Semiconductor device dicing cleaning apparatus and process

Abstract

The application discloses a kind of semiconductor device cutting cleaning equipment and process, including the following steps: loading step: directly with adhesive film as carrier installation in the fixture platform of cleaning equipment for the package that cutting is completed on adhesive film, and fixed firmly, package is neatly arranged and adheres to adhesive film surface;Surface flushing step: adjusting the position of spray head, so that spray head is located above package, and spray head sprays cleaning fluid to flush package surface;Side cleaning step: adjusting the position of ejector rod, so that ejector rod is located between adjacent packages, and control ejector rod, and ejector rod is vertically upward from the bottom of adhesive film to lift adhesive film, and the spacing of adjacent packages is expanded, and cleaning fluid flushes package side;Drying step: spray head stops spraying cleaning fluid and changes to blowing, and the application is displaced by spray head front and back, left and right and up and down, and sprays cleaning fluid while being displaced, to ensure that every position of package on adhesive film is flushed clean, to ensure cleaning effect.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor device cleaning technology, and particularly relates to a semiconductor device cutting and cleaning equipment and process. Background Technology

[0002] The packaging process generally involves arranging multiple bare chips neatly, then using a series of technologies to achieve the layout, connection, and encapsulation of each bare chip. After the encapsulation has cured, the entire encapsulation needs to be cut into product units. Cutting is a process in which the encapsulation material is vertically cut on a cutting track in a safe area until the final product unit is formed. To prevent material from flying out during cutting, the entire encapsulation needs to be adhered to an adhesive film for cutting, cutting down to the upper part of the adhesive film without cutting through it, so as to ensure that the product unit is completely cut. After cutting, cutting waste and dust are easily adhered to the product surface, so cleaning equipment is needed to clean it to ensure that the product's appearance is up to standard.

[0003] Existing cleaning equipment, after the product is cut into units, does not peel the product units from the adhesive film. Instead, it directly sprays and rinses all product units with spray heads. The spray heads and clamping platforms are fixed and the rinsing direction is unidirectional. Cut gaps are formed between adjacent product units. Due to surface tension, the cleaning fluid has difficulty penetrating the cut gaps to rinse the sides of the product. Therefore, it is impossible to effectively clean the sides of the product units. Dust or waste mixed in with the sides of the product is difficult to clean, affecting the product's appearance. Other equipment, such as centrifugal cleaning equipment, is not suitable for cleaning larger particles because large particles attached to the film are easily detached and thrown away during centrifugation, causing difficulties in subsequent processes, such as product feeding trays and subsequent packaging operations, and even damaging the product's appearance. Summary of the Invention

[0004] To address the problems in the prior art, the present invention provides a semiconductor device cutting and cleaning equipment and process.

[0005] To achieve the above objectives, the present invention proposes a semiconductor device cutting and cleaning process, comprising the following steps: Loading steps: The packaged bodies cut on the adhesive film are directly installed on the clamping platform of the cleaning equipment using the adhesive film as a carrier and fixed firmly. The packaged bodies are neatly arranged and adhered to the surface of the adhesive film. Surface rinsing step: Adjust the nozzle position so that the nozzle is above the package body, and spray the cleaning solution from the nozzle to rinse the surface of the package body; Side cleaning steps: Adjust the position of the push rod so that it is positioned between adjacent packages. Control the push rod so that it lifts the adhesive film vertically upward from the bottom of the adhesive film, thereby widening the gap between adjacent packages. Rinse the sides of the packages with cleaning solution. Drying steps: Stop spraying cleaning fluid from the nozzle and switch to blowing air. Adjust the tilt angle of the fixture platform and use the push rod to lift the adhesive film to dry the residual cleaning fluid.

[0006] Furthermore, in the loading step, the edge of the adhesive film is first clamped and fixed initially using a magnetic ring. Corner clips are installed around the clamping platform, and the magnetic ring is inserted into the corner clips and fixed to the clamping platform by tightening the bolts.

[0007] Furthermore, in the surface rinsing step, one or more nozzles are arranged at even intervals, and the nozzles move horizontally or vertically during the spraying process, so that the surface of each package is rinsed.

