A chip packaging device and a packaging method

Abstract

The application discloses a kind of chip packaging device and packaging method, belong to chip packaging field.A kind of chip packaging device, including packaging table, the top rotation of the packaging table cavity is connected with station turntable, four groups of packaging card slot are set on the station turntable with equal interval, the middle part of the packaging table cavity is fixedly connected with mounting bracket, the mounting bracket is worn out from the center hollow slot of station turntable, the mounting bracket is slidably connected with plastic package tube, further including: plastic package component, the plastic package component is arranged on mounting bracket, and plastic package component is used to the chip in packaging card slot is plastic package;Exhaust component;The application is reciprocated by piston plate in piston bin sliding, so that the gas in plastic package tube is extracted, to reduce the air pressure in plastic package tube, after opening the electromagnetic valve in block hopper, under the action of air pressure in the upper cavity of plastic package tube, plastic package slurry will be rapidly covered and pressed on the surface of chip, to improve the packaging effect, ensure the protection effect to chip.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and in particular to a chip packaging apparatus and packaging method. Background Technology

[0002] Chip packaging refers to the process of protectively packaging finished integrated circuit chips during semiconductor manufacturing. The main purpose of packaging is to protect the chip from physical damage or chemical corrosion and to provide a way to connect the electronic signals on the chip to external circuits. Chip packaging is a complex process that includes a series of steps such as chip bonding, wire bonding, and encapsulation to ensure that the chip can function reliably and is easy to mount on a circuit board.

[0003] Currently, during chip molding, it is difficult for the molding paste to completely and firmly cover the chip surface, resulting in varying degrees of adhesion between the molding paste and the chip in different areas, thus reducing the molding effect. Furthermore, during continuous long-term production and use, the molding paste may become unevenly dispersed within the storage container, thereby reducing the packaging quality. Therefore, a chip packaging device and method are proposed. Summary of the Invention

[0004] The purpose of this invention is to solve the problems in the prior art where molding paste is difficult to fully and tightly cover the chip surface, resulting in reduced molding effect; and where molding paste becomes unevenly dispersed after long-term storage in storage tanks, reducing packaging quality. Therefore, this invention proposes a chip packaging device and packaging method.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A chip packaging apparatus includes a packaging stage, a station turntable rotatably connected to the top of the inner cavity of the packaging stage, four sets of packaging slots equally spaced on the station turntable, a mounting frame fixedly connected to the middle of the inner cavity of the packaging stage, the mounting frame extending out from the central slot of the station turntable, and a molding compound tube slidably connected to the mounting frame. The apparatus further includes: a molding assembly disposed on the mounting frame, used for molding the chip within the packaging slots; and a venting assembly disposed on the molding compound tube, used for venting gas from the cavity of the molding compound tube.

[0007] To improve packaging quality and efficiency, preferably, the molding assembly includes a storage tank, which is fixed to the top of a mounting frame. An electric push rod is fixedly connected to the bottom of the mounting frame. The top of the telescopic end of the electric push rod is fixedly connected to the top of the molding cylinder. An injection tube is slidably connected inside the molding cylinder. The top end of the injection tube communicates with the inner cavity of the storage tank, and a metering valve is provided on the injection tube. A hopper is fixedly connected inside the molding cylinder, and a solenoid valve is provided in the output end of the hopper.

[0008] Furthermore, a driven gear is fixedly connected to the bottom of the workstation turntable, a servo motor is fixedly connected to the bottom of the inner cavity of the packaging stage, a drive gear is fixedly connected to the top of the rotating shaft of the servo motor, the drive gear meshes with the driven gear, and a friction arc strip is fixedly connected to the top of the workstation turntable between every two sets of packaging slots. An agitator is rotatably connected inside the storage tank, an agitator is fixedly connected to the outer wall of the agitator, and the bottom end of the agitator extends through the storage tank and the mounting frame to the top of the workstation turntable and is fixedly connected to a friction wheel, which slides in contact with the inner wall of the friction arc strip.

[0009] Furthermore, four sets of friction arc strips are arranged at equal intervals, and the centers of the four sets of friction arc strips coincide. The distance from the inner wall of the friction arc strip to the center of the workstation turntable is greater than the distance from the side wall of the workstation turntable to the center of the workstation turntable.

