UV-moisture dual-curing three-protection adhesive as well as preparation method and application thereof

Abstract

The application provides a UV-humidity dual-curing three-protection adhesive and a preparation method and application thereof, and the UV-humidity dual-curing three-protection adhesive comprises the following components in parts by weight: 40-60 parts of fluorine-containing polyurethane acrylate resin; 30-50 parts of active diluent, 2-8 parts of photoinitiator, 0.1-0.5 parts of polymerization inhibitor; 1-3 parts of dehydrating agent. The three-protection adhesive has excellent wetting performance and corrosion resistance, and has good adhesion and flexibility, can realize UV and humidity dual curing, and can be used for electronic circuit board bonding.

Description

Technical Field

[0001] This invention belongs to the field of adhesive technology, specifically relating to a UV-moisture dual-curing conformal adhesive, its preparation method, and its application. Background Technology

[0002] With the rapid development of modern electronic technology, the service environment of electronic devices and their components is becoming increasingly complex. For example, electronic devices used in aerospace, aviation, and shipbuilding often face special corrosive environments characterized by high temperature, high humidity, and high salt spray. Printed circuit boards (PCBs) are key components of modern electronic devices, making their surface protection particularly important. During manufacturing and use, PCBs are susceptible to damage from chemical corrosion, dust adhesion, moisture penetration, and mechanical damage, leading to corrosion, softening, deformation, short circuits, and breakdowns, affecting their lifespan and even causing significant losses. Electronic protective coatings are transparent coatings formed on the surface of electronic components to protect them from damage in humid and corrosive environments, as well as from harsh environmental impacts such as chemicals, dust, and extreme temperatures. Initially used in high-end aerospace and military integrated circuit industries, these coatings are increasingly being applied in civilian applications such as mobile phones, tablets, car infotainment systems, and various external displays, thanks to the rapid development of 5G communication.

[0003] Therefore, developing a polyurethane conformal adhesive with excellent high-temperature resistance, corrosion resistance, and wetting properties, as well as good adhesion and flexibility, capable of dual curing under UV and moisture conditions, is of great significance for the development of conformal adhesives and can be used for bonding electronic circuit boards. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the present invention aims to provide a UV-moisture dual-curing conformal adhesive, its preparation method, and its applications. The conformal adhesive of the present invention possesses excellent wetting properties and corrosion resistance, as well as good adhesion and flexibility. It can achieve dual curing under UV and moisture conditions and can be used for bonding electronic circuit boards.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] On one hand, the present invention provides a UV-moisture dual-curing conformal adhesive, wherein the UV-moisture dual-curing conformal adhesive comprises the following components in parts by weight:

[0007]

[0008] The fluorinated polyurethane acrylate resin mentioned above has the following structure:

[0009]

[0010] Among them, R1, R2, R3, and R4 are independently selected from -N=C=O, R5 is selected from an F-substituted alkyl group, R6 is selected from a hydroxyacrylate residue; and at least one of R1, R2, R3, and R4 is selected from... At least one of them is selected n is an integer between 8 and 20 (e.g., 8, 9, 10, 11, 12, 13, 15, 16, 18, or 20).

[0011] In this invention, the fluorinated polyurethane acrylate resin contains NCO groups and double bond groups, enabling dual curing under moisture and UV conditions, thus solving the problem of incomplete curing of shaded areas during UV curing. Furthermore, the fluorinated alkyl segments in the resin reduce surface energy, resulting in a lower surface tension in the prepared conformal adhesive and improved wettability. Simultaneously, during curing, the fluorinated segments migrate to the material surface, further reducing surface energy and giving the cured conformal adhesive excellent hydrophobic properties. This results in superior waterproofing, mildew resistance, and corrosion resistance, effectively preventing corrosion of the circuit board by moisture, mold, and solvents, thereby increasing the circuit board's lifespan.

[0012] Preferably, the F-substituted alkyl group is selected from...

