Electronic device and thermally conductive gasket

Abstract

The application provides an electronic device and a heat-conducting gasket. The electronic device comprises a heat-generating device, a heat-conducting gasket and a heat-dissipating device. The heat-conducting gasket has a first heat-conducting surface and a second heat-conducting surface arranged oppositely along the thickness direction of the heat-conducting gasket, the first heat-conducting surface is in contact with the heat-dissipating device, and the second heat-conducting surface is in contact with the heat-generating device. The heat-conducting gasket comprises a plurality of graphene heat-conducting layers arranged in a stack, and an adhesive layer is connected between any adjacent graphene heat-conducting layers. The graphene heat-conducting layer comprises a first end surface and a second end surface, the first end surface constitutes part of the first heat-conducting surface, and the second end surface constitutes part of the second heat-conducting surface. The outer surface is inclined relative to the second heat-conducting surface. By arranging the graphene heat-conducting layer obliquely, the heat-conducting gasket can bear more pressure on the basis of good heat-conducting capacity, is not easy to break when subjected to pressure, and thus the structural stability of the heat-conducting gasket is ensured, the heat-conducting capacity of the heat-conducting gasket is improved, and the heat-dissipating capacity of the electronic device is increased.

Description

Technical Field

[0001] This application relates to the field of electronic devices, and more particularly to an electronic device and a thermal pad. Background Technology

[0002] As the performance of heat-generating components in electronic devices, such as central processing units (CPUs) and graphics processing units (GPUs), continues to improve, their power consumption is also increasing. On the one hand, high temperatures degrade the performance of electronic devices; on the other hand, they increase the failure rate and lifespan of these devices. Currently, the main heat dissipation method involves placing a heat sink on one side of the heat-generating component to remove the heat. A thermally conductive layer (or thermal interface material layer) is then placed between the heat sink and the heat-generating component to reduce the contact thermal resistance between them.

[0003] As the power consumption of heat-generating devices gradually increases, it becomes increasingly insufficient to meet the heat dissipation needs of heat-generating devices in electronic devices.

[0004] In summary, existing electronic devices suffer from poor heat dissipation performance. Summary of the Invention

[0005] This application provides an electronic device and a thermal pad, which solves the problem of poor heat dissipation performance in existing electronic devices.

[0006] A first aspect of this application provides an electronic device, including a heat-generating device, a thermally conductive pad, and a heat dissipation device. The thermally conductive pad includes a first thermally conductive surface and a second thermally conductive surface disposed opposite to each other along the thickness direction of the thermally conductive pad; the first thermally conductive surface of the thermally conductive pad contacts the heat dissipation device, and the second thermally conductive surface contacts the heat-generating device.

[0007] The thermal pad includes multiple layers of graphene thermal conductive layers stacked sequentially and spaced apart. Each graphene thermal conductive layer has two outer surfaces arranged opposite to each other along its thickness direction. An adhesive layer connects any two adjacent graphene thermal conductive layers.

[0008] Each graphene thermally conductive layer includes a first end face and a second end face. The first end face is connected between the ends of the two outer surfaces that are closer to the first thermally conductive surface, and the second end face is connected between the ends of the two outer surfaces that are closer to the second thermally conductive surface. The first end face constitutes a portion of the first thermally conductive surface, and the second end face constitutes a portion of the second thermally conductive surface. The outer surfaces are inclined relative to the second thermally conductive surface.

[0009] The thermal pad in this embodiment relies on the graphene material in the graphene thermal conductive layer for heat conduction, resulting in good heat dissipation. By tilting the outer surface of the graphene thermal conductive layer relative to the second thermal conductive surface, the component force parallel to the horizontal direction of the graphene is smaller when the graphene thermal conductive layer is subjected to pressure in the thickness direction of the thermal pad. This prevents the graphene from breaking or being crushed when subjected to excessive pressure in the horizontal direction, thus avoiding any impact on the thermal conductivity of the thermal pad. This ensures the structural stability of the thermal pad and improves its thermal conductivity.

[0010] It should be noted that the inclination of the outer surface relative to the second heat-conducting surface can be understood as the angle between the outer surface and the second heat-conducting surface being greater than zero degrees and less than 90 degrees.

[0011] In summary, the thermal pads in the electronic devices provided in this application have good thermal conductivity and can withstand greater pressure, thus maintaining good thermal conductivity even under pressure. This helps to achieve efficient heat dissipation in electronic devices, thereby improving the performance and lifespan of the electronic devices.

[0012] In one possible implementation, the outer surface is tilted at an angle of 45°-85° relative to the second heat-conducting surface. By limiting the tilt angle, the thermal pad can withstand greater pressure, resulting in better heat dissipation performance for electronic devices.

[0013] In one possible implementation, the outer surface is tilted at an angle of 50°-75° relative to the second heat-conducting surface. This allows the graphene heat-conducting layer to withstand a certain amount of pressure. Furthermore, it prevents the graphene in the heat-conducting layer from deviating too much from the horizontal direction and the thickness direction of the heat-conducting pad, thus avoiding the heat-conducting pad being crushed under pressure. This achieves optimal overall performance.

[0014] In one possible implementation, the heat-conducting surface of the graphene thermally conductive layer is parallel to the outer surface. This can be understood as follows: heat transfer in the graphene thermally conductive layer is primarily achieved through the heat-conducting surface. Since the heat-conducting surface is parallel to the horizontal direction of the graphene, the heat conduction path of the graphene thermally conductive layer is parallel to the horizontal direction of the graphene layer, achieving high thermal conductivity.

[0015] In one possible implementation, the thermal pad further includes a first outer side and a second outer side disposed opposite to each other, both of which are in contact with the first thermally conductive surface and the second thermally conductive surface.

