Thin-film bonding device

Abstract

The present disclosure provides a thin film connection device, including a first thin film substrate and a plurality of elastic probes. The first thin film substrate includes a plurality of first openings penetrating the first thin film substrate. The elastic probes respectively penetrate the first openings. The elastic probes respectively include a first end and a second end. The first ends of the elastic probes are coplanar with each other, and the second ends of the elastic probes are coplanar with each other.

Description

Technical Field

[0001] This disclosure relates to a thin-film bonding device. In particular, it relates to a thin-film bonding device with an elastic probe. Background Technology

[0002] In the manufacturing process of integrated circuits, electrical testing is a crucial step to ensure the proper functioning of the device. For test devices formed using conductive adhesives (such as silicone with conductive particles, metal pillars, or metal needles), the aging rate increases significantly with the number of uses. Furthermore, metal pillars or needles lack elasticity, making it difficult to control the contact stress generated on the test object, which can easily damage the contacts. Moreover, if conductive adhesives made of silicone are used, unevenness may occur during the silicone curing process, and the curing process is also more complex. Therefore, how to solve these problems has become an important issue in this field.

[0003] The above "Background Art" description is merely to provide background information and does not acknowledge that the above "Background Art" description discloses the subject matter of this disclosure. It does not constitute prior art to this disclosure, and no description of the above "Background Art" should be considered part of this case. Summary of the Invention

[0004] In view of this, in order to solve the problems in the background art, the purpose of this disclosure is to provide a thin film bonding device.

[0005] One embodiment of this disclosure provides a thin-film bonding device, including a first thin-film substrate and a plurality of elastic probes. The first thin-film substrate includes a plurality of first openings penetrating the first thin-film substrate. The elastic probes respectively pass through the first openings. Each elastic probe includes a first end and a second end. The first ends of the elastic probes are coplanar with each other, and the second ends of the elastic probes are coplanar with each other.

[0006] Accordingly, the flatness of the probe, the test results of electrical tests, and the service life of the thin film connection device can all be improved due to the thin film connection device disclosed herein.

[0007] The foregoing has provided a fairly broad overview of the technical features and advantages of this disclosure, enabling a better understanding of the detailed description that follows. Other technical features and advantages constituting the subject matter of this disclosure will be described below. Those skilled in the art to which this disclosure pertains will understand that the concepts and specific embodiments disclosed below can be readily used to achieve the same purpose as this disclosure by modifying or designing other structures or processes. Those skilled in the art to which this disclosure pertains will also understand that such equivalent constructions cannot depart from the spirit and scope of this disclosure as defined in the appended claims. Attached Figure Description

[0008] When the drawings are considered together with the embodiments and the scope of the patent application, a more comprehensive understanding of the disclosure of this application can be obtained. The same element symbols in the drawings refer to the same elements.

[0009] Figure 1 This is a schematic diagram of a test system according to some embodiments of the present disclosure.

[0010] Figure 2 and Figure 3 This is a schematic diagram of a thin film substrate according to some embodiments of the present disclosure.

[0011] Figure 4A , Figure 4B , Figure 4C , Figure 4D , Figure 4E and Figure 4F This is a schematic diagram of an opening in some embodiments of this disclosure.

[0012] Figure 5A and Figure 5B This is a schematic diagram of an opening and an elastic probe according to some embodiments of this disclosure.

[0013] Figure 6 , Figure 7 , Figure 8 and Figure 9 This is a schematic diagram of a test system according to some embodiments of the present disclosure.

[0014] Explanation of reference numerals in the attached figures

[0015] 1. Test system; 2. Test system; 3. Test system; 10. Test device; 20. Test object; 21. Contact; 100. Test socket; 102. Contact element; 200. Thin film connection device; 210. Thin film substrate; 211. Thin film substrate; 212. Thin film substrate; 210A. First surface; 210B. Second surface; 220. Elastic probe; 221. First end; 222. Second end; 300. Reinforcing member; 321. First end; 322. Second end; 323. Housing; 324. Spring; 421. Needle body; 422. Hollowed-out part; L. Spacing; X. Direction; Y. Direction; Z. Direction; R1. Aperture; R2. Aperture; T1. Thickness; O1. Opening; SL1. Slot; SL2. Slot; SL3. Slot; SL4. Slot. Detailed Implementation

[0016] The following description of this disclosure, accompanied by drawings incorporated in and forming part of this specification, illustrates embodiments of the disclosure; however, the disclosure is not limited to these embodiments. Furthermore, the following embodiments may be appropriately integrated to complete another embodiment.

