Liquid ejecting apparatus and method for manufacturing article

Abstract

The invention provides a liquid ejecting apparatus and a method of manufacturing an article. The liquid ejecting apparatus includes: a substrate stage that holds a substrate; an ejection member that ejects a liquid onto the substrate held on the substrate stage; a first chamber that covers the substrate stage and the discharge member; a second chamber that covers the first chamber; and a control means for controlling a first pressure inside the first chamber and a second pressure outside the first chamber and inside the second chamber, the control means controlling such that the second pressure is higher than the first pressure and the second pressure is higher than the pressure outside the second chamber.

Description

Technical Field

[0001] The present invention relates to a liquid ejection device and a method for manufacturing an article. Background Art

[0002] In recent years, when manufacturing various functional elements, attempts have been made to use an inkjet device (liquid ejection device) to impart a material of the functional element to form a pattern (patterning).

[0003] Patterning using an inkjet device has the advantages of being able to pattern on demand, having high material utilization efficiency, being a non-vacuum process and having a relatively small manufacturing device, and being able to coat a large area at high speed.

[0004] In addition, recently, color conversion units including quantum dot materials and display devices having quantum dots as light-emitting elements have attracted attention. For example, a technology for manufacturing color conversion units including quantum dot materials using an inkjet device has been proposed. Color conversion units using conventional color filters extract specific colors by removing light of wavelengths other than a specific wavelength. By using quantum dots in the color conversion unit instead of conventional color filters, it is possible to directly convert the wavelength of light, and therefore it is expected that very high light conversion efficiency can be achieved.

[0005] As the main components of quantum dots, cadmium, indium, lead, etc. are known, but the above heavy metal substances are toxic to the human body (harmful substances), so it is necessary to prevent exposure to the human body. Here, if the use of an inkjet device to impart quantum dot materials is considered, the characteristics of the inkjet are called mist, and the mist-like small droplets containing the quantum dot material are scattered, so strict safety measures are required.

[0006] As a countermeasure for exposure of the inkjet device, a technology has been proposed: the inkjet device is isolated (partitioned) by a barrier called a chamber, and the air inside the chamber is sealed (see Patent Document 1). In addition, Patent Document 1 also proposes: in order to always keep the inside of the chamber clean, the air inside the chamber is circulated by a blower, and a filter is arranged in the circulation path to remove the air inside the chamber.

[0007] In addition, Patent Document 2 discloses a clean room device for preventing particles from entering the device and preventing odorous gases and harmful gases from leaking out of the device. Patent Document 2 discloses that when the pressure in the first compartment where the device is installed is set to P1, the pressure in the clean room is set to Pc, and the pressure in the second compartment connecting the first compartment and the clean room is set to P2, the pressure is adjusted to P1>Pc>P2.

[0008] Patent Literature

[0009] Patent Document 1: Japanese Patent Application Publication No. 2021-12815

[0010] Patent Document 2: Japanese Patent Application Publication No. 2015-206549 Summary of the invention

[0011] Problem that the invention aims to solve

[0012] However, the method described in Patent Document 2 has the following hidden dangers: the gas in the second compartment contains harmful substances, and the harmful substances leak from the second compartment to the clean room. For example, consider the following situation: when the processed object is unloaded from the device, the atmospheric gas generated by the transport of the processed object is drawn in, causing the atmospheric gas in the second compartment to leak into the clean room. In addition, as long as there is a small gap in the partition wall of the second compartment, the duct connection part, etc., there is a possibility that the harmful substances will be squeezed into the clean room due to the pressure difference of P1>Pc.

[0013] Therefore, an object of the present invention is to provide a liquid ejection device which is advantageous in achieving safety measures for the liquid ejection device.

[0014] In order to achieve the above-mentioned purpose, a liquid ejection device as a technical solution of the present invention is characterized in that it comprises: a substrate stage, which holds a substrate; a ejection component, which ejects liquid toward the substrate held on the substrate stage; a first chamber, which covers the substrate stage and the ejection component; a second chamber, which covers the first chamber; and a control component, which controls a first pressure in the first chamber and a second pressure outside the first chamber and in the second chamber, and the control component controls the second pressure to be higher than the first pressure and the second pressure to be higher than the pressure outside the second chamber.