[0016] Each graphene thermally conductive layer includes a first side and a second side arranged opposite to each other. Each of the first and second sides is in contact with two outer surfaces, as well as a first end face and a second end face. The first side constitutes a portion of the first outer side of the thermal pad, and the second side constitutes a portion of the second outer side of the thermal pad. This can be understood as the first and second sides of the graphene thermally conductive layer respectively forming portions of the first and second outer sides of the thermal pad. This fully utilizes the space in the width direction of the thermal pad, maximizing the volume occupied by the graphene thermally conductive layer within the thermal pad, thereby maximizing the thermal conductivity of the graphene thermally conductive layer and thus maximizing the thermal conductivity of the thermal pad. In one possible implementation, the graphene thermally conductive layer is composed of graphene sheets. Graphene sheets have excellent thermal conductivity, are simple to prepare, which helps reduce the cost of the thermal pad and facilitates large-scale production.

[0017] In one possible implementation, one end of the adhesive layer between any two adjacent graphene thermally conductive layers forms part of the first thermally conductive surface, and the other end forms part of the second thermally conductive surface. This can be understood as follows: the adhesive layer is configured as a sheet-like structure with the same shape as the graphene thermally conductive layer, and the upper and lower surfaces of the adhesive layer are flush with the first and second end faces of the graphene thermally conductive layer, forming together with the graphene thermally conductive layer the first and second thermally conductive surfaces of the thermal pad. Thus, without changing the space occupied by the thermal pad, the volume of the adhesive layer is maximized, strengthening the adhesion between the adhesive layer and the graphene thermally conductive layer, and ensuring the mechanical properties of the thermal pad during use.

[0018] In one possible implementation, the heat-generating device includes a chip, and the electronic device is a server. This allows for efficient heat dissipation of the chip, resulting in better performance release and a longer lifespan for the chip, which in turn improves the performance and extends the lifespan of the server.

[0019] A second aspect of this application provides a thermally conductive pad, including a first thermally conductive surface and a second thermally conductive surface disposed opposite to each other along the thickness direction of the thermally conductive pad. The first thermally conductive surface is used to contact a heat dissipation device, and the second thermally conductive surface is used to contact a heat-generating device.

[0020] The thermal pad includes multiple layers of graphene thermal conductive layers stacked sequentially and spaced apart. Each graphene thermal conductive layer has two outer surfaces arranged opposite to each other along its thickness direction. An adhesive layer connects any two adjacent graphene thermal conductive layers.

[0021] Each graphene thermally conductive layer includes a first end face and a second end face. The first end face is connected between the ends of the two outer surfaces closest to the first thermally conductive surface, and the second end face is connected between the ends of the two outer surfaces closest to the second thermally conductive surface. The first end face constitutes a portion of the first thermally conductive surface, and the second end face constitutes a portion of the second thermally conductive surface; wherein, the outer surfaces are inclined relative to the second thermally conductive surface. Thus, by placing the graphene thermally conductive layer of the thermally conductive pad at an angle, a thermally conductive pad with good thermal conductivity and pressure resistance is obtained, resulting in better performance under pressure and stable thermal conductivity.

[0022] In one possible implementation, the outer surface is tilted at an angle of 45°-85° relative to the second thermally conductive surface. This further improves the thermal conductivity and compressive strength of the thermal pad. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the electronic device according to an embodiment of this application;

[0024] Figure 2 This is a schematic diagram of the structure of a chip packaging device in an electronic device according to an embodiment of this application;

[0025] Figure 3 This is a front view of the first embodiment of the thermal pad in the electronic device according to the present application.

[0026] Figure 4 This is a side view of the first embodiment of the thermal pad in the electronic device according to the present application.

[0027] Figure 5 This is a top view of the first embodiment of the thermal pad in the electronic device according to the present application.

[0028] Figure 6 This is a front view schematic diagram of the second embodiment of the thermal pad in the electronic device according to the present application;

[0029] Figure 7 This is a side view of the second embodiment of the thermal pad in the electronic device according to the present application.

[0030] Figure 8 This is a top view of the second embodiment of the thermal pad in the electronic device according to the present application.

[0031] Figure 9 This is a schematic flowchart illustrating the method for preparing a thermal pad in an electronic device according to an embodiment of this application.

[0032] Figures 10-14 This diagram illustrates the different stages of the preparation method of the thermal pad in the electronic device according to the embodiments of this application.

[0033] Explanation of reference numerals in the attached figures:

[0034] 100. Electronic devices;

[0035] 1. Thermal pad; 13. First thermally conductive surface; 14. Second thermally conductive surface; 15. First outer surface; 16. Second outer surface;

[0036] 11. Graphene thermally conductive layer; 11A. Graphene thermally conductive layer preform; 110. Graphene sheet; 111. Strip graphene; 1111. First end face; 1112. Second end face; 1113. First outer surface; 1114. Second outer surface; 1115. First side surface; 1116. Second side surface; 112. Adhesive strip;

[0037] 12. Adhesive layer; 12A. Adhesive layer prefabricated component;

[0038] 2. Chip packaging device; 21. Packaging substrate; 22. Thermally conductive shell; 23. Chip; 24. Mounting space; 25. Thermally conductive adhesive layer; 20. Heat-generating device;

[0039] 3. Heat dissipation components; 31. Mounting holes; 32. Fixtures; 33. Thermal conductive modules;

[0040] 4. Circuit board;

[0041] 51. First composite layer; 52. Second composite layer; 53. Semi-finished thermal pad; 54. Pre-formed sheet; 55. Substrate; 55A. Bevel;

