A leveling method, electronic device, computer readable storage medium

Abstract

The application discloses a leveling method, electronic equipment and computer readable storage medium. The leveling method comprises the following steps: acquiring a set of plane spacings between a first plane and a second plane; fitting a third plane according to the set of plane spacings; the third plane is a fitting plane of the second plane; the higher the coincidence degree of the fitted third plane and the second plane is, the better the parallelism of the first plane and the second plane is; calculating a pitch angle P, a yaw angle Y and a roll angle R of the third plane relative to the first plane; and leveling the second plane according to the pitch angle P, the yaw angle Y and the roll angle R. According to the data, the specific flatness can be measured, and accurate adjustment can be facilitated.

Description

Technical Field

[0001] This invention relates to the field of wafer bonding, and more specifically to a leveling method, an electronic device, and a computer-readable storage medium. Background Technology

[0002] In the production of Micro LEDs, traditional bonding methods are complex and costly, hindering cost reduction and efficiency improvement. Laser mass bonding is the ideal solution for improvement. Laser bonding utilizes a high-precision alignment platform to precisely align the wafer on the carrier and the target substrate, then bond the carrier and target substrate together, and finally use a highly uniform laser spot to laser-bond the transferred Micro LEDs. This method offers advantages such as high bonding quality, high efficiency, and low cost. However, in existing technologies, insufficient parallelism between the substrate and the carrier results in incomplete bonding, affecting subsequent bonding. Summary of the Invention

[0003] To overcome the shortcomings of the prior art, the present invention provides a leveling method, an electronic device, and a computer-readable storage medium that can improve the parallelism of the carrier board and the substrate, making them fit together better.

[0004] The technical solution adopted by the present invention to solve its technical problem is as follows: On the one hand, a leveling mechanism is provided, comprising:

[0005] Step 1: Obtain the set of plane spacings between the first plane and the second plane;

[0006] Step 2: Fit a third plane based on the set of plane spacings, wherein the third plane is the fitting surface of the second plane;

[0007] Step 3: Calculate the pitch angle P, heading angle Y, and roll angle R of the third plane relative to the second plane;

[0008] Step 4: Level the second plane according to the pitch angle P, heading angle Y, and roll angle R.

[0009] As a further improvement to the above technical solution, in step 11, the first plane and the second plane are scanned by an array using a laser to collect the first spatiotemporal data of each scan point on the first plane and the second spatiotemporal data of the second plane.

[0010] Step 12: Calculate the spacing between each scanning point in the first plane and the second plane based on the first spatiotemporal data and the second spatiotemporal data;

[0011] Step 13: Generate the set of planar spacings based on the positional arrangement of each scanning point.

[0012] As a further improvement to the above technical solution, the first spatiotemporal data and the second spatiotemporal data include time data and / or spatial data;

[0013] The time data refers to the time it takes for the laser to return from the first plane / second plane when it is projected onto each scanning point;

[0014] The spatial data refers to the distance of each scanning point relative to the laser reference position.

[0015] As a further improvement to the above technical solution, in step 11, the array scanning method is specifically as follows:

[0016] The first plane and the second plane are scanned by a combination of at least three lasers arranged in a straight line at equal intervals.

[0017] As a further improvement to the above technical solution, in step 11, the laser is a composite light that includes at least band a and band b;

[0018] The laser in band a can be emitted by the carrier of the first plane, and the laser in band b can penetrate the carrier of the first plane and be reflected by the carrier of the second plane.

[0019] As a further improvement to the above technical solution, in step 11, the array scanning of the first plane and the second plane by the laser is performed simultaneously.

[0020] As a further improvement to the above technical solution, in step 4, a six-axis, six-legged displacement stage is used to level the second plane.

[0021] As a further improvement to the above technical solution, the data acquisition module is used to obtain the set of plane spacings between the first plane and the second plane;

[0022] The data processing module is used to fit the third plane based on the set of plane spacings, wherein the third plane is the fitting surface of the second plane; and to calculate the pitch angle P, heading angle Y, and roll angle R of the third plane relative to the first plane.

[0023] The leveling control module is used to level the second plane according to the pitch angle P, yaw angle Y, and roll angle R.

[0024] An electronic device includes a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the balancing method as described above.

[0025] A computer-readable storage medium storing a computer program that, when executed by a processor, implements the aforementioned leveling method.

