Semiconductor cooling device, power conversion device, and method for manufacturing semiconductor cooling device

Abstract

The semiconductor cooling device of the present invention comprises: a plurality of semiconductor modules; a plurality of first refrigerant flow paths provided so as to correspond to the semiconductor modules; and a pair of flow path pipes connected to the plurality of first refrigerant flow paths, the plurality of semiconductor modules are respectively opposite to the plurality of first refrigerant flow paths and are arranged on the substrate side by side in a first direction, and the pair of flow path pipes are respectively extended in the first direction. Each of the heat dissipation surfaces of the plurality of semiconductor modules that are in contact with the plurality of first refrigerant flow paths is disposed in an intersecting direction that intersects the direction in which the first refrigerant flow paths extend and the direction in which the plurality of semiconductor modules are disposed, and the first refrigerant flow paths have deformation sections that are deformable in the intersecting direction.

Description

Technical Field

[0001] The invention relates to a semiconductor cooling device, a power conversion device and a method for manufacturing the semiconductor cooling device. Background Art

[0002] The inverter can achieve high output and low cost by integrating mass-produced semiconductor modules and main circuit wiring using printed circuit boards. However, when double-sided cooling is performed on multiple semiconductor modules, the semiconductor modules and cooling water channels are required to have high dimensional accuracy in order to reduce thermal resistance, which leads to high costs. Even in this case, miniaturization and low height are strictly required.

[0003] Patent Document 1 below discloses a structure of a cooler that can sufficiently ensure the contact area between electronic components and pipes without increasing the number of components. Prior art literature Patent Literature

[0004] Patent Document 1: Japanese Patent Application Publication No. 2005-228877 Summary of the invention Technical problem to be solved by the invention

[0005] In the existing structure, when the semiconductor modules are mounted on the substrate, there is a certain degree of height difference between the modules, and each semiconductor module sometimes has no followability relative to the water channel it contacts. Therefore, even if cost reduction can be achieved, there is still a problem of reducing the reliability of the cooling device due to the deviation of the heat dissipation surface caused by this height difference. In view of this, the purpose of the present invention is to provide a semiconductor cooling device and a method for manufacturing a semiconductor cooling device that achieves miniaturization, low cost and high heat dissipation. Technical means for solving technical problems

[0006] The semiconductor cooling device includes: a plurality of semiconductor modules, each of which has a built-in semiconductor element; a plurality of first refrigerant flow paths, each of which is respectively arranged corresponding to the plurality of semiconductor modules; and a pair of flow path tubes, each of which is respectively connected to the inlet and outlet of the plurality of first refrigerant flow paths, the plurality of semiconductor modules are respectively opposite to the plurality of first refrigerant flow paths, and are arranged side by side on a substrate in a first direction, the pair of flow path tubes respectively extend along the first direction, the heat dissipation surfaces of the plurality of semiconductor modules in contact with the plurality of first refrigerant flow paths are arranged in a cross direction intersecting the extension direction of the first refrigerant flow paths and the arrangement direction of the plurality of semiconductor modules, and the first refrigerant flow path has a deformation portion that can deform in the cross direction at the portion connected to the flow path tube. In addition, as a manufacturing method of a semiconductor cooling device, the following method is adopted: a plurality of first refrigerant flow paths and a pair of flow tubes are joined, the plurality of first refrigerant flow paths are respectively arranged corresponding to a plurality of semiconductor modules having built-in semiconductor elements and arranged side by side on a substrate, the pair of flow tubes are connected to the plurality of first refrigerant flow paths and extend along the arrangement direction of the plurality of semiconductor modules, and the joined plurality of first refrigerant flow paths and a pair of flow tubes are installed on the semiconductor modules. In addition, as another method for manufacturing a semiconductor cooling device, the following method is adopted: a plurality of first refrigerant flow paths are connected to a plurality of semiconductor modules, the plurality of first refrigerant flow paths are respectively arranged corresponding to the plurality of semiconductor modules with built-in semiconductor elements and arranged side by side on a substrate, and a pair of flow tubes extending along the arrangement direction of the plurality of semiconductor modules are connected to the plurality of first refrigerant flow paths. Effects of the Invention A semiconductor cooling device and a method for manufacturing the semiconductor cooling device that can achieve miniaturization, low cost and high heat dissipation can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is an overall perspective view of a semiconductor cooling device according to an embodiment of the present invention. Figure 2 yes Figure 1 YY section view. Figure 3 yes Figure 1 XX cross-sectional view. Figure 4 yes Figure 3 A first variation of . Figure 5 yes Figure 3 A second variation of . Figure 6 yes Figure 2 A variation of (third variation). Figure 7 This is an example of a method for manufacturing a semiconductor cooling device. DETAILED DESCRIPTION

[0009] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The following description and drawings are examples for illustrating the present invention, and are appropriately omitted and simplified for clarity of description. The present invention may also be implemented in various other forms. Unless otherwise specified, each structural element may be singular or plural.

