Method of manufacturing a circuit board assembly and circuit board assembly

Abstract

A manufacturing method of a circuit board assembly, comprising: providing a circuit board, comprising a side surface; forming a sliding groove on the circuit board, the sliding groove being formed by recessing the side surface; providing a reinforcing member, the reinforcing member comprising a main body portion and a clamping portion connected to each other, the clamping portion protruding from the main body portion; clamping the clamping portion in the sliding groove, and leaving a gap between the main body portion and the circuit board; and filling a gap between the main body portion and the circuit board with glue to bond the circuit board and the reinforcing member. The manufacturing method of the circuit board assembly provided by the embodiment of the application sets the reinforcing member on the side surface of the circuit board, does not need to occupy the area of the circuit board for electrically connecting electronic components, and is beneficial to fully utilizing the space of the circuit board; and further can reduce the overall thickness of the circuit board assembly. The application further provides a circuit board assembly.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and in particular to a method for manufacturing a circuit board assembly and the circuit board assembly itself. Background Technology

[0002] A reinforcing plate is typically attached to the bottom of the circuit board to strengthen it. However, the inclusion of this reinforcing plate limits the usable space on the circuit board and hinders high-density wiring. Summary of the Invention

[0003] A method for manufacturing a circuit board assembly includes: providing a circuit board, including a side surface; forming a groove on the circuit board, the groove being formed by a recess in the side surface; providing a reinforcing member, the reinforcing member including a main body portion and a retaining portion connected to each other, the retaining portion protruding from the main body portion; retaining the retaining portion in the groove, a gap being formed between the main body portion and the circuit board; and filling the gap with an adhesive to bond the circuit board and the reinforcing member.

[0004] In some embodiments of this application, the circuit board further includes a first surface, a side surface connected to the first surface, a groove formed by a recess in the first surface, and the groove communicating with a slide; the circuit board includes a first solder pad exposed in the groove; prior to the step of filling the colloid, the manufacturing method further includes: filling the groove with conductive paste to electrically connect the circuit board and the reinforcing member.

[0005] In some embodiments of this application, the groove is formed by the common recess of the first surface and the side surface.

[0006] In some embodiments of this application, the circuit board further includes a second solder pad and a second surface, the second surface being disposed opposite to the first surface, and the second solder pad being disposed on the first surface and / or the second surface; the manufacturing method further includes: connecting electronic components on the circuit board, the electronic components being connected to the second solder pad.

[0007] In some embodiments of this application, the circuit board further includes a first surface, with a side connection to the first surface, and the circuit board includes a first solder pad exposed on the first surface and the side; prior to the step of filling the colloid, the manufacturing method further includes: applying conductive paste on the first solder pad to electrically connect the circuit board and the reinforcing member.

[0008] A circuit board assembly includes a circuit board, a reinforcing member, and an adhesive. The circuit board includes a side surface and a groove formed by a recess in the side surface; the reinforcing member includes a main body portion and a retaining portion connected to each other, the retaining portion protruding from the main body portion and retaining the retaining portion in the groove, and a gap exists between the main body portion and the circuit board; the adhesive fills the gap to bond the circuit board and the reinforcing member.

[0009] In some embodiments of this application, the circuit board further includes a first surface, a side surface connected to the first surface, a groove formed by a recess in the first surface, and the groove communicating with a slide; the circuit board includes a first solder pad exposed in the groove; the circuit board assembly further includes conductive paste filled in the groove to electrically connect the circuit board and the reinforcing member.

[0010] In some embodiments of this application, the groove is formed by the common recess of the first surface and the side surface, the conductive paste is also located in the gap, and the colloid also covers the conductive paste.

[0011] In some embodiments of this application, the circuit board further includes a second solder pad and a second surface, the second surface being disposed opposite to the first surface, and the second solder pad being disposed on the first surface and / or the second surface; the circuit board assembly further includes electronic components, the electronic components being connected to the second solder pad.

[0012] In some embodiments of this application, the circuit board further includes a first surface, with a side connection to the first surface, and the circuit board includes a first solder pad exposed on the first surface and the side; the circuit board assembly also includes conductive paste, which connects the first solder pad and a reinforcing member.

[0013] The circuit board assembly manufacturing method provided in this application provides a circuit board assembly in which the reinforcing member is disposed on the side of the circuit board, without occupying the area of ​​the circuit board used for electrical connection of electronic components, which is beneficial to make full use of the space of the circuit board; in addition, it can also reduce the overall thickness of the circuit board assembly. Attached Figure Description

[0014] Figure 1 A schematic diagram of the circuit board assembly provided for the related technology of this application.

[0015] Figure 2 The diagram shows the structure of a circuit board provided in some embodiments of this application.