[0010] To improve the sealing effect, preferably, the exhaust assembly includes a piston chamber, which is fixedly connected to the outer wall of the plastic sealing cylinder. An air extraction groove is provided between the piston chamber and the inner cavity of the plastic sealing cylinder, and a one-way valve is provided in the air extraction groove. A piston plate is slidably connected inside the piston chamber, and a hinge seat is fixedly connected to the side wall of the piston plate. An exhaust motor is fixedly connected to the bottom of the piston chamber. The top end of the rotating shaft of the exhaust motor passes through the piston chamber and is fixedly connected to a rotating disk. A push-pull rod is rotatably connected inside the hinge seat, and the other end of the push-pull rod is rotatably connected to the top of the rotating disk.

[0011] To improve the effectiveness of the encapsulation material, preferably, a pneumatic chamber is fixedly connected to the top of the inner cavity of the storage tank, the top end of the agitator shaft extends into the pneumatic chamber and is fixedly connected to a pneumatic impeller, a double-headed nozzle is fixedly connected to the outer wall of the pneumatic chamber, and the two output ends of the double-headed nozzle are symmetrically and staggered, the top of the piston chamber is fixed and connected to an exhaust pipe, the other end of the exhaust pipe is connected to the inner cavity of the double-headed nozzle, and a one-way valve is installed in the exhaust pipe, the top of the piston chamber near the plastic sealing cylinder is fixed and connected to a pusher pipe, the other end of the pusher pipe is connected to the inner cavity of the exhaust pipe, and a one-way valve is installed in the pusher pipe.

[0012] To accelerate the packaging efficiency, preferably, the top of the pneumatic chamber is fixed and connected to an air outlet pipe, and a blower pipe is fixed and connected to the exhaust pipe.

[0013] To improve chip stability during packaging, preferably, a sealing ring is fixedly connected inside the packaging stage, an adsorption groove is formed inside the packaging slot, four sets of adsorption tubes are fixedly connected to the bottom of the workstation turntable, the top of each set of adsorption tubes is connected to the inner cavity of the adsorption groove, a gas guide ring is fixedly connected between the four sets of adsorption tubes, the gas guide ring is slidably sleeved inside the sealing ring, the gas guide ring is divided into four equal-sized gas chambers by a partition, each gas chamber is connected to the inner cavity of its corresponding adsorption tube, and a gas guide hole is formed in the middle of each gas chamber.

[0014] To facilitate the removal of the packaged chip and adjustment of the air pressure balance, the sealing ring is further divided into a hollow half and a solid half. The air guide hole is connected to the hollow cavity of the sealing ring. The piston chamber sidewall is fixed and connected to an air extraction pipe. The other end of the air extraction pipe is connected to the hollow cavity of the air guide ring. A one-way valve is installed inside the air extraction pipe. A sealing plate is fixedly connected to the bottom of the sealing ring. The bottom end of the adsorption tube slides against the top of the sealing plate. An air inlet groove is provided on the sealing plate.

[0015] A chip packaging method, comprising the following steps:

[0016] Step 1: Place the substrate containing the chip into the encapsulation slot;

[0017] Step 2: Fit the plastic encapsulation tube onto the top of the chip and evacuate the gas inside the plastic encapsulation tube;

[0018] Step 3: Inject a measured amount of sealing material into the plastic encapsulation tube;

[0019] Step 4: Rotate the station turntable to remove the packaged chip.

[0020] Compared with the prior art, the present invention provides a chip packaging device and packaging method, which have the following beneficial effects:

[0021] 1. This chip packaging device uses a piston plate that slides back and forth in the piston chamber to draw away the gas in the molding die, thereby reducing the gas pressure inside the molding die. When the solenoid valve in the plug hopper is opened, the gas pressure in the upper cavity of the molding die will cause the molding paste to quickly cover and compact the chip surface, thereby improving the packaging effect and ensuring the protection of the chip.

[0022] 2. This chip packaging device, through the rotation of the workstation turntable and the airflow into the pneumatic chamber, repeatedly agitates the molding paste in the storage tank during the molding process, ensuring the effectiveness of the molding paste and improving the packaging quality; and the airflow that drives the pneumatic impeller to rotate is output from the blower pipe, thereby accelerating the solidification speed of the molding paste after packaging and effectively improving the packaging efficiency.