[0010] In order to facilitate understanding of the present invention, the positions, sizes, shapes, ranges, etc. of the components shown in the drawings may not represent actual positions, sizes, shapes, ranges, etc. Therefore, the present invention is not necessarily limited to the positions, sizes, shapes, ranges, etc. disclosed in the drawings.

[0011] (One embodiment of the present invention and overall structure of the device) ( Figure 1 ) Figure 1 (a) is an overall perspective view showing a semiconductor cooling device mounted on a plurality of semiconductor modules provided on a substrate. Figure 1 (b) is a perspective view of a semiconductor cooling device. A semiconductor cooling device 100 (hereinafter referred to as cooling device 100) includes a printed circuit board 4 (hereinafter referred to as substrate 4) for fixing a plurality of semiconductor modules for a power conversion unit of a power conversion device together, a plurality of small cooling flow paths 1 (hereinafter referred to as first refrigerant flow paths 1), and a pair of cooling flow path pipes 2 (hereinafter referred to as flow path pipes 2). The plurality of first refrigerant flow paths 1 are connected to a pair of flow path tubes 2 at both ends. A deformation portion 3 (details of which will be described later) is provided in the connection portion between the plurality of first refrigerant flow paths 1 and the pair of flow path tubes 2. The pair of flow path tubes 2 introduce refrigerant from the outside through the flow path inlet and outlet 2a, and allow the refrigerant to flow through the plurality of first refrigerant flow paths 1, respectively. By connecting the first refrigerant flow paths 1 and the flow path tubes 2 in parallel, the refrigerant having an equal flow rate and the same temperature flows in the flow path of the contact portion with each phase of the semiconductor module 10, thereby reducing the temperature difference between each phase of the semiconductor module 10.

[0013] ( Figure 2 ) The cooling device 100 includes a plurality of semiconductor modules 10 each having a semiconductor element built therein, a plurality of first refrigerant channels 1 provided corresponding to the plurality of semiconductor modules 10 , and a pair of channel pipes 2 connected to inlets and outlets of the plurality of first refrigerant channels 1 , respectively.

[0014] In the first refrigerant flow path 1, when the inlet side of the refrigerant flowing in from the flow tube 2 is defined as the front side and the outlet side of the refrigerant is defined as the rear side, the first refrigerant flow path 1b connected to the rear side of the flow tube 2 at a position close to the outlet side of the flow tube 2 can be formed wider than the first refrigerant flow path 1a connected to the front side of the flow tube 2 at a position close to the inlet side of the flow tube 2. Thus, in the first refrigerant flow path 1, the pressure loss of the first refrigerant flow path 1b on the rear side does not increase due to the refrigerant flowing inside, so the pressure can be reduced as a whole.

[0015] In addition, in the cooling device 100, a sheet-shaped insulating member 6 and a heat dissipating member 7 are bonded to the surface of the first refrigerant flow path 1 opposite to the semiconductor module 10. Therefore, a fixing member for fixing the insulating member 6 is not required. In addition, the insulating member 6 is a material having insulating properties and adhesive properties, such as a silicone resin sheet. In addition, the heat dissipating member 7 is, for example, a TIM (thermal interface material).

[0016] The first refrigerant flow path 1 is arranged on one surface of the plurality of semiconductor modules 10 provided on the substrate 4, and the second refrigerant flow path 13 is arranged on the other surface. Thus, by arranging the refrigerant flow paths on both surfaces of the semiconductor module 10, the cooling performance of the semiconductor module 10 is improved. A sheet-like insulating member 6 is bonded to the surface of the second refrigerant flow path 13 facing the semiconductor module 10.