[0016] Figure 3 In order to be in Figure 2 The diagram shows the structure of the circuit board after the groove is formed on its side.

[0017] Figure 4 This is a schematic diagram of the structure of the reinforcing member provided in the embodiment of this application when it moves toward the circuit board.

[0018] Figure 5 for Figure 4 A schematic diagram of the structure after the reinforcing components and circuit board are assembled.

[0019] Figure 6 In order to be in Figure 5 The diagram shows a circuit board with conductive paste applied to electrically connect the reinforcing components.

[0020] Figure 7 In order to be in Figure 6 The diagram shows the structure of the circuit board after electronic components are connected to its surface.

[0021] Figure 8 In order to be in Figure 7 The diagram shows the structure of the circuit board assembly obtained after filling the gap between the circuit board and the reinforcing member with colloid.

[0022] Figure 9 The diagram shows the structure of a circuit board provided for other embodiments of this application.

[0023] Figure 10 In order to be in Figure 9 A schematic diagram of the circuit board assembly obtained after connecting electronic components and reinforcing parts to the circuit board.

[0024] Explanation of main component symbols

[0025]

[0026] Detailed Implementation

[0027] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of this application; the described embodiments are merely some, not all, of the embodiments described in this application.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes all and any combination of one or more of the associated listed items.

[0029] In the various embodiments of this application, for ease of description and not limitation, the term "connection" used in the patent application specification and claims is not limited to physical or mechanical connections, whether direct or indirect. Terms such as "upper," "lower," "above," "below," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship also changes accordingly.

[0030] Please see Figure 1A related technology provides a circuit board assembly 100', including a circuit board 10', conductive adhesive 65', electronic components 50', and a reinforcing plate 60'. The electronic components 50' are connected to one surface of the circuit board 10', and the reinforcing plate 60' is bonded to the side of the circuit board 10' opposite to the electronic components 50' by the conductive adhesive 65'. The reinforcing plate 60' occupies the space on the surface of the circuit board 10' opposite to the electronic components 50', resulting in low space utilization of the circuit board 10'; furthermore, the conductive adhesive 65' has a low thermal conductivity, making it difficult to quickly transfer the heat generated by the circuit board 10'.

[0031] Please see Figures 2 to 8 This application provides a method for manufacturing a circuit board assembly 100, which may include the following steps:

[0032] Step S1: Please refer to Figure 2 A circuit board 10 is provided, including a first surface 111, a second surface 112 and a side surface 113. The side surface 113 connects the first surface 111 and the second surface 112. A groove 116 is formed on the circuit board 10.

[0033] The circuit board 10 can be a flexible board, a rigid-flex board, or a rigid board. In this embodiment, the circuit board 10 is a rigid-flex board, and the circuit board 10 includes a first part 11, a second part 13, and a connecting part 15 connecting the first part 11 and the second part 13. The first part 11 is generally a cuboid.

[0034] The first surface 111 and the second surface 112 are two opposing surfaces. There are two side surfaces 113, which are arranged opposite each other, and each side surface 113 connects to the first surface 111 and the second surface 112. The circuit board 10 also includes a first end face 114 and a second end face 115, which are arranged opposite each other, and both the first end face 114 and the second end face 115 are connected to the first surface 111 and the second surface 112. The first surface 111, the second surface 112, the two side surfaces 113, the first end face 114, and the second end face 115 constitute the six surfaces of the first part 11. The connecting part 15 connects to the first end face 114 and extends along the first direction L1.

[0035] The groove 116 can be formed by recessing the first surface 111, or it can be formed by recessing both the first surface 111 and the side surface 113.

[0036] The circuit board 10 includes a first solder pad 18 and a second solder pad 19, the first solder pad 18 being exposed in a recess 116, and the second solder pad 19 being located on a first surface 111 and / or a second surface 112.

[0037] Step S2: Please refer to Figure 3 A groove 117 is formed on the circuit board 10. The groove 117 is formed by the recess of the side 113, and the groove 116 is connected to the groove 117.

[0038] A groove 117 is formed on each side 113, extending along a first direction L1. One end of each groove 117 penetrates the second end face 115, and the other end of each groove 117 may or may not penetrate the first end face 114. In this embodiment, both ends of each groove 117 penetrate the first end face 114 and the second end face 115.

[0039] Step S3: Please refer to Figure 4 A reinforcing member 20 is provided, which includes a main body 21 and a retaining part 23 that are connected to each other, with the retaining part 23 protruding from the main body 21.