[0008] Furthermore, in the side cleaning step, one or more push rods are arranged at even intervals. The position of the push rod and the nozzle is always kept on the same vertical line. After moving horizontally in sync, the push rod moves vertically to lift the bottom of the adhesive film upwards, and the nozzle keeps rinsing the side of the encapsulated part of the lifted area.

[0009] Furthermore, in the surface rinsing step and the side cleaning step, the nozzle is connected to a liquid pipe and an air pipe.

[0010] A semiconductor device cutting and cleaning device includes a machine base and further includes: The clamping platform has a bottom edge connected by a hydraulic rod, which allows the tilt angle of the clamping platform to be adjusted. The clamping platform fixes the adhesive film on the machine base. The adhesive film serves as a carrier, and the surface is bonded with neatly arranged encapsulated bodies after cutting. The nozzle is adjustable and located above the encapsulation body. A lead screw component is installed on the machine base so that the nozzle can move left and right and forward and backward. An electric telescopic rod is installed so that the nozzle can move vertically up and down. The nozzle moves closer to or away from the top of the encapsulation body and sprays cleaning fluid to clean the surface of the encapsulation body. The push rod is adjustable in position and moves synchronously with the nozzle. The push rod, which moves vertically, pushes the adhesive film upward from the bottom of the adhesive film to widen the distance between adjacent packages. The nozzle sprays cleaning fluid to rinse the sides of the packages. The nozzle stops spraying cleaning fluid and switches to blowing air. The clamp platform is adjusted to tilt at a certain angle, and the push rod is used to lift the adhesive film to dry the residual cleaning fluid.

[0011] Furthermore, the edge of the adhesive film is first clamped and fixed initially by a magnetic ring. Corner clips are installed around the clamping platform to hold the magnetic ring in the corner clips and fix it to the clamping platform by tightening bolts.

[0012] Furthermore, one or more nozzles are arranged at even intervals, and the nozzles move horizontally or vertically during spraying, so that the surface of each package is rinsed.

[0013] Furthermore, one or more push rods are arranged at even intervals, and the push rods and the nozzles are moved synchronously, with the positions of the push rods and the nozzles always remaining on the same vertical line.

[0014] Furthermore, the push rod is also moved synchronously with the nozzle through a lead screw component and an electric telescopic rod installed on the machine base. The vertically upward-moving push rod lifts the bottom of the adhesive film upward, while the nozzle keeps rinsing the side of the encapsulated part of the lifted area.

[0015] Furthermore, the nozzle is connected to a liquid pipe and a gas pipe.

[0016] This invention: 1. By moving the nozzle back and forth, left and right, and up and down, the cleaning fluid is sprayed while moving to ensure that the encapsulation at every position on the adhesive film is cleaned, thus ensuring the cleaning effect; 2. The push rod and the nozzle move horizontally or vertically in sync. The push rod moves vertically upward to lift the bottom of the adhesive film upward, increasing the distance between adjacent encapsulated bodies. The nozzle moves vertically downward to approach the encapsulated body for rinsing, so that the sides of the encapsulated body can also be rinsed clean. Dust or waste mixed on the sides of the product is also cleaned, ensuring the product appearance is qualified and simplifying the process. 3. The fixture platform can be tilted at a certain angle, so that each side of the package can be thoroughly rinsed. It also facilitates the tilting out of the cleaning fluid. Combined with the blower nozzle, the drying is faster and the drying effect is better. Attached Figure Description

[0017] Figure 1 This is a process flow diagram of a semiconductor device cutting and cleaning process according to the present invention; Figure 2 This is a perspective view of a semiconductor device cutting and cleaning device according to the present invention; Figure 3 This is a schematic diagram of the structure of a nozzle for a semiconductor device cutting and cleaning device according to the present invention; Figure 4 This is a schematic diagram of the fixture platform of a semiconductor device cutting and cleaning equipment according to the present invention; Figure 5 This is a schematic diagram of the adhesive film structure of a semiconductor device cutting and cleaning equipment according to the present invention.