[0017] The second refrigerant flow path 13 is arranged opposite to the first refrigerant flow path 1 via the semiconductor module 10, and is formed to be wider than the first refrigerant flow path 1. Thus, the substrate 4 can be cooled. In addition, the second refrigerant flow path 13 is connected to a pair of flow path pipes 2 in the same manner as the first refrigerant flow path 1. In addition, the second heat dissipation member 12 is arranged between the second refrigerant flow path 13 and the substrate 4. Thus, the second refrigerant flow path 13 and the substrate 4 are in close contact via the second heat dissipation member 12, thereby improving the cooling performance. In addition, the second heat dissipation member 12 is, for example, a gap filler or a heat sink.

[0018] Furthermore, the second refrigerant flow path 13 cools the plurality of semiconductor modules 10 on one side and has higher rigidity than the first refrigerant flow path 1. Thus, when the first refrigerant flow path 1 is screwed, the followability of the first refrigerant flow path 1 relative to the semiconductor module 10 is improved.

[0019] The substrate 4 is a printed substrate and is formed of a conductive member such as a copper busbar. That is, the substrate 4 has both the function of fixing the semiconductor module 10 and the function of electrical conduction. The substrate 4 has a plurality of wiring layers, each of which is connected to a plurality of semiconductor modules 10, and includes a DC wiring through which a DC current flows and an AC wiring through which an AC current flows. Thus, a power conversion device including a cooling device 100 that realizes miniaturization, low cost, and high heat dissipation can be realized.

[0020] Furthermore, the component for mounting each of the plurality of semiconductor modules 10 is the substrate 4, and by mounting them collectively, in terms of the process, for example, the reference plane 11 when setting the semiconductor module 10 in the second refrigerant flow path 13 becomes easy to determine, thereby improving production efficiency and mounting performance.

[0021] ( Figure 3 ) Figure 3 (a) Yes Figure 1 XX cross-sectional view, Figure 3 (b) is used to fix Figure 3 (a) is a diagram of a member of a structure. The first refrigerant flow path 1 has a deformable portion 3 that can be deformed in a cross direction at the connection portion with a pair of flow path pipes 2. The deformable portion 3 is, for example, an elastic member such as aluminum or a spring. In addition, the first refrigerant flow path 1 has a heat dissipation fin 5 inside. The heat dissipation fin 5 is, for example, a highly heat-conductive member such as aluminum or copper.

[0022] A pair of flow tubes 2 connected to the first refrigerant flow path 1 are covered by a water path fixing member 9 such as a leaf spring, and the water path fixing member 9 is fastened and fixed to a housing or the like (not shown) of a power conversion device by screws 8, so that the first refrigerant flow path 1 is pressed and fixed to a plurality of semiconductor modules 10 mounted on a substrate 4. Thus, the tightness between the first refrigerant flow path 1 and the semiconductor module 10 is improved.

[0023] The deformable portion 3 has an easily deformable shape such as a wavy shape or a thin-walled shape. In addition, the rigidity of the deformable portion 3 is lower than the rigidity of the first refrigerant flow path 1. When the first refrigerant flow path 1 is pressed against the plurality of semiconductor modules 10, the deformable portion 3 is deformed due to its fastening force. Thus, the closeness between the first refrigerant flow path 1 and the semiconductor module 10 is improved.

[0024] Here, from Figures 1 to 3 It can be seen that the plurality of semiconductor modules 10 are respectively opposite to the plurality of first refrigerant flow paths 1 and are arranged side by side on the substrate 4 in the first direction, and the pair of flow path tubes 2 are respectively extended along the first direction. In addition, it can be seen that in the plurality of semiconductor modules 10, each heat dissipation surface in contact with the plurality of first refrigerant flow paths 1 is arranged in the extension direction ( Figure 3 The left-right direction) and the arrangement direction of the plurality of semiconductor modules 10 ( Figure 3 The cross direction ( Figure 3 In addition, the cross direction mentioned here refers to the vertical direction side relative to the extension direction of the first refrigerant flow path 1 and the arrangement direction of the semiconductor module 10, and covers a wide range.

[0025] Therefore, while improving the reliability of the cooling device 100, the closeness between the heat dissipation fins 5 and the semiconductor module 10 is improved by separating the flow path wall of the first refrigerant flow path 1. In addition, since the deformation portion 3 is deformed in the cross direction side rather than in the arrangement direction of the semiconductor module 10, the thickness tolerance of each semiconductor module 10 relative to the first refrigerant flow path 1 is absorbed, and the structure of the first refrigerant flow path 1 is arranged side by side on the same plane along the substrate 4, so that the first refrigerant flow path 1 itself can be made thinner. As a result, the entire cooling device 100 can be made low in height.