[0015] According to the present invention, it is possible to provide a liquid ejecting device which is advantageous in achieving safety measures for the liquid ejecting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram showing the structure of the inkjet device according to the first embodiment.

[0017] Figure 2 This is a schematic diagram showing the structure of an inkjet device according to a second embodiment.

[0018] Figure 3 This is a schematic diagram showing the structure of an inkjet device according to a third embodiment.

[0019] Figure 4 It is a flowchart of the manufacturing method of an item.

[0020] Description of Reference Numerals

[0021] 1. Inkjet device (liquid ejection device); 2. Substrate; 3. Substrate stage; 5. Inkjet head (ejection component); 11. First supply pipeline (control component); 12. First exhaust pipeline (control component); 21. Second supply pipeline (control component); 22. Second exhaust pipeline (control component); 40. First chamber; 50. Second chamber; P1. First pressure; P2. Second pressure. DETAILED DESCRIPTION

[0022] Hereinafter, preferred embodiments of the present invention will be described in detail based on the drawings. In addition, in each of the drawings, the same reference numerals are given to the same components, and repeated descriptions are omitted.

[0023] <First embodiment>

[0024] Figure 1 This is a schematic diagram showing the structure of the inkjet device of this embodiment. Figure 1 The basic structure and operating principle of the inkjet device 1 (liquid ejection device) of the present embodiment are described below. The inkjet device 1 has a substrate stage 3, which is used to carry and hold a substrate 2 that serves as a base material for a display panel (liquid crystal display, OLED display, etc.). The substrate 2 uses a substrate appropriately selected from a glass substrate or a plastic substrate, etc., depending on the target product to be manufactured. The substrate 2 is typically a rectangular plate-like member, but as long as it can function as a base material, the shape is not limited, for example, it can be a deformable film, or a circular substrate can be used. A pixel area 201 is provided on the substrate 2, and the pixel area 201 is used to apply ink and arrange to form a large number of display pixels.

[0025] The inkjet device 1 includes an inkjet head 5 (discharging member) capable of discharging ink droplets 4 toward a predetermined position on a substrate 2 , an ink supply system 6 for supplying ink to the inkjet head 5 , and an ink cartridge 7 for storing ink.

[0026] The inkjet heads 5 are arranged in the main scanning direction and the sub-scanning direction orthogonal to the main scanning direction of the substrate stage 3. The inkjet heads 5 can apply ink of a desired distribution to the pixel area 201 on the substrate 2 by individually controlling the ejection of ink droplets 4 from each inkjet head 5.

[0027] Here, considering that the functional element formed on the substrate is a structure including a quantum dot material (e.g., a color conversion unit), the ink ejected by the inkjet head 5 includes the quantum dot material. Since the quantum dot material includes at least one heavy metal substance among cadmium, indium, and lead, it is necessary to prevent exposure to the human body.

[0028] The substrate stage 3 and the inkjet head 5 are covered by the first chamber 40. The substrate stage 3 and the inkjet head 5 are supported by the first chamber 40. Hereinafter, the space in the first chamber is referred to as a first space 10, and the pressure of the first space 10 is referred to as a first pressure P1.

[0029] When ink droplets 4 are ejected from the inkjet head 5, the ejected ink droplets 4 (main droplets) land on the pixel area 201 of the substrate 2 held by the substrate stage 3. At this time, a part of the ink ejected from the inkjet head 5 becomes fine granular fine ink 8 not included in the main droplets and scatters into the air of the first space 10. If the ink contains a quantum dot material, there is a case where the fine ink 8 is harmful to the human body. Therefore, a safety measure is sought to prevent the gas in the first space 10 containing the fine ink 8 from leaking to the clean room space 30 outside the inkjet device 1.

