Safety-level HEMT packaging TO-220 lead frame structure

Abstract

A safety-level HEMT packaging TO-220 lead frame structure provided by the present invention comprises a plurality of lead frame units, each lead frame unit comprises a cooling fin, a ceramic substrate and an external pin which are arranged in sequence, the cooling fin is provided with a chip carrying area used for carrying the ceramic substrate, one surface of the ceramic substrate is connected with the cooling fin, and the other surface of the ceramic substrate is connected with the external pin. One surface of the ceramic substrate is provided with a plurality of external pins, the other surface of the ceramic substrate is provided with a plurality of chip carrying islands, one ends of the external pins are connected with the chip carrying islands, and the ceramic substrate is arranged between the radiating fin and the external pins, so that the external pins, the chip and the radiating fin can be electrically isolated, and potential safety hazards such as electric leakage, ignition and electrical contact when the terminal is used are solved; and meanwhile, the ceramic substrate provides a heat dissipation channel between the chip and the heat dissipation sheet, so that the lead frame has an excellent heat dissipation effect.

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