[0026] [Modification 1] ( Figure 4 ) The deformation portion 3 may be, for example, an S-shaped deformation portion 3a formed in an S-shape. Thus, since the first refrigerant flow path 1 and the pair of flow tubes 2 are provided on the same plane, the height of the cooling device 100 can be reduced.

[0027] [Modification 2] ( Figure 5 ) Figure 5 (a) Yes Figure 3 Modification 2 of Figure 5 (b) Yes Figure 5 (a) is a cross-sectional view of a portion of the structure of the modified example shown. A pair of flow tubes 2 are arranged in the above-mentioned cross direction relative to the first refrigerant flow path 1, and accordingly, the deformation portion 3 is also arranged in the above-mentioned cross direction relative to the first refrigerant flow path 1. The deformation portion 3 is formed by, for example, a bellows. As a result, the footprint of the first refrigerant flow path 1 is reduced. In addition, since the deformation portion 3 is compressed and deformed in the vertical direction (cross direction), the followability in the cross direction relative to the semiconductor module 10 is improved, and the reliability as a cooling device 100 is improved. In addition, the deformation portion 3 is formed by a low-cost component such as stamping, thereby reducing the cost of the entire first refrigerant flow path 1. In addition, the pair of flow tubes 2 are formed by a cylindrical or low-cost stamping plate, etc.

[0028] [Variation 3] ( Figure 6 ) The flow tube 2 has bellows 14 between the positions connected to the plurality of first refrigerant flow paths 1. With such a structure, the first refrigerant flow path 1 improves the followability of each arm of the semiconductor module 10 and more easily absorbs the tolerance of each semiconductor module 10 in the cross direction.

[0029] (Method for manufacturing semiconductor cooling device) ( Figure 7 ) The manufacturing method of the cooling device 100 is as follows, for example: First, a plurality of first refrigerant flow paths 1 respectively provided corresponding to a plurality of semiconductor modules 10 having built-in semiconductor elements and arranged side by side on a substrate 4, and a pair of flow path pipes 2 connected to the plurality of first refrigerant flow paths 1 and extending along the arrangement direction of the plurality of semiconductor modules 10 are joined. Subsequently, the joined plurality of first refrigerant flow paths 1 and flow path pipes 2 are mounted on the semiconductor module 10. Due to the use of such a manufacturing method, in the process of mounting the first refrigerant flow path 1 on the semiconductor module 10 in a joined state, the first refrigerant flow path can be inspected as a single unit, which can reduce the number of processes and improve the yield.

[0030] In addition, as another method of manufacturing the cooling device 100, there is Figure 7 First, a plurality of first refrigerant flow paths 1 provided corresponding to a plurality of semiconductor modules 10 having built-in semiconductor elements and arranged side by side on a substrate 4 are connected to the plurality of semiconductor modules 10. Next, as shown in FIG. Figure 7 As shown, a pair of flow tubes 2 extending along the arrangement direction of the plurality of semiconductor modules 10 are joined to the plurality of first refrigerant flow paths 1. By adopting such a manufacturing method, stress in the joint portion between the first refrigerant flow paths 1 and the flow tubes 2 can be reduced.

[0031] Although the semiconductor cooling device 100 of the present invention has been described above, for example, the above structure in which the first refrigerant flow path 1 is divided into six corresponding to each of the semiconductor modules 10 to absorb the tolerance can be changed to a structure in which the semiconductor modules 10 are arranged in two rows and pressed by one first refrigerant flow path 1. In addition, although the structure in which the second refrigerant flow path 13 is arranged as one flow path has been described above, the first refrigerant flow path 1 can be arranged as one flow path, and the second refrigerant flow path 13 can be made into a divided structure corresponding to each of the semiconductor modules 10.

[0032] According to one embodiment of the present invention described above, the following effects are achieved.