[0013] Preferably, the residues of the hydroxyacrylate are selected from...

[0014] Preferably, the fluorinated polyurethane acrylate resin is obtained by reacting hexamethylene diisocyanate-based polyisocyanate, polyethylene glycol, hydroxy acrylate, and monohydroxy fluorinated monomer.

[0015] Preferably, the hexamethylene diisocyanate-based polyisocyanate is a hexamethylene diisocyanate trimer.

[0016] Preferably, the hexamethylene diisocyanate-based polyisocyanate is selected from one of Wanhua Chemical's HT-90, HT-100, HB-100, HT-300 or HT-600.

[0017] In this invention, the structure of the polyethylene glycol is as follows: n is an integer between 8 and 12.

[0018] Preferably, the polyethylene glycol is selected from one of Bluestar Dongda's DL1000, DL-400 and Daicel's PCL205U, PCL205, PCL208 or PCL210.

[0019] Preferably, the acrylate is selected from one or a combination of at least two of hydroxyethyl methacrylate, hydroxypropyl methacrylate, or pentaerythritol triacrylate.

[0020] Preferably, the monohydroxy fluorinated monomer is selected from at least one of perfluorohexyl ethyl alcohol or 2-perfluorooctyl ethanol (e.g., perfluorohexyl ethyl alcohol and 2-perfluorooctyl ethanol produced by Liaoning Hengtong Fuxin Fluorochemical Co., Ltd.).

[0021] Preferably, the reaction is carried out in the presence of a catalyst.

[0022] Preferably, the catalyst is dibutyltin dilaurate.

[0023] Preferably, the reaction is carried out in the presence of a polymerization inhibitor.

[0024] Preferably, the polymerization inhibitor is selected from hydroquinone, p-hydroxyanisole, or p-benzoquinone and naphthoquinone, or a combination of at least two of these.

[0025] Preferably, the reaction is carried out in the presence of an antioxidant.

[0026] Preferably, the antioxidant is selected from one or a combination of at least two of 1076, BHT (2,6-di-tert-butyl-4-methylphenol), or TPP (triphenyl phosphite).

[0027] Preferably, the molar ratio of hexamethylene diisocyanate-based polyisocyanate to polyethylene glycol is (1-1.2):(0.4-0.6), for example, 1:0.4, 1:0.45, 1:0.5, 1:0.55, 1:0.6, 1.1:0.4, 1.1:0.45, 1.1:0.5, 1.1:0.55, 1.1:0.6, 1.2:0.4, 1.2:0.45, 1.2:0.5, 1.2:0.55, or 1.2:0.6.

[0028] Preferably, the molar ratio of hexamethylene diisocyanate-based polyisocyanate to hydroxy acrylate is (1-1.2):(0.8-1), for example, 1:0.8, 1:0.85, 1:0.9, 1:0.95, 1:1, 1.1:0.8, 1.1:0.85, 1.1:0.9, 1.1:0.95, 1.1:1, 1.2:0.8, 1.2:0.85, 1.2:0.9, 1.2:0.95, 1.2:1.

[0029] Preferably, the molar ratio of the hexamethylene diisocyanate-based polyisocyanate to the monohydroxy fluorinated monomer is (1-1.2):(0.4-0.6), for example, 1:0.4, 1:0.45, 1:0.5, 1:0.55, 1:0.6, 1.1:0.4, 1.1:0.45, 1.1:0.5, 1.1:0.55, 1.1:0.6, 1.2:0.4, 1.2:0.45, 1.2:0.5, 1.2:0.55, or 1.2:0.6.

[0030] Preferably, the reaction specifically includes the following steps:

[0031] (1) Mix hexamethylene diisocyanate-based polyisocyanate and polyethylene glycol, along with polymerization inhibitors and antioxidants, react, add a catalyst, and continue the reaction;

[0032] (2) Add hydroxy acrylate and monohydroxy fluorinated monomer to the reaction solution obtained in step (1) and react to obtain the fluorinated polyurethane acrylate resin.