[0042] z, the thickness direction of the thermal pad; x, the first direction; α, the tilt angle of the outer surface relative to the second thermally conductive surface. Detailed Implementation

[0043] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to these embodiments. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0044] In the description of the embodiments of this application, it should be noted that the mutual perpendicularity in the embodiments of this application is not absolute perpendicularity. Approximate perpendicularity due to processing errors and assembly errors (e.g., the included angle between two structural features is 88°) is also within the range of mutual perpendicularity in the embodiments of this application. Similarly, the mutual parallelism in the embodiments of this application is not absolute parallelism. Approximate parallelism due to processing errors and assembly errors (e.g., the included angle between two structural features is 2°) is also within the range of mutual parallelism in the embodiments of this application. The axial symmetry in the embodiments of this application is not absolute axial symmetry. Approximate axial symmetry due to processing errors and assembly errors (e.g., a portion of the structure is offset by a certain distance or angle relative to the axis of symmetry) is also within the range of axial symmetry in the embodiments of this application. The embodiments of this application do not impose specific limitations on this.

[0045] This application provides an electronic device including a heat-generating device, a heat-dissipating device, and a thermally conductive pad disposed between the two. One side of the thermally conductive pad contacts the heat-dissipating device, and the other side contacts the heat-generating device. Good contact is achieved with the heat-generating device under a certain pressure.

[0046] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the specific implementation methods of the embodiments of this application will be further described in detail below with reference to the accompanying drawings.

[0047] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0048] like Figure 1 As shown, this application embodiment provides an electronic device 100. The electronic device 100 includes a heat-generating device 20, a thermally conductive pad 1, and a heat-dissipating device 3. The heat-generating device 20, the thermally conductive pad 1, and the heat-dissipating device 3 are sequentially stacked along the thickness direction z of the thermally conductive pad. The first thermally conductive surface 13 of the thermally conductive pad 1 contacts the heat-dissipating device 3, and the second thermally conductive surface 14 contacts the heat-generating device 20 (the specific structure of the thermally conductive pad 1 will be described in detail below), thereby allowing the heat generated by the heat-generating device 20 to be transferred to the heat-dissipating device 3 through the thermally conductive pad 1, and finally dissipated by the heat-dissipating device 3.

[0049] It should be noted that the specific type of electronic device 100 is not limited. In one possible implementation, electronic device 100 can be a server, computer, switch, or other device with heat-generating components. For example, this embodiment will use a server as an example to illustrate the concept.

[0050] It will be understood by those skilled in the art that the types and structures of the heat-generating device 20 and the heat-dissipating device 3 in the electronic device 100 are not limited.

[0051] Please see Figure 2 , Figure 2 This is a schematic diagram of the structure of a chip packaging device in an electronic device according to an embodiment of this application.

[0052] like Figure 2 As shown, in one possible implementation, the heat-generating device 20 can be a chip. Those skilled in the art will understand that the chip referred to here can refer to a bare die or a chip-packaged device formed by packaging a bare die. The following explanation will use a chip-packaged device 2 as an example, and the case of a bare die will not be elaborated upon.

[0053] See also Figure 2 The chip packaging device 2 includes a packaging substrate 21, a thermally conductive shell 22, and a chip 23. The thermally conductive shell 22 and the chip 23 are disposed on the packaging substrate 21, and a mounting space 24 exists between the thermally conductive shell 22 and the packaging substrate 21, with the chip 23 disposed within the mounting space 24. The thermally conductive shell 22 exchanges heat with the chip 23 within the mounting space 24 through a thermally conductive adhesive layer 25, thereby allowing the heat dissipation device 3 to exchange heat with the thermally conductive shell 22 through the thermally conductive pad 1, ultimately removing the heat generated by the chip 23.

[0054] It is understandable that the specific type of chip packaging device 2 is also not limited.

[0055] In one possible implementation, chip package 2 can be a central processing unit (CPU) package, a graphics processing unit (GPU) package, an embedded neural network processor package, etc. It is understood that when chip package 2 is a CPU package, the corresponding chip 23 is a CPU. When chip package 2 is a GPU package, chip 23 is a GPU. When chip package 2 is an embedded neural network processor package, chip 23 is an embedded neural network processor.

[0056] The above is an introduction to the possible structure of the heat-generating device 20. The heat dissipation device 3 will be introduced below with reference to the attached diagram.

[0057] like Figure 1As shown, in one possible implementation, the heat dissipation device 3 may specifically include a heat-conducting module 33 and a heat dissipation module (not shown in the figure). The heat-conducting module 33 has a heat dissipation surface that faces and is in contact with the first heat-conducting surface 13 of the heat-conducting pad 1. This allows the heat transferred by the heat-conducting pad 1 to pass through the heat-conducting module 33 and ultimately to the heat dissipation module connected to the heat-conducting module 33, where it is dissipated. This maintains the normal temperature of the electronic device 100, ensuring a stable operating environment and full performance release for the chip package device 2.

[0058] It should be noted that the specific type of heat dissipation device 3 is not limited. In one possible implementation, the heat dissipation device 3 can be an air-cooled radiator or a water-cooled radiator. Accordingly, when the heat dissipation device 3 is an air-cooled radiator, the heat conduction module 33 is a base, and the heat dissipation module is a heat dissipation fin. The fan is stacked with the base (heat conduction module 33) and the heat is dissipated through airflow. When the heat dissipation device 3 is a water-cooled radiator, the heat conduction module 33 is a cold plate, and the heat dissipation module is a radiator. The radiator is connected to the cold head (heat conduction module 33) through water pipes, and the heat from the cold head is carried away by the coolant flowing in the water pipes. The embodiments of this application are not limited here.