[0033] (1) It includes a plurality of semiconductor modules 10 having built-in semiconductor elements, a plurality of first refrigerant flow paths 1 respectively arranged corresponding to the plurality of semiconductor modules 10, and a pair of flow path tubes 2 respectively connected to the inlet and outlet of the plurality of first refrigerant flow paths 1. The plurality of semiconductor modules 10 are respectively opposite to the plurality of first refrigerant flow paths 1 and are arranged side by side on a substrate 4 in a first direction. The pair of flow path tubes 2 respectively extend in the first direction, and the heat dissipation surfaces of the plurality of semiconductor modules 10 in contact with the plurality of first refrigerant flow paths 1 are arranged in a cross direction intersecting the extension direction of the first refrigerant flow path 1 and the arrangement direction of the plurality of semiconductor modules 10. The first refrigerant flow path 1 has a deformable portion 3 that can be deformed in the cross direction at the portion connected to the flow path tube 2. Thus, a semiconductor cooling device that can achieve miniaturization, low cost and high heat dissipation can be provided.

[0034] (2) The deforming portion 3 is provided in the intersecting direction with the first refrigerant flow path 1. Thus, since the deforming portion 3 deforms in the perpendicular compression direction, the followability of the semiconductor module 10 in the intersecting direction is improved, thereby improving reliability.

[0035] (3) The deformed portion 3 is formed in an S-shape. Thus, since the first refrigerant flow path 1 is provided on the same plane as the flow path tube 2, a reduction in height can be achieved.

[0036] (4) The first refrigerant flow path 1 is arranged on one surface of the semiconductor module 10, and the second refrigerant flow path 2 is arranged on the other surface. Thus, the semiconductor module 10 can be cooled on both sides.

[0037] (5) The second refrigerant flow path 2 is arranged opposite to the first refrigerant flow path 1 via the semiconductor module 10, and is formed wider than the first refrigerant flow path 1. The heat dissipation member 12 is arranged between the second refrigerant flow path 2 and the substrate 4. Thus, the semiconductor module 10 is in close contact with the substrate 4, thereby improving the cooling performance.

[0038] (6) The second refrigerant flow path 2 performs single-side cooling of the plurality of semiconductor modules 10 and has higher rigidity than the first refrigerant flow path 1. This improves the followability of the first refrigerant flow path 1 relative to the semiconductor module 10 during screw tightening.

[0039] (7) Among the plurality of first refrigerant flow paths 1, the first refrigerant flow path 1b connected to the flow tube 2 at a position close to the outlet side of the flow tube 2 is wider than the first refrigerant flow path 1a connected to the flow tube 2 at a position close to the inlet side of the flow tube 2. Thus, the substrate 4 can be cooled.

[0040] (8) The insulating member 6 is bonded to the surfaces of the first refrigerant flow path 1 and the second refrigerant flow path facing the semiconductor module 10. Thus, a fixing member for fixing the insulating member 6 is not required.

[0041] (9) The power conversion device includes a semiconductor cooling device 100, wherein the substrate 4 has a plurality of wiring layers, the plurality of wiring layers are respectively connected to the plurality of semiconductor modules 10, and include DC wiring through which a DC current flows and AC wiring through which an AC current flows. Thus, a power conversion device that is compact, low-cost, and has high heat dissipation can be provided.

[0042] (10) As a method for manufacturing the semiconductor cooling device 100, the following method is adopted: first, a plurality of first refrigerant flow paths 1 provided corresponding to a plurality of semiconductor modules 10 having built-in semiconductor elements and arranged side by side on a substrate 4, and a pair of flow path pipes 2 connected to the plurality of first refrigerant flow paths 1 and extending along the arrangement direction of the plurality of semiconductor modules 10 are joined. Subsequently, the joined plurality of first refrigerant flow paths 1 and flow path pipes 2 are mounted on the semiconductor modules 10. Thus, the number of steps can be reduced and the yield can be improved.

[0043] (11) As a method for manufacturing the semiconductor cooling device 100, the following method is adopted: First, a plurality of first refrigerant flow paths 1 provided corresponding to a plurality of semiconductor modules 10 respectively having built-in semiconductor elements and arranged side by side on a substrate 4 are joined to the plurality of semiconductor modules 10. Then, a pair of flow path pipes 2 extending in the arrangement direction of the plurality of semiconductor modules 10 are joined to the plurality of first refrigerant flow paths 1. Thus, stress in the joint portion between the first refrigerant flow paths 1 and the flow path pipes 2 can be reduced.