[0023] 3. This chip packaging device uses the gas generated by the reciprocating sliding of the piston plate in the piston chamber to reduce the gas pressure in the adsorption tank, creating a negative pressure adsorption effect. This allows the substrate with the chip to be stably adsorbed in the packaging slot, effectively improving the stability of chip packaging and ensuring packaging quality. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of a chip packaging device proposed in this invention. Figure 1 ;

[0025] Figure 2 This is a schematic diagram of the overall structure of a chip packaging device proposed in this invention. Figure 2 ;

[0026] Figure 3 This is a partial half-section view of the chip packaging device proposed in this invention.

[0027] Figure 4 This invention proposes a chip packaging device. Figure 3 Enlarged structural diagram of region A in the middle;

[0028] Figure 5 This is a schematic diagram of the internal cross-sectional structure of the packaging stage of a chip packaging device proposed in this invention.

[0029] Figure 6 This invention proposes a chip packaging device. Figure 5 Enlarged structural diagram of region B in the middle;

[0030] Figure 7 This is a schematic diagram of the cross-sectional structure of the sealing ring of a chip packaging device proposed in this invention;

[0031] Figure 8 This is a schematic diagram of the internal structure of the pneumatic chamber of a chip packaging device proposed in this invention.

[0032] In the diagram: 1. Packaging stage; 2. Turntable; 21. Driven gear; 22. Servo motor; 221. Drive gear; 23. Friction arc strip; 3. Packaging slot; 31. Adsorption tank; 32. Adsorption tube; 4. Mounting bracket; 5. Sealing cylinder; 6. Storage tank; 61. Electric push rod; 62. Injection tube; 63. Blocking hopper; 64. Agitator shaft; 641. Agitator paddle; 642. Friction wheel; 7. Piston chamber; 71. Vacuum tank 72. Piston plate; 721. Hinge seat; 722. Push-pull rod; 73. Exhaust motor; 731. Rotary disk; 74. Pneumatic chamber; 741. Pneumatic impeller; 742. Double-headed nozzle; 75. Exhaust pipe; 751. Air thrust pipe; 76. Air outlet pipe; 761. Air blowing pipe; 8. Sealing ring; 81. Air guide ring; 811. Gas chamber; 812. Air guide hole; 82. Air extraction pipe; 83. Sealing plate; 831. Air inlet groove. Detailed Implementation

[0033] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0034] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0035] Example 1:

[0036] Reference Figures 1-8 A chip packaging device includes a packaging stage 1, a workstation turntable 2 rotatably connected to the top of the inner cavity of the packaging stage 1, four sets of packaging slots 3 equally spaced on the workstation turntable 2, a mounting frame 4 fixedly connected to the middle of the inner cavity of the packaging stage 1, the mounting frame 4 extending out from the central slot of the workstation turntable 2, and a molding cylinder 5 slidably connected to the mounting frame 4. The device also includes: a molding assembly, which is mounted on the mounting frame 4 and is used to mold the chip in the packaging slot 3; and a venting assembly, which is mounted on the molding cylinder 5 and is used to vent the gas inside the cavity of the molding cylinder 5.

[0037] In addition, to facilitate the description of the device's operation, the positions of the four sets of packaging slots 3 are named accordingly (e.g., Figure 1As shown, the encapsulation slot 3 located below the plastic encapsulation tube 5 is the first station. Then, rotating clockwise, it becomes the second station, the third station (unloading), and the fourth station (loading). Through the alternating operation of the above four stations, the encapsulation efficiency is improved and the labor consumption is effectively reduced.