[0059] like Figures 1-2 As shown, in one possible implementation, the electronic device 100 may also include a circuit board 4, with the packaging substrate 21 of the chip packaging device 2 mounted on and electrically connected to the circuit board 4, so that the chip 23 can be electrically connected to the circuit board 4 through the packaging substrate 21. Furthermore, as... Figure 1 As shown, in one possible implementation, the electronic device 100 further includes a fixing member 32. The fixing member 32 passes through the mounting hole 31 provided on the heat-conducting module 33 and fixes the heat-conducting module 33 to the circuit board 4. During installation, the fixing member 32 applies a certain pressure to the heat-conducting pad 1 through the heat-conducting module 33, thereby allowing the heat-conducting pad 1 to make better contact with the heat-generating device 20 and the heat-dissipating device 3, thus achieving a better heat transfer effect.

[0060] It should be noted that the specific type of circuit board 4 is not limited. In one possible implementation, circuit board 4 is a motherboard, used for the integration and connection of various components. In another possible implementation, circuit board 4 can also be a sub-board. This application embodiment does not impose any limitations here. Furthermore, circuit board 4 can be a PCB board. This application embodiment also does not impose any limitations here.

[0061] The above is an exemplary description of the usage scenarios of the embodiments of this application. The specific structure of the thermal pad 1 provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0062] Please see Figures 3-5 , Figure 3This is a front view of the first embodiment of the thermal pad in the electronic device according to the present application. Figure 4 This is a side view of the first embodiment of the thermal pad in the electronic device according to the present application. Figure 5 This is a top view schematic diagram of the first embodiment of the thermally conductive pad in the electronic device according to the present application. It should be noted that the pattern filling of the graphene thermally conductive layer in the figure is only for ease of distinction and understanding, and does not constitute a specific limitation on the graphene thermally conductive layer.

[0063] like Figures 3-5 As shown, and in combination Figure 1 It is understood that this application provides a thermally conductive pad 1, which includes a first thermally conductive surface 13 and a second thermally conductive surface 14 disposed opposite to each other along the thickness direction z of the thermally conductive pad. The first thermally conductive surface 13 is in contact with the heat dissipation device 3, and the second thermally conductive surface 14 is in contact with the heat-generating device 20.

[0064] The thermal pad 1 includes multiple layers of graphene thermal conductive layers 11 stacked sequentially and spaced apart. Each graphene thermal conductive layer 11 has two outer surfaces (first outer surface 1113 and second outer surface 1114) arranged opposite to each other along its thickness direction. An adhesive layer 12 connects any two adjacent graphene thermal conductive layers 11.

[0065] Each graphene thermally conductive layer 11 includes a first end face 1111 and a second end face 1112. The first end face 1111 connects the ends of the first outer surface 1113 and the second outer surface 1114 near the first thermally conductive surface 13, and the second end face 1112 connects the ends of the first outer surface 1113 and the second outer surface 1114 near the second thermally conductive surface 14. The first end face 1111 constitutes a portion of the first thermally conductive surface 13, and the second end face 1112 constitutes a portion of the second thermally conductive surface 14; wherein the first outer surface 1113 and the second outer surface 1114 are inclined relative to the second thermally conductive surface 14. That is, the graphene thermally conductive layer is inclined relative to the second thermally conductive surface.

[0066] It should be noted that the inclination of the outer surface relative to the second heat-conducting surface can be understood as the angle between the outer surface and the second heat-conducting surface being greater than zero degrees and less than 90 degrees.

[0067] This can be understood as follows: the thermal pad 1 mainly relies on the graphene material (hereinafter referred to as graphene) in the graphene thermal conductive layer 11 for heat conduction. In this embodiment, the outer surface of the graphene thermal conductive layer 11 is inclined relative to the second thermal conductive surface 14. That is, the graphene thermal conductive layer is inclined relative to the second thermal conductive surface, so that when the graphene thermal conductive layer 11 is subjected to pressure in the thickness direction z of the thermal pad, the component force parallel to the horizontal direction of the graphene is smaller. This prevents the graphene from breaking or being crushed when subjected to excessive pressure in the horizontal direction, thereby affecting the thermal conductivity of the thermal pad 1.

[0068] In summary, the thermal pad 1 in the electronic device 100 provided in this application embodiment has good thermal conductivity and can withstand greater pressure, thus maintaining good thermal conductivity even under pressure. This helps to achieve efficient heat dissipation of the electronic device 100, and further helps to improve the performance and service life of the electronic device 100. Those skilled in the art will understand that the thickness direction z of the aforementioned thermal pad can be the height direction of the electronic device 100, or the height direction of the gap between the heat dissipation device 3 and the heat generation device 20. This application embodiment does not impose any limitations on this.

[0069] Similarly, it should be noted that the specific shape of the aforementioned outer surface is not limited. In one possible implementation, the outer surface of the thermal pad 1 is planar. In another possible implementation, the outer surface can also be curved or other shapes. The outer surface can be adaptively varied according to the specific shape of the graphene thermally conductive layer 11. This application does not impose any limitations on the embodiments herein.

[0070] In summary, the thermally conductive pad 1 provided in this embodiment can withstand significant pressure while maintaining good thermal conductivity. This contributes to efficient heat dissipation of the electronic device 100, thereby improving its performance and lifespan.

[0071] The above is a description of the basic scheme of the embodiments of this application. The specific structure of the thermal pad 1 will be described in detail below.

[0072] First, it should be noted that the specific overall shape of the thermal pad 1 is not limited. Furthermore, different graphene thermal conductive layers 11 can have the same or different structures; this application embodiment does not impose any restrictions on this.