[0018] In the diagram: 1. Machine base; 2. Fixture platform; 3. Adhesive film; 4. Encapsulation body; 5. Nozzle; 6. Top rod; 7. Magnetic ring; 8. Angle clamp; 9. First support rod; 10. First slider; 11. Second support rod; 12. Second slider; 13. Electric telescopic rod; 14. Vertical pole; 15. Hydraulic rod. Detailed Implementation

[0019] The present invention will now be described in conjunction with specific embodiments, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout.

[0020] The directional terms used in this invention, such as up, down, left, right, front, back, inside, outside, front, back, side, etc., are merely for reference to the accompanying drawings. The embodiments and directional terms used in the following description with reference to the accompanying drawings are exemplary and are only used to explain this invention, and should not be construed as limiting this invention. Furthermore, the various specific processes and materials provided in this invention are examples that those skilled in the art will recognize for the application of other processes and / or the use of other materials.

[0021] To better understand the purpose, structure, and function of this invention, the following description is provided in conjunction with the appendix. Figure 1 -Appendix Figure 5 The present invention will provide a more detailed description of the semiconductor device cutting and cleaning equipment and process proposed herein.

[0022] Before each step in the semiconductor packaging method of the present invention is carried out, a unitized package 4 needs to be formed first as the basis for subsequent process implementation. The unitized package 4 in the semiconductor packaging method is obtained through the product cutting step.

[0023] Specifically, after being packaged using layer-by-layer encapsulation technology, the bare die becomes a package board. The bare die can be an optoelectronic device, a micro-electromechanical system (MEMS), a power amplifier chip, a power management chip, a biometric device, a microfluidic system, a light-emitting diode (LED), a resistor, a capacitor, etc., but is not limited to these. The selection depends on the specific product. Based on the safety area reserved in the product design, the safety area refers to the area where the product unit will not be damaged during cutting. That is, the bare die, the wiring layer and pins plated on the bare die, etc., do not exceed the safety area. Only the encapsulation material is in the safety area. Cutting the encapsulation material makes the product unitized. A cutting channel is designed in the safety area. The width of the safety area is greater than the width of the cutting channel. This is a common cutting channel and safety area design in this packaging field. The encapsulation material is cut at the cutting channel position.

[0024] First, the encapsulated board is peeled off from the carrier board and then adhered to the adhesive film 3. The adhesive film 3 is made of materials commonly used in the field, such as polyimide (PI), polyethylene terephthalate (PET), silicone, or blue glue. Then, using a cutting blade commonly used in the art, the encapsulation board is cut at the cutting track position. The cutting blade cuts from top to bottom perpendicular to the adhesive film 3 until the encapsulation board is completely cut off and part of the adhesive film 3 is cut off. After cutting, the unitized product package 4 remains attached to the original position of the adhesive film 3. The package 4 is neatly and evenly arranged on the surface of the adhesive film 3. The adhesive film 3 is then removed from the cutting platform as a whole, awaiting the next cleaning process.

[0025] Please see the appendix Figure 1 The semiconductor device cutting and cleaning process includes the following steps: Loading steps: The package 4, which has been cut on the adhesive film 3, is directly installed on the clamping platform 2 of the cleaning equipment using the adhesive film 3 as a carrier and is fixed firmly. The package 4 is neatly arranged and adhered to the surface of the adhesive film 3. Surface rinsing step: Adjust the position of nozzle 5 so that nozzle 5 is above the package 4, and nozzle 5 sprays cleaning fluid to rinse the surface of package 4. Side cleaning steps: Adjust the position of the push rod 6 so that the push rod 6 is between adjacent packages 4. Control the push rod 6 so that the push rod 6 vertically pushes the adhesive film 3 from the bottom of the adhesive film 3 upwards, widening the distance between adjacent packages 4. The cleaning solution rinses the side of the package 4. Drying steps: Stop spraying cleaning fluid from nozzle 5 and switch to blowing air. Adjust the tilt angle of clamp platform 2 and use push rod 6 to lift adhesive film 3 to dry the residual cleaning fluid.