[0044] In addition, the present invention is not limited to the above-mentioned embodiments, and various modifications or combinations of other structures are possible without departing from the scope of the present invention. In addition, the present invention is not limited to having all the structures described in the above-mentioned embodiments, and also includes structures obtained by deleting part of the structures. Description of symbols

[0045] 1 small cooling water path (first refrigerant flow path) 1a The first refrigerant flow path on the front side 1b The first refrigerant flow path on the rear side 2 Refrigerant flow pipe 2a flow path entrance and exit 3. Deformation 3a S-shaped deformation part 4Printed substrate 5 cooling fins 6 Insulation components 7. Heat dissipation components 8 Screws 9Waterway fixing components 10Semiconductor modules 11 Datum plane 12 Second heat dissipation member 13 Second refrigerant flow path 14 Bellows 100Semiconductor cooling device (cooling device).

Claims

1. A semiconductor cooling device, characterized in that: include: A plurality of semiconductor modules, each of which has semiconductor elements built therein; a plurality of first refrigerant flow paths, the plurality of first refrigerant flow paths being respectively arranged corresponding to the plurality of semiconductor modules; as well as a pair of flow path pipes, the pair of flow path pipes being respectively connected to the inlet and the outlet of the plurality of first refrigerant flow paths, The plurality of semiconductor modules are respectively opposite to the plurality of first refrigerant flow paths and are arranged side by side in a first direction on a substrate. The pair of flow tubes extend along the first direction respectively. The heat dissipation surfaces of the plurality of semiconductor modules that are in contact with the plurality of first refrigerant flow paths are arranged in a direction intersecting the extending direction of the first refrigerant flow paths and the arrangement direction of the plurality of semiconductor modules. The first refrigerant flow path has a deformable portion that is deformable in the intersecting direction at a portion connected to the flow path pipe.

2. The semiconductor cooling device according to claim 1, characterized in that: The deformation portion is provided in the intersecting direction intersecting with the first refrigerant flow path.

3. The semiconductor cooling device according to claim 1, characterized in that: The deformation portion is formed in an S-shape.

4. The semiconductor cooling device according to claim 1, characterized in that: The first refrigerant flow path is arranged on one surface of the semiconductor module, and the second refrigerant flow path is arranged on the other surface.

5. The semiconductor cooling device according to claim 4, characterized in that: The second refrigerant flow path is arranged to face the first refrigerant flow path via the semiconductor module and is formed to be wider than the first refrigerant flow path. A heat dissipation member is disposed between the second refrigerant flow path and the substrate.

6. The semiconductor cooling device according to claim 4, characterized in that: The second refrigerant flow path performs single-side cooling of the plurality of semiconductor modules and has higher rigidity than the first refrigerant flow path.

7. The semiconductor cooling device according to claim 1, characterized in that: Among the plurality of first refrigerant flow paths, the first refrigerant flow path connected to the flow tube at a position close to an outlet side of the flow tube is wider than the first refrigerant flow path connected to the flow tube at a position close to an inlet side of the flow tube.

8. The semiconductor cooling device according to claim 4, characterized in that: Insulating members are bonded to surfaces of the first refrigerant flow path and the second refrigerant flow path that are respectively opposed to the semiconductor module.

9. A power conversion device, characterized in that: comprising a semiconductor cooling device as claimed in any one of claims 1 to 8, The substrate has a plurality of wiring layers which are respectively connected to the plurality of semiconductor modules and include DC wirings through which a DC current flows and AC wirings through which an AC current flows.

10. A method for manufacturing a semiconductor cooling device, characterized in that: A plurality of first refrigerant flow paths are connected to a pair of flow path pipes, the plurality of first refrigerant flow paths are respectively arranged corresponding to a plurality of semiconductor modules having built-in semiconductor elements and arranged side by side on a substrate, and the pair of flow path pipes are connected to the plurality of first refrigerant flow paths and extend along the arrangement direction of the plurality of semiconductor modules, The joined plurality of first refrigerant flow paths and the pair of flow path pipes are mounted on the semiconductor module.

11. A method for manufacturing a semiconductor cooling device, characterized in that: A plurality of first refrigerant flow paths are connected to a plurality of semiconductor modules, wherein the plurality of first refrigerant flow paths are respectively provided corresponding to the plurality of semiconductor modules having built-in semiconductor elements and arranged side by side on a substrate, A pair of flow path pipes extending along the arrangement direction of the plurality of semiconductor modules are joined to the plurality of first refrigerant flow paths.

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