[0073] like Figure 5 As shown, and in combination Figure 3 It is understood that, in one possible implementation, the thermal pad 1 further includes a first outer surface 15 and a second outer surface 16 disposed opposite to each other, both of which are in contact with the first thermally conductive surface 13 and the second thermally conductive surface 14. It should be noted that, as... Figure 5 As shown, in one example, the first outer surface 15 and the second outer surface 16 are arranged opposite to each other in a first direction x, which is perpendicular to the thickness direction z of the thermal pad. The specific direction of the first direction x is not limited; for example, it can be the width direction of the thermal pad 1 or the length direction of the thermal pad 1. This embodiment of the application does not impose any limitations on this.

[0074] Furthermore, such as Figure 3As shown, in one possible implementation, both the first thermally conductive surface 13 and the second thermally conductive surface 14 are planar and perpendicular to the thickness direction z of the thermally conductive pad. The fact that both the first thermally conductive surface 13 and the second thermally conductive surface 14 are planar and perpendicular to the thickness direction z of the thermally conductive pad facilitates contact between the thermally conductive pad 1 and the heat dissipation device 3 and the heat-generating device 20, thereby improving heat transfer efficiency.

[0075] Those skilled in the art will understand that the first heat-conducting surface 13 and the second heat-conducting surface 14 may not be planar, in order to adapt to the special shape of the heat dissipation device 3 or the heat-generating device 20. Those skilled in the art can design freely as needed, and the embodiments of this application are not limited herein.

[0076] Secondly, it should be noted that the specific shape of the graphene thermal conductive layer 11 is also not limited.

[0077] like Figures 3-5 As shown, in one possible implementation, the tilt angle α of the outer surface relative to the second heat-conducting surface 14 is 45°-85°. By limiting the tilt angle, the heat-conducting pad can withstand greater pressure, resulting in better heat dissipation performance of the electronic device.

[0078] In some implementations, the tilt angle α of the outer surface relative to the second heat-conducting surface 14 is set to 50°-75°. For example, the tilt angle α of the outer surface relative to the second heat-conducting surface 14 can be 50°, 55°, 60°, 65°, 70°, or 75°. Setting the tilt angle α of the outer surface relative to the second heat-conducting surface 14 to 50°-75° allows the graphene heat-conducting layer 11 to withstand a certain amount of pressure. On the other hand, the graphene in the graphene heat-conducting layer 11 will not deviate too much from its horizontal direction and the thickness direction z of the heat-conducting pad, thus preventing the heat-conducting pad 1 from being crushed under pressure. This achieves the optimal overall performance.

[0079] The above describes the structural features of the graphene thermally conductive layer 11 along the heat conduction path. It is understandable that the structure of the graphene thermally conductive layer 11 in the direction perpendicular to the heat conduction path is also not limited.

[0080] like Figures 3-5As shown, in one possible implementation, the graphene thermal conductive layer 11 is entirely composed of graphene (or it can be understood that the graphene thermal conductive layer 11 is composed of a single graphene sheet 110, which has excellent thermal conductivity and is simple to prepare, which helps to reduce the cost of the thermal pad and facilitates the large-scale preparation of the thermal pad). The graphene thermal conductive layer 11 includes a first side 1115 and a second side 1116 arranged opposite to each other. Each side of the first side 1115 and the second side 1116 is connected to the first outer surface 1113 and the second outer surface 1114, as well as the first end face 1111 and the second end face 1112. The first side 1115 constitutes part of the first outer side 15 of the thermal pad 1, and the second side 1116 constitutes part of the second outer side 16 of the thermal pad 1.

[0081] This can be understood as follows: the graphene thermally conductive layer 11 is configured as a layered (or sheet-like) graphene thermally conductive layer 11. In this case, the first side 1115 and the second side 1116 of the graphene thermally conductive layer 11 respectively constitute portions of the first outer side 15 and the second outer side 16 of the thermal pad 1. This maximizes the volume of the graphene thermally conductive layer 11 within the thermal pad 1, thereby maximizing the thermal conductivity of the graphene thermally conductive layer 11 and, consequently, maximizing the thermal conductivity of the thermal pad 1.

[0082] It should be noted that the heat conduction method of the graphene thermal conductive layer is also not limited.

[0083] In one possible implementation, the heat-conducting surface of the graphene thermally conductive layer 11 is parallel to the outer surfaces (first outer surface 1113 and second outer surface 1114). This can be understood as follows: heat transfer in the graphene thermally conductive layer 11 is primarily achieved through the heat-conducting surface. Since the heat-conducting surface of the graphene thermally conductive layer is a horizontal plane of the graphene, the heat conduction path of the graphene thermally conductive layer is parallel to the horizontal direction of the graphene layer. This allows the ultra-high thermal conductivity of graphene in the horizontal direction to be utilized, thereby improving the thermal conductivity efficiency of the thermal pad 1 and achieving high thermal conductivity.

[0084] It should be noted that, compared to contact thermal conductive materials (such as thermal grease and liquid metal), the thermal pad 1, which includes graphene, can significantly improve thermal efficiency by utilizing the extremely high thermal conductivity of graphene in the horizontal direction. For example, the thermal conductivity of a single layer of graphene is as high as 5300 W / (m·K), while the thermal conductivity of commonly used thermal grease is typically 3.3 W / (m·K)-8 W / (m·K). Furthermore, compared to contact thermal conductive materials that may fail over long-term use, the thermal pad 1 also has advantages such as being maintenance-free and having a wide range of applications.