[0026] In the loading step, the unitized package 4 obtained through the above-mentioned product cutting step is installed on the machine base 1 of the cleaning equipment using the adhesive film 3 as a carrier. First, the edge of the adhesive film 3 is clamped by the magnetic ring 7. Then, the magnetic ring 7 is installed into the corner clamp 8 on the clamping platform 2 of the cleaning equipment. The bolts passing through the corner clamp 8 are adjusted to clamp the magnetic ring 7, thereby fixing the adhesive film 3 firmly. Multiple clamping platforms 2 can be set on the machine base 1 at the same time to increase the cleaning volume at one time. This application takes setting one clamping platform 2 as an example.

[0027] In the surface rinsing step, a first support rod 9 is installed on the machine base 1. A lead screw component is installed at one end of the first support rod 9. The output shaft of the lead screw rotates inside the first support rod 9, driving the first slider 10, which is screwed in, to move back and forth on the first support rod 9. Another lead screw component is installed above the first slider 10. Similarly, the output shaft of this lead screw rotates inside the second support rod 11, driving the second slider 12, which is screwed in, to move left and right on the second support rod 11. An electric telescopic rod 13 is installed on the side of the second slider 12. A nozzle 5 is installed at the output end of the electric telescopic rod 13. The nozzle 5 is located above the encapsulation body 4 and its position is adjustable. It can move back and forth, left and right, and up and down. The nozzle 5 is connected to a liquid pipe and an air pipe. During cleaning, the nozzle 5 sprays cleaning fluid to rinse the surface of the encapsulation body 4. The cleaning fluid sprayed by the nozzle 5 is pure water or ultrapure water.

[0028] Pure water refers to water in which both easily removable strong electrolytes and difficult-to-remove weak electrolytes such as silica have been removed to a certain extent. Pure water has a salt content below 1.0 mg / L and an electrical conductivity less than 5.0 μS / cm.

[0029] Ultrapure water (also known as high-purity water or UP water) refers to water in which almost all conductive media have been removed, and non-dissociated colloidal substances, gases, and organic matter have also been removed to very low levels. Ultrapure water has a salt content of less than 0.3 mg / L and a conductivity of less than 0.2 μS / cm.

[0030] In the side cleaning step, a push rod 6 is also installed on the machine base 1. The connection structure between the push rod 6 and the nozzle 5 is the same. The push rod 6 is located below the encapsulation body 4. The positions of the push rod 6 and the nozzle 5 are always kept on the same vertical line. The number of push rods 6 and nozzles 5 can be configured as one or more according to actual production needs and arranged at even intervals. This application takes one configuration as an example. The cleaning equipment system controls the screw component connected to the nozzle 5 and the screw component connected to the push rod 6 to operate synchronously to ensure that the push rod 6 and the nozzle 5 move horizontally synchronously, ensuring that the encapsulation body 4 at each position on the adhesive film 3 is evenly cleaned. It can be rinsed to ensure cleaning effect. The system controls the electric telescopic rod 13 connected to the nozzle 5 and the electric telescopic rod 13 connected to the top rod 6 to operate synchronously, so as to ensure that the top rod 6 and the nozzle 5 move vertically at the same time. The nozzle 5 moves vertically downward to approach the encapsulation body 4 for rinsing, and the top rod 6 moves vertically upward to lift the bottom of the adhesive film 3 upward, expanding the distance between adjacent encapsulation bodies 4, so that the sides of the encapsulation body 4 can also be rinsed clean. It can effectively clean all sides of the product unit, and the dust or waste mixed on the sides of the product is also cleaned, ensuring the product appearance and simplifying the process.

[0031] Furthermore, the clamping platform 2 installed on the cleaning equipment has support members at its four corners. The support members at the two corners on the same side are uprights 14, and the ends of the uprights 14 are rotatably connected to the clamping platform 2. The support members at the two corners on the other side are hydraulic rods 15. By operating the two hydraulic rods 15 synchronously, the clamping platform 2 can be tilted at a certain angle to ensure that all sides of the package 4 can be completely rinsed.

