显示模组及其制备方法、显示装置、拼接显示装置
By using bonding patterns and bonding terminals in the display module to directly bond the circuit board to the substrate, the problem of connecting wires breaking due to excessive climbing angle is solved, thus achieving stable display of the display module and stable connection of the circuit board.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BOE MLED TECH CO LTD
- Filing Date
- 2023-07-28
- Publication Date
- 2026-07-17
AI Technical Summary
In the prior art, the connecting wires between the flexible circuit board and the display panel are prone to breakage due to excessive climbing angle, resulting in unstable display of the display module.
By using bonding patterns and bonding terminals to directly bond the circuit board to the substrate, the creep angle of the connecting wires is reduced, the use of double-sided adhesive is avoided, and the distance between the circuit board and the substrate is minimized.
This reduces the risk of broken connecting wires, improves the display stability of the display module and the electrical characteristics of the circuit board, and enhances the overall stability of the display device.
Smart Images

Figure CN119445975B_ABST