[0017] Terms such as “an embodiment,” “an embodiment,” “an exemplary embodiment,” “another embodiment,” and “another embodiment” refer to embodiments described in this disclosure that may include specific features, structures, or characteristics; however, not every embodiment must include that specific feature, structure, or characteristic. Furthermore, repeated use of the phrase “in an embodiment” does not necessarily refer to the same embodiment, but may refer to the same embodiment.

[0018] To enable a full understanding of this disclosure, the following description provides detailed steps and structures. It is obvious that implementation of this disclosure does not limit the specific details known to those skilled in the art. Furthermore, known structures and steps are not detailed further to avoid unnecessarily limiting this disclosure. Preferred embodiments of this disclosure are detailed below. However, in addition to the detailed description, this disclosure can also be widely implemented in other embodiments. The scope of this disclosure is not limited to the detailed description, but is defined by the claims.

[0019] It should be understood that the following disclosure provides numerous different embodiments or examples for implementing various features of this disclosure. Specific embodiments or examples of components and arrangements are described below to simplify this disclosure. Of course, these are merely examples and are not intended to be limiting. For example, the dimensions of elements are not limited to the disclosed range or values, but may depend on process conditions and / or the desired properties of the apparatus. Furthermore, the description below of a first feature being formed "on" or "on" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, thereby potentially preventing direct contact between the first and second features. For simplicity and clarity, various features may be drawn at any scale. In the drawings, some layers / features may be omitted for simplicity.

[0020] Furthermore, for ease of explanation, spatial relative terms such as "beneath," "below," "lower," "above," and "upper" may be used herein to describe the relationship between one element or feature shown in the figures and another element or feature. These spatial relative terms are intended to encompass different orientations of the components in use or operation, in addition to those shown in the figures. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein can be interpreted accordingly.

[0021] Figure 1This is a schematic diagram of a test system 1 according to some embodiments of the present disclosure. The test system 1 includes a test apparatus 10 and a device under test (DUT) 20. In some embodiments, the test apparatus 10 is a probe test apparatus, including a test socket 100, a thin-film connection device 200, and a reinforcing member 300. The test apparatus 10 is used to perform electrical tests on the DUT 20. In some embodiments, the DUT 20 is a die-on-chip integrated circuit or a wafer-level integrated circuit. However, the present disclosure is not limited thereto, and various electronic components capable of transmitting electrical signals can be the DUT 20 described in this disclosure.

[0022] The membrane connection device 200 is mounted on the test socket 100 by a reinforcing member 300. In some embodiments, the test socket 100 is a printed circuit board for transmitting electrical signals between a testing machine (not shown) and the membrane connection device 200. In some embodiments, the reinforcing member 300 is a metal sheet or a metal block. In some embodiments, the reinforcing member 300 is an insulating material.

[0023] The thin-film bonding device 200 includes a thin-film substrate 210 and a plurality of elastic probes 220. The elastic probes 220 are disposed in the thin-film substrate 210. In some embodiments, the elastic probes 220 are vertical probes. Each elastic probe 220 has a first end 221 and a second end 222, which protrude from opposite surfaces of the thin-film substrate 210. The first end 221 of each elastic probe 220 abuts against a contact 102 on a test socket 100. The second end 222 of each elastic probe 220 is used to contact a contact 21 on a test object 20. In some embodiments, the first ends 221 of each elastic probe 220 are coplanar. In some embodiments, the second ends 222 of each elastic probe 220 are coplanar. In some embodiments, the first end 221 and the second end 222 of each elastic probe 220 are located on the same axis, which is a normal to the surface of the test socket 100. In some embodiments, the surface of the thin-film substrate 210 (e.g., Figure 2 The normals of the first surface 210A and / or the second surface 210B shown are parallel to the normals of the surface of the test socket 100. For ease of understanding, Figure 1 The Z direction of the diagram is parallel to the normal to the surface of the test socket 100, and the first end 221 and the second end 222 of each elastic probe 220 are aligned along the Z direction.

[0024] When the test device 10 approaches the test object 20 and contacts the contact 21, the elastic probe 220 provides axial (e.g., Z-direction) compressive stress through the contact member 102 and the contact 21, so that the elastic probe 220 can stably contact the contact member 102 and the contact 21, serving as the transmission path of electrical signals between the test object 20 and the test socket 100.