[0032] In the drying process, the nozzle 5 stops spraying cleaning fluid and switches to blowing air, which can be nitrogen or other stable gases. At the same time, the push rod 6 continues to push the adhesive film 3 vertically upward at the blowing part of the nozzle, which increases the distance between adjacent encapsulated bodies 4. The residual cleaning fluid is completely blown away, resulting in a good drying effect. In conjunction with the clamping platform 2 tilting at a certain angle, it is beneficial for the cleaning fluid to detach from the clamping platform 2 more quickly, resulting in high drying efficiency.

[0033] This invention controls the synchronous horizontal displacement of the push rod 6 and the nozzle 5 to ensure that each encapsulated body 4 on the adhesive film 3 can be rinsed, guaranteeing the cleaning effect. The push rod 6 and the nozzle 5 move vertically synchronously. The nozzle 5 moves vertically downward to approach the encapsulated body 4 for rinsing, while the push rod 6 moves vertically upward to lift the bottom of the adhesive film 3, increasing the distance between adjacent encapsulated bodies 4, so that the sides of the encapsulated bodies 4 can also be rinsed clean. Dust or waste mixed on the sides of the product is also cleaned, ensuring the product appearance and simplifying the process. The fixture platform 2 can be tilted at a certain angle for more comprehensive rinsing. The nozzle 5 blows air to completely blow away any residual cleaning liquid, resulting in good drying effect. The tilted fixture platform 2 also helps the cleaning liquid to detach from the fixture platform 2 more quickly, resulting in high drying efficiency.

[0034] The packaging process used in the package body 4 of this invention is to form a package by means of injection molding with molding compound. Package refers to the process of mounting a semiconductor integrated circuit chip in a shell, attaching, fixing and connecting the chip layout, and finally forming an overall three-dimensional structure. The packaging process plays an important role in the semiconductor manufacturing field. When the chip is packaged, the electrical circuit of the chip is brought out to the outside of the package body 4 through the metal circuit layer, and the metal located outside the package body 4 becomes the pin. The pin is the port for the entire package structure to be electrically connected to the outside.

[0035] The encapsulation materials used in this invention can be epoxy resin, cyanate ester, polyimide, etc., which are low in cost and have good curing performance. Encapsulation technology plays an important role in the semiconductor manufacturing field, mainly in terms of protection, connection, support, reliability, and promoting technological progress. The protection function refers to the chip encapsulation's ability to protect the chip from mechanical damage, moisture, dust, and other external environmental factors, ensuring the chip's normal operation in extreme environments. The connection function refers to the encapsulation providing a way to connect the chip to other electronic components, enabling the chip to be installed and used on the circuit board. The support function refers to the encapsulation's ability to support the chip while fixing it, preventing damage. The reliability function refers to the increasingly higher requirements for the reliability of encapsulation materials and processes to ensure that the chip can operate normally in various extreme environments.

[0036] After the cleaning process is completed, the package 4 needs to undergo a series of operations, such as finished product testing after packaging. It usually goes through processes such as incoming inspection, testing, and packaging on the product tray before finally being put into storage and shipped.