[0038] Reference Figures 1-3 The molding assembly includes a storage tank 6, which is fixed to the top of a mounting frame 4. An electric push rod 61 is fixedly connected to the bottom of the mounting frame 4. The top of the telescopic end of the electric push rod 61 is fixedly connected to the top of a molding cylinder 5. An injection tube 62 is slidably connected inside the molding cylinder 5. The top end of the injection tube 62 communicates with the inner cavity of the storage tank 6, and a metering valve is installed on the injection tube 62. A hopper 63 is fixedly connected inside the molding cylinder 5, and a solenoid valve is installed at the output end of the hopper 63. A driven gear plate 21 is fixedly connected to the bottom of the workstation turntable 2, and the bottom of the inner cavity of the packaging stage 1 is fixedly connected to... There is a servo motor 22, and a drive gear 221 is fixedly connected to the top of the rotating shaft of the servo motor 22. The drive gear 221 meshes with the driven gear disk 21. The top of the station turntable 2 is fixedly connected to friction arc strips 23 between each pair of packaging slots 3. An agitator 64 is rotatably connected inside the storage tank 6. An agitator 641 is fixedly connected to the outer wall of the agitator 64. The bottom end of the agitator 64 passes through the storage tank 6 and the mounting frame 4 and extends to the top of the station turntable 2 and is fixedly connected to a friction wheel 642. The friction wheel 642 slides in contact with the inner wall of the friction arc strip 23.

[0039] With the above structure, the servo motor 22 is turned on, and the drive gear 221 meshes with the driven gear plate 21, driving the station turntable 2 to rotate 90 degrees, so that the packaging slot 3 containing the chip moves to the fourth station. During the rotation of the station turntable 2, the friction between the friction wheel 642 and the friction arc strip 23 will cause the friction wheel 642 to drive the stirring shaft 64 and the stirring paddle 641 to rotate in the storage tank 6, thereby stirring the molding paste in the storage tank 6 and ensuring the use effect of the molding paste.

[0040] In addition, four sets of friction arc strips 23 are equally spaced, and the centers of the four sets of friction arc strips 23 coincide. The distance from the inner wall of the friction arc strip 23 to the center of the station turntable 2 is greater than the distance from the side wall of the station turntable 2 to the center of the station turntable 2.

[0041] Reference Figure 3 , Figure 4The exhaust assembly includes a piston chamber 7, which is fixedly connected to the outer wall of the plastic sealing cylinder 5. An air extraction groove 71 is provided between the piston chamber 7 and the inner cavity of the plastic sealing cylinder 5, and a one-way valve is provided in the air extraction groove 71. A piston plate 72 is slidably connected inside the piston chamber 7. A hinge seat 721 is fixedly connected to the side wall of the piston plate 72. An exhaust motor 73 is fixedly connected to the bottom of the piston chamber 7. The top end of the rotating shaft of the exhaust motor 73 passes through the piston chamber 7 and is fixedly connected to a rotating disk 731. A push-pull rod 722 is rotatably connected inside the hinge seat 721. The other end of the push-pull rod 722 is rotatably connected to the top of the rotating disk 731.

[0042] It should be noted that the one-way valve in the air extraction groove 71 can only allow the gas in the sealing cylinder 5 to enter the piston chamber 7; in addition, when the sealing paste falls from the blockage hopper 63, the piston plate 72 is in the state closest to the sealing cylinder 5 to ensure that the sealing paste falls smoothly.

[0043] With the above-described structure, the exhaust motor 73 is turned on, causing the rotating disk 731 to rotate. Through the cooperation between the push-pull rod 722 and the hinge seat 721, the piston plate 72 will slide back and forth in the piston chamber 7. When the piston plate 72 slides towards the side closer to the rotating disk 731, a suction force will be generated in the side cavity of the piston chamber 7 near the molding cylinder 5, thereby opening the one-way valve in the air extraction groove 71, allowing the gas in the molding cylinder 5 to be drawn into the piston chamber 7, thereby reducing the air pressure in the molding cylinder 5. At this time, the solenoid valve in the plug hopper 63 is opened. Under the action of the air pressure in the upper cavity of the molding cylinder 5, the molding paste will quickly cover and compact the chip surface, thereby improving the packaging effect and ensuring the protection of the chip. In addition, the dust attached to the chip surface will also be sucked away in the above process, ensuring the cleanliness of the chip surface and improving the packaging quality.

