The raised water-blocking bucket 22 can effectively block and collect sewage that is ejected due to the rotation of the germanium chip 30.

[0030] Furthermore, the recycling base 24 also includes a mounting base 27, an adsorption plate 28, and a gripping plate 29. The adsorption plate 28 is respectively disposed above the mounting base 27 and is slidably connected to the mounting base 27 through a sliding groove. The gripping plate 29 is respectively disposed on the front and rear sides of the adsorption plate 28. In this process, wastewater slowly flows from the water storage tank 23 to the top of the adsorption plate 28. The dust in the wastewater is adsorbed by the surface material of the adsorption plate 28 and remains on the upper surface of the adsorption plate 28. After adsorption and separation by multiple adsorption plates 28, the wastewater is discharged into the wastewater tank 25. When the adsorption plate 28 has been used for a period of time, it can be removed from the mounting base 27 by the gripping plate 29 when the germanium wafer 30 is replaced. The adsorption plate 28 with adsorbed dust can be recycled and reused after drying and dust recovery.

[0031] Furthermore, the surface of the adsorption plate 28 is composed of a porous silicone plate material; Among them, porous silica gel material can effectively adsorb dust particles in wastewater.

[0032] In summary, the device includes a base 1, a clamping device, and a polishing device. The clamping device vertically clamps the wafer, and the polishing device below polishes the edges. By adopting a vertical placement for polishing, the range of dust diffusion is shifted to the vertical direction, facilitating dust recovery. During polishing, the spraying device 20 sprays water mist above the polishing base 4, adsorbing and degrading the dust generated during polishing onto the polishing device. Then, the dust is separated and recovered along the recovery device to the left, preventing excessive dust diffusion into the air environment, reducing the dust diffusion range, and increasing the efficiency of dust recovery. During the process of changing the wafer to be polished, the polishing base 4 can repeatedly reset the bonding state, automatically adapting the polishing structure to fit the surface size of the wafer, ensuring the device's polishing effect on wafers of different sizes.

[0033] Working principle of the invention: When the device begins polishing the germanium wafer 30, the clamping device vertically clamps the germanium wafer 30 to be polished from both sides. The telescopic cylinder 6 is raised up and down via the telescopic control link 7 with the connection between the link 7 and the device base 1 as the axis. The link 7 drives the telescopic cylinder 6 on the mounting base 8 to perform lifting and lowering movements. The telescopic cylinder 6 is used to extend and retract the clamping device 3 at the front end to clamp the germanium wafer 30. The suction cup base 10 receives a gas control signal and is evacuated by the vacuum generator in the device control system. The vacuum is then connected to the internal cavity of the suction cup base 10 to connect the sponge suction cup 11 and the germanium wafer. A vacuum is drawn inside the contact surface of 30, so that the sponge suction cups 11 on both sides of the germanium wafer 30 can hold the germanium wafer 30. Then, the drive motor 13 drives the gear 14 at the output end to rotate, so that the rack 12 can drive the sponge suction cups 11 to rotate on the suction cup base 10, thereby providing power for the polishing of the germanium wafer 30. This vertical placement polishing method changes the range of dust generation and diffusion to the vertical direction. The dust generated by polishing is deposited downward in the vertical direction under the action of initial force and gravity, reducing the range of dust diffusion and making it easier for the dust recovery device 5 to recover the dust. The lower edge of the germanium wafer 30 is attached to the polishing base 4. The polishing layer 15 can be shaped by the gas injected into the air chamber 17 by the exhaust valve 18 to inflate the porous base 16. When the polishing layer 15 is subjected to pressure from the germanium wafer 30, the exhaust valve 18 stops the air intake. The flexible air holes 19 in the porous base 16 will contract and release the gas when subjected to pressure. The gas is discharged into the air chamber 17 and then discharged through the exhaust valve 18, causing the polishing layer 15 to deform and adhere to the edge surface of the germanium wafer 30. While the grinding device drives the germanium wafer 30 to grind, the dust collection device 5 sprays water mist at the point where dust is generated when the germanium wafer 30 contacts the grinding base 4. The water mist adsorbs and settles the dust generated by the rotation of the germanium wafer 30, creating a water mist barrier along the dust diffusion path to prevent further dust diffusion. The wastewater generated by the water mist dust removal is blocked and collected by the grinding layer 15 and the water baffle 22. The water baffle 22 can effectively block and collect the wastewater ejected due to the rotation of the germanium wafer 30. The wastewater is introduced into the water storage tank 23 through the water guide 21. After being collected in the water storage tank 23, the wastewater slowly flows out from the outlet on the left side of the water storage tank 23. The dust in the wastewater is retained on the upper surface of the adsorption plate 28 by the adsorption material on the surface of the porous silica gel material. After passing through multiple layers... After adsorption and separation by the adsorption plate 28, the wastewater is discharged into the wastewater tank 25. When the adsorption plate 28 has been used for a period of time, it can be removed from the mounting base 27 by the gripping plate 29 when the germanium wafer 30 is replaced. The adsorption plate 28 with adsorbed dust can be recycled and reused after drying and dust recovery. The dust in the wastewater remains above the recovery base 24, and the wastewater flows into the wastewater tank 25. During the dust recovery process, the cleaning plate 26 cleans the residual moisture on the wet germanium wafer 30. This dust collection method by spraying prevents excessive dust from spreading into the air environment. The dust carried out by the spray is recovered after separation, which reduces the dust diffusion range and increases the dust recovery efficiency. After polishing, the telescopic cylinder 6 drives the connecting rod 7 to lift the germanium wafer 30. After polishing, the polished layer 15 is no longer under the pressure of the germanium wafer 30. The air chamber 17 refills the flexible air hole 19 with air. The flexible air hole 19 springs back after being filled with air and returns to its initial state. After replacing with a new germanium wafer 30, the above steps are repeated to achieve an automatic polishing structure that fits the wafer surface size, ensuring the device can polish wafers with different sizes. This concludes the description of the working principle of the device.

