A silicon carbide tray for rapid thermal processing and a method of rapid thermal processing
CN119517816BActive Publication Date: 2026-08-28ADVANCED MATERIALS TECH & ENG INC +1
Patent Information
- Application Number
- CN202411410850.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-10
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2044-10-10
AI Technical Summary
Technical Problem
[0006]上述方案通过改变热处理装置的结构组成提升晶圆的热处理效果,但是其装置的结构复杂且改善效果一般,实用性较差
Benefits of technology
[0032](1)本发明所述快速热处理用碳化硅托盘具有高的热力学稳定性、良好的导热性、高的电子迁移率、抗氧化、耐腐蚀等优点,使用方便且改善热处理效果明显,使用之后可以直接清洗使用并重复利用。
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Figure CN119517816B_ABST
Abstract
The application provides a silicon carbide tray for rapid thermal processing and a rapid thermal processing method, the silicon carbide tray for rapid thermal processing comprises a silicon carbide base, at least three groups of cooling table limiting openings, wafer limiting columns and through holes are arranged on the silicon carbide base, the cooling table limiting openings, the wafer limiting columns and the through holes are respectively equally divided on the silicon carbide base, wherein the distance between the cooling table limiting opening and the center of the silicon carbide base is a, the distance between the wafer limiting column and the center of the silicon carbide base is b, the distance between the through hole and the center of the silicon carbide base is c, and a > b > c. The silicon carbide is made into a special structure of the tray for rapid thermal processing, the uniformity of wafer heating can be improved, the edge effect and the pattern loading effect in the wafer heating process are reduced, and a higher quality oxide film is obtained.
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Citation Information
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