Two-component silicone pouring sealant, preparation method and application thereof

Abstract

The application provides a two-component silicone pouring sealant and a preparation method and application thereof. The two-component silicone pouring sealant comprises an A component and a B component. The A component comprises modified vinyl silicone oil A, hydrogen-containing silicone oil, crosslinking hydrogen silicone oil, heat-conducting filler A and inhibitor. The B component comprises modified vinyl silicone oil B, heat-conducting filler B and platinum catalyst. The modified vinyl silicone oil A and the modified vinyl silicone oil B are obtained by reacting unmodified vinyl silicone oil and trimethylchlorosilane. By adding the modified vinyl silicone oil, the obtained two-component silicone pouring sealant has low viscosity and high heat-conducting coefficient, and also has the characteristics of moderate hardness, good anti-settling performance and good insulation, and meets the pouring requirements of small-size high-power electronic modules.

Description

Technical Field

[0001] This invention belongs to the field of potting compound technology, specifically relating to a two-component silicone potting compound, its preparation method, and its application. Background Technology

[0002] Organosilicon potting compounds are mainly composed of vinyl silicone oil, hydrogen-containing silicone oil, catalysts, inhibitors, thermally conductive fillers, etc. They have the characteristics of high and low temperature resistance and insulation properties of organosilicon, as well as excellent thermal conductivity, making them very suitable for potting electronic products and playing a role in heat dissipation, sealing, and shock absorption.

[0003] Conventional silicone potting compounds typically have a thermal conductivity of less than 2 W / (m·K), which can meet the needs of most electronic products. However, with the continuous development of technology, the demand for high-power electronic modules, such as those with a power of 2000W or more, in some special application scenarios is gradually increasing. Therefore, the heat dissipation requirements for potting compounds are becoming higher and higher, requiring the thermal conductivity of the potting compounds to reach 5 W / (m·K) or more.

[0004] CN117384584A discloses a high thermal conductivity potting compound with a thermal conductivity of 4-6 W / (m·K). This solution uses aramid fiber, boron nitride and alumina as micro thermally conductive fillers, and the anti-settling performance can reach 6 months. However, the potting compound provided by this solution has a high viscosity, all above 30000 mPa·s.

[0005] CN112812740A discloses a potting compound with low viscosity and self-leveling properties obtained by using spherical alumina as microfiller. Its thermal conductivity reaches 4 W / (m·K). However, the viscosity of this potting compound is at least above 24000 mPa·s. For small-sized, high-power electronic modules, the gaps inside are very small, requiring a potting compound with lower viscosity and higher thermal conductivity.

[0006] Therefore, in order to address the above-mentioned technical problems, there is an urgent need to develop a two-component silicone potting compound that combines low viscosity and high thermal conductivity. Summary of the Invention

[0007] In view of the shortcomings of the existing technology, the purpose of this invention is to provide a two-component silicone potting compound, its preparation method and application. The two-component silicone potting compound has both low viscosity and high thermal conductivity, which meets the potting requirements of small-sized high-power electronic modules. It also has the characteristics of moderate hardness, good anti-settling performance and good insulation.

[0008] To achieve this objective, the present invention adopts the following technical solution:

[0009] In a first aspect, the present invention provides a two-component silicone potting compound, the two-component silicone potting compound comprising component A and component B:

[0010] The A component includes modified vinyl silicone oil A, hydrogen-terminated silicone oil, crosslinked hydrogen silicone oil, thermally conductive filler A, and inhibitor;

[0011] Component B includes modified vinyl silicone oil B, thermally conductive filler B, and platinum catalyst;

[0012] Both the modified vinyl silicone oil A and the modified vinyl silicone oil B are obtained by reacting unmodified vinyl silicone oil with trimethylchlorosilane.

[0013] Increasing the thermal conductivity of potting compound by adding more thermally conductive filler can easily lead to a sharp increase in viscosity, or even cause it to solidify and lose its fluidity. This is because, on the one hand, the proportion of the base compound decreases as the proportion of thermally conductive filler powder increases, thus increasing the viscosity of the entire system. On the other hand, the main component of the base compound in addition-type potting compounds is vinyl silicone oil. During the synthesis of vinyl silicone oil, the presence of trace amounts of water in the raw materials results in a small amount of silanol groups in the synthesized vinyl silicone oil. When the amount of thermally conductive filler powder added reaches a certain proportion, these trace amounts of silanol groups will quickly form hydrogen bonds with the residual silanol groups on the powder surface, causing a sudden change in the viscosity of the system or even causing it to solidify.