[0085] In another possible implementation, the thermally conductive surface of the graphene thermally conductive layer may not be parallel to the outer surface to accommodate certain special requirements, and this application does not impose any limitations on this. The above is an exemplary description of a specific structure of a single graphene thermally conductive layer 11 (another specific structure of a single graphene thermally conductive layer 11 will be described below in conjunction with the accompanying drawings). It should be noted that the relationship between different graphene thermally conductive layers 11 is also not limited.

[0086] like Figure 3 As shown, in one possible implementation, the multiple graphene thermally conductive layers 11 are arranged in parallel with each other. The parallel arrangement here mainly refers to the parallelism between the first outer surfaces 1113 of each graphene thermally conductive layer 11 and the parallelism between the second outer surfaces 1114. The parallel arrangement of the multiple graphene thermally conductive layers 11 helps to achieve uniform heat conduction and avoid the generation of local hot spots. Furthermore, it also makes the thermal pad 1 easier to manufacture uniformly, which is beneficial for reducing the cost of the thermal pad 1.

[0087] Similarly, Figure 3 As shown, furthermore, the multi-graphene thermal conductive layers 11 can also be configured with the same specifications, in which case the first outer surface 1113 and the second outer surface 1114 of all graphene thermal conductive layers are parallel. The first side surface 1115 of all graphene thermal conductive layers are located on the same plane. The second side surface 1116 of all graphene thermal conductive layers are located on the same plane. This ensures that all four outer surfaces of the thermal pad are flat planes, facilitating transportation and processing.

[0088] In another possible implementation, any two graphene thermally conductive layers 11 may not be arranged in parallel. This allows for targeted heat conduction path design for the high-heat areas of the chip package device 2. The embodiments described in this application are not limited thereto.

[0089] The above is a complete description of one implementation of the graphene thermal conductive layer 11. The following will describe another implementation of the graphene thermal conductive layer 11 in conjunction with the accompanying drawings.

[0090] Please see Figures 6-8 , Figure 6 This is a front view of the second embodiment of the thermal pad in the electronic device according to the present application. Figure 7 This is a side view of the second embodiment of the thermal pad in the electronic device according to the present application. Figure 8 This is a top view of the second embodiment of the thermal pad in the electronic device according to the present application.

[0091] like Figures 6-8As shown, in another possible implementation, the main difference lies in the fact that the graphene thermally conductive layer 11 can also be formed by bonding strips of graphene 111 and adhesive strips 112 together in the first direction x (e.g., the width direction of the thermally conductive pad 1). Specifically, the strips of graphene 111 are spaced apart in the first direction x, and an adhesive strip 112 is provided between any two adjacent strips of graphene 111 to bond them together. This enhances the overall adhesion of the graphene thermally conductive layer 11 and improves its mechanical properties.

[0092] The above is a complete description of another implementation method of graphene thermal conductive layer 11. The specific thickness of the graphene thermal conductive layer will be described below.

[0093] Those skilled in the art will understand that the specific thickness of the graphene thermal conductive layer 11 is not limited. First, the thickness direction of the graphene thermal conductive layer 11 needs to be defined: the thickness of the graphene thermal conductive layer 11 is the distance from the first outer surface 1113 to the second outer surface 1114 in the direction perpendicular to the tangent plane at any point on the first outer surface 1113. It should be noted that the tangent plane is the plane itself. In one possible implementation, the thickness of the graphene thermal conductive layer 11 is 5μm-300μm, for example, 5μm, 50μm, 100μm, 150μm, 200μm, 250μm, or 300μm. Those skilled in the art will understand that the larger the thickness of the graphene thermal conductive layer 11, the better the thermal conductivity, and the better the thermal conductivity of the thermal pad 1. The smaller the thickness of the graphene thermally conductive layer 11, the more flexible its placement in the thermally conductive pad 1 can be, resulting in lower costs and a more secure bond. Those skilled in the art can freely set the thickness as needed, and this application does not impose any limitations. For example, in another possible implementation, the thickness of the graphene thermally conductive layer 11 can be less than 5 μm or greater than 300 μm, such as 3 μm, 4 μm, or 350 μm, 400 μm, 500 μm, etc., to save costs or achieve better thermal conductivity.

[0094] The above is a detailed description of the various possible structures of the graphene thermal conductive layer 11. The following will describe the specific structure of the adhesive layer 12.

[0095] It should be noted that the specific structure of the adhesive layer in the embodiments of this application is not limited.

[0096] like Figures 4-5 and Figures 7-8As shown, in one possible implementation, one end of the adhesive layer 12 between any two adjacent graphene thermally conductive layers 11 forms part of the first thermally conductive surface 13, and the other end forms part of the second thermally conductive surface 14. This can be understood as follows: the adhesive layer 12 is configured as a layered (sheet-like) structure with the same shape as the graphene thermally conductive layer 11, and the upper and lower surfaces of the adhesive layer 12 are flush with the first end face 1111 and the second end face 1112 of the graphene thermally conductive layer 11, and together with the graphene thermally conductive layer 11, they form the first thermally conductive surface 13 and the second thermally conductive surface 14 of the thermally conductive pad 1. This ensures that the space between any two adjacent graphene thermally conductive layers 11 is filled with the adhesive layer 12, and the two ends of the adhesive layer 12 respectively form part of the first thermally conductive surface 13 and the second thermally conductive surface 14 of the thermally conductive pad 1. Thus, without changing the space occupied by the thermal pad 1, the volume of the adhesive layer 12 is increased to the maximum extent, which strengthens the bonding effect of the adhesive layer 12 to the graphene thermal conductive layer 11 and ensures the mechanical properties of the thermal pad 1 during use.