[0033] Preferably, after mixing in step (1), the temperature is raised to 65°C and reacted for 1 hour, then the temperature is raised to 75°C and reacted for another 2 hours. After adding a catalyst, the reaction continues for another 2 hours.

[0034] Preferably, the reaction temperature in step (2) is 75°C and the reaction time is 1-2 hours.

[0035] Preferably, the reactions in steps (1) and (2) are carried out under nitrogen protection.

[0036] Preferably, the active diluent is selected from one or a combination of at least two of isoborneol acrylate, isoborneol methacrylate, or isooctyl acrylate.

[0037] Preferably, the photoinitiator is selected from one or a combination of at least two of initiators 651, 184, 1173, 500, 907, TPO, or LTM.

[0038] Preferably, the polymerization inhibitor in the formulation of the UV-moisture dual-curing conformal adhesive is selected from one or a combination of at least two of hydroquinone, p-hydroxyanisole, p-benzoquinone, or naphthoquinone.

[0039] Preferably, the dehydrating agent is p-toluenesulfonyl isocyanate.

[0040] On the other hand, the present invention provides a method for preparing the UV-moisture dual-curing conformal adhesive as described above, the method comprising the following steps:

[0041] The reactive diluent and photoinitiator are mixed, and then the fluorinated polyurethane acrylate resin, polymerization inhibitor, and dehydrating agent are added to the mixture and mixed to obtain the UV-moisture dual-curing conformal adhesive.

[0042] Preferably, the mixing is carried out at 20-30°C (e.g., 20°C, 23°C, 25°C, 28°C or 30°C).

[0043] Preferably, the mixing is carried out under stirring.

[0044] Preferably, the mixing is carried out under nitrogen protection.

[0045] Preferably, the mixing time of the reactive diluent and the photoinitiator is 0.5 to 1 hour, for example, 0.5 hours, 0.6 hours, 0.7 hours, 0.8 hours, 0.9 hours or 1 hour.

[0046] Preferably, the mixing time after adding the fluorinated polyurethane acrylate resin, polymerization inhibitor, and dehydrating agent to the mixture is 0.5 to 1 hour, for example, 0.5 hours, 0.6 hours, 0.7 hours, 0.8 hours, 0.9 hours, or 1 hour.

[0047] On the other hand, the present invention provides the application of the UV-moisture dual-curing conformal adhesive as described above in the bonding of electronic circuit boards.

[0048] Compared with the prior art, the present invention has the following beneficial effects:

[0049] The UV-moisture dual-curing conformal adhesive of this invention uses a fluorinated polyurethane acrylate resin containing NCO groups and double bonds, enabling dual curing by both moisture and UV, thus solving the problem of incomplete curing of shaded areas during UV curing. The F-alkyl groups in this resin have extremely low surface energy, resulting in low surface tension and improved wettability. Simultaneously, during curing, fluorinated segments migrate to the material surface, further reducing surface energy and giving the cured conformal adhesive excellent hydrophobic properties. This results in superior waterproofing, mildew resistance, and corrosion resistance, effectively preventing corrosion of circuit boards by moisture, mold, and solvents, thereby increasing the lifespan of the circuit boards. Detailed Implementation

[0050] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be construed as limiting the invention in any way.

[0051] Unless otherwise specified, the reagents, methods, and equipment used in this invention are conventional reagents, methods, and equipment in this technical field. Unless otherwise specified, all reagents and materials used in this invention are commercially available.