[0044] Reference Figures 1-5 and Figure 8 The storage tank 6 has a pneumatic chamber 74 fixedly connected to the top of its inner cavity. The top of the stirring shaft 64 extends into the pneumatic chamber 74 and is fixedly connected to a pneumatic impeller 741. A double-headed nozzle 742 is fixedly connected to the outer wall of the pneumatic chamber 74, with the two output ends of the double-headed nozzle 742 arranged symmetrically and staggered. The top of the piston chamber 7 is fixedly connected to an exhaust pipe 75, the other end of which is connected to the inner cavity of the double-headed nozzle 742. A one-way valve is installed inside the exhaust pipe 75. The top of the piston chamber 7 near the plastic sealing cylinder 5 is fixedly connected to a push pipe 751, the other end of which is connected to the inner cavity of the exhaust pipe 75. A one-way valve is installed inside the push pipe 751. The top of the pneumatic chamber 74 is fixedly connected to an air outlet pipe 76, and a blower pipe 761 is fixedly connected to the air outlet pipe 76.

[0045] It should be noted that the one-way valve in the exhaust pipe 75 is located between the thrust pipe 751 and the piston chamber 7; the one-way valve in the exhaust pipe 75 can only allow the gas in the piston chamber 7 to enter the pneumatic chamber 74; the one-way valve in the thrust pipe 751 can only allow the gas in the piston chamber 7 to enter the pneumatic chamber 74 through the exhaust pipe 75.

[0046] With the above-described structure, when the piston plate 72 slides towards the side closest to the rotating disk 731, it will compress the cavity containing the rotating disk 731 in the piston chamber 7, thereby opening the one-way valve in the exhaust pipe 75. This allows gas to flow along the exhaust pipe 75 and the double-headed nozzle 742 into the pneumatic chamber 74, thereby driving the pneumatic impeller 741 to rotate the stirring shaft 64 and the stirring paddle 641 again, thus agitating the molding compound in the storage tank 6 again and improving the performance of the molding compound. The gas that drives the pneumatic impeller 741 to rotate will eventually be transported through the exhaust pipe 76 and the blower pipe 761. The encapsulated slurry is sent to the encapsulation slot 3 at the second station to accelerate the solidification of the encapsulated slurry, thereby effectively improving the encapsulation efficiency. When the piston plate 72 moves towards the side closer to the encapsulation cylinder 5, it will generate a thrust in the side cavity of the piston chamber 7 that is closer to the encapsulation cylinder 5, thereby opening the one-way valve in the air push pipe 751. This allows the gas drawn into this side cavity to be transported along the air push pipe 751, the exhaust pipe 75, and the double-headed nozzle 742 to the pneumatic chamber 74, which in turn drives the stirring shaft 64 and the stirring paddle 641 to stir the encapsulated slurry again, further improving the performance of the encapsulated slurry.

[0047] Reference Figures 5-7 The encapsulation platform 1 is fixedly connected to a sealing ring 8, and the encapsulation slot 3 is provided with an adsorption groove 31. Four sets of adsorption tubes 32 are fixedly connected to the bottom of the workstation turntable 2. The top end of each set of adsorption tubes 32 communicates with the inner cavity of the adsorption groove 31. A gas guide ring 81 is fixedly connected between the four sets of adsorption tubes 32. The gas guide ring 81 is slidably fitted inside the sealing ring 8. The gas guide ring 81 is divided into four equally sized gas chambers 811 by a partition. Each gas chamber 811 communicates with the inner cavity of its corresponding adsorption tube 32, and each gas chamber... Each of the 811 has a vent hole 812 in the middle; the sealing ring 8 is half hollow and half solid, the vent hole 812 is connected to the hollow cavity of the sealing ring 8, the piston chamber 7 is fixed to the side wall and connected to the suction pipe 82, the other end of the suction pipe 82 is connected to the hollow cavity of the vent ring 81, and a one-way valve is provided in the suction pipe 82. The bottom of the sealing ring 8 is fixedly connected to the sealing plate 83, the bottom end of the adsorption tube 32 is in contact with the top of the sealing plate 83 and slides, and the sealing plate 83 is provided with an air inlet groove 831.

[0048] It should be noted that the cavity inside the air guide ring 81 is located at the bottom of the first and second stations, thereby ensuring that an adsorption effect is generated in the packaging slots 3 at the first and second stations; the air inlet groove 831 is located between the second and fourth stations with the third station as the center; thereby ensuring that the adsorption effect generated in the packaging slots 3 at the third and fourth stations disappears, so that unloading can be performed at the third station.