[0014] Based on the above, the inventors of this invention creatively discovered during the research process that treating unmodified vinyl silicone oil with trimethylchlorosilane can effectively eliminate trace amounts of silanol groups in the unmodified vinyl silicone oil. Compared with unmodified vinyl silicone oil, the potting compound prepared from the modified vinyl silicone oil has a lower viscosity. When combined with end-hydrogen silicone oil and crosslinked hydrogen silicone oil as a base adhesive, the resulting potting compound can still have a low viscosity even with a high amount of thermally conductive filler added, thus meeting the potting requirements of small-sized, high-power electronic modules. In addition, the two-component silicone potting compound provided by this invention, through the combination of the above-mentioned specific components A and B, also has the characteristics of moderate hardness, good anti-settling performance, and good insulation.

[0015] Preferably, component A comprises the following components in parts by weight:

[0016]

[0017] The amount of modified vinyl silicone oil A can be 0.5 parts by weight, 0.7 parts by weight, 0.9 parts by weight, 1 part by weight, 1.2 parts by weight, 1.4 parts by weight, 1.6 parts by weight, 1.8 parts by weight, or 2 parts by weight, etc.

[0018] The amount of the hydrogen-containing silicone oil can be 3 parts by weight, 3.2 parts by weight, 3.4 parts by weight, 3.6 parts by weight, 3.8 parts by weight, 4 parts by weight, 4.2 parts by weight, 4.4 parts by weight, 4.6 parts by weight, 4.8 parts by weight, or 5 parts by weight, etc.

[0019] The amount of the crosslinked hydrosilicone oil can be 0.01 parts by weight, 0.02 parts by weight, 0.04 parts by weight, 0.06 parts by weight, 0.08 parts by weight, 0.1 parts by weight, 0.12 parts by weight, 0.14 parts by weight, 0.16 parts by weight, 0.18 parts by weight, or 0.2 parts by weight, etc.

[0020] The amount of the thermally conductive filler A can be 94.5 parts by weight, 94.7 parts by weight, 94.9 parts by weight, 95.1 parts by weight, 95.3 parts by weight, or 95.5 parts by weight, etc.

[0021] The amount of the inhibitor can be 0.001 parts by weight, 0.005 parts by weight, 0.01 parts by weight, 0.02 parts by weight, 0.04 parts by weight, 0.06 parts by weight, 0.08 parts by weight, or 0.1 parts by weight, etc.

[0022] Preferably, component B comprises the following components in parts by weight:

[0023] Modified vinyl silicone oil B, 4.5–5.5 parts by weight;

[0024] Thermally conductive filler B: 94.5–95.5 parts by weight;

[0025] Platinum catalyst 0.01 to 0.5 parts by weight.

[0026] The amount of modified vinyl silicone oil B can be 4.4 parts by weight, 4.7 parts by weight, 4.9 parts by weight, 5.1 parts by weight, 5.3 parts by weight, or 5.5 parts by weight, etc.

[0027] The amount of the thermally conductive filler B can be 94.5 parts by weight, 94.7 parts by weight, 94.9 parts by weight, 95.1 parts by weight, 95.3 parts by weight, or 95.5 parts by weight, etc.

[0028] The amount of platinum catalyst used can be 0.01 parts by weight, 0.02 parts by weight, 0.04 parts by weight, 0.06 parts by weight, 0.08 parts by weight, 0.1 parts by weight, 0.2 parts by weight, 0.3 parts by weight, 0.4 parts by weight, or 0.5 parts by weight, etc.

[0029] Preferably, the mass ratio of the unmodified vinyl silicone oil to trimethylchlorosilane is (99-101):1, for example, 99:1, 99.5:1, 100:1, 100.5:1 or 101:1, etc.

[0030] Preferably, the reaction temperature is 60-70°C, such as 60°C, 62°C, 64°C, 66°C, 68°C, or 70°C.

[0031] Preferably, the reaction time is 3 to 5 hours, for example, 3 hours, 3.2 hours, 3.4 hours, 3.6 hours, 3.8 hours, 4 hours, 4.2 hours, 4.4 hours, 4.6 hours, 4.8 hours, or 5 hours.