[0025] It should be understood that the arrangement of the elastic probes 220 shown in this disclosure is merely illustrative and is not limited thereto. The number and arrangement of the elastic probes 220 can be set according to the requirements of the object 20 to be tested.

[0026] Figure 2 A cross-sectional view (side view) of the thin film substrate 210 in a plane defined by the X and Z directions is shown. In some embodiments, the thin film substrate 210 includes a plurality of openings O1, which penetrate the thin film substrate 210. The openings O1 are used to accommodate the elastic probe 220. In some embodiments, the openings O1 have approximately the same aperture on the first surface 210A and the second surface 210B of the thin film substrate 210, that is, the aperture R1 is equal to the aperture R2. In some embodiments, the aperture R1 is not equal to the aperture R2. In some embodiments, the aperture R1 is smaller than the aperture R2, wherein the second surface 210B is the surface closer to the object to be tested 20.

[0027] Figure 3 A top view (cross-sectional view) of the thin film substrate 210 in a plane defined by the X and Y directions is shown. The openings O1 are arranged in a matrix and have a rectangular outline in the top view; however, this disclosure is not limited to this, and the arrangement of the openings O1 can be varied according to the requirements of the object under test 20. In some embodiments, the shape of the openings O1 is the same as the cross-sectional shape of the elastic probe 220. In some embodiments, such as... Figure 4A , Figure 4B , Figure 4C , Figure 4D , Figure 4E and Figure 4F As shown, opening O1 has a different profile when viewed from above.

[0028] refer to Figure 4A and Figure 4B In some embodiments, the opening O1 is circular, and the thin film substrate 210 further includes a plurality of slots SL1 connecting the opening O1. More specifically, the slots SL1 can be considered as cross-sections on the thin film substrate 210, and the lateral dimension of the slots SL1 is very small relative to the longitudinal dimension. The slots SL1 penetrate the thin film substrate 210, that is, the slots SL1 extend from the first surface 210A to the second surface 210B. The thin film substrate 210 on both sides of the slots SL1 is discontinuous and consists of two parts that can be displaced relative to each other. One opening O1 can be configured with two slots SL1 or eight slots SL1. However, this disclosure is not limited thereto, and various configurations of the number of slots SL1 are all within the considerations and scope of this disclosure.

[0029] In some embodiments, the area of ​​the opening O1 is less than or equal to the cross-sectional area at the widest point of the elastic probe 220. Therefore, when the elastic probe 220 is disposed in the opening O1, the area around the opening O1 is compressed by the elastic probe 220, while the slot SL1 provides space for the thin film substrate 210 to deform, causing the opening O1 to expand along the direction of the slot SL1. The opening O1 can thus provide centripetal stress to the elastic probe 220 to clamp it. Figure 5A and Figure 5B As shown, when the elastic probe 220 is placed in the opening O1, the elastic probe 220 compresses the thin film substrate 210, causing the thin film substrate 210 near the opening O1 to deform downwards (bend along the Z direction) and expand the slot SL1 (expanding on the plane jointly defined by the X and Y directions), thereby expanding the area of ​​the opening O1. In other words, when the elastic probe 220 is placed in the opening O1, the opening O1 is compressed, causing the slot SL1 connecting the opening O1 to expand. Because the slot SL1 expands, the area of ​​the opening O1 expands along the slot SL1.

[0030] refer to Figure 4C In some embodiments, the opening O1 is pentagonal, and the thin film substrate 210 further includes a plurality of slots SL2 connecting the opening O1. The slots SL2 can be considered as cross-sections on the thin film substrate 210. The slots SL2 penetrate the thin film substrate 210, that is, the slots SL2 extend from the first surface 210A to the second surface 210B. The function of the slots SL2 is similar to that of the slots SL1, and will not be described in detail here.

[0031] refer to Figure 4D In some embodiments, the opening O1 is a parallelogram, and the thin film substrate 210 further includes a plurality of slots SL3 connecting the opening O1. The slots SL3 can be considered as cross-sections on the thin film substrate 210. The slots SL3 penetrate the thin film substrate 210, that is, the slots SL3 extend from the first surface 210A to the second surface 210B. The function of the slots SL3 is similar to that of the slots SL1, and will not be described in detail here.