[0049] With the above-described structure, when the piston plate 72 moves towards the side closer to the encapsulation cylinder 5, a suction force will be generated in the cavity of the encapsulation cylinder 5 near the rotating disk 731. This will open the one-way valve in the suction pipe 82, allowing the gas in the adsorption tank 31 to enter the piston chamber 7 along the adsorption pipe 32, the gas guide ring 81, the gas guide hole 812, the sealing ring 8, and the suction pipe 82. This will reduce the gas pressure in the adsorption tank 31 at the first and second work stations, creating a negative pressure adsorption effect, so that the substrate with the chip is stably adsorbed in the packaging slot 3. This effectively improves the stability of chip packaging and ensures packaging quality. When the packaging slot 3 moves from the second station to the third and fourth stations, the gas chamber 811 first moves to the solid gas guide ring 81, and the bottom end of the adsorption tube 32 moves to the air inlet slot 831. At this time, the external airflow will be supplemented into the adsorption tube 32, thereby relieving the negative pressure effect in the adsorption slot 31 to facilitate material feeding. It also ensures that the airflow subsequently supplemented into the adsorption slot 31 is drawn into the piston chamber 7 to achieve air pressure balance regulation and ensure the smooth operation of the device.

[0050] Example 2:

[0051] Reference Figures 1-8 Similar to Embodiment 1, a chip packaging method is proposed based on Embodiment 1, with the following steps:

[0052] Step 1: Place the substrate with the chip installed into the encapsulation slot 3;

[0053] Step 2: Fit the plastic encapsulation tube 5 onto the top of the chip and draw in the gas inside the plastic encapsulation tube 5;

[0054] Step 3: Inject a measured amount of sealing material into the plastic sealing tube 5;

[0055] Step 4: Rotate the station turntable 2 to remove the packaged chip.

[0056] Reference Figures 1-8In this invention, during use, the substrate to be encapsulated with the chip is first placed into the encapsulation slot 3 at the fourth station. Then, the servo motor 22 is turned on, and the drive gear 221 meshes with the driven gear 21, driving the station turntable 2 to rotate 90 degrees, so that the encapsulation slot 3 containing the chip moves to the fourth station (that is, directly below the encapsulation cylinder 5). During the rotation of the station turntable 2, the friction between the friction wheel 642 and the friction arc strip 23 will cause the friction wheel 642 to drive the stirring shaft 64 and the stirring paddle 641 to rotate in the storage tank 6, thereby stirring the encapsulation slurry in the storage tank 6 and ensuring the effectiveness of the encapsulation slurry.

[0057] Next, the electric push rod 61 is activated, causing its telescopic end to retract downwards, thereby moving the molding compound 5 downwards until it contacts the chip substrate and encloses the chip within the molding compound 5. Simultaneously, the metering valve on the injection tube 62 is opened, allowing a measured amount of molding compound to flow into the hopper 63. Then, the exhaust motor 73 is activated, causing the rotating disk 731 to rotate. Through the cooperation between the push rod 722 and the hinge seat 721, the piston plate 72 will reciprocate within the piston chamber 7. When the piston plate 72 slides towards the side closer to the rotating disk 731, it will generate a suction force in the side cavity of the piston chamber 7 near the encapsulation cylinder 5, thereby opening the one-way valve in the air extraction groove 71, allowing the gas in the encapsulation cylinder 5 to be drawn into the piston chamber 7, thereby reducing the air pressure in the encapsulation cylinder 5. At this time, the solenoid valve in the blocking hopper 63 opens, and under the action of the air pressure in the upper cavity of the encapsulation cylinder 5, the encapsulation paste will quickly cover and compact the chip surface, thereby improving the encapsulation effect and ensuring the protection of the chip. Furthermore, while the piston plate 72 slides, it will also squeeze the cavity where the rotating disk 731 is located in the piston chamber 7, thereby opening the one-way valve in the exhaust pipe 75, allowing gas to be filled into the pneumatic chamber 74 along the exhaust pipe 75 and the double-headed nozzle 742, thereby driving the pneumatic impeller 741 to drive the stirring shaft 64 and the stirring paddle 641 to rotate again, thereby stirring the plastic sealant in the storage tank 6 again, improving the use effect of the plastic sealant; and the gas that drives the pneumatic impeller 741 to rotate will eventually be transported to the encapsulation slot 3 at the second station along the exhaust pipe 76 and the blowing pipe 761, thereby accelerating the solidification of the encapsulated plastic sealant and effectively improving the encapsulation efficiency.

