A refrigeration chip glue filling packaging device and method

By designing a rubber filling packaging device for refrigeration chips, the combination of fixing mechanism and rubber filling packaging mechanism is used to solve the problems of low processing efficiency and difficult accuracy of rubber filling packaging of refrigeration chips, and an efficient and stable rubber filling packaging effect is achieved.

CN119497556BActive Publication Date: 2025-03-25CHANGSHAN WANGU ELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202510066524.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-01-16
Publication Date
2025-03-25
Estimated Expiration
2045-01-16

AI Technical Summary

Technical Problem

The processing efficiency of refrigeration chip filling packaging is low and the processing accuracy control is difficult, which can easily affect the packaging quality.

Method used

A refrigeration chip glue filling packaging device is designed, including a fixing mechanism and a glue injection packaging mechanism. The fixing mechanism fixes the chip body through the fixing head, and the glue injection and packaging mechanism achieves synchronous glue injection and curing through the mobile seat, glue injection cylinder, accelerated curing head and reference limit head to improve efficiency and accuracy.

Benefits of technology

Improves the efficiency of glue injection packaging, enhances processing accuracy, and ensures the stability of glue filling packaging quality.

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Abstract

The present invention relates to the technical field of chip glue filling and packaging, specifically to a device and method for glue filling and packaging of refrigeration chips, including a fixing mechanism and a glue filling and packaging mechanism, wherein the fixing mechanism includes a fixing seat provided with a plurality of fixing heads, and the glue filling and packaging mechanism includes a moving seat, which is distributed in a rectangular shape and corresponds to the four sides of a chip body respectively, and a glue filling cylinder and a plurality of accelerating curing heads are provided on the moving seat, and a plurality of glue filling heads are provided on the glue filling cylinder. The present invention utilizes a fixing mechanism to cooperate with a glue filling and packaging machine to precisely fix a plurality of chip bodies at the same time and to perform glue filling and packaging synchronously after fixation, and the four sides of each chip body are simultaneously glue filled and packaged, which effectively improves the efficiency of glue filling and packaging, and during the entire packaging process, the chip body does not need to move, and the glue filling and packaging mechanism only performs linear motion, which is convenient for controlling the filling and packaging processing accuracy, and correspondingly improves the stability of the glue filling and packaging process, which is conducive to continuous and stable glue filling and packaging work.
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