[0032] Preferably, the viscosity of the unmodified vinyl silicone oil is 10 to 50 mPa·s, such as 10 mPa·s, 15 mPa·s, 20 mPa·s, 25 mPa·s, 30 mPa·s, 35 mPa·s, 40 mPa·s, 45 mPa·s, or 50 mPa·s.

[0033] Preferably, the unmodified vinyl silicone oil has a vinyl content of 0.7 to 1.8 mmol / g, such as 0.7 mmol / g, 0.8 mmol / g, 0.9 mmol / g, 1 mmol / g, 1.2 mmol / g, 1.4 mmol / g, 1.6 mmol / g, or 1.8 mmol / g.

[0034] Preferably, the viscosity of the hydrogen-containing silicone oil is 5 to 15 mPa·s, such as 5 mPa·s, 6 mPa·s, 7 mPa·s, 8 mPa·s, 9 mPa·s, 10 mPa·s, 11 mPa·s, 12 mPa·s, 13 mPa·s, 14 mPa·s, or 15 mPa·s.

[0035] Preferably, the hydrogen content of the end-hydrogen silicone oil is 1.3 to 2.6 mmol / g, such as 1.3 mmol / g, 1.5 mmol / g, 1.7 mmol / g, 1.9 mmol / g, 2.1 mmol / g, 2.2 mmol / g, 2.4 mmol / g or 2.6 mmol / g.

[0036] Preferably, the viscosity of the crosslinked hydrosilicone oil is ≤100 mPa·s, such as 100 mPa·s, 90 mPa·s, 80 mPa·s, 70 mPa·s, 60 mPa·s, or 50 mPa·s.

[0037] Preferably, the hydrogen content of the crosslinked hydrosilicone oil is 5 to 16 mmol / g, such as 5 mmol / g, 7 mmol / g, 9 mmol / g, 11 mmol / g, 13 mmol / g, 15 mmol / g or 16 mmol / g.

[0038] Preferably, the molar ratio of Si-H to vinyl in the crosslinked hydrosilicone oil is (0.05-0.15):1, for example, 0.05:1, 0.07:1, 0.09:1, 0.11:1, 0.13:1 or 0.15:1, etc.

[0039] Preferably, both the thermally conductive filler A and the thermally conductive filler B comprise spherical alumina and silicon carbide.

[0040] As a preferred technical solution of the present invention, the above-mentioned spherical alumina and silicon carbide are selected for combination. Since the thermal conductivity of silicon carbide is stronger than that of spherical alumina, by compounding it with spherical alumina in an appropriate ratio, the resulting potting compound can have a higher thermal conductivity and a lower density under the same amount of addition.

[0041] Preferably, the mass ratio of the spherical alumina to silicon carbide is (55-115):(10-20), for example, 55:10, 65:12, 70:14, 75:16, 80:18, 90:19, 110:20, etc.

[0042] Preferably, the D of the spherical alumina 50 The particle size ranges from 2 to 90 μm, for example, 2 μm, 10 μm, 15 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm or 90 μm.

[0043] More preferably, the D of the spherical alumina 50 The particle sizes are 2μm, 10μm and 90μm, and the mass ratio of the three is (5~15):(40~70):(10~20), for example 5:40:10, 7:50:12, 9:55:14, 11:60:16, 13:65:18 or 15:70:20, etc.

[0044] Preferably, the silicon carbide D 50 The particle size is 15–25 μm, for example, 15 μm, 17 μm, 19 μm, 21 μm, 23 μm or 25 μm.

[0045] Preferably, the inhibitor comprises any one or a combination of at least two of 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane, 3-methyl-1-butyn-3-ol, 1-ethynylcyclohexanol, 3-phenyl-1-butyn-3-ol, 3-propyl-1-butyn-3-ol, or 3-octyl-1-butyn-3-ol.

[0046] Preferably, the platinum catalyst comprises any one or a combination of at least two of the following: an alcoholic solution of chloroplatinic acid, a platinum catalyst coordinated with tetrahydrofuran, or a platinum catalyst coordinated with divinyltetramethylsiloxane.

[0047] Preferably, component B further includes color paste, including any one or a combination of at least two of red, black, or blue color paste.