[0026] The beneficial effects of this invention are as follows: by obtaining the set of plane spacings between the first plane and the second plane, and fitting a third plane based on the set of plane spacings, the third plane is the fitting surface of the second plane. The higher the degree of overlap between the fitted third plane and the second plane, the better the parallelism between the first plane and the second plane. The pitch angle P, yaw angle Y, and roll angle R of the third plane relative to the first plane are calculated, and the second plane is leveled according to the pitch angle P, yaw angle Y, and roll angle R. Based on these data, the specific flatness can be measured, which facilitates precise adjustment. Attached Figure Description

[0027] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0028] Figure 1 This is a schematic diagram of the leveling method provided in a preferred embodiment of the present invention. Detailed Implementation

[0029] The following will clearly and completely describe the concept, specific structure, and technical effects of the present invention in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are all within the scope of protection of the present invention. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. For example, fixed connections / fixed installations can use screw connections, bolt connections, pin connections, key connections, adhesive connections, mortise and tenon connections, welding, riveting, etc., as needed. Detachable connections can use screw connections, bolt connections, threaded connections, snap-fit ​​connections, mortise and tenon connections, Velcro connections, etc., as needed. The various technical features in this invention can be combined interactively without contradicting each other.

[0030] Please see Figure 1 This invention provides a leveling method for adjusting the parallelism between two planes, comprising at least the following steps:

[0031] Step 1, obtain the set of plane spacings between the first plane and the second plane:

[0032] First, move the first plane and the second plane so that they are in relative positions, and initially adjust the tilt angle of the first plane and the second plane so that they are parallel.

[0033] Secondly, an array scan of the first and second planes is performed using lasers to collect first spatiotemporal data of each scan point on the first plane and second spatiotemporal data on the second plane. Laser scanning provides precise data, which helps ensure accuracy. Specifically, the first and second spatiotemporal data include temporal and / or spatial data; temporal data refers to the time it takes for the laser to return from the first / second plane when it is projected onto each scan point; spatial data refers to the distance of each scan point relative to the laser reference position. Calculating the distance between the first and second planes using both temporal and spatial data improves accuracy.

[0034] Then, the spacing between each scanning point and the first and second spatiotemporal data is calculated based on the first and second spatiotemporal data; these spacings reflect the parallelism between the two planes, and the smaller the difference between these spacings, the better the parallelism between the two planes.

[0035] Finally, a set of planar spacings is generated based on the positional arrangement of each scanning point. This set of planar spacings is represented by (i,j), where i represents the i-th row of the array scan and j represents the j-th column of the array scan. In this embodiment, i is 3 and j is n. The specific value of n is determined by the time interval of the array scan. The shorter the interval, the larger the value of n. During laser scanning, three laser heads can scan simultaneously, thereby obtaining a set of planar spacings of 3 rows and j columns.

[0036] Step 2: Fit a third plane based on the set of plane spacings. The third plane is the fitting surface of the second plane. The third plane is fitted by a computer software algorithm based on the set of plane spacings.

[0037] Step 3: Calculate the pitch angle P, heading angle Y, and roll angle R of the third plane relative to the second plane. The pitch angle P, heading angle Y, and roll angle R reflect the deviation angle between the third plane and the second plane. If all three values ​​are zero, it means that the third plane coincides with the second plane, that is, the parallelism between the first plane and the second plane is very high at all points.

[0038] Step 4: Level the second plane based on the pitch angle P, heading angle Y, and roll angle R. Repeat steps 1-3 above until the values ​​of pitch angle P, heading angle Y, and roll angle R in step 3 are zero.

[0039] In step 4 of the above embodiment, a six-axis, six-legged displacement stage is used to level the second plane. This stage allows for precise adjustment of the second plane's tilt, ensuring accurate leveling. Specifically, in step 3, the software calculates the pitch angle P, yaw angle Y, and roll angle R of the third plane relative to the second plane. These values ​​are then converted into pulse signals. Upon receiving these signals, the six-axis, six-legged displacement stage controls the movement of its axes to perform leveling.

[0040] In one embodiment, the array scanning method in step 1 specifically involves using a combination of three linearly equidistant laser beams to scan the first and second planes. A single scan can obtain a set of three equidistantly arranged plane spacings, resulting in high efficiency. The laser beams are composite light containing at least wavelengths a and b; wherein the laser beam of wavelength a can be emitted by the carrier of the first plane, and the laser beam of wavelength b can penetrate the carrier of the first plane and be reflected by the carrier of the second plane. This improves the accuracy of laser ranging. The array scanning of the first and second planes by the lasers is performed simultaneously, further enhancing the accuracy of laser ranging.