[0052] Preparation Example 1

[0053] 1 mol HT-600, 0.5 mol PCL208, 0.02% benzoquinone polymerization inhibitor, and 0.02% antioxidant 1076 were added to a four-necked flask equipped with a thermometer. After stirring evenly, the mixture was heated to 65°C and reacted for 1 hour. Then, the temperature was raised to 75°C and the reaction was continued for 2 hours. 0.01% dibutyltin dilaurate catalyst was added, and the reaction was continued for 2 hours. The NCO value was then tested. When the NCO value reached the theoretical value, 1 mol hydroxyethyl acrylate and 1 mol perfluorobutanol were added, and the reaction was continued for 1 hour until the NCO value reached the theoretical value and tended to stabilize. The reaction was then stopped, and the mixture was cooled to 40°C to discharge the material, thus obtaining the self-made UV-moisture dual-curing fluorinated polyurethane acrylate resin.

[0054] Preparation Example 2

[0055] 1 mol HT-600, 0.5 mol PCL208, 0.02% naphthoquinone (polymerization inhibitor), and 0.02% BHT (antioxidant) were added to a four-necked flask equipped with a thermometer. After stirring evenly, the mixture was heated to 65°C and reacted for 1 hour. Then, the temperature was raised to 75°C and the reaction was continued for 2 hours. 0.01% dibutyltin dilaurate (catalyst) was added and the reaction was continued for 2 hours. The NCO value was then tested. When the NCO value reached the theoretical value, 1 mol hydroxyethyl acrylate and 1 mol perfluorobutyl ethanol were added and the reaction was continued for 2 hours until the NCO value reached the theoretical value and tended to stabilize. The reaction was then stopped, and the mixture was cooled to 40°C and discharged to obtain the self-made UV-moisture dual-curing fluorinated polyurethane acrylate resin.

[0056] Preparation Example 3

[0057] 1 mol HT-600, 0.5 mol PCL208, 0.02% hydroquinone (polymer inhibitor), and 0.02% TPP (antioxidant) were added to a four-necked flask equipped with a thermometer. After stirring evenly, the mixture was heated to 65°C and reacted for 1 hour. Then, the temperature was raised to 75°C and the reaction continued for 2 hours. 0.01% dibutyltin dilaurate (catalyst) was added, and the reaction continued for another 2 hours. The NCO value was then tested. When the NCO value reached the theoretical value, 1 mol hydroxyethyl acrylate and 1 mol perfluorohexylethyl alcohol were added, and the reaction continued for 1-2 hours until the NCO value reached the theoretical value and tended to stabilize. The reaction was then stopped, and the mixture was cooled to 40°C to discharge the product, thus obtaining the self-made UV-moisture dual-curing fluorinated polyurethane acrylate resin.

[0058] Preparation Example 4

[0059] 1 mol HT-600, 0.5 mol PCL208, 0.02% polymerization inhibitor p-hydroxyanisole, and 0.02% antioxidant 1076 were added to a four-necked flask equipped with a thermometer. After stirring evenly, the mixture was heated to 65°C and reacted for 1 hour. Then, the temperature was raised to 75°C and the reaction continued for 2 hours. 0.01% catalyst dibutyltin dilaurate was added, and the reaction continued for 2 hours. The NCO value was then tested. When the NCO value reached the theoretical value, 1 mol hydroxyethyl acrylate and 1 mol 2-perfluorooctyl ethanol were added, and the reaction continued for 1 hour until the NCO value reached the theoretical value and tended to stabilize. The reaction was then stopped, and the mixture was cooled to 40°C to discharge the product, thus obtaining the self-made UV-moisture dual-curing fluorinated polyurethane acrylate resin.

[0060] Preparation of Comparative Example 1 (Fluorine-free polyurethane acrylate resin)

[0061] 1 mol HT-600, 0.5 mol PCL208, 0.02% benzoquinone polymerization inhibitor, and 0.02% antioxidant 1076 were added to a four-necked flask equipped with a thermometer. After stirring evenly, the mixture was heated to 65°C and reacted for 1 hour. Then, the temperature was raised to 75°C and the reaction was continued for 2 hours. 0.01% dibutyltin dilaurate catalyst was added and the reaction was continued for 2 hours. The NCO value was then tested. When the NCO value reached the theoretical value, 1 mol hydroxyethyl acrylate was added and the reaction was continued for 1 hour until the NCO value reached the theoretical value and tended to stabilize. The reaction was then stopped, and the mixture was cooled to 40°C to discharge the material, thus obtaining the self-made UV-moisture dual-curing fluorinated polyurethane acrylate resin.