[0048] In a second aspect, the present invention provides a method for preparing a two-component silicone potting compound as described in the first aspect, the method comprising the preparation of component A and component B;

[0049] The preparation method of component A includes: mixing modified vinyl silicone oil A, hydrogen-terminated silicone oil, crosslinked hydrogen silicone oil, thermally conductive filler A and inhibitor to obtain component A;

[0050] The preparation method of component B includes: mixing modified vinyl silicone oil B, thermally conductive filler B, platinum catalyst and optionally pigment paste to obtain component B.

[0051] When using components A and B, they should be mixed in a 1:1 mass ratio.

[0052] Thirdly, the present invention provides an application of the two-component silicone potting compound as described in the first aspect in electronic products.

[0053] The numerical range described in this invention includes not only the point values ​​listed above, but also any point values ​​within the numerical ranges not listed above. Due to space limitations and for the sake of brevity, this invention will not exhaustively list all the specific point values ​​included in the range.

[0054] Compared with the prior art, the present invention has the following beneficial effects:

[0055] The two-component silicone potting compound provided by this invention comprises component A and component B. Component A includes modified vinyl silicone oil A, hydrogen-terminated silicone oil, crosslinked hydrogen silicone oil, thermally conductive filler A, and inhibitor. Component B includes modified vinyl silicone oil B, thermally conductive filler B, and platinum catalyst. Both modified vinyl silicone oil A and modified vinyl silicone oil B are obtained by reacting unmodified vinyl silicone oil with trimethylchlorosilane. By adding the above-mentioned modified vinyl silicone oil, the resulting two-component silicone potting compound has both low viscosity and high thermal conductivity, with a thermal conductivity of over 5 W / (m·K) and a viscosity below 20000 mPa·s. It also has moderate hardness, good anti-settling properties, and good insulation, meeting the potting requirements of small-sized, high-power electronic modules. Detailed Implementation

[0056] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be construed as limiting the invention in any way.

[0057] Unless otherwise specified, the raw materials used in the following examples and comparative examples are all conventional materials in the art and can be purchased from commercially available products. In particular, information on some of the raw materials involved is shown below:

[0058] (1) Vinyl silicone oil

[0059] Unmodified vinyl silicone oil A: viscosity 10 mPa·s (25℃), vinyl content 1.48 mmol / g, purchased from Ambiar, brand name Andisil VS10;

[0060] Unmodified vinyl silicone oil B: viscosity 20 mPa·s (25℃), vinyl content 1.4 mmol / g, purchased from Ambiar, brand name Andisil VS20;

[0061] Unmodified vinyl silicone oil B: viscosity 45 mPa·s (25℃), vinyl content 0.71 mmol / g, purchased from Ambiar, brand name Andisil VS 50.

[0062] (2) Hydrogen-containing silicone oil

[0063] Hydrogen-containing silicone oil A: viscosity 9 mPa·s (25℃), hydrogen content 1.8 mmol / g, purchased from Shanghai Jingri, brand name DH018N;

[0064] Hydrogen-containing silicone oil B: viscosity 17 mPa·s (25℃), hydrogen content 1.3 mmol / g, purchased from Runhe, brand name RH-H45.

[0065] (3) Crosslinked hydrosilicone oil

[0066] Crosslinked hydrosilicone oil: viscosity 50 mPa·s (25℃), hydrogen content 8.6 mmol / g, purchased from Ambier, brand name XL1342.

[0067] (4) Thermally conductive filler

[0068] Spherical alumina A:D 50 Particle size is 2μm, commercially available;

[0069] Spherical alumina B:D 50 Particle size is 10μm, commercially available;

[0070] Spherical alumina C:D 50 Particle size is 90μm, commercially available;

[0071] Silicon carbide: D 50 The particle size is 20μm, and it is commercially available.

[0072] (5) Platinum catalyst

[0073] Divinyltetramethylsiloxane coordinated platinum catalyst: platinum content 1%, purchased from Amdisil, brand name Amdisil Pt 10000.

[0074] (6) Color paste

[0075] Black paste: Regularly available commercially.

[0076] Preparation Example 1

[0077] A modified vinyl silicone oil A is prepared by means of: adding 250g of unmodified vinyl silicone oil A and 2.5g of trimethylchlorosilane to a three-necked flask, stirring and reacting at 60°C for 4h, then heating to 100°C, and distilling under reduced pressure at a vacuum degree of not less than -0.08MPa to remove excess trimethylchlorosilane, thereby obtaining the modified vinyl silicone oil A.