[0030] Therefore, in this embodiment, the second chamber 50 is provided to cover the first chamber 40. Hereinafter, the space outside the first chamber and inside the second chamber is referred to as the second space 20, and the pressure of the second space 20 is referred to as the second pressure P2. In addition, the pressure of the clean room space 30 is referred to as P3.

[0031] In addition, the first chamber 40 is provided with a first opening 9, and the second chamber 50 is provided with a second opening 53. The first opening 9 and the second opening 53 are provided, for example, so that the substrate 2 can be carried from the clean room space 30 to the substrate stage 3. At least one of the first opening 9 and the second opening 53 can also be configured to be able to open and close, and can be in an open state when the substrate is carried in, and in a closed state after the substrate is carried in. For example, an opener 54 is provided at the second opening 53. A slit 51 that connects the clean room space 30 and the second space 20, and a skirt 52 that can adjust the opening area of ​​the slit 51 can also be provided in the second chamber 50.

[0032] Here, if foreign matter adheres to the pixel area 201 on the substrate 2, it will cause defects in the components in this part. Therefore, the first space 10 for processing the substrate 2 is preferably a space with a high cleanliness level from which foreign matter is removed. The inkjet device 1 has a first supply pipe 11 (first supply unit) for supplying gas to the first space 10 in the first chamber 40 and a first exhaust pipe 12 (first exhaust unit) for exhausting gas from the first space 10 in the first chamber 40. The first supply pipe 11 supplies clean gas from which foreign matter is removed. A first filter 13 such as a HEPA filter and a ULPA filter is provided at the front end of the first supply pipe 11.

[0033] A first supply damper 14 is provided upstream of the first supply duct 11, and the first supply damper 14 can adjust the flow rate of the gas supplied from the first supply duct 11 to the first space 10. In addition, a first exhaust damper 15 is provided downstream of the first exhaust duct 12, and the first exhaust damper 15 can adjust the exhaust flow rate from the first space 10. When the air volume is adjusted by the first supply damper 14 and the first exhaust damper 15, in order to measure the wind speed inside the first supply duct 11 and the first exhaust duct 12 by an anemometer, the ducts may be provided with a measurement port or an anemometer may be provided.

[0034] The inkjet device 1 has a second supply pipe 21 (second supply unit) for supplying gas to the second space 20 outside the first chamber 40 and in the second chamber, and a second exhaust pipe 22 (second exhaust unit) for exhausting gas from the second space 20 outside the first chamber 40 and in the second chamber.

[0035] The second supply duct 21 supplies clean gas from which foreign matter has been removed. A second filter 23 such as a HEPA filter or a ULPA filter is provided at the front end of the second supply duct 21 .

[0036] A second supply damper 24 is provided upstream of the second supply duct 21, and the second supply damper 24 can adjust the flow rate of the gas supplied from the second supply duct 21 to the second space 20. In addition, a second exhaust damper 25 is provided downstream of the second exhaust duct 22, and the second exhaust damper 25 can adjust the exhaust flow rate from the second space 20. When the air volume is adjusted by the second supply damper 24 and the second exhaust damper 25, in order to measure the wind speed inside the ducts of the second supply duct 21 and the second exhaust duct 22 by an anemometer, the ducts may be provided with a measurement port or an anemometer may be provided.

[0037] The above-mentioned first supply pipe 11 (first supply part), first exhaust pipe 12 (first exhaust part), second supply pipe 21 (second supply part), and second exhaust pipe 22 (second exhaust part) are also called control components for controlling the first pressure P1 and the second pressure P2.

[0038] The inkjet device 1 includes a control unit CNT formed of a computer (information processing device) including a CPU, a memory, etc. The control unit CNT generally controls each part of the inkjet device 1 according to a program stored in the memory. The control unit CNT can control each part of the control means.

[0039] This embodiment can provide a liquid ejecting device that is advantageous in preventing gas in the first space 10 containing fine ink 8 from leaking to the outside of the device and preventing foreign matter from entering the first space 10 and the second space 20 from the clean room space 30 . The principle will be described in detail below.