[0037] Please see the appendix Figure 2 -Appendix Figure 5 Through the above semiconductor device cutting and cleaning process, a semiconductor device cutting and cleaning equipment is obtained. This cleaning equipment includes a machine base 1 and also includes: The bottom edge of the clamping platform 2 is rotatably connected by a hydraulic rod 15, making the tilt angle of the clamping platform 2 adjustable. The edge of the adhesive film 3 is first clamped by a magnetic ring 7 for initial fixation. Angle clips 8 are installed around the upper surface of the clamping platform 2. After the magnetic ring 7 clamps the adhesive film 3, it is stuck in the angle clip 8 and fixed by tightening the bolts on the angle clip 8. The clamping platform 2 fixes the adhesive film 3 on the machine base 1. The adhesive film 3 serves as a carrier, and the surface is adhered with neatly arranged encapsulated bodies 4 after cutting. The nozzle 5 is adjustable and located above the encapsulation body 4. A screw component is installed on the machine base 1 to allow the nozzle 5 to move left and right and back and forth. An electric telescopic rod 13 is installed to allow the nozzle 5 to move vertically up and down. The nozzle 5 moves closer to or away from the top of the encapsulation body 4. The nozzle 5 sprays cleaning fluid to clean the surface of the encapsulation body 4. There is one nozzle 5 or multiple nozzles evenly spaced. The nozzle 5 can move horizontally or vertically during the spraying process. The surface of each encapsulation body 4 is rinsed. The nozzle 5 moves vertically downward to approach the encapsulation body 4 for rinsing. The nozzle 5 is connected to a liquid pipe and a gas pipe. The cleaning equipment system controls the solenoid valve in the pipeline to open the liquid pipe to spray cleaning fluid or open the gas pipe to blow air for drying. The sprayed cleaning fluid is pure water or ultrapure water, and the blown air is nitrogen or other stable gas. The top rod 6 is adjustable in position and moves horizontally in sync with the nozzle 5. The top rod 6, which moves vertically, lifts the adhesive film 3 from the bottom and expands the distance between adjacent encapsulated bodies 4. The nozzle 5 sprays cleaning fluid to rinse the sides of the encapsulated bodies 4. There is one or multiple top rods 6 arranged at even intervals. The top rod 6 moves horizontally in sync with the nozzle 5. The positions of the top rod 6 and the nozzle 5 are always kept on the same vertical line. The top rod 6 also achieves synchronous horizontal movement with the nozzle 5 through the lead screw component and electric telescopic rod 13 installed on the machine base 1. Therefore, the displacement drive connection structure of the nozzle 5 is the same as the displacement drive connection structure of the top rod 6. The top rod 6 moves vertically upward to lift the adhesive film 3 upward, expands the distance between adjacent encapsulated bodies 4, and the nozzle 5 keeps rinsing the sides of the encapsulated bodies 4 at the lifted part. The nozzle 5 stops spraying cleaning fluid and switches to blowing air. The clamp platform 2 is adjusted to tilt at a certain angle, and the push rod 6 is used to lift the adhesive film 3 to dry the residual cleaning fluid.

[0038] The selection, installation requirements, and connection methods of all the above electrical components are common knowledge in existing mechanical design and are not the focus of this application. This application does not impose any restrictions on them and will not elaborate further.

[0039] This invention uses the nozzle 5 to move back and forth, left and right, and up and down while spraying cleaning fluid, ensuring that each encapsulated body 4 on the adhesive film 3 can be cleaned, thus guaranteeing the cleaning effect. The top rod 6 is controlled by a lead screw component to move horizontally or vertically synchronously with the nozzle 5. The top rod 6 moves vertically upward to lift the bottom of the adhesive film 3, increasing the distance between adjacent encapsulated bodies 4 and exposing the sides of the encapsulated bodies 4. The nozzle 5 moves vertically downward to approach the encapsulated bodies 4 for rinsing, so that the sides of the encapsulated bodies 4 can also be cleaned. Dust or waste mixed in with the sides of the product is also cleaned, ensuring the product's appearance is qualified and simplifying the process. The clamping platform 2 can be tilted at a certain angle, allowing the nozzle 5 to rinse more thoroughly. Moreover, during drying, it is more conducive to the flow of cleaning fluid out of the clamping platform 2, resulting in better drying effect and higher drying efficiency.

[0040] It is understood that this invention has been described through some embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of this invention. Furthermore, under the teachings of this invention, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of this invention. Therefore, this invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this invention are within the protection scope of this invention.