[0062] Preparation of Comparative Example 2 (NCO-free fluorinated polyurethane acrylate resin)

[0063] 1 mol HT-600, 0.5 mol PCL208, 0.02% polymerization inhibitor, and 0.02% antioxidant were added to a four-necked flask equipped with a thermometer. After stirring evenly, the mixture was heated to 65°C and reacted for 1 hour. Then, the temperature was raised to 75°C and the reaction was continued for 2 hours. 0.01% catalyst was added and the reaction was continued for 2 hours. The NCO value was then tested. When the NCO value reached the theoretical value, 2 mol of perfluorohexylethyl alcohol and 2 mol of hydroxyethyl acrylate were added and the reaction was continued for 2 hours until the NCO value reached the theoretical value and tended to stabilize. The reaction was then stopped, and the mixture was cooled to 40°C and discharged to obtain the self-made UV-moisture dual-curing fluorinated polyurethane acrylate resin.

[0064] Comparative Example 3 (fluorinated polyurethane acrylate resin without carbon-carbon double bonds) was prepared.

[0065] 1 mol HT-600, 0.5 mol PCL208, 0.02% benzoquinone polymerization inhibitor, and 0.02% antioxidant 1076 were added to a four-necked flask equipped with a thermometer. After stirring evenly, the mixture was heated to 65°C and reacted for 1 hour. Then, the temperature was raised to 75°C and the reaction was continued for 2 hours. 0.01% dibutyltin dilaurate catalyst was added and the reaction was continued for 2 hours. The NCO value was then tested. When the NCO value reached the theoretical value, 1 mol of perfluorohexylethyl alcohol was added and the reaction was continued for 1 hour until the NCO value reached the theoretical value and tended to stabilize. The reaction was then stopped, and the mixture was cooled to 40°C to discharge the material, thus obtaining the self-made UV-moisture dual-curing fluorinated polyurethane acrylate resin.

[0066] Examples 1-7

[0067] This embodiment provides a series of UV-moisture dual-curing conformal adhesives, which are prepared according to a method including the following steps:

[0068] According to the formula in Table 1, the reactive diluent and photoinitiator are added to the reactor, the temperature is controlled at 25°C, N2 protection is provided, and the mixture is stirred for 1 hour until it is uniform. Then, the self-made fluorinated polyurethane acrylate resin, polymerization inhibitor, and dehydrating agent are added, and the mixture is stirred for another hour until it is uniform. The entire stirring process is protected by N2 to obtain the UV-moisture dual-curing conformal adhesive described in this application.

[0069] Table 1. Raw material formulations (parts by weight) for Examples 1-7

[0070]

[0071] Comparative Example 1

[0072] This comparative example provides a sealant prepared according to the method of Example 3, except that the fluorinated polyurethane acrylate resin is replaced with an equal weight of the fluorinated polyurethane acrylate resin prepared in Comparative Example 1.

[0073] Comparative Example 2

[0074] This comparative example provides a sealant prepared according to the method of Example 3, except that the fluorinated polyurethane acrylate resin is replaced with an equal weight of the polyurethane acrylate resin without NCO groups prepared in Comparative Example 2.

[0075] Comparative Example 3

[0076] This comparative example provides a sealant prepared according to the method of Example 3. The difference from Example 3 is that the fluorinated polyurethane acrylate resin is replaced with an equal weight of the fluorinated polyurethane acrylate resin without carbon-carbon double bonds prepared in Comparative Example 3.