[0040] The flow rate of the clean gas supplied to the first space 10 by the first supply pipe 11 is determined according to various factors such as the temperature control accuracy of the first space 10, the cleanliness requirement, or the management concentration of harmful substances. As an example, it is assumed that the first supply damper 14 is adjusted to supply a flow rate of 20L / min. At this time, the flow rate recovered from the first exhaust pipe 12 is adjusted to a value greater than the supplied flow rate (for example, 25L / min) by operating the first exhaust damper 15, so that the first space 10 becomes a negative pressure state relative to the second space. For example, when the flux of the gas discharged from the first exhaust pipe 12 is 1.1 times or more of the flux of the gas supplied by the first supply pipe 11, the safety countermeasure of the present embodiment can be expected to be effective.

[0041] The flow rate supplied from the second supply duct 21 to the second space 20 is also determined according to various conditions such as the requirement for cleanliness of the second space 20 and the requirement for temperature control. As an example, it is assumed that the second supply damper 24 is adjusted to supply a flow rate of 30 L / min. At this time, if the flow rate recovered from the second exhaust duct 22 is adjusted to a value smaller than the supplied flow rate (for example, 20 L / min) by operating the second exhaust damper 25, the pressure of the second space 20 becomes higher than the pressure of the first space 10. At the same time, the second pressure P2 of the second space 20 can be set to a state higher than the third pressure P3 of the clean room space 30. For example, when the flux of the gas supplied by the second supply duct 21 is 1.1 times or more of the flux of the gas discharged from the second exhaust duct 22, the effect of reducing the inflow of foreign matter from the clean room space 30 to the second space 20 can be expected. In addition, the flux in this embodiment is the flow rate per unit time and per unit area.

[0042] By the above adjustment, the first opening 9 is used as a vent to allow gas to flow from the second space 20 to the first space 10, thereby suppressing the gas in the first space 10 from leaking into the second space 20, and further preventing the fine ink 8 from leaking into the clean room space 30. In addition, according to the pressure relationship between the second space 20 and the clean room space 30, the gas flows out from the second space 20 to the clean room space 30 through the gap of the second chamber 50 including the slit 51. Therefore, it is expected that the gas in the clean room space 30 is suppressed from entering the second space 20, and foreign matter is prevented from entering the first space 10 and the second space 20 from the clean room space 30. In addition, in order to confirm the state of the pressure setting by adjusting the flow rate at various locations, a micro differential pressure gauge capable of measuring the pressure difference between the second space 20 and the first space 10 and the pressure difference between the second space 20 and the clean room space 30 may be provided.

[0043] That is, in the present embodiment, the control unit operates in a manner that the second pressure P2 is controlled to be higher than the first pressure P1 and the second pressure P2 is higher than the pressure outside the second chamber (third pressure P3). In other words, in the present embodiment, the control unit operates in a manner that the first airflow of the first opening 9 flows from outside the first chamber 40 to inside the first chamber 40, and the second airflow of the second opening 53 flows from inside the second chamber 50 to outside the second chamber 50. Thus, a liquid ejection device that is advantageous in preventing the gas of the first space 10 containing the fine ink 8 from leaking to the outside of the device and preventing foreign matter from entering the first space 10 and the second space 20 from the clean room space 30 can be provided.

[0044] Furthermore, the control means preferably operates so as to control the first pressure P1 to be higher than the pressure outside the second chamber (third pressure P3). This can further improve the effect of preventing the gas in the first space 10 containing the fine ink 8 from leaking out of the device.

[0045] In this embodiment, the first air conditioner 60 supplies temperature-controlled clean air to the first space 10 via the first supply duct 11. In addition, the first air conditioner 60 can supply temperature-controlled clean air to the second space 20 via the second supply duct 21 and exhaust the gas in the second space 20 via the second exhaust duct 22.