[0040] In this embodiment, the main body 21 includes a first region 212, a second region 214, and a connecting region 216 connecting the first region 212 and the second region 214. The first region 212 and the second region 214 both extend along a first direction L1, and the connecting region 216 extends along a second direction L2. The size of the main body 21 is slightly larger than the size of the first part 11 so that the reinforcing member 20 can be fitted around the first part 11. The retaining part 23 is disposed in the first region 212 and the second region 214 and is located inside the main body 21 for retaining in the slide groove 117.

[0041] The material of the reinforcing component 20 can be stainless steel.

[0042] Step S4: Please refer to Figure 5 The retaining part 23 is retained in the slide groove 117.

[0043] The reinforcing member 20 is moved toward the circuit board 10 along the first direction L1, and the holding part 23 is accommodated in the slide groove 117. The first area 212 and the second area 214 are located on both sides of the first part 11, and a gap 30 can be provided between them and the first part 11.

[0044] The connecting area 216 is located on the side of the second end face 115, and there may be a gap 30 between the connecting area 216 and the second end face 115; the ends of the first area 212 and the second area 214 that are away from the connecting area 216 are flush with the first end face 114.

[0045] Step S5: Please refer to Figure 6 Conductive paste 40 is filled into the groove 116, and the conductive paste 40 connects the circuit board 10 and the retaining part 23.

[0046] Since the groove 116 is connected to the slide 117, the first solder pad 18 is exposed in the groove 116. The conductive paste 40 contained in the groove 116 connects the first solder pad 18 and the retaining part 23 contained in the slide 117, thereby connecting them electrically and grounding the reinforcing member 20.

[0047] When the groove 116 is formed by the recesses of the first surface 111 and the side surface 113, the conductive paste 40 can also flow into the gap 30 between the side surface 113 and the first region 212 and the gap 30 between the side surface 113 and the second region 214 to connect with the side surface 113, which helps to increase the connection area between the conductive paste 40 and the reinforcing member 20. The reinforcing member 20 can also play a role in heat dissipation. Increasing the connection area helps to increase the heat dissipation effect.

[0048] Conductive paste 40 can be solder paste, copper paste, silver paste, etc.

[0049] Step S6: Please refer to Figure 7 Electronic components 50 are connected on circuit board 10.

[0050] While filling the groove 116 with conductive paste 40, conductive paste 40 is also applied to the surface of the second pad 19 for connecting electronic component 50. Electronic component 50 can be connected to the second pad 19 located on the first surface 111 and / or the second surface 112. Electronic component 50 can be a capacitor, resistor, chip, etc.

[0051] Step S7: Please refer to Figure 8 Adhesive 35 is filled between the side 113 and the main body 21 to bond the circuit board 10 and the reinforcing member 20, thereby forming the circuit board assembly 100.

[0052] The colloid 35 fills the gap 30, and the colloid 35 can also coat the conductive paste 40 located in the gap 30.

[0053] Please see Figure 9 Other embodiments of this application provide a circuit board 10a, wherein the first solder pad 18a is a solid semi-cylindrical shape and fills the entire recess 116. For subsequent processes, please refer to... Figure 10 Conductive paste 40a can be applied to the first solder pad 18a exposed on the first surface 111 and the reinforcing member 20 to achieve electrical connection between the circuit board 10a and the reinforcing member 20, thereby obtaining the circuit board assembly 100a.

[0054] In some embodiments, when there is no need for an electrical connection between the reinforcing member 20 and the circuit board 10, there is no need to provide a groove 116 on the circuit board 10, nor is there a need to provide conductive paste 40 for electrical connection.

[0055] Please refer to it again. Figure 8 This application also provides a circuit board assembly 100, including a circuit board 10, a reinforcing member 20, a conductive paste 40, and an adhesive 35. The adhesive 35 bonds the circuit board 10 and the reinforcing member 20, and the conductive paste 40 electrically connects the circuit board 10 and the reinforcing member 20.

[0056] The circuit board 10 includes a first surface 111, a second surface 112, two oppositely arranged side surfaces 113, a first end surface 114, and a second end surface 115. The first surface 111 and the second surface 112 are oppositely arranged, and the first end surface 114 and the second end surface 115 are oppositely arranged.

[0057] The circuit board 10 has a groove 116 and a slide 117, which are interconnected. The groove 116 can be formed by recessing the first surface 111, or by recessing both the first surface 111 and the side surface 113. The slide 117 is formed by recessing the side surface 113, and one end of the slide 117 penetrates the second end face 115. In this embodiment, both ends of the slide 117 penetrate the first end face 114 and the second end face 115, respectively.

[0058] The circuit board 10 also includes a first solder pad 18 and a second solder pad 19, the first solder pad 18 being exposed in the groove 116 and the second solder pad 19 being located on the first surface 111 and / or the second surface 112.