[0097] It should be noted that the specific material of the adhesive layer in this application embodiment is not limited. In one possible implementation, the adhesive layer can be made of organic glue, such as a glue containing a base adhesive, silicone oil, platinum catalyst, inhibitor, etc. This results in good bonding performance while maintaining low cost.

[0098] Those skilled in the art will understand that the thickness of the adhesive layer 12 is also not limited. In one possible implementation, the thickness can be 20μm-35μm, such as 20μm, 25μm, 30μm, or 30μm, to ensure the adhesion effect of the adhesive layer. Those skilled in the art will understand that the thicker the adhesive layer 12, the better the adhesion effect, but it will also lead to a decrease in the space occupied by the graphene thermally conductive layer 11, weakening the thermal conductivity. Conversely, the thinner the adhesive layer 12, the weaker the adhesion effect. Those skilled in the art can design it freely as needed, and the embodiments of this application are not limited herein. For example, in another possible implementation, the thickness can also be less than 20μm or greater than 35μm, such as 10μm, 15μm, or 40μm, 45μm, 50μm, etc., to achieve a better adhesion effect or a better thermal conductivity effect.

[0099] The above describes the possible specific structures of the thermally conductive pad 1 and its included graphene thermally conductive layer 11 and adhesive layer 12 in the embodiments of this application. For clarity, an exemplary preparation method of the thermally conductive pad 1 in the embodiments of this application is also given below.

[0100] Please see Figures 9-14 , Figure 9 This is a schematic flowchart illustrating the method for preparing a thermal pad in an electronic device according to an embodiment of this application. Figures 10-14 This diagram illustrates the different stages of the preparation method of the thermal pad in the electronic device according to the embodiments of this application.

[0101] like Figure 9 As shown, and in combination Figures 3-5 It is understood that this application provides a method for preparing the aforementioned thermal pad 1. Specifically, it includes the following steps:

[0102] S1: As Figure 10 As shown, a graphene thermally conductive layer preform 11A is provided, and an adhesive layer preform 12A is coated on the surface of the graphene thermally conductive layer preform 11A to obtain a first composite layer 51.

[0103] S2: As Figures 11-12 As shown, a substrate 55 including a slope 55A is provided. The slope 55A forms an angle with the thickness direction z of the thermal pad, and the angle is complementary to the tilt angle α of the outer surface relative to the second thermally conductive surface 14. The side of the graphene thermally conductive layer preform 11A of the first composite layer 51 away from the adhesive layer preform 12A is attached to the slope 55A.

[0104] S3: As Figure 11 As shown, repeat the above coating steps to obtain the second composite layer 52.

[0105] S4: As Figure 11 As shown, the graphene thermally conductive layer preform 11A of the second composite layer 52 is bonded to the adhesive layer preform 12A of the first composite layer 51 and then bonded and fixed.

[0106] S5: As Figure 12 As shown, repeat the above coating and bonding steps to obtain the thermal pad semi-finished product 53.

[0107] S6: As Figures 12-13 As shown, the thermal pad semi-finished product 53 is cut into pre-formed sheets 54 of a specific thickness.

[0108] S7: As Figure 14 As shown, and in combination Figure 3 Understood, the surface of the preform 54 is treated to obtain the thermal pad 1.

[0109] Those skilled in the art will understand that the specific steps for obtaining the semi-finished thermal pad 53 in S5 are not limited. In one possible implementation, the steps for obtaining the semi-finished thermal pad 53 include:

[0110] S51: Repeat the coating and bonding steps until a semi-finished thermal pad 53 of the target length in the horizontal direction is formed. The target length can be arbitrary, for example, 10cm-15cm.

[0111] S52: After standing for 8-16 hours, heat the semi-finished thermal pad 53 at a temperature of 120-200℃ for 2-6 hours to cure the adhesive layer preform 12A.

[0112] like Figure 13 As shown, and in combination Figure 3 It is understood that by setting the length to 10cm-15cm, on the one hand, processing accuracy can be ensured, making the first heat-conducting surface 13 and the second heat-conducting surface 14 of the prepared heat-conducting pad 1 flat. On the other hand, as many heat-conducting pads 1 as possible can be processed in one operation.

[0113] It should be noted that the specific steps of the cutting process in S6 are not limited. In one possible implementation, the cutting steps include:

[0114] S61: Cut the semi-finished thermal pad 53 into preforms 54 with a thickness of 0.1mm-3.0mm along the horizontal direction.

[0115] like Figure 13 As shown, and in combination Figure 2 It is understood that by setting the thickness of the preform 54 to 0.1mm-3.0mm, it can be well matched with the installation dimensions of various commonly used heat-generating and heat-dissipating components on the market.

[0116] It should be noted that the specific steps of surface treatment in S7 are not limited. In one possible implementation, the surface treatment steps include:

[0117] S71: Using lint-free paper soaked in adhesive remover, wipe the surface of the preform 54 and remove excess adhesive layer preform 12A from the surface of the preform 54.

[0118] S72: Use ultrasonic cleaning to remove adhesive from the surface of preform 54.

[0119] By treating the excess adhesive layer preform 12A on the surface of the preform 54 with a desiccant, this part can prevent the graphene thermal conductive layer 11 from making contact with the surface of the heat-generating or heat-dissipating component, thereby hindering the heat transfer process and improving the thermal conductivity of the thermal pad.

[0120] The above describes one method for preparing a thermally conductive pad according to an embodiment of this application. Two sets of experimental data for thermally conductive pads according to embodiments of this application will also be provided below for reference by those skilled in the art.