[0078] Preparation Example 2

[0079] A modified vinyl silicone oil B is prepared by means of: adding 250g of unmodified vinyl silicone oil B and 2.5g of trimethylchlorosilane to a three-necked flask, stirring and reacting at 60°C for 4h, then heating to 100°C, and distilling under reduced pressure at a vacuum degree of not less than -0.08MPa to remove excess trimethylchlorosilane, thereby obtaining the modified vinyl silicone oil B.

[0080] Preparation Example 3

[0081] A modified vinyl silicone oil C is prepared by means of: adding 250g of unmodified vinyl silicone oil C and 2.5g of trimethylchlorosilane to a three-necked flask, stirring and reacting at 70°C for 3h, then heating to 100°C, and distilling under reduced pressure at a vacuum degree of not less than -0.08MPa to remove excess trimethylchlorosilane, thereby obtaining the modified vinyl silicone oil C.

[0082] Examples 1-9

[0083] Examples 1-9 provide a two-component silicone potting compound, each comprising components A and B. The composition and dosage of components A and B are shown in Table 1.

[0084] Furthermore, in Table 1, the unit of measurement for each component is "parts by weight";

[0085] Table 1

[0086]

[0087]

[0088] The preparation method of the two-component silicone potting compound provided in Examples 1-9 is characterized in that the preparation method includes the preparation of component A and component B;

[0089] The preparation method of component A includes: mixing modified vinyl silicone oil A, hydrogen-terminated silicone oil, crosslinked hydrogen silicone oil, thermally conductive filler A and inhibitor to obtain component A;

[0090] The preparation method of component B includes: mixing modified vinyl silicone oil B, thermally conductive filler B, platinum catalyst, and optionally pigment paste to obtain component B.

[0091] Comparative Example 1

[0092] A two-component silicone potting compound differs from Example 1 in that unmodified vinyl silicone oil B is used to replace the modified vinyl silicone oil provided in Preparation Example 2 in Component A, while the other components, amounts, and preparation methods are the same as in Example 1.

[0093] Comparative Example 2

[0094] A two-component silicone potting compound differs from Example 1 in that unmodified vinyl silicone oil B is used to replace the modified vinyl silicone oil provided in Preparation Example 2 in component B, while the other components, amounts, and preparation methods are the same as in Example 1.

[0095] Performance testing

[0096] (1) Viscosity: The viscosity was tested according to GB / T 2794 Determination of viscosity of adhesives by single-cylinder rotational viscometer method.

[0097] (2) Thermal conductivity: The test was performed in accordance with ISO 22007-2 Plastics. Determination of thermal conductivity and thermal diffusivity. Part 2: Transient planar heat source (heat plate) method.

[0098] The two-component silicone potting compounds provided in Examples 1-9 and Comparative Examples 1-2 were tested according to the above test methods. The test results are shown in Table 2.

[0099] Table 2

[0100]

[0101]

[0102] (1) The viscosity of components A and B of the two-component silicone potting compound provided in Examples 1 to 5 is low and the thermal conductivity is high; while the component A of the two-component silicone potting compound provided in Comparative Example 1 is solid and the component B of the two-component silicone potting compound provided in Comparative Example 2 is solid, neither of which meets the requirements.

[0103] (2) Compared with Example 1, the A component of the two-component silicone potting compound provided in Example 6 did not contain silicon carbide, the B component of the two-component silicone potting compound provided in Example 7 did not contain silicon carbide, the A component of the two-component silicone potting compound provided in Example 8 had a lower amount of thermally conductive filler, and the B component of the two-component silicone potting compound provided in Example 9 had a lower amount of thermally conductive filler, which also led to a decrease in the thermal conductivity of the obtained two-component silicone potting compound.

[0104] The applicant declares that the above description is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention fall within the protection and disclosure scope of the present invention.