[0046] The gas discharged from the second exhaust duct 22 passes through the first air conditioning filter 61 to remove foreign matter. The first air conditioning filter 61 is preferably a structure that has both a HEPA filter and a chemical filter, and can remove both inorganic and organic foreign matter. In addition, in order to make up for the amount of gas flowing into the first air conditioner 60, gas can be supplied from the gas suction port 64. The supplied gas can also be the gas of the clean room space 30. In addition, it is also possible to set a damper at the gas suction port 64 to adjust the amount of gas suction.

[0047] The gas that has passed through the first air conditioning filter 61 and from which foreign matter has been removed is adjusted to the temperature required for inkjet drawing (e.g., 23° C.) in the temperature adjustment section 62. The gas that has been temperature-adjusted in the temperature adjustment section 62 is blown out from the first air conditioner 60 by the first air conditioning fan 63 and supplied to the respective connection destinations using the first supply pipe 11 and the second supply pipe 21. In addition, in order to implement precise temperature adjustment, a heater that heats the gas individually and a temperature sensor that measures the temperature of each pipe individually may be provided in each supply pipe, and the heating amount of the heater is controlled based on the measurement value of the temperature sensor, so that each supply system is individually temperature-adjusted.

[0048] In addition, the rotation speed of the first air-conditioning fan 63 can be controlled by an inverter or the like configured in the driving control system of the first air-conditioning fan 63. The amount of air blown out from the first air-conditioning unit 60 is constant by the rotation speed control of the first air-conditioning fan 63. The amount of air blown out from the first air-conditioning unit 60 can be adjusted by changing the set value of the rotation speed control.

[0049] As another method of adjusting the flow rate of each air supply duct, there is also a method of adjusting the flow rate of either the first supply duct 11 or the second supply duct 21 and the total flow rate of the gas blown out from the first air conditioner 60 by the first air conditioning fan 63. In this method, only one of the first supply damper 14 and the second supply damper 24 needs to be configured.

[0050] Furthermore, it is also considered that, in the stage of designing the ducts, the ratio of the pressure loss between the ducts is determined in such a way as to distribute the required flow rate to each supply duct, thereby eliminating both the first supply damper 14 and the second supply damper 24. In this case, the flow rate supplied from each supply duct is adjusted by adjusting the set value of the rotation speed control of the first air-conditioning fan 63.

[0051] The second air conditioner 70 is configured to discharge the gas of the first space 10 via the first exhaust duct 12. The gas discharged from the first exhaust duct 12 passes through the second air conditioning filter 71 to remove foreign matter. Preferably, the second air conditioning filter 71 has both a HEPA filter and a chemical filter to remove both inorganic and organic foreign matter. The gas subjected to dust collection treatment in the second air conditioning filter 71 is discharged to the outside of the device by the second air conditioning fan 73 and the external exhaust duct 80. Depending on the type of substance contained in the ink, there is a situation where the exhaust gas of the first space 10 is sought to be discharged outdoors, so the external exhaust duct 80 is preferably set as an exhaust system independent of the second exhaust duct 22 in a manner that can be connected to an outdoor exhaust system.

[0052] The rotation speed of the second air-conditioning fan 73 can be controlled by an inverter or the like configured in the driving control system of the second air-conditioning fan 73. The air volume recovered by the second air-conditioning unit 70 is constant by the rotation speed control of the second air-conditioning fan 73. The air volume recovered by the second air-conditioning unit 70 can be adjusted by changing the set value of the rotation speed control.

[0053] As a method of adjusting the flow rate in the first exhaust duct 12 , the final flow rate may be adjusted by the first exhaust damper 15 , or the flow rate may be adjusted by a set value of the rotation speed control of the second air-conditioning fan 73 without configuring the first exhaust damper 15 .

[0054] In addition, in the present embodiment, the gas exhausted from the first exhaust duct 12 is configured not to circulate to the first supply duct 11 , so that harmful substances do not circulate.

[0055] <Second embodiment>

[0056] In this embodiment, an example in which the structure of the first exhaust duct 12 of the first embodiment is modified is described. In addition, since the structure of the inkjet device 1 is the same as that of the first embodiment, the description is omitted. In addition, matters not described in this embodiment follow those of the first embodiment.