[0032] It should be understood that the opening O1 is not limited to a pentagon or a quadrilateral; the opening O1 can also be a convex polygon.

[0033] refer to Figure 4E In some embodiments, the opening O1 is a polygon containing straight lines and curves, and the thin film substrate 210 further includes a plurality of slots SL4 connecting the opening O1. The slots SL4 can be considered as cross-sections on the thin film substrate 210. The slots SL4 penetrate the thin film substrate 210, that is, the slots SL3 extend from the first surface 210A to the second surface 210B. In some embodiments, the slots SL4 are curved. The function of the slots SL4 is similar to that of the slots SL1, and will not be described again here.

[0034] refer to Figure 4F In some embodiments, the opening O1 is an arbitrary polygon, such as a star.

[0035] In some embodiments, the thin film substrate 210 may simultaneously have Figure 4A , Figure 4B , Figure 4C , Figure 4D , Figure 4E , Figure 4F Or a combination of openings O1. For example, thin film substrate 210 includes two openings O1. Figure 4A The opening O1 shown and 3 Figure 4D The opening O1 is shown. In some embodiments, the shape of the opening O1 corresponds to the cross-sectional shape of the elastic probe 220, for example, having a similar shape or having the same shape but a different size. In some embodiments, the shape of the opening O1 depends on the cross-sectional shape of the elastic probe 220; for example, a probe with a rectangular cross-section is more suitable. Figure 4D , Figure 4E An opening O1; a probe with a circular cross-section is more suitable. Figure 4A , Figure 4B , Figure 4C , Figure 4F For opening O1, if the groove is close to the inside of opening O1, a circular probe can also be used. Figure 4E In some embodiments, the shape of the opening is the same as the cross-sectional shape of the probe. The opening and slot are designed to form one or more protrusions within the opening O1. These protrusions are deformable because of the slots; when the probe is inserted into the opening O1, they push against these protrusions, causing deformation and generating an interference force on the probe, thereby fixing it in place. It should be understood that... Figures 4A to 4F These are merely some feasible methods that utilize the setting of openings and slots to form one or more protrusions to generate interference force on the probe and fix the probe, all of which are within the scope of this disclosure.

[0036] In some embodiments, the thin film substrate 210 comprises Mylar. In other embodiments, the thin film substrate 210 comprises glass. In some embodiments, the thickness T1 (thickness along the Z direction) of the thin film substrate 210 is less than 0.75 mm. In some embodiments, the thickness T1 of the thin film substrate 210 is greater than or equal to 0.75 mm.

[0037] In some prior art technologies, silicone rubber has been used as a substrate material for thin-film bonding devices. However, in the fabrication of silicone rubber substrates, the silicone rubber is liquid-coated onto the probe at a high temperature, and then cooled and solidified to form an insulator around the probe. The flatness of the solidified silicone rubber is difficult to control, making it difficult to maintain the contact points between the probe and the test object on the same plane, thus reducing the accuracy of the test. Furthermore, when using silicone rubber as a substrate, the thickness of the substrate is limited by the manufacturing process and materials. In prior art technologies, the thickness of silicone rubber substrates is generally greater than 0.75 mm, which means that the length of the selected elastic probe can only be greater than 0.75 mm. In high-frequency testing, the signal transmission path length significantly affects the test accuracy. The thicker the substrate and the longer the elastic probe used, the longer the signal transmission path, which increases the impedance and makes the signal more susceptible to interference, thus reducing the test accuracy. Moreover, the elasticity of silicone rubber gradually ages with repeated use due to external factors such as temperature and pressure, including high-temperature testing. Before silicone rubber fatigue occurs, the silicone rubber substrate may already be unusable. However, the types and number of tests a silicone rubber substrate will undergo are difficult to predict, therefore, the service life of the silicone rubber substrate is also difficult to estimate accurately.

[0038] Compared to prior art, the thin-film bonding device 200 provided in this disclosure uses Mylar or glass as the thin-film substrate 210 to overcome the problems encountered in the prior art. First, the flatness of the thin-film substrate 210 made of Mylar or glass can be accurately controlled. Second, the thickness of the thin-film substrate 210 made of Mylar or glass can be controlled to below 0.75 mm, thus allowing the use of shorter elastic probes 220. Third, the service life of the thin-film substrate 210 made of Mylar or glass is significantly better than that of silicone rubber substrates. Furthermore, compared to silicone rubber, Mylar and glass are not elastic and have better rigidity and support, thus providing good support even at a relatively small thickness.