[0077] Performance testing

[0078] The performance of the conformal adhesives obtained in the above embodiments and comparative examples was tested. The specific test items and test conditions are shown in Table 2.

[0079] 365nm LED Curing Conditions: Ultraviolet curing is performed using LEDs with a wavelength of 365nm, and the radiant light intensity is 700mW / cm². 2 .

[0080] Moisture curing conditions: Place it in a room with constant temperature and humidity (23±2℃, 50±10%RH) for 48 hours under absolutely dark conditions.

[0081] The test conditions for adhesion, contact angle, acid resistance, alkali resistance, and salt spray resistance are: UV curing energy of 6000 mJ / cm². 2 Then, allow it to cure with moisture for 72 hours.

[0082] Table 2

[0083]

[0084]

[0085] The test results are shown in Table 3.

[0086] Table 3 Test results of the examples and comparative examples

[0087]

[0088]

[0089] The results show that the UV-moisture dual-curing conformal adhesive prepared by this invention has moderate viscosity, good surface drying performance under both moisture and UV curing, effectively solves the problem of incomplete curing of shaded areas during UV curing, achieves an adhesion rating of 0, and exhibits good wetting effect on PCBs. The use of a self-made fluorinated polyurethane acrylate resin containing NCO groups and double bonds reduces the surface tension of the conformal adhesive and improves its wettability. Simultaneously, during curing, fluorinated segments migrate to the material surface, reducing the surface energy. After curing, the water contact angle of the conformal adhesive reaches over 89°, and the water absorption rate decreases to below 1.2%, indicating excellent water resistance. Furthermore, after 168 hours of acid and alkali immersion and salt spray treatment, the surface of the conformal adhesive remains undamaged, demonstrating the excellent corrosion resistance of the conformal adhesive prepared by this invention. This effectively prevents corrosion of the circuit board by moisture, mold, and solvents, increasing the lifespan of the circuit board.

[0090] The applicant declares that this invention illustrates the UV-moisture dual-curing conformal adhesive, its preparation method, and its application through the above embodiments. However, this invention is not limited to the above embodiments, meaning that this invention does not necessarily rely on the above embodiments for implementation. Those skilled in the art should understand that any improvements to this invention, equivalent substitutions of the raw materials in the product, additions of auxiliary components, and selection of specific methods all fall within the protection and disclosure scope of this invention.

Claims

1. A UV-moisture dual-curing conformal adhesive, characterized in that, The UV-moisture dual-curing conformal adhesive comprises the following components in parts by weight: 40-60 parts of fluorinated polyurethane acrylate resin; 30-50 parts of reactive diluent; 2-8 parts of photoinitiator; Polymerization inhibitor 0.1-0.5 parts; 1-3 parts dehydrating agent; The fluorinated polyurethane acrylate resin is obtained by reacting hexamethylene diisocyanate-based polyisocyanate, one of Daicel's PCL205U, PCL205, PCL208 or PCL210, hydroxy acrylate and monohydroxy fluorinated monomer. The hexamethylene diisocyanate-based polyisocyanate is a hexamethylene diisocyanate trimer; The hydroxy acrylate is selected from one or a combination of at least two of hydroxyethyl methacrylate, hydroxypropyl methacrylate, or pentaerythritol triacrylate. The monohydroxy fluorinated monomer is selected from at least one of perfluorobutanol, perfluorobutylethanol, perfluorohexylethyl alcohol or 2-perfluorooctylethanol; The molar ratio of the hexamethylene diisocyanate-based polyisocyanate to one of Daicel's PCL205U, PCL205, PCL208 or PCL210 is (1-1.2):(0.4-0.6); The molar ratio of hexamethylene diisocyanate-based polyisocyanate to hydroxy acrylate is (1-1.2):(0.8-1); The molar ratio of the hexamethylene diisocyanate-based polyisocyanate to the monohydroxy fluorinated monomer is (1-1.2):(0.4-0.6); The reaction specifically includes the following steps: (1) Mix hexamethylene diisocyanate-based polyisocyanate and one of Daicel's PCL205U, PCL205, PCL208 or PCL210, along with a polymerization inhibitor and an antioxidant, react, add a catalyst, and continue the reaction. (2) Add hydroxy acrylate and monohydroxy fluorinated monomer to the reaction solution obtained in step (1), and react to obtain the fluorinated polyurethane acrylate resin. After mixing as described in step (1), the temperature is raised to 65-70℃ and reacted for 1-1.5 hours, then the temperature is raised to 75-80℃ and the reaction continues for 2-3 hours. After adding the catalyst, the reaction continues for 1.5-2 hours. The reaction temperature in step (2) is 75℃ and the reaction time is 1-2h.

