An anti-interference solid-state relay

By designing the linkage mechanism between expansion components and heat dissipation structure and new connection components in solid-state relays, the problems of poor heat dissipation and unstable power connection in solid-state relays are solved, and stable heat dissipation and high-reliability power connection are achieved.

CN119446843BActive Publication Date: 2025-03-25ZHEJIANG XURUI ELECTRONICS
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Patent Information

Application Number
CN202510019016.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-01-07
Publication Date
2025-03-25
Estimated Expiration
2045-01-07

AI Technical Summary

Technical Problem

The current solid-state relays are not suitable for the triggering method of the heat dissipation structure in a strong electromagnetic interference environment, and the electrical connection method poses safety hazards.

Method used

An anti-interference solid-state relay is designed, and the linkage mechanism between the expansion assembly and the heat dissipation structure is adopted. The heat dissipation structure is triggered through the expansion of the airbag, and the power connection stability and shock resistance are improved through the new connecting components and the resistance components.

Benefits of technology

Stable heat dissipation is achieved in a strong magnetic environment, avoiding the problems of inaccurate temperature detection or failure, and improving the stability and safety of power connection, enhancing the reliability and durability of solid-state relays.

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Abstract

The present invention relates to the technical field of solid-state relays, and specifically to an anti-interference solid-state relay, comprising a solid-state relay body, heat dissipation holes are provided at both ends of the middle of one end face of the solid-state relay body, the inner wall of the solid-state relay body is located, a heat dissipation tube is fixedly connected at the heat dissipation hole position, a heat dissipation structure is arranged inside the heat dissipation tube, the heat dissipation structure is used to cool down the inside of the solid-state relay body, an expansion component is arranged in the middle of the inner bottom surface of the solid-state relay body, the expansion component is used to trigger the heat dissipation structure to work, connection grooves are provided at the four corners of the upper end of the solid-state relay body, fixing bolts and conductive sheets are arranged inside the connection grooves, and the connection component includes fixing bolts and conductive sheets. Compared with the prior art, the present application solves the problem that the heat dissipation structure triggering method in the prior art is not suitable for use in a strong magnetic environment and the electrical connection method has safety hazards.
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