[0039] In some embodiments, such as Figure 6 As shown, the elastic probe 220 is a pogo pin. In Figure 6In some embodiments, the elastic probe 220 includes a first end 321, a second end 322, a housing 323, and a spring 324. The housing 323 is disposed in the thin film substrate 210. The first end 321 and the second end 322 are connected to the upper and lower sides of the housing 323, respectively protruding from the first surface 210A and the second surface 210B of the thin film substrate 210. The spring 324 is disposed in the housing 323 and abuts against the first end 321 and the second end 322 to provide elastic force. In some embodiments, the thin film substrate 210 may be glass, and one end of the elastic probe 220 may form a protrusion (not shown), which is used to keep the elastic probe 220 stuck on the glass thin film substrate 210 and prevent it from falling off.

[0040] In some embodiments, the springs 324 of the plurality of elastic probes 220 in the thin-film bonding device 200 have the same spring constant. In some embodiments, at least two of the plurality of elastic probes 220 in the thin-film bonding device 200 have different spring constants for their springs 324.

[0041] In some embodiments, such as Figure 7 As shown, the elastic probe 220 is a microelectromechanical system (MEMS) probe. In Figure 7 In one embodiment, the elastic probe 220 includes a needle body 421 and at least one cutout portion 422. The cutout portion 422 provides space for the elastic probe 220 to be compressed. The needle body 421 is a monolithic structure. In other words, the elastic probe 220 is a one-piece molded structure.

[0042] In some embodiments, the elastic probe 220 includes a plurality of cutouts 422, and each cutout 422 is identical. In some embodiments, the cutouts 422 of different elastic probes 220 are identical to each other. In some embodiments, at least two of the plurality of elastic probes 220 in the thin film bonding device 200 have different cutouts 422.

[0043] Figure 8 This is a schematic diagram of a test system 2 according to some embodiments of the present disclosure. Test system 2 is similar to test system 1, including a test apparatus 10 and a test object 20. The test apparatus 10 includes a test socket 100, a thin-film connection device 200, and a reinforcing member 300. The difference from test system 1 is that the thin-film connection device 200 includes a plurality of thin-film substrates 210. For ease of explanation, Figure 7 The two thin film substrates 210 are designated as thin film substrate 211 and thin film substrate 212, respectively.

[0044] In test system 2, the thin film bonding device 200, according to the requirements of the elastic probe 220 (e.g., when the elastic probe 220 is too long), sets two thin film substrates 211 and 212 to keep the elastic probe 220 stable. Figure 8 As shown, thin film substrate 211 and thin film substrate 212 are in contact with each other, that is, the distance between thin film substrate 211 and thin film substrate 212 is equal to 0.

[0045] Thin film substrate 211 has a plurality of openings O1, and thin film substrate 212 has the same number of openings O1 as thin film substrate 211. The openings O1 of thin film substrate 211 and thin film substrate 212 are arranged correspondingly to each other in a manner that allows the elastic probe 220 to pass through, forming multiple sets of corresponding openings. In some embodiments, at least one set of corresponding openings has the same shape. In some embodiments, at least one set of corresponding openings has different shapes. In some embodiments, at least two of the plurality of openings O1 of thin film substrate 211 have the same shape. In some embodiments, at least two of the plurality of openings O1 of thin film substrate 211 have different shapes. In some embodiments, at least two of the plurality of openings O1 of thin film substrate 212 have the same shape. In some embodiments, at least two of the plurality of openings O1 of thin film substrate 212 have different shapes.

[0046] Figure 9 This is a schematic diagram of a test system 3 according to some embodiments of the present disclosure. Test system 3 is similar to test system 2, including a test apparatus 10 and a test object 20. The test apparatus 10 includes a test socket 100, a thin-film connector 200, and a reinforcing member 300. The difference from test system 2 is that the distance L between the thin-film substrate 211 and the thin-film substrate 212 of the thin-film connector 200 is greater than 0.