[0057] use Figure 2 The structure of the inkjet device 1 of this embodiment will be described below. Figure 2 As shown, when the second chamber 50 and the second air conditioner 70 are not connected, the path 121 of the first exhaust duct 12 is adjacent to the clean room space 30 without sandwiching the second space 20 therebetween. Such a structure can be achieved for various reasons such as the connection position of the first exhaust duct 12, the size of the device, and the layout when the device is installed.

[0058] Since the gas containing the harmful substances in the first space 10 flows in the first exhaust duct 12, it is necessary to prevent the gas from leaking to the clean room space 30 in the path of the first exhaust duct 12 until the harmful substances are removed by the second air conditioning filter 71. Therefore, the pressure in the first space 10 and the first exhaust duct 12 connected thereto is set lower than the pressure in the clean room space 30. Thus, in the path 121, even if a gap is generated at the joint of the first exhaust duct 12, etc., it is possible to prevent the gas in the first exhaust duct 12 from leaking to the clean room space 30.

[0059] <Third embodiment>

[0060] In this embodiment, an example of circulating the gas exhausted from the first exhaust duct 12 is described. In addition, since the structure of the inkjet device 1 is the same as that of the first embodiment, the description is omitted. In addition, matters not described in this embodiment follow those of the first embodiment.

[0061] use Figure 3 The inkjet device 1 of this embodiment is described below. Figure 3 , an air conditioning system is shown in which the exhaust gas of the first space 10 is circulated by re-adjusting the temperature by the first air conditioner 60. Depending on the type of substance contained in the ink, the exhaust gas of the first space 10 may be circulated. The exhaust gas of the first space 10 is recovered by the first air conditioner 60 by the first exhaust duct 12, and the exhaust gas of the second space 20 recovered by the second exhaust duct 22 merges with the gas sucked from the gas suction port 64 and is subjected to dust removal by the first air conditioning filter 61.

[0062] Compared with the second embodiment, the present embodiment reduces the flow rate sucked from the gas suction port 64, so when sucking the gas of the clean room space 30, the power consumption of the air conditioner can be reduced. The reason is that, generally speaking, the temperature deviation of the gas circulated from the device relative to the target temperature of the temperature control is smaller than that of the gas of the clean room space 30, so the power required for the temperature control is smaller. In the present embodiment, although the gas exhausted from the first exhaust duct 12 is circulated to the first supply duct 11, there is no problem because the gas circulates in a state where harmful substances are removed by the filter in the middle.

[0063] The present invention may be configured such that the gas exhausted from the first exhaust section is not circulated to the first supply section, and the gas exhausted from the second exhaust section is circulated to at least one of the first supply section and the second supply section via a filter. In addition, the present invention may be configured such that the gas exhausted from the first exhaust section and the gas exhausted from the second exhaust section are circulated to at least one of the first supply section and the second supply section via a filter.

[0064] <Embodiment of the method for manufacturing an article>

[0065] The manufacturing method of the article of the embodiment of the present invention is suitable for manufacturing articles such as panels for displays such as organic EL, micro devices such as semiconductor devices, and components with fine structures. The manufacturing method of the article of the present embodiment has a process (forming process, S11) of using an inkjet device 1 to spray liquid onto a substrate to form a liquid film. In addition, there is a process (processing process, S12) of processing the substrate on which the liquid film is formed in the process, specifically drying it to obtain a substrate formed with a dry film. In addition, the manufacturing method of the article of the present embodiment also has a process of manufacturing an article from a substrate formed with a dry film. In addition, the manufacturing method of the article includes other well-known processes (baking, cooling, cleaning, oxidation, film formation, evaporation, doping, flattening, etching, resist stripping, cutting, bonding, packaging, etc.). The manufacturing method of the article of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to previous methods.

