Manufacturing method of LED device and LED device

Abstract

The invention relates to a manufacturing method of an LED device and the LED device. The manufacturing method of the LED device comprises the following steps: carrying out mold pressing on a transparent colloid on a substrate on which a light-emitting chip is transferred; grooving in the direction from the bottom surface of the substrate to the transparent colloid, so that groove bodies which are communicated with each other are formed in the substrate and the transparent colloid; the groove body is filled with light blocking glue, the light blocking glue is arranged on the periphery of the light-emitting chip in a surrounding mode, and the top face of the light blocking glue is higher than the top face of the light-emitting chip. According to the LED device, the groove body is formed by grooving the substrate and the transparent colloid, the groove body can be filled with the light blocking glue higher than the light emitting chip, so that the light blocking glue surrounds the periphery of the light emitting chip, the problem of light emitting color cast is solved, meanwhile, the LED device manufactured through the substrate is easy to achieve the tiny distance of the chips, and the light emitting efficiency is improved. And the problem that the box dam is rugged due to the fact that the groove body is filled with the light blocking glue is solved, and the technical problems that in the related technology, the small interval size of a cup-shaped structure is difficult to achieve, a uniform cup-like structure is difficult to achieve during ink brushing, and the effect is poor are solved.

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