Claims

1. A semiconductor device cutting and cleaning process, characterized in that, Includes the following steps: Loading steps: The packaged bodies cut on the adhesive film are directly installed on the clamping platform of the cleaning equipment using the adhesive film as a carrier and fixed firmly. The packaged bodies are neatly arranged and adhered to the surface of the adhesive film. Surface rinsing step: Adjust the nozzle position so that the nozzle is above the package body, and spray the cleaning solution from the nozzle to rinse the surface of the package body; Side cleaning steps: Adjust the position of the push rod so that it is positioned between adjacent packages. Control the push rod so that it lifts the adhesive film vertically upward from the bottom of the adhesive film, thereby widening the gap between adjacent packages. Rinse the sides of the packages with cleaning solution. Drying steps: Stop spraying cleaning fluid from the nozzle and switch to blowing air. Adjust the tilt angle of the fixture platform and use the push rod to lift the adhesive film to dry the residual cleaning fluid. During the side cleaning step, the position of the push rod and the nozzle is always kept on the same vertical line. After moving horizontally in sync, the push rod moves vertically to lift the bottom of the adhesive film upwards, while the nozzle continues to rinse the side of the encapsulated part of the lifted area.

2. The semiconductor device cutting and cleaning process according to claim 1, characterized in that, In the loading step, the edge of the adhesive film is first clamped and fixed initially using a magnetic ring. Angle clips are installed around the clamping platform. The magnetic ring is then inserted into the angle clips and fixed to the clamping platform by tightening the bolts.

3. The semiconductor device cutting and cleaning process according to claim 1, characterized in that, In the surface rinsing step, one or more nozzles are arranged at even intervals. The nozzles move horizontally or vertically during the spraying process, and the surface of each package is rinsed.

4. The semiconductor device cutting and cleaning process according to claim 3, characterized in that, In the side cleaning step, one or more top rods are arranged at even intervals.

5. The semiconductor device cutting and cleaning process according to claim 1, characterized in that, In the surface rinsing step and the side cleaning step, the nozzle is connected to a liquid pipe and an air pipe.

6. A semiconductor device cutting and cleaning equipment, comprising a machine base, characterized in that, It also includes: The clamping platform has a bottom edge connected by a hydraulic rod, which allows the tilt angle of the clamping platform to be adjusted. The clamping platform fixes the adhesive film on the machine base. The adhesive film serves as a carrier, and the surface is bonded with neatly arranged encapsulated bodies after cutting. The nozzle is adjustable and located above the encapsulation body. A lead screw component is installed on the machine base so that the nozzle can move left and right and forward and backward. An electric telescopic rod is installed so that the nozzle can move vertically up and down. The nozzle moves closer to or away from the top of the encapsulation body and sprays cleaning fluid to clean the surface of the encapsulation body. The push rod is adjustable in position and moves horizontally in sync with the nozzle. The push rod, which moves vertically, pushes the adhesive film upward from the bottom of the adhesive film to widen the distance between adjacent packages. The nozzle sprays cleaning fluid to rinse the sides of the packages. The nozzle stops spraying cleaning fluid and switches to blowing air. The clamp platform is adjusted to tilt at a certain angle, and the push rod is used to lift the adhesive film to dry the residual cleaning fluid. The push rod and the nozzle move horizontally in sync, and the positions of the push rod and the nozzle always remain on the same vertical line.

7. The semiconductor device cutting and cleaning equipment according to claim 6, characterized in that, The edge of the adhesive film is first clamped and fixed initially by magnetic rings. Corner clips are installed around the clamping platform to hold the magnetic rings in the corner clips and fix them to the clamping platform by tightening bolts.

8. The semiconductor device cutting and cleaning equipment according to claim 7, characterized in that, The nozzles are arranged in one or more uniformly spaced positions. The nozzles move horizontally or vertically during the spraying process, and the surface of each package is rinsed.

9. The semiconductor device cutting and cleaning equipment according to claim 6, characterized in that, The top rods are arranged in one or more uniformly spaced positions.

10. The semiconductor device cutting and cleaning equipment according to claim 6, characterized in that, The push rod is also moved horizontally in sync with the nozzle through a lead screw assembly and an electric telescopic rod installed on the machine base. The vertically upward-moving push rod lifts the bottom of the adhesive film upward, while the nozzle keeps rinsing the side of the encapsulated part of the lifted area.

11. The semiconductor device cutting and cleaning equipment according to claim 6, characterized in that, The nozzle is connected to a liquid pipe and a gas pipe.

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