[0121] The test method was the steady-state heat flow method, and the test standard was the standard for thermal conductivity of thin solid electrical insulating materials (ASTM D5470 2006). Table 1 shows the test conditions with a thermally conductive pad thickness of 0.3 mm. Table 2 shows the test conditions with a thermally conductive pad thickness of 2.0 mm. The measured data are as follows:

[0122] Table 1

[0123]

[0124] Table 2

[0125]

[0126] As can be seen from Tables 1 and 2, the thermal pads provided in the embodiments of this application can withstand greater pressure and maintain good thermal conductivity even when under pressure, which helps to achieve efficient heat dissipation of electronic devices, thereby also helping to improve the performance and service life of electronic devices.

[0127] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. An electronic device, characterized in that, It includes a heat-generating device, a thermally conductive pad, and a heat dissipation device; wherein, the thermally conductive pad includes a first thermally conductive surface and a second thermally conductive surface disposed opposite to each other along the thickness direction of the thermally conductive pad; the first thermally conductive surface of the thermally conductive pad is in contact with the heat dissipation device, and the second thermally conductive surface is in contact with the heat-generating device; The thermal pad includes multiple layers of graphene thermal conductive layers stacked sequentially and spaced apart along its length. Each graphene thermal conductive layer has two outer surfaces arranged opposite to each other along its thickness direction. An adhesive layer connects any two adjacent graphene thermal conductive layers. The length direction is perpendicular to the thickness direction of the thermal pad. Each of the graphene thermally conductive layers includes a first end face and a second end face. The first end face is connected between the ends of the two outer surfaces that are closer to the first thermally conductive surface, and the second end face is connected between the ends of the two outer surfaces that are closer to the second thermally conductive surface. The outer surfaces are inclined relative to the second thermally conductive surface to prevent the graphene from breaking when subjected to excessive pressure parallel to its horizontal direction. The upper surface of the adhesive layer is flush with the first end face of the graphene thermally conductive layer, so as to form the first thermally conductive surface together with the first end face; the lower surface of the adhesive layer is flush with the second end face of the graphene thermally conductive layer, so as to form the second thermally conductive surface together with the second end face. The graphene thermal conductive layer further includes an adhesive strip and multiple layers of graphene strips, which are spaced apart in the width direction. An adhesive strip is provided between any two adjacent graphene strips to bond adjacent graphene strips, thereby enhancing the mechanical properties of the graphene thermal conductive layer. The width direction is perpendicular to the length direction and the thickness direction of the thermal pad, respectively.

2. The electronic device as claimed in claim 1, characterized in that, The outer surface is inclined at an angle of 45° relative to the second heat-conducting surface. 85°.

3. The electronic device as described in claim 2, characterized in that, The outer surface is inclined at an angle of 50° relative to the second heat-conducting surface. 75°.

4. The electronic device as claimed in claim 1, characterized in that, The thermally conductive surface of the graphene thermally conductive layer is parallel to the outer surface.

5. The electronic device as claimed in claim 1, characterized in that, The thermal pad also includes a first outer side and a second outer side disposed opposite to each other, wherein the first outer side and the second outer side are both in contact with the first thermally conductive surface and the second thermally conductive surface; Each of the graphene thermally conductive layers includes a first side and a second side disposed opposite to each other. Each of the first side and the second side is in contact with the two outer surfaces, as well as the first end face and the second end face. The first side constitutes part of the first outer side of the thermally conductive pad, and the second side constitutes part of the second outer side of the thermally conductive pad.

6. As claimed in claim 1 5. The electronic device according to any one of the claims, characterized in that, The graphene thermally conductive layer is composed of graphene sheets.

7. As claimed in claim 1 5. The electronic device according to any one of the claims, characterized in that, One end of the adhesive layer between any two adjacent graphene thermally conductive layers constitutes part of the first thermally conductive surface, and the other end constitutes part of the second thermally conductive surface.

8. As claimed in claim 1 5. The electronic device according to any one of the claims, characterized in that, The heat-generating device includes a chip, and the electronic device is a server.

9. A thermally conductive pad, characterized in that, It includes a first thermally conductive surface and a second thermally conductive surface disposed opposite to each other along the thickness direction of the thermally conductive pad; the first thermally conductive surface is used to contact the heat dissipation device, and the second thermally conductive surface is used to contact the heat-generating device. The thermal pad includes multiple layers of graphene thermal conductive layers stacked sequentially and spaced apart along its length. Each graphene thermal conductive layer has two outer surfaces arranged opposite to each other along its thickness direction. An adhesive layer connects any two adjacent graphene thermal conductive layers. The length direction is perpendicular to the thickness direction of the thermal pad. Each of the graphene thermally conductive layers includes a first end face and a second end face. The first end face is connected between the ends of the two outer surfaces that are closer to the first thermally conductive surface, and the second end face is connected between the ends of the two outer surfaces that are closer to the second thermally conductive surface. The outer surfaces are inclined relative to the second thermally conductive surface to prevent the graphene from breaking when subjected to excessive pressure parallel to its horizontal direction. The upper surface of the adhesive layer is flush with the first end face of the graphene thermally conductive layer, so as to form the first thermally conductive surface together with the first end face; the lower surface of the adhesive layer is flush with the second end face of the graphene thermally conductive layer, so as to form the second thermally conductive surface together with the second end face. The graphene thermal conductive layer further includes an adhesive strip and multiple layers of graphene strips, which are spaced apart in the width direction. An adhesive strip is disposed between any two adjacent graphene strips, and the adhesive strip is used to bond adjacent graphene strips to enhance the mechanical properties of the graphene thermal conductive layer. The width direction is perpendicular to the length direction and the thickness direction of the thermal pad, respectively.

10. The thermally conductive pad as described in claim 9, characterized in that, The outer surface is inclined at an angle of 45° relative to the second heat-conducting surface. 85°.

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