2. The UV-moisture dual-curing conformal adhesive according to claim 1, characterized in that, The hexamethylene diisocyanate-based polyisocyanate is selected from one of Wanhua Chemical's HT-90, HT-100, HB-100, HT-300 or HT-600.

3. The UV-moisture dual-curing conformal adhesive according to claim 1, characterized in that, The catalyst is dibutyltin dilaurate.

4. The UV-moisture dual-curing conformal adhesive according to claim 1, characterized in that, The polymerization inhibitor mentioned in step (1) is selected from hydroquinone, p-hydroxyanisole, or p-benzoquinone and naphthoquinone, or a combination of at least two of them.

5. The UV-moisture dual-curing conformal adhesive according to claim 1, characterized in that, The antioxidant is selected from one or a combination of at least two of 1076, BHT (2,6-di-tert-butyl-4-methylphenol), or TPP (triphenyl phosphite).

6. The UV-moisture dual-curing conformal adhesive according to claim 1, characterized in that, The reactions in steps (1) and (2) are carried out under nitrogen protection.

7. The UV-moisture dual-curing conformal adhesive according to claim 1, characterized in that, The active diluent is selected from one or a combination of at least two of isoborneol acrylate, isoborneol methacrylate, or isooctyl acrylate.

8. The UV-moisture dual-curing conformal adhesive according to claim 1, characterized in that, The photoinitiator is selected from one or a combination of at least two of the following initiators: 651, 184, 1173, 500, 907, TPO, or LTM.

9. The UV-moisture dual-curing conformal adhesive according to claim 1, characterized in that, The polymerization inhibitor in the formulation of the UV-moisture dual-curing conformal adhesive is selected from one or a combination of at least two of hydroquinone, p-hydroxyanisole, p-benzoquinone, or naphthoquinone.

10. The UV-moisture dual-curing conformal adhesive according to claim 1, characterized in that, The dehydrating agent is p-toluenesulfonyl isocyanate.

11. A method for preparing a UV-moisture dual-curing conformal adhesive according to any one of claims 1-10, characterized in that, The preparation method includes the following steps: The reactive diluent and photoinitiator are mixed, and then the fluorinated polyurethane acrylate resin, polymerization inhibitor, and dehydrating agent are added to the mixture and mixed to obtain the UV-moisture dual-curing conformal adhesive.

12. The preparation method according to claim 11, characterized in that, All mixing was carried out at 20-30°C.

13. The preparation method according to claim 11, characterized in that, All mixing was carried out under stirring.

14. The preparation method according to claim 11, characterized in that, All mixing was carried out under nitrogen protection.

15. The preparation method according to claim 11, characterized in that, The mixing time for the reactive diluent and photoinitiator is 0.5 to 1 hour.

16. The preparation method according to claim 11, characterized in that, The fluorinated polyurethane acrylate resin, polymerization inhibitor, and dehydrating agent are added to the mixture and then mixed for 0.5 to 1 hour.

17. The application of a UV-moisture dual-curing conformal adhesive according to any one of claims 1-10 in the bonding of electronic circuit boards.

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