[0059] Can be combined Figure 4 The reinforcing member 20 includes a main body portion 21 and a retaining portion 23 connected to each other, with the retaining portion 23 protruding from the main body portion 21. The main body portion 21 includes a first region 212, a second region 214, and a connecting region 216 connecting the first region 212 and the second region 214. The retaining portion 23 is disposed on the first region 212 and the second region 214 and is retained in the slide groove 117. The first region 212, the second region 214, and the connecting region 216 all have gaps 30 between themselves and the circuit board 10. Adhesive 35 is filled in the gaps 30 to bond the circuit board 10 and the reinforcing member 20.

[0060] Conductive paste 40 is filled in the groove 116, connecting the first solder pad 18 exposed in the groove 116 and the retaining portion 23 filled in the groove 117, so that the circuit board 10 is electrically connected to the reinforcing member 20. The reinforcing member 20 can be used for grounding; the resistance of the grounding is related to the grounding area. The reinforcing member 20 is disposed on the side 113 of the circuit board 10, leaving space between the first surface 111 and the second surface 112 of the circuit board 10. The thermal conductivity of the conductive paste 40 is higher than that of the conductive adhesive 65', which facilitates the rapid transfer of heat from the circuit board 10 through the conductive paste 40.

[0061] When the groove 116 is formed by the recesses of the first surface 111 and the side surface 113, the conductive paste 40 is located in the gap 30, which helps to increase the connection area between the conductive paste 40 and the reinforcing member 20. The reinforcing member 20 can also play a role in heat dissipation, and increasing the connection area helps to increase the heat dissipation effect. When the conductive paste 40 is located in the gap 30, the colloid 35 also covers the conductive paste 40 located in the gap 30.

[0062] Please see Figure 9 and Figure 10 In some embodiments, the first solder pad 18a fills the entire groove 116, and conductive paste 40a can be disposed on the first solder pad 18a exposed on the first surface 111 and the reinforcement 20 to achieve electrical connection between the circuit board 10a and the reinforcement 20.

[0063] In some embodiments, when the reinforcing member 20 does not require electrical connection with the circuit board 10, the groove 116 and the conductive paste 40 can be omitted accordingly.

[0064] The circuit board assembly 100 may also include an electronic component 50, which is electrically connected to the second pad 19.

[0065] The circuit board assembly 100 provided in this application embodiment has the reinforcing member 20 disposed on the side 113 of the circuit board 10, which does not require occupying the area of ​​the circuit board 10 used for electrically connecting electronic components 50, thus making full use of the space of the circuit board 10; and it can also reduce the overall thickness of the circuit board assembly 100.

[0066] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A method for manufacturing a circuit board assembly, characterized in that, include: A circuit board is provided, including a first surface, a side surface, a groove, and a first solder pad, wherein the side surface is connected to the first surface, the groove is formed by the first surface and the side surface being recessed together, and the first solder pad is exposed in the groove; A groove is formed on the circuit board, the groove being formed by the side recess, and the groove communicating with the groove. A reinforcing member is provided, the reinforcing member comprising a main body portion and a retaining portion connected to each other, the retaining portion protruding from the main body portion; The retaining part is held in the sliding groove, the main body is located on the side, and there is a gap between the main body and the circuit board; and The groove is filled with conductive paste to electrically connect the circuit board and the reinforcing member; The gap is filled with colloid to bond the circuit board to the reinforcement.

2. The method for manufacturing a circuit board assembly according to claim 1, characterized in that, The circuit board further includes a second solder pad and a second surface, the second surface being disposed opposite to the first surface, and the second solder pad being disposed on the first surface and / or the second surface; The manufacturing method further includes: connecting electronic components on the circuit board, wherein the electronic components are connected to the second solder pad.

3. A circuit board assembly, characterized in that, include: A circuit board includes a first surface, a side surface, a groove, a slot, a first solder pad, and a second solder pad. The side surface is connected to the first surface. The groove is formed by the first surface and the side surface being recessed together. The first solder pad is exposed in the groove. The slot is formed by the side surface being recessed. The groove is connected to the slot. The reinforcing member includes a main body and a retaining part that are connected to each other. The retaining part protrudes from the main body and is retained in the slide groove. The main body is located on the side and there is a gap between the main body and the circuit board. Conductive paste is filled into the grooves and gaps to electrically connect the circuit board and the reinforcing member; as well as An colloid is filled in the gap to bond the circuit board and the reinforcing member, and the colloid also coats the conductive paste.

4. The circuit board assembly according to claim 3, characterized in that, The circuit board further includes a second solder pad and a second surface, the second surface being disposed opposite to the first surface, and the second solder pad being disposed on the first surface and / or the second surface; the circuit board assembly further includes electronic components, the electronic components being connected to the second solder pad.

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