[0034] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0035] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A grinding mechanism for a germanium wafer with recyclable powder, comprising a base (1), a clamping device, and a grinding device, wherein the clamping device is disposed on the upper right side of the base (1), and the grinding device is disposed on the upper left side of the base (1), characterized in that: The clamping device further includes a swing arm device (2) and a chuck device (3). The swing arm device (2) is respectively located on the front and rear sides of the germanium wafer (30) above the device base (1), and the chuck device (3) is respectively located on the left front end of the swing arm device (2). The polishing device further includes a polishing base (4) and a dust collection device (5). The polishing base (4), which automatically adapts to the size of the germanium wafer (30), is located below the germanium wafer (30), and the dust collection device (5) is located on the left side of the polishing base (4). The grinding base (4) also includes a grinding layer (15), a porous base (16), an air chamber (17), and an exhaust valve (18). The grinding layer (15) is located above the porous base (16), the air chamber (17) is located on the right side of the porous base (16), and the exhaust valve (18) is located on the right side of the air chamber (17) and connected to the air chamber (17) via a hose. The right side of the exhaust valve (18) is also connected to the workshop control branch via a hose. The dust collection device (5) also includes a spray device (20) and a water hopper (21). The grinding base (4) is equipped with a water-retaining hopper (22), a water storage tank (23), a recycling base (24), a wastewater tank (25), a cleaning plate (26), and a spray device (20). The spray device (20) is located on both sides above the grinding base (4). The water-drawing hopper (21) is located on the left side of the grinding base (4), the water-retaining hopper (22) is located on the right side of the grinding base (4), the water storage tank (23) is located on the left side of the water-drawing hopper (21), the recycling base (24) is located on the left side of the water-drawing hopper (21), and the wastewater tank (25) is located on the left side of the recycling base (24). The cleaning plates (26) are respectively set on the left and right sides of the germanium wafer (30), and the right end of the spray device (20) is connected to the water branch pipe of the workshop; the recycling base (24) also includes the mounting base (27), the adsorption plate (28), and the gripping plate (29). The adsorption plate (28) is respectively set above the mounting base (27) and is slidably connected to the mounting base (27) through the sliding groove. The gripping plate (29) is respectively set on the front and rear sides of the adsorption plate (28); the surface of the adsorption plate (28) is composed of porous silicone plate material.

2. The grinding mechanism for a germanium wafer with recyclable powder as described in claim 1, characterized in that: The swing arm device (2) also includes a telescopic cylinder (6), a connecting rod (7), a mounting base (8), and a sliding cylinder (9). The connecting rod (7) is located above the device base (1) and the right end of the connecting rod (7) is hinged to the device base (1). The telescopic cylinder (6) is located above the connecting rod (7) and the left end of the telescopic cylinder (6) is hinged to the middle part of the connecting rod (7). The right end of the connecting rod (7) is hinged to the right end of the device base (1). The mounting base (8) is located at the left end of the connecting rod (7). The sliding cylinder (9) is located above the mounting base (8). The telescopic cylinder (6) and the sliding cylinder (9) are connected to the control air pipe of the workshop through a flexible hose.

3. The grinding mechanism for a germanium wafer with recyclable powder as described in claim 1, characterized in that: The clamping device (3) further includes a suction cup base (10), a sponge suction cup (11), a rack (12), a drive motor (13), and a gear (14). The suction cup base (10) is located above the slide cylinder (9). The sponge suction cup (11) is located behind the suction cup base (10) and is in a sealed sliding connection with the suction cup base (10). The rack (12) is located on the front side of the sponge suction cup (11). The drive motor (13) is located on the right side of the suction cup base (10). The gear (14) is located at the output end of the drive motor (13) and meshes with the rack (12). The suction cup base (10) and the sponge suction cup (11) are internally connected by a cavity, and the suction cup base (10) is connected to the control branch pipe of the workshop by a flexible hose.

4. The grinding mechanism for a germanium wafer with recyclable powder as described in claim 1, characterized in that: The porous base (16) is provided with flexible pores (19) distributed parallel to the germanium wafer (30).

5. The grinding mechanism for a germanium wafer cylindrical grinding machine with recyclable powder as described in claim 1, characterized in that: The right side of the water-blocking bucket (22) is raised upward.

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