Claims

1. A two-component silicone potting compound, characterized in that, The two-component silicone potting compound includes component A and component B; The A component includes modified vinyl silicone oil A, hydrogen-terminated silicone oil, crosslinked hydrogen silicone oil, thermally conductive filler A, and inhibitor; Component B includes modified vinyl silicone oil B, thermally conductive filler B, and platinum catalyst; Both the modified vinyl silicone oil A and the modified vinyl silicone oil B are obtained by reacting unmodified vinyl silicone oil with trimethylchlorosilane. The reaction is carried out at a temperature of 60-70°C for 3-5 hours. The mass ratio of the unmodified vinyl silicone oil to trimethylchlorosilane is (99~101):1; Both thermally conductive filler A and thermally conductive filler B are combinations of spherical alumina and silicon carbide. The mass ratio of the spherical alumina to silicon carbide is (55~115):(10~20); The two-component silicone potting compound has a thermal conductivity of 5 W / (m•K) or higher and a viscosity of 20,000 mPa•s or lower.

2. The two-component silicone potting compound according to claim 1, characterized in that, Component A comprises the following components in parts by weight: Modified vinyl silicone oil A, 0.5~2 parts by weight; 3-5 parts by weight of hydrogen-containing silicone oil; Crosslinked hydrosilicone oil, 0.01~0.2 parts by weight; Thermally conductive filler A: 94.5~95.5 parts by weight; Inhibitor 0.001~0.1 parts by weight.

3. The two-component silicone potting compound according to claim 1, characterized in that, Component B comprises the following components in parts by weight: Modified vinyl silicone oil B, 4.5~5.5 parts by weight; Thermally conductive filler B: 94.5~95.5 parts by weight; Platinum catalyst 0.01~0.5 parts by weight.

4. The two-component silicone potting compound according to claim 1, characterized in that, The viscosity of the unmodified vinyl silicone oil is 10~50 mPa·s.

5. The two-component silicone potting compound according to claim 1, characterized in that, The vinyl content of each of the unmodified vinyl silicone oils is independently 0.7~1.8 mmol / g.

6. The two-component silicone potting compound according to claim 1, characterized in that, The viscosity of the hydrogen-containing silicone oil is 5~15 mPa·s.

7. The two-component silicone potting compound according to claim 1, characterized in that, The hydrogen content of the hydrogen-containing silicone oil is 1.3~2.6 mmol / g.

8. The two-component silicone potting compound according to claim 1, characterized in that, The viscosity of the cross-linked hydrosilicone oil is ≤100 mPa·s.

9. The two-component silicone potting compound according to claim 1, characterized in that, The hydrogen content of the crosslinked hydrosilicone oil is 5~16 mmol / g.

10. The two-component silicone potting compound according to claim 1, characterized in that, The molar ratio of Si-H to vinyl groups in the crosslinked hydrosilicone oil is (0.05~0.15):

1.

11. The two-component silicone potting compound according to claim 1, characterized in that, The D of the spherical alumina 50 The particle size is 2~90 μm.

12. The two-component silicone potting compound according to claim 1, characterized in that, The silicon carbide D 50 The particle size is 15~25 μm.

13. The two-component silicone potting compound according to claim 1, characterized in that, The inhibitors include any one or a combination of at least two of 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane, 3-methyl-1-butyn-3-ol, 1-ethynylcyclohexanol, 3-phenyl-1-butyn-3-ol, 3-propyl-1-butyn-3-ol, or 3-octyl-1-butyn-3-ol.

14. The two-component silicone potting compound according to claim 1, characterized in that, The platinum catalyst includes any one or a combination of at least two of the following: an alcoholic solution of chloroplatinic acid, a platinum catalyst coordinated with tetrahydrofuran, or a platinum catalyst coordinated with divinyltetramethylsiloxane.

15. The two-component silicone potting compound according to claim 1, characterized in that, Component B also includes color paste.

16. The two-component silicone potting compound according to claim 15, characterized in that, The content of pigment in component B is 0.01~0.1 parts by weight.

17. The two-component silicone potting compound according to claim 15, characterized in that, The colorant includes any one or a combination of at least two of red, black, or blue colorants.

18. A method for preparing a two-component silicone potting compound as described in any one of claims 1 to 17, characterized in that, The preparation method includes the preparation of component A and the preparation of component B; The preparation method of component A includes: mixing modified vinyl silicone oil A, hydrogen-terminated silicone oil, crosslinked hydrogen silicone oil, thermally conductive filler A and inhibitor to obtain component A; The preparation method of component B includes: mixing modified vinyl silicone oil B, thermally conductive filler B, platinum catalyst and optionally pigment paste to obtain component B.

19. The application of a two-component silicone potting compound as described in any one of claims 1 to 17 in electronic products.

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