Claims

1. A liquid ejection device, characterized in that: The liquid ejection device comprises: a substrate stage that holds a substrate; a discharge member configured to discharge liquid toward the substrate held on the substrate stage; a first chamber covering the substrate stage and the ejection member; a second chamber covering the first chamber; and a control member for controlling a first pressure in the first chamber and a second pressure outside the first chamber and in the second chamber, The control means controls so that the second pressure is higher than the first pressure and the second pressure is higher than the pressure outside the second chamber.

2. The liquid ejection device according to claim 1, characterized in that: The control means controls so that the first pressure is higher than the pressure outside the second chamber.

3. The liquid ejection device according to claim 1, characterized in that: The first chamber and the second chamber have openings.

4. The liquid ejection device according to claim 1, characterized in that: The control component comprises: a first exhaust portion for exhausting gas from a first space in the first chamber; and The first supply unit supplies gas to the first space.

5. The liquid ejection device according to claim 4, characterized in that: The gas exhausted from the first exhaust unit does not circulate to the first supply unit.

6. The liquid ejection device according to claim 4, characterized in that: The gas exhausted from the first exhaust unit circulates to the first supply unit via a filter.

7. The liquid ejection device according to claim 4, characterized in that: The control unit controls so that the pressure of the gas in the first exhaust portion is lower than the pressure outside the second chamber.

8. The liquid ejection device according to claim 4, characterized in that: The control unit controls so that a flux of the gas exhausted from the first exhaust unit is 1.1 times or more of a flux of the gas supplied from the first supply unit.

9. The liquid ejection device according to claim 1, characterized in that: The control component comprises: a second exhaust portion for exhausting gas from a second space in the second chamber; and The second supply unit supplies gas to the second space.

10. The liquid ejection device according to claim 9, characterized in that: The gas exhausted from the second exhaust unit circulates to the second supply unit via a filter.

11. The liquid ejection device according to claim 9, characterized in that: The control unit controls so that a flux of the gas supplied by the second supply unit is 1.1 times or more of a flux of the gas exhausted by the second exhaust unit.

12. The liquid ejection device according to claim 1, characterized in that: The control component comprises: a first exhaust portion for exhausting gas from a first space in the first chamber; a first supply unit for supplying gas to the first space; a second exhaust portion for exhausting gas from a second space in the second chamber; and a second supply unit that supplies gas to the second space, The gas exhausted from the first exhaust unit does not circulate to the first supply unit. The gas exhausted from the second exhaust unit circulates to at least one of the first supply unit and the second supply unit via a filter.

13. The liquid ejection device according to claim 1, characterized in that: The control component comprises: a first exhaust portion for exhausting gas from a first space in the first chamber; a first supply unit for supplying gas to the first space; a second exhaust portion for exhausting gas from a second space in the second chamber; and a second supply unit that supplies gas to the second space, The gas exhausted from the first exhaust portion and the gas exhausted from the second exhaust portion are circulated to at least one of the first supply portion and the second supply portion via a filter.

14. The liquid ejection device according to claim 1, characterized in that: The liquid contains quantum dot material.

15. The liquid ejection device according to claim 14, characterized in that: The quantum dot material contains heavy metal substances.

16. The liquid ejection device according to claim 15, characterized in that: The quantum dot material includes at least one of cadmium, indium and lead.

17. A liquid ejection device, characterized in that: The liquid ejection device comprises: a substrate stage that holds a substrate; a discharge member configured to discharge liquid toward the substrate held on the substrate stage; a first chamber covering the substrate stage and the ejection member and having a first opening; a second chamber covering the first chamber and having a second opening; and a control member for controlling a first airflow through the first opening and a second airflow through the second opening, The control unit controls so that the first airflow flows from outside the first chamber into the first chamber and the second airflow flows from inside the second chamber to outside the second chamber.

18. A method for manufacturing an article, characterized in that: The manufacturing method has the following features: a forming step in which a liquid film is formed by ejecting a liquid onto a substrate using the liquid ejecting device according to any one of claims 1 to 17; and a processing step in which the substrate sprayed with the liquid is processed, An article is manufactured from the processed substrate.

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