[0058] When the piston plate 72 moves towards the side closer to the sealing cylinder 5, it will generate a thrust in the piston chamber 7 near the sealing cylinder 5, thereby opening the one-way valve in the air thrust pipe 751. This allows the gas drawn into this side of the chamber to be transported along the air thrust pipe 751, exhaust pipe 75, and double-headed nozzle 742 into the pneumatic chamber 74, which in turn drives the stirring shaft 64 and stirring paddle 641 to stir the sealing slurry again, further improving the performance of the sealing slurry. At the same time, a suction force will be generated in the cavity of the sealing cylinder 5 near the rotating disk 731, thereby opening the one-way valve in the suction pipe 82. This allows the gas in the adsorption tank 31 to flow along the adsorption pipe 32, air guide ring 81, air guide hole 812, sealing ring 8, and suction pipe 82. Entering the piston chamber 7, the air pressure in the adsorption tank 31 at the first and second stations is reduced, creating a negative pressure adsorption effect. This allows the substrate with the chip to be stably adsorbed in the packaging slot 3, effectively improving the stability of chip packaging and ensuring packaging quality. When the packaging slot 3 moves from the second station to the third and fourth stations, the gas chamber 811 first moves to the solid air guide ring 81, and the bottom end of the adsorption tube 32 moves to the air inlet slot 831. At this time, the external airflow will be replenished into the adsorption tube 32, thereby relieving the negative pressure effect in the adsorption tank 31 to facilitate material unloading. It also ensures that the airflow subsequently replenished into the adsorption tank 31 is drawn into the piston chamber 7, achieving air pressure balance and ensuring the smooth operation of the device.

[0059] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A chip packaging apparatus, comprising a packaging stage (1), characterized in that, The top of the inner cavity of the packaging platform (1) is rotatably connected to a workstation turntable (2). Four sets of packaging slots (3) are equally spaced on the workstation turntable (2). A mounting bracket (4) is fixedly connected to the middle of the inner cavity of the packaging platform (1). The mounting bracket (4) extends out from the central slot of the workstation turntable (2). A plastic sealing tube (5) is slidably connected to the mounting bracket (4). The packaging platform (1) also includes: A molding assembly is mounted on a mounting bracket (4) and is used to mold the chip in the encapsulation slot (3). An exhaust assembly is provided on the plastic seal tube (5) and is used to exhaust the gas inside the cavity of the plastic seal tube (5); The sealing assembly includes a storage tank (6), which is fixed to the top of the mounting frame (4). An electric push rod (61) is fixedly connected to the bottom of the mounting frame (4). The top of the telescopic end of the electric push rod (61) is fixedly connected to the top of the sealing cylinder (5). An injection tube (62) is slidably connected inside the sealing cylinder (5). The top end of the injection tube (62) is connected to the inner cavity of the storage tank (6), and a metering valve is provided on the injection tube (62). A blocking hopper (63) is fixedly connected inside the sealing cylinder (5), and a solenoid valve is provided in the output end of the blocking hopper (63). The bottom of the workstation turntable (2) is fixedly connected to a driven gear plate (21), the bottom of the inner cavity of the packaging stage (1) is fixedly connected to a servo motor (22), the top of the rotating shaft of the servo motor (22) is fixedly connected to a drive gear (221), the drive gear (221) meshes with the driven gear plate (21), and the top of the workstation turntable (2) is fixedly connected to a friction arc strip (23) between each two sets of packaging slots (3). The storage tank (6) is rotatably connected to a stirring shaft (64), and a stirring paddle (641) is fixedly connected to the outer wall of the stirring shaft (64). The bottom end of the stirring shaft (64) passes through the storage tank (6) and the mounting bracket (4) and extends to the top of the workstation turntable (2) and is fixedly connected to a friction wheel (642). The friction wheel (642) slides against the inner wall of the friction arc strip (23). The friction arc strips (23) are arranged in four sets at equal intervals, and the centers of the four sets of friction arc strips (23) coincide. The distance from the inner wall of the friction arc strip (23) to the center of the station turntable (2) is greater than the distance from the side wall of the station turntable (2) to the center of the station turntable (2).