[0047] Thin film substrate 211 has a plurality of openings O1, and thin film substrate 212 has the same number of openings O1 as thin film substrate 211. The openings O1 of thin film substrate 211 and thin film substrate 212 are arranged correspondingly to each other in a manner that allows the elastic probe 220 to pass through, forming multiple sets of corresponding openings. In some embodiments, at least one set of corresponding openings has the same shape. In some embodiments, at least one set of corresponding openings has different shapes. In some embodiments, at least two of the plurality of openings O1 of thin film substrate 211 have the same shape. In some embodiments, at least two of the plurality of openings O1 of thin film substrate 211 have different shapes. In some embodiments, at least two of the plurality of openings O1 of thin film substrate 212 have the same shape. In some embodiments, at least two of the plurality of openings O1 of thin film substrate 212 have different shapes.

[0048] It should be understood that the number of thin film substrates 210 in test system 2 and test system 3 is merely illustrative, and various numbers of thin film substrates 210 are all within the considerations and scope of this disclosure. For example, in other embodiments, test system 2 and test system 3 respectively include 3 and 4 thin film substrates 210.

[0049] In summary, the thin-film bonding device of the present disclosure uses a Mylar or glass thin-film substrate, which improves the flatness of the probe, the test results of electrical tests, and the service life of the thin-film bonding device.

[0050] While this disclosure and its advantages have been described in detail, it should be understood that various changes, substitutions, and alternatives may be made without departing from the spirit and scope of this disclosure as defined in the claims. For example, many of the processes described above may be implemented using different methods, and other processes or combinations thereof may be substituted for many of the processes described above.

[0051] Furthermore, the scope of this application is not limited to the specific embodiments of the processes, machinery, manufacturing, material composition, means, methods, and steps described in the specification. Those skilled in the art will understand from the disclosure of this publication that existing or future processes, machinery, manufacturing, material composition, means, methods, or steps that have the same function or achieve substantially the same results as the corresponding embodiments described herein can be used according to this disclosure. Accordingly, such processes, machinery, manufacturing, material composition, means, methods, or steps are included within the scope of the claims of this application.

Claims

1. A thin film connection device, comprising: a first thin film substrate, comprising a plurality of first openings passing through the first thin film substrate; a plurality of slots, wherein the slots pass through the first thin film substrate and connect the first openings; and a plurality of elastic probes passing through the first openings, respectively, wherein the elastic probes each comprise a first end and a second end, wherein the first ends of the elastic probes are coplanar with each other, and the second ends of the elastic probes are coplanar with each other, wherein the first openings comprise at least one convex portion, wherein an area of each of the first openings is smaller than a cross-sectional area of each of the elastic probes at its widest point, wherein when the elastic probes pass through the first openings, the slots provide space for the first openings to deform, causing the first thin film substrate of the first openings to bend in a first direction, and the area of each of the first openings to expand in a plane perpendicular to the first direction by being pressed by the corresponding elastic probe.

2. The thin film connection device of claim 1, wherein the first thin film substrate comprises Mylar.

3. The thin film connection device of claim 1, wherein the first openings have a circular shape, a convex polygonal shape, a star shape, or a combination thereof.

4. The thin film connection device of claim 1, wherein the shape of the first openings corresponds to the cross-sectional shape of the elastic probes.

5. The thin film connection device of claim 4, wherein the shape of the first openings is identical to the cross-sectional shape of the elastic probes.

6. The thin film connection device of claim 1, further comprising: a second thin film substrate, comprising a plurality of second openings passing through the second thin film substrate, wherein the elastic probes pass through the second openings, respectively.

7. The thin film connection device of claim 6, wherein the distance between the first thin film substrate and the second thin film substrate is greater than 0.

8. The thin film connection device of claim 6, wherein the distance between the first thin film substrate and the second thin film substrate is equal to 0.

9. The thin film connection device of claim 6, wherein the first openings and the second openings are correspondingly arranged into a plurality of groups of corresponding openings, respectively.

10. The thin film connection device of claim 9, wherein the first openings and the second openings of at least one of the groups of corresponding openings are identical.

11. The thin film connection device of claim 9, wherein the first openings and the second openings of at least one of the groups of corresponding openings are different.

12. The thin film connection device of claim 1, wherein the elastic probes each comprise a spring.

13. The thin film connection device of claim 1, wherein the elastic probes are microelectromechanical system probes, each comprising at least one hollow portion.

14. The thin film connection device of claim 1, wherein the thin film connection device is configured to be arranged on a test socket.

15. The thin film connection device of claim 1, wherein the first end and the second end of each of the elastic probes are on the same axis, wherein the axis is a normal to the surface of the first thin film substrate.

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