[0041] The system employs an array scanning method using three laser rangefinders arranged side-by-side. The three rangefinders simultaneously emit ranging lasers and, during uniform movement, emit ranging lasers multiple times at equal intervals. The laser rangefinders are lightweight, small in size, easy to operate, fast, and accurate.

[0042] In another embodiment, the array scanning method in step 1 is as follows: a combination of three or more lasers arranged in straight lines at equal intervals is used to move and scan the first plane and the second plane. One scan can obtain a set of plane spacings arranged in three or more rows at equal intervals, which can obtain more spacing data at various points of the first plane and the second plane, and further facilitate the control of the flatness of the first plane and the second plane.

[0043] In other embodiments, the difference from the above embodiments lies in the number of array scans. Specifically, a set of planar spacings is generated based on the positional arrangement of each scan point; where i represents the i-th row of the array scan and j represents the j-th column of the array scan. In this embodiment, i is greater than 3. During laser scanning, three or more laser rangefinders arranged side by side can scan simultaneously to obtain a set of planar spacings in row i and column j.

[0044] A leveling mechanism includes a data acquisition module for acquiring a set of planar spacings between a first plane and a second plane;

[0045] The data processing module is used to fit a third plane based on the set of plane spacings, the third plane being the fitting surface of the second plane; and to calculate at least one of the pitch angle P and the roll angle R of the third plane relative to the first plane; the leveling control module is used to level the second plane based on one or more of the pitch angle P and the roll angle R of the roll angle R. This leveling mechanism can precisely adjust the parallelism between the first plane and the second plane.

[0046] An electronic device includes a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the leveling method as described in the above embodiments.

[0047] A computer-readable storage medium storing a computer program that, when executed by a processor, implements the leveling method as described in the above embodiments.

[0048] The above is a detailed description of the preferred embodiments of the present invention. However, the present invention is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A leveling method for adjusting the parallelism between two planes, characterized in that, It should include at least the following steps: Step 1: Obtain the set of plane spacings between the first plane and the second plane; Step 2: Fit a third plane based on the set of plane spacings, wherein the third plane is the fitting surface of the second plane; Step 3: Calculate the pitch angle P, heading angle Y, and roll angle R of the third plane relative to the second plane; Step 4: Level the second plane according to the pitch angle P, yaw angle Y, and roll angle R; Step 1 includes at least: Step 11, performing array scanning on the first plane and the second plane using a laser to collect first spatiotemporal data of each scanning point on the first plane and second spatiotemporal data of the second plane; Step 12: Calculate the spacing between each scanning point in the first plane and the second plane based on the first spatiotemporal data and the second spatiotemporal data; Step 13: Generate the set of planar spacings based on the positional arrangement of each scanning point; The first spatiotemporal data and the second spatiotemporal data include time data and / or spatial data; The time data refers to the time it takes for the laser to return from the first plane / second plane when it is projected onto each scanning point; The spatial data refers to the distance of each scanning point relative to the laser reference position; In step 11, the array scanning method is specifically as follows: The first plane and the second plane are scanned by a combination of at least three lasers arranged in a straight line at equal intervals.

2. The leveling method as described in claim 1, characterized in that, In step 11, the laser is a composite light containing at least band a and band b; The laser in band a can be emitted by the carrier of the first plane, and the laser in band b can penetrate the carrier of the first plane and be reflected by the carrier of the second plane.

3. The leveling method as described in claim 1, characterized in that, In step 11, the laser scans the arrays of the first plane and the second plane simultaneously.

4. The leveling method as described in claim 1, characterized in that, In step 4, a six-axis, six-legged displacement stage is used to level the second plane.

5. A leveling mechanism, applied to the leveling method according to any one of claims 1-4, characterized in that, include: The data acquisition module is used to obtain the set of planar distances between the first plane and the second plane; The data processing module is used to fit the third plane based on the set of plane spacings, wherein the third plane is the fitting surface of the second plane; and to calculate the pitch angle P, heading angle Y, and roll angle R of the third plane relative to the first plane. The leveling control module is used to level the second plane according to the pitch angle P, yaw angle Y, and roll angle R.

6. An electronic device, characterized in that, It includes a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the leveling method as described in any one of claims 1 to 4.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the leveling method as described in any one of claims 1 to 4.

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