2. The chip packaging device according to claim 1, characterized in that, The exhaust assembly includes a piston chamber (7), which is fixedly connected to the outer wall of the plastic seal (5). An air extraction groove (71) is provided between the piston chamber (7) and the inner cavity of the plastic seal (5). A one-way valve is provided in the air extraction groove (71). A piston plate (72) is slidably connected in the piston chamber (7). A hinge seat (721) is fixedly connected to the side wall of the piston plate (72). An exhaust motor (73) is fixedly connected to the bottom of the piston chamber (7). The top end of the rotating shaft of the exhaust motor (73) passes through the piston chamber (7) and is fixedly connected to a rotating disk (731). A push-pull rod (722) is rotatably connected in the hinge seat (721). The other end of the push-pull rod (722) is rotatably connected to the top of the rotating disk (731).

3. The chip packaging device according to claim 2, characterized in that, The top of the inner cavity of the storage tank (6) is fixedly connected to a pneumatic chamber (74). The top of the stirring shaft (64) extends into the pneumatic chamber (74) and is fixedly connected to a pneumatic impeller (741). A double-headed nozzle (742) is fixedly connected to the outer wall of the pneumatic chamber (74). The two output ends of the double-headed nozzle (742) are symmetrically and staggered. The top of the piston chamber (7) is fixed and connected to an exhaust pipe (75). The other end of the exhaust pipe (75) is connected to the inner cavity of the double-headed nozzle (742). A one-way valve is installed in the exhaust pipe (75). The top of the piston chamber (7) near the plastic sealing cylinder (5) is fixed and connected to a push pipe (751). The other end of the push pipe (751) is connected to the inner cavity of the exhaust pipe (75). A one-way valve is installed in the push pipe (751).

4. The chip packaging apparatus according to claim 3, characterized in that, The top of the pneumatic chamber (74) is fixed and connected to an air outlet pipe (76), and an air blower pipe (761) is fixed and connected to the air outlet pipe (76).

5. A chip packaging apparatus according to claim 2, characterized in that, A sealing ring (8) is fixedly connected inside the packaging platform (1). An adsorption groove (31) is opened inside the packaging slot (3). Four sets of adsorption tubes (32) are fixedly connected to the bottom of the workstation turntable (2). The top of each set of adsorption tubes (32) is connected to the inner cavity of the adsorption groove (31). A gas guide ring (81) is fixedly connected between the four sets of adsorption tubes (32). The gas guide ring (81) is slidably sleeved inside the sealing ring (8). The gas guide ring (81) is divided into four gas chambers (811) of equal size by a partition. Each gas chamber (811) is connected to the inner cavity of its corresponding adsorption tube (32). A gas guide hole (812) is opened in the middle of each gas chamber (811).

6. A chip packaging apparatus according to claim 5, characterized in that, The sealing ring (8) is half hollow and half solid. The air guide hole (812) is connected to the hollow cavity of the sealing ring (8). The piston chamber (7) is fixed to the side wall and connected to the suction pipe (82). The other end of the suction pipe (82) is connected to the hollow cavity of the air guide ring (81). A one-way valve is provided in the suction pipe (82). A sealing plate (83) is fixedly connected to the bottom of the sealing ring (8). The bottom end of the adsorption tube (32) slides against the top of the sealing plate (83). An air inlet groove (831) is provided on the sealing plate (83).

7. A chip packaging method, employing a chip packaging apparatus as described in any one of claims 1-6, characterized in that, The steps are as follows: Step 1: Place the substrate with the chip installed into the encapsulation slot (3); Step 2: Fit the plastic encapsulation tube (5) onto the top of the chip and draw in the gas inside the plastic encapsulation tube (5); Step 3: Inject a quantitative amount of sealing material into the plastic sealing tube (5); Step 4: Rotate the workstation turntable (2) to remove the packaged chip.

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