Magnetic fluid circulation heat dissipation device applied to electronic chip

Abstract

The invention relates to a magnetofluid circulation heat dissipation device applied to an electronic chip, which comprises a metal heat conduction base in contact with the chip, fixed brackets arranged at four corners of the upper part of the metal heat conduction base, and a vertical array heat dissipation ring pipe embedded in the upper part of the metal heat conduction base, and the array heat dissipation ring pipe is filled with oil-based magnetofluid; the horizontal heat dissipation fins are fixed to the lower middle portion of the array heat dissipation ring pipe, the electromagnetic coil is wound around the outer wall face of the upper portion of the array heat dissipation ring pipe, the fan is installed on the side face of the array heat dissipation ring pipe, and the infrared temperature sensor and the controller are located on the side face of the upper portion of the fan. According to the heat dissipation device, the convection heat exchange principle of high heat exchange efficiency of fluid is utilized, the magnetic fluid serves as a heat exchange medium in the heat exchange process, under the action of a magnetic field generated by the electromagnetic coil, the magnetic fluid does circular motion in the array heat dissipation ring pipe wound around the electromagnetic coil, the heat dissipation effect of the heat dissipation device is enhanced, and meanwhile the heat dissipation efficiency is improved. The device also has the characteristics of simple structure, small size and high heat dissipation efficiency.

Images